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Mar 6

Foxconn eyes double-digit revenue growth in 2026, driven by AI servers and smartphones

Foxconn chairman Young Liu said on March 6 that 2026 is expected to be "a very good year" for the company, with full-year revenue projected to grow at a double-digit rate from approximately NT$8.1 trillion (approx. US$253 billion) in 2025, provided there are no major uncertainties.

AW 2026: how AX is advancing traditional automation

Mar 6

Apple's US$599 MacBook Neo uses A18 Pro, partly due to supply constraints

Mar 6

Explainer: Why the Pentagon’s move on Anthropic matters for the AI supply chain

Mar 6

Alibaba faces questions over Qwen continuity after sudden departures and structural shift

Mar 6

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AIWeekly news roundup: TSMC probe, AI boom, and memory price surge

Mar 9, 09:24

Below are the most-read DIGITIMES Asia stories from the week of March 2 - March 8, 2026.

ICT MANUFACTURINGExclusive: Compal advances Direct to Cell work, integrates communication modules into satellites

Mar 9, 08:59

Compal Electronics Inc. is developing Direct-to-Cell (D2C) technology for smartphones and has begun integrating communication modules into satellites while negotiating with several international satellite operators, according to company vice president JS Liang.

IT COMPONENTS, PERIPHERALSRadbon sees boost from resumption of deferred orders, expects long-term growth from aerospace, defense

Mar 9, 07:49

Connector and cable assembly manufacturer Radbon Electronics has steadily deepened its presence in the defense and aerospace markets, with its investments gradually converting into tangible order momentum.

ICT MANUFACTURINGTaiwan stands firm on US investment commitments, pursuing strategic high-tech partnership amid legal shifts

Mar 9, 07:48

Taiwan's tariff negotiations with the US initially yielded relatively favorable terms, bringing Taiwan's export tariffs in line with those of Japan and South Korea. However, a recent US Supreme Court ruling has complicated the outcome. While 70% of Taiwan's exports—primarily electronics and components—remain duty-free under International Trade Administration (ITA) rules, new uncertainties have emerged that could influence Taiwan's trade strategy going forward.

ICT MANUFACTURINGSamsung Display secures largest OLED supply for iPhone 17e, BOE's lead role questioned

Mar 9, 07:47

Samsung Display (SDC) has reportedly secured the largest share of orders supplying OLED panels for Apple's latest budget smartphone, the iPhone 17e. This development overturns earlier industry forecasts that predicted BOE Technology Group (BOE) would be the primary OLED supplier for the iPhone 17e.

PC, CEComponent price surge hits business PC market harder than consumer segment

Mar 9, 03:54

Rising costs for memory, passive components, and battery modules are intensifying pressure on PC makers, while DynaPack and Acer Taiwan report shortages that are constraining supply and driving prices higher.

AIMeribank extends semiconductor precision to biomedicine with AI and modular process

Mar 9, 02:54

Meribank Biotech has signed a letter of intent with Ahead Medicine and Apexcella Biomedical, focusing on optimizing allogeneic natural killer (NK) cell manufacturing and building an AI-based immune cell detection platform. The collaboration aims to strengthen the technical foundation for mass production and standardization of NK cell therapies, expanding clinical applications of umbilical cord blood immune cells.

ICT MANUFACTURINGApplied Materials VP warns AI growth may hit energy, not chip limits

Mar 8

AI is rapidly driving global computing demand and accelerating semiconductor industry growth. Applied Materials vice president Erix Yu expects the semiconductor market to reach US$1 trillion in revenue in 2026—earlier than previous forecasts.

IT COMPONENTS, PERIPHERALSDynaPack plans triple BBU capacity expansion to meet AI data center demand

Mar 8

With AI data centers now integrating battery backup units (BBU), battery module maker DynaPack plans to add an additional 200% to its production capacity at its Taiwan and Thailand facilities to capitalize on this clearly emerging trend, with room for further growth. In addition, the company has several ongoing projects to develop BBUs tailored for high-voltage direct current (HVDC) systems, targeting mass production as early as 2027.

SERVER, IPC, CLOUD COMPUTING, IOTBroadcom CEO sees copper interconnects viable through 2028

Mar 8

Broadcom reported strong results for the first quarter of fiscal 2026, driven by robust demand for cloud application-specific integrated circuits (ASICs), and issued an upbeat outlook. During the earnings call, however, industry attention centered less on the company's financial performance and more on its views on silicon photonics and copper interconnect technologies.

SERVER, IPC, CLOUD COMPUTING, IOTWistron posts record February revenue driven by AI server shipments

Mar 8

Wistron Group's February 2026 revenue surged to a historic high, fueled by strong shipments of AI servers and network switches. The company reported a year-over-year increase of 177.37% in February, with continued growth expected as PC-related shipments rise in March alongside sustained demand for AI servers and network switches.

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