Saeed Amidi, founder and CEO of Plug and Play, used the 5th Mobis Mobility Day in Sunnyvale to offer a candid market outlook on humanoid robotics and detail the accelerator's expanding strategy to build Applied AI ecosystems beyond Silicon Valley.

Pradeep S. Shenoy, a computing technology expert at Texas Instruments's (TI) US headquarters, recently shared his views on 800V architectures for AI data centers in a media appearance. He said 800V solutions will not see broad adoption in AI data centers in 2026, but rollout will accelerate year by year from 2027.

Taiwan precision motion-control leader Hiwin Technologies is accelerating growth on the back of semiconductor automation and robotics demand, with robot-related products emerging as a rapidly expanding revenue driver as the company deepens its push into wafer-handling systems, logistics robots, and humanoid robot components.

Hehui Electronics said it expected operations to improve in 2026 as new business in robotics, smart in-vehicle systems, and smart manufacturing gained traction following product demonstrations at Nvidia GTC 2026. The company announced plans to leverage an integrated edge vision-language model and smart mobility capabilities to drive growth and target a return to breakeven in its core business this year, a spokesperson stated.

Taiwan's Ministry of Digital Affairs (MODA) has revealed that three applicants have submitted bids for its AI compute center BOO (build-own-operate) program, which closed on May 14, 2026. The disclosure comes as Foxconn is widely reported to be highly interested in building a large AI compute center.

Asus is accelerating its push into the server market in South Korea, leveraging its manufacturing prowess, long-term ties with major memory makers, and flexible design and supply strategies to take advantage of mass procurements in South Korea's government-led sovereign AI infrastructure initiative and GPU server roll-outs at Hyundai Motor, telecom operators, and financial institutions in the country.

Swancor Holding and RobiChip Technology announced a strategic partnership to accelerate the adoption of advanced packaging materials and heterogeneous chip system integration in robots, robot dogs, and AI-powered platforms, the firms said at the forum on robotics and circular materials hosted by the Taiwan Composite Low-Carbon Circular Alliance. The collaboration will focus on co-developing materials and high-power-density power systems to enable the deployment of next-generation robotic and drone applications.

The global map of semiconductor manufacturing is beginning to shift. For years, the market for advanced chip production was dominated almost entirely by TSMC. But the rise of artificial intelligence (AI), intensifying geopolitical tensions, and mounting pressure from Washington to secure critical supply chains are beginning to loosen that grip.

Taiwan's information and communications technology (ICT) sector has reinforced its central role in the global artificial intelligence supply chain and unveiled an overseas expansion strategy, executives said at the Taiwan Electrical and Electronic Manufacturers' Association annual members' meeting in 2026. The industry reported record output in 2025 and is advancing a "TEEMA Science Park 3.0" initiative aimed at helping companies deploy production and data infrastructure abroad to manage geopolitical risk.

Rising global geopolitical tensions are driving up defense budgets worldwide and boosting demand for rugged computers. Getac expects rugged computer shipments to grow by a double-digit percentage in 2026, driven mainly by defense demand. Additionally, demand related to drones has increased significantly and is expected to account for 5-10% of rugged computer revenue over the next 12 months.