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Aug 3
Amazon deepens OpenAI ties with US$50B AWS expansion
Amazon has completed the latest round of its US$50 billion investment in OpenAI, fully funding an originally conditional financing package that gives it about a 5% stake in the company and further deepens the two sides' long-term cooperation in cloud, AI chips, and infrastructure. For Amazon, this is not just an equity investment, but a strategic move to trade capital for AI compute demand and cloud growth.
AI-driven demand, new fab construction, and conflict-led raw material inflation are combining to squeeze semiconductor suppliers in 2026, according to Topco Scientific Co. senior CEO Dennis Chen. He said higher upstream costs are flowing through the industry, while shortages in wafer front-opening unified pods (FOUPs) are adding another layer of strain as manufacturers expand capacity and compete for inventory.
Riding continued investment in AI infrastructure, industrial PC (IPC) maker Advantech extended its strong growth momentum in the second quarter of 2026, posting record second-quarter revenue and earnings.
Unitree sees 1H26 revenue rise over 35% on humanoid robot demand
Aug 4, 07:53

China's leading humanoid robot maker Unitree Technology expects first-half 2026 revenue to reach roughly CNY1.1 billion (US$155.8 million), an increase of 35.6% to 45.4% year on year, as demand for embodied AI continues to grow and the company expands its business scale.

As generative AI moves from personal productivity tools into enterprise operations, most companies are discovering that scaling AI agents is less about ambition than reliability. Chunghwa Telecom Laboratories estimates that only about 5% of enterprises are using AI agents at scale, while roughly 80% remain stuck at the stage of making AI systems accurate, dependable, and controllable enough for production deployment.

RichWave Technology said at a recent earnings call that Wi-Fi 7 adoption continues to rise rapidly, with strong demand from telecom operators and retailers. The radio frequency (RF) front-end supplier said that the second half of 2026 should be slightly better than the first half of the year overall, but warned that tight supply of memory and passive components could affect shipment timing.

Roborock Technology has grown from its roots in China to become the world's leading robot vacuum brand, securing the top spot in the global market for three years in a row and beating the runner-up in 2025 by more than 10pp with a commanding 27% share of the market worldwide. As competition in its home market of China grows increasingly fierce, Roborock has instead seen overseas revenue surpass domestic revenue for the first time in 2025.
Delta Electronics is moving from planning to early shipments in high-voltage direct current (HVDC) systems as rising power demand from Nvidia's next-generation AI platforms pushes data center infrastructure toward a new architecture. Chairman Ping Cheng said HVDC has reached the shipment stage, with larger volumes still expected in 2027.
Coretronic said its OLED monitor business is gaining traction as new production lines ramp up, while car displays continue to expand. The company expects full-year OLED monitor shipments to rise 70% to 80% year-over-year, even as its weaker notebook business faces a sharp downturn.
China Steel Chemical Corporation has opened a new research and development center at its Pingtung plant as it expands into lithium battery anode materials, advanced carbon materials, and isostatic graphite. The move has implications beyond Taiwan, as global demand rises for electric vehicles, energy storage systems, AI servers, and semiconductor materials.

Asia Optical reported record operating profit for the second quarter of 2026, as consolidated revenue, gross profit and operating profit all increased from a year earlier. The company said the result was supported by three growth drivers that it expects to sustain momentum into the third quarter.

Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of its next-generation packaging technology, embedded multi-die interconnect bridge-through-silicon via (EMIB-T), positioning it to compete with TSMC.