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Aug 21, 12:08
Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the way. Supply-chain sources say the chip has already returned from fabrication, completed initial power-on testing and moved into the device integration stage.

Taiwanese automation integrator DS Technology is shifting more of its highly customized robotic automation work toward standardized, modular systems as it seeks to make its technology easier to sell and deploy overseas, with prospective partners in Brazil and Mexico among its latest expansion targets.

Broadcom is in talks with asset managers to raise more than US$60 billion in debt financing, with the potential package reaching as much as US$100 billion, as the chipmaker moves to expand its role in the rapidly growing AI infrastructure market, according to Bloomberg.
Taiwan industrial computer supplier Vecow is stepping up its push into robotics and edge AI, with North America and Europe, the Middle East and Africa (EMEA) together accounting for 65% of its business, Executive Vice President Joseph Huang said at Automation Taipei 2026 on August 21.

As the first publicly listed humanoid robot company, Ubtech Robotics is often referred to in China as the sector's "first humanoid robot stock." At the 2026 World Robot Conference (WRC) in Beijing, the company found itself sharing the spotlight with recently listed Unitree Robotics, as both showcased their latest humanoid platforms.

Major global cloud service providers (CSPs) continue to scale up investments in AI infrastructure. According to the latest DIGITIMES research report, combined capital expenditures from Amazon, Microsoft, Alphabet, and Meta are projected to reach a record high of US$745 billion in 2026.
Hiwin Technologies Chairman Eric Y. T. Chuo stated that the company has supplied samples of miniature ball screws and single-axis robots to co-packaged optics (CPO) vendors across Taiwan and China for validation. Meanwhile, the timeline for its dual-arm logistics robot, originally scheduled for small-batch shipment in 2026, has been adjusted due to customer requirement changes. Hiwin expects to submit revised samples for testing in November.
Cambricon Technologies chairman and president Chen Tian-shi said the company's sixth-generation AI processor and instruction set remain under development, with the next-generation platform targeting large-model training and inference while improving programmability, ease of use, performance, power efficiency and chip area.
China Huaneng Group said on August 20 that chairman Wen Shugang and president Zhong Guodong recently visited Huawei in Shenzhen, where they met Huawei founder Ren Zhengfei to discuss potential cooperation in artificial intelligence, computing power and "compute-power coordination."
SK Group Chairman Tae-Won Chey said in a recent interview with CNBC that memory demand is surging explosively and that the most severe "memory shortage" will hit in 2027. He also apologized to the market for the pace of memory chip price increases, saying the rapid rise is fueling chip inflation across the industry.
Taiwan's automation industry is moving beyond the traditional race over robot-arm payload, servo precision, and sensor resolution. At the 2026 Automation Taipei and Taiwan Automation Intelligence and Robot Show, held August 19-22 at the Taipei Nangang Exhibition Center, the industry's major players all put the spotlight on AI software-hardware integration platforms and open robot architectures as the technologies will determine the next phase of competition.

At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES in Taipei on August 20, semiconductor, investment, and financial executives gathered to discuss the industry's next frontier. During the event, DIGITIMES deputy director Jason Tsai pointed out that as electricity supply struggles to keep pace with soaring compute demands, energy efficiency per unit of compute power will dictate the future fate of AI data centers.