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Exclusive: China 6-inch SiC substrate supply tightens, suppliers brace for another price hike

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Intel’s EMIB-T emerges as a backup option as CoWoS capacity tightens

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AUO unit plans to ride synergy gains momentum into entering TSMC ecosystem

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AI buildout lifts demand for China high-speed optical module makers

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SJSemi expands 2.5D packaging to 3.3-reticle size for AI and HPC chips

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Sep

3

2026

MiniMax, Z.ai revenues surge on API demand but adjusted losses widen

TIME AI 100 spotlights China's new AI guard, from Moonshot, Z.ai to AgiBot, Manus

SEMICON Taiwan 2026: Physical AI drives new demand for multimodal robot sensing

Yield has been semiconductor industry's oldest question; now it's Microsoft's test for AI

Sep

2

2026

Sandisk says HBF can match HBM bandwidth with up to 16x the capacity

Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth

Lam Research exec says automated preventive maintenance key to fabs of the future

DRAM giants target 3D stacking to break memory wall and power bottlenecks

Fresh off Nasdaq listing, Pasqal turns to Taiwan's photonics industry to help it scale

EU EV battery recycling still lacks a profitable model

Taiwan's semiconductor ecosystem has the UK taking notes

Nvidia and Micron top NT$4.4T in Taiwan investment

Zhen Ding launches 1.6T optical modules, 34-layer AI server boards at Semicon Taiwan to meet next-gen AI infrastructure demand

Samsung, SK Hynix inventories surge as valuation reserves fall

Semicon Taiwan 2026 to test cloud AI investment boom

Wonderful Hi-Tech expands Thailand, Vietnam capacity to capture emerging space data center, physical AI demand

World's first legged robot standard sets global benchmark for humanoids, robot dogs

Indium CEO: packaging, cooling and power are next AI bottlenecks

India reportedly readies AI agent payments on UPI, its national payment rails

TSMC moves into Baipu Industrial Park, boosts advanced packaging

TSMC reportedly asks suppliers to develop 5μm HBM microbumps

Certain Micro targets AI test-interface demand with three Semicon products

China's Galactic Energy puts PALLAS-1 in orbit, raising stakes in reusable rocket race

Energy and water: How to tackle the fab resource crunch

IBM's quantum pitch to chip audience: bottleneck is now manufacturing

MediaTek pushes advanced packaging and supply chain to keep pace with AI

Meta reportedly taps SeeYA for Phoenix OLEDoS panels as BOE fails to qualify

Operations shake-up: how SpaceX is reengineering its AI data center strategy

Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center

Manus resumes independent operations after Meta deal collapses

Hardware isn't the problem — TSMC exec flags software, substrate gaps in 3D IC

SDC to expand foldable iPhone OLED mass production in September

European chip ambitions hinge on more than subsidies, says TSMC

ByteDance-ZTE Nubia NaviX Ultra clears launch hurdle, takes agentic AI beyond smartphone assistants

Chinese foundry Hua Hong Grace adds 55,000-wpm Wuxi capacity in US$4.17 billion Phase III buildout

China moves to curb overseas price wars as automakers accelerate global expansion

Taiwan doesn't just want a quantum lab — it wants a quantum fab

TCL CSOT bets on InP laser chips as supply tightens

MCU chipmaker Sonix sees supply crunch lasting through 2026, memory shortage hits imaging shipments

GoPro to merge with Starman Optical in US$285 million deal, pivoting deeper into AI and defense markets

AI demand push expands wafer industry's growth outlook

Anthropic launches Claude Fable 5.1 and Mythos 5.1, cuts agentic-task costs by up to 45%

Taiwan materials makers see new opening in chip packaging shift

TSMC says Europe chip strategy is shifting from plans to demand creation

Gemtek deepens partnership with India's Dixon Technologies to expand optical transceiver, connectivity footprint

Dell says enterprise AI customers accelerated even faster than its record orders suggest

Dell's AI server boom lifts profitability across its whole business

Semicon Taiwan 2026 signals a broader race for AI-era semiconductor leadership

UMC targets 12-inch TFLN to break 400G SiPh bottleneck

Apple's M6 and M5 Ultra break rule tying process to chip strength

How Taiwan is closing its semiconductor materials gap — three shifts to watch

Deep Dive: CXMT challenges Pentagon as Trump-Xi meeting nears

Micro LED maker PlayNitride targets Micro LED optical communications within two years

Innolux targets advanced packaging with debut of Chip Last tech

Panasonic reportedly raises CCL and PP prices again as IC substrate costs jump 30%

AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks

US solar module capacity to lead by 2027, but cell and wafer shortages pose major hurdles

China memory-module makers report surging profits, strained cash flow

LG fights Chinese brands with innovation, business model shifts

Commentary: Malaysia wants foreign automotive investment to leave more behind

Chinese MRAM chipmaker ICY Tech rethinks HBM for rack-scale AI inference

Qisda builds physical AI ecosystem from land to space

Nvidia pushes into HBM base dies as NVHBM battle heats up

'Chinamaxxing' fuels China tech tourism as visitors flood Huaqiangbei

Taiwan eyes satellite communications to cut sea cable reliance

Global quantum industry accelerates as Taiwan eyes Asia hub

Tmytek to list on Innovation Board in September on antenna module growth

Gudeng pursues 'Taiwan Plus One' overseas strategy, says cost is not sole consideration

Plug and Play plans US$100 million Taiwan fund, hopes one of its next five unicorns is Taiwanese

Sep

1

2026

Taiwan carbon fee joins UK CBAM qualifying list

Taoyuan eyes northern AIDC hub, touts Tatan and LNG cooling edge

SK Hynix touts up to 5.15x inference gains with custom HBM

Samsung eyes early 2027 LPDDR5X-PIM production, touts 3.8x performance gain

Autonomous driving expands into Physical AI, creating new openings for Taiwan firms

Safety rewired: AI, robots on the front line at K-Safety Expo 2026

Japan's chip materials makers reportedly deepen Taiwan ties as AI reshapes supply chains

Taiwan chip equipment maker Skytech opens advanced process lab with TSMC backing

Imec CEO: AI era pushes broader ties between chip, model and CSP players

AI server demand lifts Japanese capacitor shipments by 22% in first half of 2026

ASE CEO describes AI resource squeeze as a short-term problem

Micron opens Tainan plant after 6.5 months amid labor dispute

South Korea CCL exports surge 42% on AI demand

Chinese smartphone brands raise prices as component costs climb

Marvell CTO: power and density bottlenecks are driving CPO adoption in AI data centers

Samsung Electro-Mechanics discloses major MLCC supply deal tied to AI server demand

Tim Cook concludes 15-year Apple tenure, John Ternus takes over

K-Safety Expo 2026 to open in Busan, spotlighting AI-driven safety technologies

Foxlink, Yongwei to sell Shinfox stake, cede control

Commentary: DeepSeek out, SMIC in? TIME100 AI maps China's widening AI battleground

Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan

BYD's overseas business overtakes China for the first time as price war erodes domestic margins

BYD widens overseas lead over Geely, but profits still lag

ASML says High NA EUV has reached its first high-volume logic product

Trymax lands multi-year AOI order as InP laser capacity race tightens

Tmytek moves toward Taiwan listing as millimeter-wave demand nears mass production

Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables

SEMI lifts 2028 wafer fab equipment forecast to US$220 billion

Z.ai runs GLM inference on 100,000 Chinese AI chips, eyes overseas CSPs

Chinese court freezes US$318M in Nexperia assets, further escalating corp rift

Imec maps chip scaling to 2040, says AI's next gains need full-stack integration

China's memory chipmakers post a record 1H — but not all of it came from chips

LG Energy Solution secures long-term US lithium supply

Apple reshuffles leadership, shifts Schiller out of App Store

TSMC delays CoWoS orders as CoPoS plans take shape

Anthropic's rumored US$35 billion Lambda deal shows how far Nvidia will go to bankroll its own customers

Analysis: CXMT's US$11.5B profit surge raises the stakes in China's AI memory race

JCET lifts 2026 capex to CNY10 billion as AI packaging demand outruns forecasts

XCENA teams up with Samsung on rack-scale CXL memory; demos on Intel Xeon 6

Samsung locks 70% of memory output as HBM spot prices soar

Cisco: CPO is ready for mass deployment amid surging AI data-center demand

Huawei's revenue climbs 9.6%, but AI, chips and HarmonyOS exact heavier R&D toll

South Korea-India joint venture opens semiconductor materials plant, targets China-free supply chain

Commentary: CXMT's HBM3E leap gives China's AI chipmakers a new path to scale

China's humanoid robot cost cuts run into three bottlenecks

India expands chip ambitions with full Semicon 2.0 notification

China reportedly moves space computing from concept towards commercial deployment

Taiwan clears Lam Research's NT$9.8 billion subsidiary injection as etch leader scales R&D worldwide

Taiwan's G2C+ Alliance members target global markets

Semicon Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts

Nvidia's MediaTek investment signals broader push to shape AI infrastructure

Nvidia and MediaTek link AI technologies in bid to accelerate custom data center chip adoption

China's Xenomi LLM brings quantum computing into AI agent decision-making

Buima returns to profit in the second quarter on battery module demand

Commentary: Why America fell behind on Open models — and how Nvidia plans to close the gap

Nvidia targets HBM race with custom NVHBM, expands NVLink Fusion

Taiwan workplace AI use reaches 96% as employers push skills upgrades

Samsung weighs HBM4 bonuses as memory, foundry teams align

AI server cooling specialist Nidec expands Vietnam capacity, forms liquid-cooling team

Humanoid robots gain a sense of touch, lifting tactile sensor adoption above 60%

Taiwan manufacturing moves into the prosperity zone as US export growth slows

Acme sees years of SiC growth as data center demand builds

OpenAI compresses Jalapeno design to 9 months

Luxnet eyes orders through 2028, DCI revenue set to double in 2027

Kaimei sees 2H26 momentum strengthen as AI demand lifts orders and resistor price hikes take effect

Silergy data center business surges as new products scale up

LGD launches PFAS exit roadmap, targets full phaseout by 2035

Samsung is said to develop 8-layer HBM4E for Nvidia's NVHBM push

Chinese OSAT earnings surge on AI packaging demand, but recurring profit tells a narrower story

AI Macs, Part 2: Mac mini, Mac Studio gain enterprise AI ground; Apple still lacks the platform

China specialty foundry XMC plans fourfold capacity growth around 3D integration, silicon photonics

SK Hynix explores Intel as second source for HBM base dies

John Ternus takes over an Apple with one growth engine, no obvious second

Analysis: Tim Cook hands Ternus a slower-growing but far richer Apple than the one Steve Jobs left him

Aug

31

2026

Nvidia takes US$3.5 billion of MediaTek's record US$3.9 billion convertible bond

China urges pragmatism over hype in rapidly expanding humanoid robotics market

Smart manufacturing, robotics drive renewed growth in industrial PCs

Taiwan drone bill dispute leaves NT$240 billion procurement plan in limbo

Gudeng sees double-digit advanced packaging growth from 2027

U-Best races to launch PFAS-free coatings by 1Q27

Marvell sees 2027 acceleration in scale-up optics

Nvidia demand nearly doubles as supply meets only 70%

TSMC tackles the AI I/O wall with two COUPE bandwidth paths and deeper heterogeneous integration

AI Macs, Part 1: OpenAI reportedly buys tens of thousands of Macs for reinforcement learning

Unimicron search puts spotlight on cross-border manufacturing for Taiwan's electronics sector

Update: SK Hynix breaks silence on Japan expansion rumors

TSMC sees SiPh going mainstream in 2027

Agentrys, agentic chip design startup backed by MediaTek, raises US$24.5M in funding

ASE: CPO scale-out demands deeper supply-chain coordination for mass production

The 72.4% dominance: China's battery lead is now a chemistry problem for South Korea

Gudeng chairman says trust underpins Taiwan supply chains amid Unimicron row

Unimicron stock prices fall 10% daily limit, says origin probe covers PCBs, not substrates

US weighs limits on China's access to chips in overseas data centers

The architect of Apple's China machine also built its hardest problem

Cook made sustainability an Apple feature; the ledger he leaves John Ternus is mixed

Taiwan vendors chase India's wireless broadband opportunity, with Alpha Networks in the lead

Kingboard Laminates raises prices again as CCL shortages deepen

MetaX posts first-half profit while China's AI GPU rivals split

CXMT's global DRAM push runs into US curbs

OpenAI to pull its models from Cursor, highlighting tension with SpaceX's Elon Musk

Samsung Galaxy Z Fold8 demand surges, straining UMC 22nm DDI supply

Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging

South Korea risks 'HBM 2.0' trap in emerging CPO market

CXMT starts LPDDR6 mass production for Xiaomi 18 Fold, claiming global first

US rallies 24 nations to compete for 6G

Asus launches physical AI business group, shifting from EMS to humanoid robots

China silicon wafers enter AI-led upcycle: prices rise, 12-inch capacity expands

Taiwan manufacturing know-how is key physical AI asset

SiFive BigSky brings RISC-V into data centers with CUDA, Nvidia links and enterprise Linux

Commentary: Malaysia's China dilemma sits at the heart of GATE 2026

Interview: Taiwan's National Atomic Research Institute eyes SMRs for AI power shift

Chinese robotaxis head for Seoul as Pony.ai and FutureLink plan a 200-vehicle fleet

Musk tackles key AI power bottleneck with in-house turbine foundry

AI smart glasses race heats up as MEMS enable wearability

China's silicon wafer makers report profit gains of varying quality

Taisic Materials produces Taiwan's first 12-inch SiC boule with homegrown crystal growth furnace

Weekly news roundup: US pressures Korea chip investment, MediaTek wins Google TPU, Apple debuts 2nm M6

France draws Taiwanese investment projects worth EUR7.5 billion

Lightel posts record first-half revenue, profit as LEO satellite demand rises

Samsung launches Galaxy S26 FE with lower price

India roundup: India broadens semiconductor and AI ambitions across manufacturing, design, materials and data centers

Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff

China optical display investment shrinks 80% in 1H26

USI advances optical interconnect push with ELSFP laser module

Repon to ship Vera Rubin rails in August, ramp ASIC in September

Tex Year's specialty chemicals push could reshape its growth mix as AI and optics expand

MCE expands auto electronics capacity to defend Malaysia's domestic market

AI pushes autonomous driving toward a more pragmatic commercial model

Aug

30

2026

Innodisk says AI demand is lifting margins while memory supply remains tight

Shinkong Synthetic Fibers eyes cautious 2H26 on higher-value, recycled materials

China writes its first national liquid-cooling standard as AI racks approach 1MW

Humanoid robot shipments top 22,000 in 1H26 as industrial use gains ground

Nvidia's US$36 billion cloud commitments expose the limits of vertical influence

Aug

29

2026

Samsung bets on JWMT: can glass substrates flip the script for South Korea in advanced packaging?

China's dexterous-hand makers take center stage as three technology paths vie for humanoid robotics

Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM

Research Insight: Humanoid robots near mass production as suppliers face precision, ramp-up test

A smuggled motorcycle exposes what Taiwan's makers stopped building

Inside TSMC's 238-page sustainability report: nine things that matter more than they look

Exclusive Interview: Turning scale into value — AUO chair's post-LCD ambition

Aug

28

2026

Update: ABF substrate maker Unimicron searched in origin-labeling probe

Winstar's AI push gains momentum with some orders extending into 2027

Humanoid robot demand boosts planetary gear reducers

Foxconn eyes higher margins with push beyond contract manufacturing

ASIC makers see CSP orders stay strong through 2028

Apple's M6 marks a transitional step before wider 2nm adoption

Huawei targets 100 million HarmonyOS 6 devices, paving way for global expansion next

China chip profits jump 18.5-fold on AI demand; advanced-node self-sufficiency seen at 66% by 2035

Jingwei Hirain targets Malaysia, ASEAN smart mobility supply chains

KKCompany taps PressPlay to expand into knowledge learning, creator economy

Anthropic sets sights on custom hardware to fuel AI ambitions, reportedly eyed $7B MatX deal

Anthropic wins key ruling as judge voids Pentagon blacklist

AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

US still pinning down AI approach as plans for self-regulating body reportedly stall

China memory catch-up broadens: YMTC closes in on SK Hynix NAND share, CXMT advances DRAM tech

Pioneering sustainable water solutions in Asia-Pacific data centers

Hiroca Holdings 2Q26 loss narrows as China plant consolidation supports recovery

Taiwan Mobile acquisition of Systex moves forward as review committee deems terms fair, reasonable

China's Kaizhong eyes data centers and dexterous hands

Huawei's Ascend 910C sold out in China, but Nvidia's H200 supply gap persists

Nvidia forms PAC to expand Washington lobbying

Nvidia's upbeat outlook points to tighter AI supply chains ahead

Samsung eyes zHBM products from 2029 as heat remains key hurdle

Exemption that shields US$143 billion of US server imports is now on the table

Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production

Insight: China's next AI frontier is silicon, not smarter models

Taiwan passes drone procurement bill allocating NT$240 billion for 6 years

Long-term contracts tie up InP capacity due to data center optics demand

Analysis: Nvidia beats, Taiwan wins — and hyperscalers race to make AI pay

Exclusive: IC design faces wire bonding bottleneck in 2027

SK Hynix weighs closer ties with Kioxia in NAND

YMTC builds China chip supply chain around Wuhan fabs with 'Wutong Tree' Plan

Vanguard says Taoyuan fab fire did not disrupt production

Lam Research breaks ground on Oregon lab expansion for AI chip development

Anthropic opens research preview of hardware standard for AI agents

Renesas opens physical AI, robotics lab in Beijing

Google moves AI safety team into global affairs in DeepMind overhaul

Workday says Taiwan, Hong Kong firms lag in AI workflow integration

Marvell raises its outlook twice in two quarters as custom silicon, scale-up optics broaden

Kioxia, Sandisk plan more than US$31 billion in Japan investments

SK Hynix breaks ground on US$4 billion Indiana plant that will package, not make, HBM

Marvell revenue climbs 37% to a record US$2.74 billion on data center demand

Honor Robot Phone enters mass production, making robotics central to its premium AI strategy

LG Innotek wins Zoox camera module order for robotaxi production

Samsung absorbs memory costs to chase smartphone crown

Taiwan's next biotech prescription: AI drug discovery, smart devices, biomedical chips

IntelliEPI says Japan substrate outage hit 2Q26 revenue

Global LCD TV shipments above 70 inches rise as large-screen prices fall

China rises to No. 2 in global CMOS image sensors, overtaking Korea with 21% share

China's humanoid boom hits its next bottleneck: making robots measurable, interoperable, safe

China reshapes helium supply chain as semiconductor demand rises, import risks persist

China's industrial reboot: AI, chips, robotics, 6G define next five years

Wah Lee targets 2Q27 ODM phase as robotics push moves beyond components

US targets Singapore's Apex Logistics in widening probe into illicit Nvidia chip smuggling to China

Regulators fast-track lithium battery M&As as China shifts from capacity expansion to consolidation

AI chip demand squeezes capacity, Data Image secures 1-year supply

HITCON expands Taiwan's cybersecurity focus from agentic AI to post-quantum cryptography

P-Duke Technology optimistic on 2H26 growth as demand surges across three niche markets