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Home Tech Semiconductors

UMC targets 12-inch TFLN to break 400G SiPh bottleneck

Siu Han

Siu Han

, Taipei

Sep 2, 2026, 08:33 0

As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations...

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Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing

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