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REALTIME NEWS

Xiaomi-backed RISC-V chip designer Nuclei starts IPO process

Tomorrow's Headlines

Xpeng expands Turing chip from EVs into humanoid robots

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Corning sees CPO and glass core as new semiconductor battlegrounds

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China optical transceivers avoid US FCC curbs as NPO and CPO compete in high-speed links

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China's AIDC token costs hinge on access to advanced GPUs

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Sep

14

2026

Australia sets LNG reserve rules to protect domestic supply and cap prices

Kokusai Electric gains from Hitachi split as AI memory demand surges

LG sells 15 US image patents to Honor as IP monetization expands

UAE commits EUR40B to expand Germany ties in AI, energy and defense

Taiwan drone maker Twoway breaks into US defense supply chain with Oklahoma procurement deal

Yole Group takes outside capital for the first time, selling minority stake to new French fund

Fujitsu's Monaka targets 2027 mass production with TSMC 2nm boost

AI power demand pushes Taiwan to overhaul energy rules

AI demand lifts UMC, VIS, PSMC revenue

Behind the BRICS handshake: How far can the China-India reset go?

Samsung, SK Hynix reject US$19 billion power prepayment as Korea speeds chip expansion

STMicro lead times top 1 year, boosting Taiwan chip makers

DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker

Taiwan eases investment rules for AI center infrastructure projects

DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up

China optical firms target photonics with mixed high-end, lower-cost push

China accelerates e-SIM's leap from wearables to smartphones

Foxconn subsidiary broadens AI interconnect role as 1.6T enters deployment

DIGITIMES Insight: China's GaN challengers are no longer playing catch-up

Beijing municipality bans civilian drones starting mid-November

Sandisk recruits engineers in Korea as memory talent race heats up

South Korea broadens espionage law to counter rising tech leaks

Gogoro sees turnaround ahead of schedule as Vietnam rollout gathers pace

LG Display's AI transformation turns employees into AI builders, yielding 450+ in-house projects

Taiwan taps Amazon Leo for next-generation government satellite network

Z.ai reloads with US$5 billion for China's AI race

Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist

Gritek to take full control of 12-inch silicon wafer venture in major restructuring

iPhone Duo's price opens room for Android rivals

AI's energy demand ignites global nuclear rush, straining Taiwan's restart

Foldable smartphone panel shipments to grow 23% in 2026

Lab self-investigations show AI agents improvising past their own guardrails

China's OLED expansion narrows South Korea's auto, IT panel lead

Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues

India semiconductor deals hit a multi-year high ahead of SEMICON India 2026

Hua Hong Grace completes Huali Micoelectronics acquisition, state parent raises stake

CPO nears mass production — next battle about interfaces, yield and maintenance

US finalizes anti-dumping and anti-subsidy duties on solar imports from India, Indonesia, and Laos

AI server tracker: Taiwan ASIC design houses diverge as AI projects enter different revenue cycles

AI server tracker: Taiwan testing suppliers accelerate as AI chip complexity raises interface demand

The case for an AI speed limit collapsed in a weekend

AI labs ask to be slowed, Congress stirs, and Nvidia calls the alarm a sales pitch

A Taiwan PCB maker's China affiliate is worth three times its parent — and the parent just bought more of it

India's chip show nearly doubles in two years, with suppliers leading the build-out

CoreIntelligence Holdings posts 6% revenue growth in first 8 months as optical ASP soars and energy-saving products grow

AI infrastructure race shifts to Grid-to-Chip as Foxconn, Delta, Flex converge on the same track

Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout

Blokcert launches Gefjon AI to help Taiwan charging operators improve profitability as EV demand rebounds

Hiroca revenue jumps 35% as auto summer slowdown fades

Lite-On revenue rises in August on cloud power demand

Aurotek posts record August revenue on semiconductor, robot shipments

Renesas readies second price hike amid stronger power-chip demand

India roundup: India says it cannot build electronics without China

Image Match Design wins exclusive fingerprint module role in African ID project

AI agents drive token use 300-600x, Dell Taiwan says

Shihlin Electric eyes orders through 2029 as T4 plant starts in 2027

Sep

13

2026

China's robot champions can run; now they have to prove they can earn

AI, 5G upgrades lift Taiwan's top three telecoms in August

Column: What is SLAM? The first step in Physical AI

China auto exports hold above 1 million as new energy shipments surge

AI server exports to US slow; electronics parts jump 1.5 times in August

AI server tracker: Taiwan optics race beyond 1.6T

Delays trim CAEC August sales, but UPS demand outlook stays firm

Taiwan's BTL builds new plant for high-power AI server testing, eyeing 4Q27 launch

Artery secures spot in Arm ecosystem, pushing high-end MCUs into robotics, physical AI

HannStar to halve panel output as layoffs and a management exit fuel closure talk

Sep

12

2026

Europe buys time in the LEO race as Eutelsat extends OneWeb toward the IRIS² era

Renault sets 2-year car development quality line

Rethinking defense perimeters, supply chain resilience in the AI era

Analysis: Speed built Colossus, yet redundancy may decide whether SpaceX can scale it

Apple foldable plans drive new demand for Japanese smartphone parts makers

Exclusive: ASUS xHIS aims to become digital backbone for AI-ready healthcare

AI server boom reshuffles MLCC supply, opening a rare expansion window for Taiwan makers

Murata targets mass production of its AI power substrate next year

Taiwan sees AI-era power upgrade openings in France

Pegatron's AI server engine starts to outweigh notebook drag, with Apple adding lift

Commentary: Apple sends off Cook with a foldable flourish, but Ternus's trial is still ahead

ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs

Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line

Luxshare eyes AR glasses breakthrough through car HUD model

Charts: Taiwan's AI supply chain growth moves from cooling to rack hardware

Sep

11

2026

Why Chinese automakers' aggressive push only further tightens CATL's grip

ASE to buy AOI, AVI equipment from Machvision for NT$334M

Kioxia eyes US listing amid NAND profit rebound

Apple phones drive premium upgrade wave for carriers

Taiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment

ficonTEC breaks CPO test bottleneck, teams with Hermes Testing

Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says

Samsung Electro-Mechanics, LG Innotek vie in AI package substrates

Memory makers gain the upper hand as Apple's iPhones pay the price

Enflame enters public markets with Nvidia alternatives in its sights

Huawei stakes out the AI optics rulebook with 7.2Tbps NPO

AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging

CPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor

Beyond Earth's orbit: how Besxar, Space Forge, Varda, BioOrbit, Voyager are industrializing space

Innolux factory shift could reshape InnoCare's supply chain and growth mix

China's DRAM supply chain clears another materials hurdle

CIOE 2026: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

Samsung's Exynos gains ground as Galaxy S26 lifts share to 9%

Taiwan govt boosts EDA R&D to target global gaps

CIOE 2026: Automotive optical-module demand could rival FTTx shipments by 2030

China's energy storage capacity surges 50-fold in five years, sparking crackdown on lithium battery expansion

AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle

Apple cracks mmWave with C2, weakening Qualcomm's last big iPhone modem edge

Micron Taiwan junior engineers to average NT$3.4 million, production workers up to 68 months’ pay amid memory boom

Nvidia expands Australian AI factory push as global demand rises

Apple's new chip packaging boosts A20 Pro AI power, pushing MediaTek, Qualcomm to follow suit

CIOE 2026: Smartphone camera market faces deeper slump as Apple draws attention in Shenzhen

Altera eyes $2B IPO, from Intel carve-out to public debut

SK Hynix raises cash portion of bonuses after 25-vote union rejection

Huawei, Xiaomi, Apple take different bets on foldables

Global drone supply chain accelerates de-China shift, Taiwan wins

FCC closes a chip-level loophole while media debate another White House retreat

Taiwan tech minister in Europe to advance semiconductor cooperation

AI server tracker: Taiwan's rack supply chain reveals where the AI buildout is accelerating

ASPEED plans December BMC price hikes to fuel server security footprint

Anthropic disrupts Chinese AI firms' attempts to extract Claude capabilities

Pentagon reportedly weighs US$5B loan to AI infrastructure startup Fluidstack

Jensen Huang bets Nvidia's next leg of growth on turning AI compute into an investable asset

Nvidia's US$13 billion Hugging Face deal bets physical AI can start at US$400, not US$40,000

Oracle's AI cloud build-out is now rewriting its cost structure

Oracle turns its AI build-out into a delivery number, the cost lands where management said it would

AI server tracker: Taiwan's August filings say demand is still accelerating

iPhone Duo leads Apple's new lineup as market stays split

MediaTek August revenue beats expectations, boosts 3Q outlook

Apple's foldable arrives late to a supply chain already moving on

Apple makes the hinge, not the screen, the centerpiece of its first foldable

Rayzher rides semiconductor fab buildout to record revenue

Taiwan startup taps CMOS infrared chips to give robots an electronic 'nose'

China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing

d-Matrix brings Raptor chips to Nvidia racks as falling token prices pressure GPU economics

Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%

ProLogium deepens partnership with Kyushu Electric Power through strategic investment

Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT

Samsung, SK Hynix eye 2028 High-NA DRAM rollout

Academia Sinica to open 8-inch quantum chip platform in September 2026

Nuvoton sees robots driving MCU demand over next decade

Foxconn's global expansion signals a longer-term manufacturing shift

TPK, GIS post mixed August sales as 2H26 demand stays cautious

Quantum computer development is more about national security than profits, says expert

More memory won't fix AI's bottleneck, says Microsoft's Azure hardware chief

Sep

10

2026

ITRI to showcase 3.2T silicon photonics and AI data center cooling

Taiwan pushes smart health care partnerships at Singapore medical trade show

Meta loses key AI researcher after billion-dollar hiring push

Taiwan EV charging operators face profit squeeze despite rapid network expansion

MicroIP lands NT$630 million AI smart-building contract in northern Taiwan

Murata to stop some MLCC lines as AI server demand strains supply

Samsung pushes into display-equipped smart glasses as Meta leads market

STMicroelectronics sets 2027 AI revenue plan with fiber chips at 80%

Taiwan quantum leap expands scope to drug and finance

Nanoprinting lithography shifts from round to square, increasing waveguide output

Huachuang Xinguang sees MicroLED optical interconnects entering data centers in 3 to 5 years

US Justice Department probes Nvidia-Groq deal over antitrust concerns

ASE August revenue tops NT$80 billion record as AI packaging capacity stays sold out

Navigating economies of scale: how South Korea and China are reshaping the OLED market

Foxsemicon hits record 2Q26 revenue on Thailand ramp-up

Shinkong Synthetic Fibers partners with Earthbook, Jedsy to tap Taiwan's medical drone logistics market

Jeter August revenue rises on AI server shipments

Gem Terminal rides China plug rule shift for 8.8% sales growth

AUO matching glass substrate size stokes TSMC collab speculation

Apple added flat US$100 to every iPhone and rebuilt A20 Pro around memory

China's Nvidia rivals raise prices as HBM shortage bites

Taiwan nuclear drill simulates drone attack, drawing on Ukraine war lessons

Intelligo targets double-digit 2027 revenue growth on AI IP, ASICs

TSMC August 2026 revenue jumps 53.3% as AI chip demand drives record growth

Enflame to list on Septemper 11 as China's four major domestic GPU makers complete IPOs

India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it

China sets clear limits on payment terms to auto suppliers

Taiwan chipmakers target humanoid robots beyond the 'brain,' focusing on vision, motor control

DeepSeek reportedly advances Shanghai IPO plans as it cuts Flash model API prices

Spirox TGV inspection capable of scanning entire substrate in 20 minutes

Europe's BEV running costs now 33% below ICE

Hermes Testing ships membrane probe cards, targets SiPh and CPO

Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens

AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand

STMicroelectronics ties AI data center carbon cuts to power design, not location

Samsung SDS partners with OpenAI and Anthropic in AI push

Powerlogic revenue rises for 3rd straight month on niche demand

Wistron, Wiwynn hit record August revenue as board approves US$200 Million for US, Vietnam expansion

DeepSeek's next AI test is not the model; it's everything around it

Phison pushes in-house AI solutions as August revenue surges to record high

DB HiTek completes reliability qualification for 8-inch SiC MOSFET process

Firmus, OpenAI strike compute deal for Malaysia AI factories

Compute-in-memory returns to the spotlight with edge AI's power, memory squeeze

Naver pitches a Europe-facing AI factory to France as Brookfield deal moves ahead

Samsung SDS broadens AI push from software to factory robots

JD Cloud plans 100,000-GPU cluster built on Moore Threads chips

SK Hynix says 3D DRAM will borrow from logic foundry playbook

Korea puts KRW250 billion behind free national AI service as frontier-model fund takes shape

China gets an early shot at the next SiC power-chip cycle

Beyond the stage, can XPeng's EV playbook scale humanoid robots?

Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

Samsung trims foundry partner network as remaining DSPs gain momentum

Cheap, energy-dense, difficult to tame: LG Energy Solution pushes LMR closer to EVs

CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap

CIOE 2026: Morphotonics draws on display background to break AR waveguide bottlenecks

Apple's iPhone Duo raises the stakes for foldable smartphone cameras

China's 6G race starts before the first 6G phone as satellite links move into the network core

Wiwynn sees AI server shipments to overtake general-purpose servers in 3Q26

Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans

Apple just put a US$700 premium on hinges — seven supply chain takeaways

Apple's John Ternus puts iPhone at AI center stage

Apple's A20 Pro pushes mobile chips into the 2nm era — but AI may be the bigger disruption

Apple's 100-part iPhone Duo hinge puts spotlight on Chinese suppliers

Panasonic Energy unveils high-temperature solid-state battery, targets industrial uses, robotics

Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers

Samsung India reportedly cuts jobs as memory costs squeeze electronics unit

Qualcomm's AWS deal raises stakes for MediaTek and Alchip

Analysis: China chases EUV as chipmakers move to High-NA

Sumitomo, Sakana AI reportedly team up to expand Japan-made AI

Europe and US IDM grid-to-core push challenges Taiwan power modules

Taiwan hardware strength meets open-source gap

STMicro sees AI sales accelerating as factory transfers hold key to margin recovery

Google plans EUR13 billion Finland investment to expand data centers, clean energy

Analog Devices agrees to buy Alif Semiconductor to expand edge AI push

Himax launches eDP TDDI for smart cockpit displays

Yageo's August revenue hits record on AI demand

How AI and global expansion are reshaping semiconductor recruitment to production, tech integration

Arm launches second-generation CSS, targets China's AI smartphone market with C2 CPU

Global PMX sees semiconductor parts shipments strengthen

AI server ODMs face widening component mismatches, with shortages reaching 15–20%

SuperAlloy advances semiconductor aluminum certification

Silicon photonics boom could push InP supply-demand gap above 70%, triggering race for strategic optical resources

Taiwan IC design firms seek government subsidies for advanced chip development

Flex's EPC Power deal points to a broader shift in AI infrastructure

Confidence in Germany's auto repair sector slips, even as demand hits record high

Hiwin supply deal with Semes points to deeper access in South Korea's memory equipment market

Three open source foundations share one stage in Shanghai

Taiwan virtual asset alliance builds next-gen financial infrastructure

Song Chuan rides 800V HVDC upgrade wave, posts record 2Q26 sales

Acer's PC, non-PC businesses drive 13-year revenue high

Chenbro Micom August revenue dips, core projects unchanged

Apple names 2nm node for the first time since 2024 — and raises prices on every iPhone it still sells

Apple bets on new sensors and S11 chip to differentiate its 2026 watches

Apple's first foldable lands at US$1,999, and constraint is the panel

Sep

9

2026

AI servers push Asus' August revenue up 51%

OpenAI's deeper Samsung tie-up lands on a foundry that is running out of capacity

AI computing power propels tech sector to US$30 trillion, putting servers at the core of 2027's supply chain

Samsung, LG secure roles as key suppliers for Apple's foldable iPhone

Enterprise AI spending gives Taiwan's Systex a new growth wing

Huaqin signs Nanchang projects as robotics push widens

Cambricon wins PyTorch Foundation board seat in bid to strengthen China AI chip software ecosystem

Jin Lian Cheng expands into semiconductor wafer fab UPS battery recycling

Ledlink Optics posts 21-month revenue high on AI server, auto demand

Google steps up green power purchases in Taiwan for 24/7 carbon-free electricity

China Rapidly Expands OLED Production to Target South Korea’s Market Share

China reportedly tightens humanoid robot IPO rules as market mania meets reality

CIOE 2026: Luxshare bets on flat optics to solve AR glasses' weight problem

Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

Getac sees growing drone orders, with 2027 revenue contribution reaching up to 12%

Realtek expands cloud AI push with ASIC and SSD chips

Ample Electronic hits 120% utilization as MLCC customers step up copper paste orders

Kioxia rules out deeper SK Hynix ties, resists further NAND price hikes

Update: US finalizes US$775 million in CHIPS quantum awards, with equity attached

Verizon, Corning strike multi-billion-dollar fiber deal for broadband and AI buildout

Y.S. Tech's Renwu plant lifts August sales

Amkor expands Arizona chip campus with phase 2 plan

China's up to 99.2% anti-dumping duty on Japan DCS boosts local chip material suppliers

CXMT's 10% DRAM share intensifies debate over South Korea's 52-hour workweek

Ability Enterprises August revenue hits 10-year high on AI vision, drones, robot cameras

LG Display wins Sharp OLED TV supply deal for 2026 turnaround

JD.com's real target with 3 million robots: physical AI

Weblink posts record August revenue on AI, premium computing demand

Foxtron clears another hurdle in the race to make SDVs globally compliant

Sysgration expands Taiwan, US drone manufacturing as procurement plans advance

Smart applications boost AOPEN, Acerpure revenue

Thailand pauses 49 data center projects

Asia Vital revenue hits record as US CSP ASIC server demand climbs

Axcelis to build new Korea manufacturing site in US$35 million expansion

China's AI meets photonics: CIOE, IICIE, and elexcon open together in Shenzhen

Huawei orchestrates China's DUV lithography push to cut reliance on ASML

Commentary: Huawei's Kirin comeback, Xiaomi's Xring entry widen China's chipmaking race

LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up

Huawei Qiankun turns 2 million cars into its next assisted-driving advantage

SEMIFIVE begins HyperAccel chip production on Samsung 4nm as capacity tightens

Apple yields to memory suppliers in historic strategy shift, with Kioxia tipped as NAND long-term agreement recipient

India's HCLTech opens semiconductor lab in Bengaluru to serve global chip supply chains

IT panel peak season loses its edge after brands stocked too early

European automakers expand China software teams amid layoffs

China's AI computing plan targets sixfold growth, 100,000-card clusters

Cambricon takes a PyTorch Foundation board seat as China's chip challengers turn to software

Exclusive Interview: WG Tech sees a faster route for TGV beyond displays

Samsung-led EUR3B funding round nearly doubles Mistral's valuation

US security agencies tell AI firms to degrade answers to suspected Chinese distillation traffic in secret

Arm expands push for agentic AI infrastructure with new Neoverse chip design

Mature-node chip scramble may persist through 2028 as supply chain management becomes bargaining leverage

Chinese automakers face globalization test in overseas push

Accenture, Google Cloud launch global Gemini Enterprise business group

Apple may delay iPhone 18 base model to 1Q27

Preferred Networks eyes an IPO as Japan's AI chip ambitions outgrow private funding

Meta ships Muse as its agent bet, waging faster model cadence can close the frontier gap

ASML chooses Netherlands for major expansion after warning it could build abroad

Qualcomm to build custom AI inference chips for AWS

China GPU developer Biren expands AI chip R&D into optical interconnects, advanced cooling

SDC, LGD target advanced glass packaging

CSPs expand Malaysia AI server hubs as Southeast Asia grows

Backed by Nanya partnership, PieceMakers eyes AI memory upgrade boom

Taiwan's chip research agencies overlap on two new 300mm fabs

Taiwanese suppliers are being demoted to second tier as Xiaomi squeezes prices

WinWay revenue surges on AI chip pin-count demand

Arm expands AI platform strategy across cloud, robotics and mobile

Uber Eats names Samuel Li Taiwan GM

IQE returns to profit in 1H26, warns on China InP risk

Taiwan Mobile moves into enterprise AI integration with Systex

Industrial AI needs eyes: Sony tests its sensor edge in Aramco's physical world

Realtek expands Wi-Fi 8, optical communications, ASICs, keeps Nvidia partnership low-profile

OpenAI taps Firmus for Malaysia data center capacity

Samsung's Taylor fab reportedly fully booked before 2nm production begins

Lotte Energy Materials pivots from EV weakness to AI, ESS copper foil

LCD supply could tighten by 2028 as Taiwan sells its fabs to chipmakers

Analysis: When 72% of the world's EV batteries are Chinese, one defect travels

Syrma SGS Elemaster opens electronics plant in southern India to serve global markets

Indonesia bets on a full EV supply chain as BYD opens its Subang plant

Tesla's Cybercab hits the road, but regulation may become autonomy's next scaling bottleneck

Sep

8

2026

Kian Shen eyes stronger 3Q26 on chassis, lightweight frames, Lean3

CIOE 2026: FIT wins Amphenol patent license, expands AI interconnect push

Ma-tek August revenue hits record, eyes U.S. FA, MA service in 2027

AIDC wins 20-year Bombardier contract to expand business jet work

SmallSat 2026: Two bottlenecks and four trends reshaping satellite industry

LG's robot actuator push turns appliance know-how into a physical AI supply-chain bet

US chip tariffs raise stakes for Samsung, SK Hynix's US memory plans

PCB maker Zhen Ding tops US$634M August revenue on AI server, optical module demand

Xiaomi debuts 18 fold to challenge Huawei and Samsung in wide-screen foldable race

What to expect at CIOE 2026, Shenzhen's optoelectronics mega-expo

US chip investment push puts ownership at center of Korea's $200 billion deal

Samsung speeds silicon photonics test plan with TSMC-vetted probe vendors

CXMT sees tight DRAM supply through 2H26, accelerates server memory and China-made tool validation

Samsung boosts Galaxy A series output as rivals cut lower-end phones

ChenFull Precision expands from defense and semiconductor equipment into quantum computing

ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline

Xiaomi debuts Xiaomi 18 Fold and mid-to-high-end lineup to defend 100M shipment target amid rising memory costs

Ennoconn reports August growth as Kontron stake rises to 48.36%

CPO testing faces hurdles from Insertion 1 to 4, with '100% testing' expected to accelerate in 2027

Advantech to open North America HQ and expand US manufacturing

Nvidia reportedly shifts Rubin Ultra toward 8-high HBM as memory costs rise

Huawei shifts AI battle to HarmonyOS 7, turning Celia into system-level agent

Kinko revenue climbs monthly, August sales jump 107%

Intel CPU prices reportedly rising 10% again as Qualcomm and MediaTek target IPC and IoT gaps

Renewable power shortage puts Taiwan's chip cluster under scrutiny

CIOE 2026: 5,000 exhibitors gather in Shenzhen to chase AI-driven optics boom

Samsung allocates more than half of 4nm foundry capacity to HBM4

iPhone 18 Pro prices tipped to cross CNY10,000 as Apple faces China pricing test

Tungsten hexafluoride supply chain alerts as Peric expands

Chicony targets 2027 robot startup shipments as notebook sales soften

Malaysia weighs Huawei Ascend 910C for MYR2 billion sovereign AI cloud

ViTrox rides AI demand, expands Taiwan push as Malaysia semiconductor base grows

Sercomm revenue surges past 3Q25 on North America upgrades

Taiwan panel capacity shifts push TV brands to stock up as LCD price declines slow

Analysis: Imec's EUV edge raises question over how far Taiwan should replicate research fab model

Chinese smartphone price hikes squeeze Southeast Asia: shipments fall 23%, low-end demand retreats

Huawei holds the price line for new Kirin-powered Mate XT 2

Huawei Kirin 9050 Pro puts LogicFolding to the test with 55% density gain, 66% lower NPU power

Privacy displays become a premium smartphone battleground as Huawei brings one to a foldable

Macronix, Winbond, Etron see revenue surge through August as memory price rally continues

Adata, Team Group post record August revenue as memory module makers build inventory for 2027

TSMC's co-COO left ITRI in 1987 for a startup foundry — ITRI just named him a laureate

Infineon COO leaves a US fab open, says GlobalFoundries, ESMC already cover it

Nvidia underwrites its own demand; that may be harder to copy than its chips

SK Hynix weighs Gwangju investment as Yongin buildout continues

South Korea's UBATT targets 500 Wh/kg lithium-metal batteries for drone and defense markets

Corning targets AI bottlenecks with glass substrates, optics for high-speed data transmission

SST market grows 32% as global players race to secure position

Taiwan and Saxony start building the talent pipeline behind TSMC's German fab

Acer Asia units post double-digit growth on strong AI orders

BYD weighs US$1B car-carrier order to support surging EV exports

FitTech shifts from LED to optical communications, eyes InP relief

US-China space race expands from Moon landings to LEO satellite constellations and orbital computing

Accton sets August revenue record as AI networking demand surges

India's IndieSemiC targets 3 to 5 million Wi-Fi camera modules as local CCTV rules spur demand

Interview: California companies highlight synergy between the state and Taiwan

Black Sesame, Horizon Robotics unveil China's smart driving chip race

Innolux, AUO take display technology into AI chips with FOPLP, glass substrates, Micro LED CPO

LG bets on in-cabin AI agents as South Korea races to catch China in autonomous driving

AI demand gives Aspeed visibility into 2027 as supply constraints ease

Shield AI, AeroVironment deepen ties with Taiwan drone supply chain

Analysis: Taiwan manufacturers put 78.9% of new investment into machines as hiring fails

Acer India tablet deal points to deeper push in Asia-Pacific

Taiwan sets out 2027 plan to reinforce AI, chip leadership

Sep

7

2026

SK Hynix reportedly ends LG eSSD talks as ASICLAND deal expands

How UC Santa Cruz's Silicon Valley lab is reverse-engineering the human brain to solve AI's chip power crisis

Silicon Valley goes physical: how San Jose is building an energy-rich, tariff-mitigated capital for physical AI

Inside UC San Diego's 'Made with Taiwan' push to train TSMC's future engineers, reinvent chip packaging

Smartphone lens shipments lift Genius Electronic Optical revenue 12% in August

South Korea secures US$2B from Air Products, Axcelis, Corning, Pacifico Energy to bolster supply chains

HBM4 squeezes DRAM supply as Samsung, SK Hynix inventories fall below 10 days

Huawei Kirin 9050 Pro revives flagship chip launches with reported LogicFolding architecture in Mate XT 2

STMicroelectronics says humanoid robots must clear a trio of hurdles

Exclusive: Infineon Dresden fab to hit full capacity in 2-3 years, COO says

India frames its chip build-out as redundancy for the world, and Taiwan as its partner in building it

SEMICON Taiwan 2027 move to August highlights venue pressure, not anniversary tie-in

Kian Shen lifts Taiwan mix as China exports gain traction

Yaho rides TSMC, Micron expansion wave to tap facility integration, equipment installation market

Model fatigue, China's price pressure, and a profit horizon still years away

Largan expects higher September output after sixth land acquisition

Inside K-Safety Expo 2026: AI is disappearing into safety — and that changes everything

Exclusive: Infineon COO says chip shortage recovery will take longer

Phison snaps up low-cost China NAND inventory, AI revenue share set to top 40%

NEC reportedly ends quantum computer hardware development, shifts focus to annealing

DeepSeek plans to buy 160,000 Huawei chips as China aims to wean itself off Nvidia

Micron scores seventh PTAB win in YMTC patent fight

China smart driving chips hit bottlenecks in mass production, cost, in-house auto R&D

China's power battery sector maintains strong growth momentum as global market presence expands

Exclusive: Taipower's new green power sandbox could ease TSMC's surplus electricity problem

Xiaomi warns of more India price hikes as AI squeezes the phone from both sides

Analysis: Under tariff threats, Taiwan chipmakers hedge beyond US

SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E

Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV

India's TCS unit secures land in Hyderabad for planned 1GW AI data center campus

JM-Applied sees gas equipment demand surge on AI expansion, order book exceeds NT$3 billion

India says it cannot build electronics without China and has started easing the rules to prove it

Anthropic IPO set to put AI governance under public-market scrutiny

Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law

Chicony Power's August revenue dips as AI server and satellite demand strengthens

Foxconn revenue climbs on AI server demand, outlook improves

Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens

Eaton expands AI data center stack from grid to chip

Wah Lee sees faster growth in 2027 as supply stays tight

Every Chinese CPU maker grew in 1H26 but only one grew on processors

Orphans of the liquid cooling age: xMEMS targets data center 'hot spots,' eyes 2027 smartphone and smartglasses cooling ports

China's JCET seeks US$968M for AI-driven packaging expansion

Dark fab cybersecurity: Why autonomous manufacturing needs zero trust

Exclusive: DIGITIMES' top 3 at K-Safety Expo 2026 shows where intelligent safety is heading — act 'before' disaster strikes

No foundry price relief before 2027 as utilization nears 90%

SiliconAuto pushes AI chiplets as automotive SoC ties tighten

Taiwan-Netherlands silicon photonics team targets 1.6T DR8 in 2026, 3.2T optical links next

Pegatron, Deloitte Taiwan team up to speed smart manufacturing

Experts say subsidies can't buy semiconductor competitiveness

AI is driving force behind 'Moore's Law on steroids,' says Merck's Benjamin Hein

AI racks move toward MW scale as power, cooling converge

Machine builders flood SEMICON 2026 to grow local chip tools

India roundup: India expands chip ambitions with full Semicon 2.0 notification

Acer hedges memory price shock with local AI, diversification

China NEV imports sink as local brands crowd out foreign cars

Sep

6

2026

BenQ Materials targets CPO in semiconductor push

Hiwin Mikrosystem targets SiPh inspection gear as capacity expands 20%, order visibility extends to 2Q27

TEL sees AI-driven packaging, memory demand reshaping Taiwan strategy

I-Chiun eyes Nvidia Vera Rubin supply chain as thermal business nears half of sales

K-Safety Expo 2026: Safety gets smarter as six innovators win foreign media honors

Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands

TWM, SYSTEX debut at smart building expo

Tongtai doubles semiconductor orders on AI data-center demand

Taiwan thermal supplier I-Chiun launches AI chip cooling venture targeting US$19.2B liquid-cooling market

Taiwan chip equipment maker Scientech sees orders into 2028, may turn away customers in 2027

Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem

G20 AI agenda: US champions light-touch regulation while data center backlash, China rivalry intensify

Trumpf CTO says advanced packaging reshapes semiconductor equipment race

K-Safety Expo 2026: Beyond AI, Korea re-engineers the human layer of industrial safety

Google's quantum boss says five years; his engineer says not so fast

Sep

5

2026

Exclusive: South Korea's safety AI boom is being built from the top down, BEXCO says

NYCU wins Nobel laureate for Taiwan job card

Semicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonics

Taiwan semiconductor output targets NT$8 trillion

Topco targets optical comms, cooling as copper gives way

TSMC's 3D packaging roadmap: engineering AI chips to think like the human brain

Interview: China Tier 1 supplier Jingwei Hirain shares lessons from EV race

Exclusive: Taiwan's first tokamak to begin plasma testing by end of 2026

Interview: Agility Robotics CTO discusses the future of collaborative humanoid robotics

Samsung SDI nears solid-state battery mass production, eyes China supply chain

SiPh, optical lens demand ignite laser race

Google TPU splits training, inference as CPU becomes next focus

Micron looks to lock in Taiwanese construction capacity with long-term deals

Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC

Taiwan auto parts makers face exit-or-overseas dilemma

Jmem Tek's PQC security chip nears mass production

Taiwan satellite ground equipment output grows 13%, nears NT$300B

Marketech profits hit record in 1H26 on overseas orders

Adata expands AI business with TRUSTA, Industrial brands

Sep

4

2026

Cisco targets zero engineers writing code by end-October

CPO testing shifts to mid-stage to avoid costly failures, Chroma says

TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex

Commentary: Apple shifts to smart vehicle software layer as Ternus era arrives

From chips to physical AI: Experts urge Taiwan-US push for trusted drone supply chains at Semicon Taiwan 2026

The 'Copper Wall': inside the physical bottlenecks threatening to melt AI supercomputing boom

How agentic AI and 'AI physics' are reshaping chip design

South Korea taps chip windfall for next tech push

Samsung turns to chips, OLED for next phase of Vietnam expansion

MSScorps August revenue hits new high on silicon photonics gains

Trusval Technology eyes NT$23 billion order backlog, US 4Q26 ramp

SEMICON Taiwan 2026: QuantumDiamonds cracks the hybrid bonding blind spot with new inline metrology

G20 approves guidelines calling for more business-friendly AI regulation

Chunghwa Precision Test sees ASIC revenue overtaking GPU by 2027

Lite-On makes US$170 million strategic investment in DCX for AI cooling push

India tablet market grows as business demand shifts toward premium devices

K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap

China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development

Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge

CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough

Taiwan to expand AI compute capacity as supercomputer at research institute hits full load

Ennostar accelerates AI optical communications with micro LED

Kyocera completes Nagasaki plant for semiconductor ceramics and packages

Fujitsu says useful quantum computers may need far fewer qubits than expected

China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls

Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications

Taiwan automation specialist Kenmec targets semiconductor packaging plants with low-clearance OHT, AI digital twins

China Motor unit Greentrans launches Taiwan-made quadruped robots

Analysis: Physical AI upgrades autonomous driving and lifts Taiwan supply chains

Xiaomi Auto maps 2027 Europe entry with German dealer network and four-country vehicle testing

Processor, memory boom could push chip supply chain out of sync, says Yole

Moonshot AI reportedly files for Hong Kong IPO, targets US$3B

AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

Silicon Valley overflow fuels semiconductor boom in California's Capital Region

Acer broadens lineup with e-paper displays and scooters, ahead of PC industry headwinds

Sumitomo Chemical starts mass production of 4-inch InP wafers for AI data centers

Silicon photonics testing shift could reshape how CPO suppliers win business

Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab

India's refurbished smartphone market gains as prices push buyers toward premium used devices

Acer bets on RTX, GoogleBook as on-site AI demand grows

LB Semicon starts Qualcomm shipments as DDI dependence fades

Kioxia pitches flash as a DRAM substitute as Micron, YMTC close in

Nvidia sets an October launch for RTX Spark PCs, gives local AI a router

OpenAI says Astra crosses critical cybersecurity threshold, adding tighter safeguards

Adobe names Anil Chakravarthy as next chief executive

Analysts read Nvidia's Hugging Face deal as a hedge, not a software bet

Nvidia's Hugging Face terms pay out its chip rivals and reserve US$1 billion to keep the staff

Nvidia buys the front door to open AI with a US$12.93 billion Hugging Face deal

D-Wave, quantum computing's oldest company, is now building a second kind of machine

K-Safety Expo 2026: South Korea's safety AI moves from watching danger to acting on it

K-Safety Expo 2026: Inside Korea's push to make safety smarter, faster, more predictive

India PC shipments rise as channel buying lifts second quarter sales

China's GPU makers found scale as profit came from elsewhere

Taiwan's tech council allocates NT$3.76 billion for quantum host

ESA backs European rocket startups to diversify launch supply

Acer wowed IFA with AI, gaming hardware

China speed hits brakes as regulators tighten safety rules

ENE Technology eyes 4Q26 drone scale-up with satellite link

Taiwan to expand industrial land for AI hardware boom

Nanya, ESMT hit record August revenue on higher contract prices

Young Liu urges 'Made with Taiwan' supply chain rethink

Acer unveils IFA lineup with AI, slim notebooks, sustainability

Electroninks, Merck, Qualipoly build advanced packaging ecosystem

Sep

3

2026

CHPT spans wafer to system-level testing

SanDisk pushes HBF ecosystem as AI inference reshapes token economics

Infineon sees AI data centers, physical AI as growth drivers

Exclusive: China 6-inch SiC substrate supply tightens, prices set to rise

Mitsubishi Heavy Industries and NEC form alliance to advance defense tech, AI sovereignty

Turing Drive highlights overseas expansion, extends invitation to global automakers

China chip tool makers expand beyond import substitution at CSEAC 2026

KEPCO seeks US$18 billion from Samsung, SK Hynix to fund Korea's power grid

Fei-Fei Li's World Labs unveils Atlas world model for 3D AI, robotics

Niching validates 500-ton press for large heat spreaders

Semiconductor sustainability shifts to cost control as fab resource demand surges

Broadcom says CPO fits scale-out better than scale-up

Microsoft unveils two-segment reporting structure, standalone Azure financials

CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade

Taiwan LED packaging provider Ligitek pivots to silicon photonics; 1.6T modules eye 2H27 revenue

Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools

Huawei, Xiaomi to launch new foldable smartphones ahead of Apple

Solomon leverages AI vision and optical tech to tap semiconductor inspection market

TSMC doubles down on equipment purchase as AI demand is outpacing semiconductor supply chain planning

SK Hynix weighs Kioxia production tie-up in Japan

Intel pre-funds EMIB-T and CPU capacity, will address DRAM through partners rather than fabs

Taiwan's supply chain is 'one of a kind,' MediaTek CEO says

Apple, Xiaomi and Nvidia chase terabyte-class bandwidth for AI chips

AUO unit eyes TSMC ecosystem as merger benefits emerge

China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration

AI substrate shortages widen as Unimicron signals capacity support through 2029

Win Semiconductors unveils 0.1μm GaN for AI, satellite links

UniVista expands China EDA stack with AI agents, native 3DIC tools

CXMT's 'Hefei Project' exposed in Samsung DRAM theft case

BYD Semiconductor scales 4D radar chip for L2-L4 driving, deepening its in-house automotive sensing stack

TRUMPF targets advanced packaging as AI chip makers chase higher density, better cooling

Google to expand Taipei AI infrastructure center as Taiwan ties deepen

Broadcom puts 30GW, US$350 billion of custom AI silicon on the calendar through fiscal 2028

China optical module makers ride AI boom as 800G, 1.6T orders stretch into 2027

HPE has already bought the supply behind its raised fiscal 2027 plan

HPE's constraint has shifted from demand to memory

Lutnick confirms chip tariffs are coming, with relief tied to manufacturing in America

Broadcom's custom AI silicon takes over the income statement as revenue climbs 86%

VinFast reportedly pauses India manufacturing work on three EVs, a year after opening its Tamil Nadu plant

CPO material race widens as Taiwan eyes key role

Auras sees ASIC revenue reaching 50% in 2027, eyes microchannel cooling production in 2028

Alpha Networks, ITRI develop B5G/Pre-6G Massive MIMO base stations

JPC Connectivity sees AI demand driving orders into 2027 as margins benefit from longer lead times

Column: From automation to autonomy—what robotics still needs to make the leap

SB Energy eyes US listing as Nvidia commits US$1.5 billion

Analysis: India's fast-growing FWA market may widen, but suppliers still face margin pressure

PlayNitride sees 3.2T AI links opening a new front for Micro LED, but auto weakness weighs on 2H26

Samsung Electro-Mechanics eyes 30% MLCC price hikes, ABF up too

SK Hynix wafer purchases jump 104% on AI demand

Global smartphone outlook cut again as foldables shine

Thailand AiPASS unlocks premium AI after lessons

Samsung to add 1,612 new equipment units at Vietnam chip plant

LCY Advanced Materials launches wet chemicals for AI chip packaging

Macronix boosts sustainability spending to NT$780 million

MiniMax, Z.ai revenues surge on API demand but adjusted losses widen

TIME AI 100 spotlights China's new AI guard, from Moonshot, Z.ai to AgiBot, Manus

SEMICON Taiwan 2026: Physical AI drives new demand for multimodal robot sensing

Yield has been semiconductor industry's oldest question; now it's Microsoft's test for AI

Sep

2

2026

Sandisk says HBF can match HBM bandwidth with up to 16x the capacity

Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth

Lam Research exec says automated preventive maintenance key to fabs of the future

DRAM giants target 3D stacking to break memory wall and power bottlenecks

Fresh off Nasdaq listing, Pasqal turns to Taiwan's photonics industry to help it scale

EU EV battery recycling still lacks a profitable model

Taiwan's semiconductor ecosystem has the UK taking notes

Nvidia and Micron top NT$4.4T in Taiwan investment

Zhen Ding launches 1.6T optical modules, 34-layer AI server boards at Semicon Taiwan to meet next-gen AI infrastructure demand

Samsung, SK Hynix inventories surge as valuation reserves fall

Semicon Taiwan 2026 to test cloud AI investment boom

Wonderful Hi-Tech expands Thailand, Vietnam capacity to capture emerging space data center, physical AI demand

World's first legged robot standard sets global benchmark for humanoids, robot dogs

Indium CEO: packaging, cooling and power are next AI bottlenecks

India reportedly readies AI agent payments on UPI, its national payment rails

TSMC moves into Baipu Industrial Park, boosts advanced packaging

TSMC reportedly asks suppliers to develop 5μm HBM microbumps

Certain Micro targets AI test-interface demand with three Semicon products

China's Galactic Energy puts PALLAS-1 in orbit, raising stakes in reusable rocket race

Energy and water: How to tackle the fab resource crunch

IBM's quantum pitch to chip audience: bottleneck is now manufacturing

MediaTek pushes advanced packaging and supply chain to keep pace with AI

Meta reportedly taps SeeYA for Phoenix OLEDoS panels as BOE fails to qualify

Operations shake-up: how SpaceX is reengineering its AI data center strategy

Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center

Manus resumes independent operations after Meta deal collapses

Hardware isn't the problem — TSMC exec flags software, substrate gaps in 3D IC

SDC to expand foldable iPhone OLED mass production in September

European chip ambitions hinge on more than subsidies, says TSMC

ByteDance-ZTE Nubia NaviX Ultra clears launch hurdle, takes agentic AI beyond smartphone assistants

Chinese foundry Hua Hong Grace adds 55,000-wpm Wuxi capacity in US$4.17 billion Phase III buildout

China moves to curb overseas price wars as automakers accelerate global expansion

Taiwan doesn't just want a quantum lab — it wants a quantum fab

TCL CSOT bets on InP laser chips as supply tightens

MCU chipmaker Sonix sees supply crunch lasting through 2026, memory shortage hits imaging shipments

GoPro to merge with Starman Optical in US$285 million deal, pivoting deeper into AI and defense markets

AI demand push expands wafer industry's growth outlook

Anthropic launches Claude Fable 5.1 and Mythos 5.1, cuts agentic-task costs by up to 45%

Taiwan materials makers see new opening in chip packaging shift

TSMC says Europe chip strategy is shifting from plans to demand creation

Gemtek deepens partnership with India's Dixon Technologies to expand optical transceiver, connectivity footprint

Dell says enterprise AI customers accelerated even faster than its record orders suggest

Dell's AI server boom lifts profitability across its whole business

Semicon Taiwan 2026 signals a broader race for AI-era semiconductor leadership

UMC targets 12-inch TFLN to break 400G SiPh bottleneck

Apple's M6, M5 Ultra break rule tying process to chip strength

How Taiwan is closing its semiconductor materials gap — three shifts to watch

Deep Dive: CXMT challenges Pentagon as Trump-Xi meeting nears

Micro LED maker PlayNitride targets Micro LED optical communications within two years

Innolux targets advanced packaging with debut of Chip Last tech

Panasonic reportedly raises CCL and PP prices again as IC substrate costs jump 30%

AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks

US solar module capacity to lead by 2027, but cell and wafer shortages pose major hurdles

China memory-module makers report surging profits, strained cash flow

LG fights Chinese brands with innovation, business model shifts

Commentary: Malaysia wants foreign automotive investment to leave more behind

Chinese MRAM chipmaker ICY Tech rethinks HBM for rack-scale AI inference

Qisda builds physical AI ecosystem from land to space

Nvidia pushes into HBM base dies as NVHBM battle heats up

'Chinamaxxing' fuels China tech tourism as visitors flood Huaqiangbei

Taiwan eyes satellite communications to cut sea cable reliance

Global quantum industry accelerates as Taiwan eyes Asia hub

Tmytek to list on Innovation Board in September on antenna module growth

Gudeng pursues 'Taiwan Plus One' overseas strategy, says cost is not sole consideration

Hunting for the next Jensen: Plug and Play zeroes in on Taiwan's AI and hardware founders