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Analysis: How Oracle’s Cerebras deal is less about dethroning Nvidia than rewiring the AI cloud

Tomorrow's Headlines

Nvidia secures substrate capacity as FCBGA market targets US$27.3 billion by 2030

Tomorrow's Headlines

NearLink seeks to expand beyond Huawei ecosystem with chip vendor support

Tomorrow's Headlines

HBM4 supply cycle may shorten as HBM4E transition accelerates

Tomorrow's Headlines

US drone program raises edge AI threshold, creating supply-chain opportunities for Taiwan firms

Tomorrow's Headlines

Analysis: Why Marvell’s rumored Lumentum buy may be hard to pull off but harder to pass up

Tomorrow's Headlines

Oct

30

2026

Amazon's cloud acceleration lifts profitability as AI spending absorbs cash

Alibaba, Tencent, ByteDance reportedly seek 10-year DRAM deals

STMicroelectronics' recovery gains momentum, but power chips lag

Intel slashes 18A costs by 40% as foundry posts US$1.9 billion loss

Intel's AI PCs are selling, but the wider PC recovery is still missing

Samsung, SK Hynix say memory crunch could drag on for years despite spending surge

Taiwan semiconductor output to hit NT$9.1 trillion as TSIA urges stable power

Japan's Nidec reports update on restated financial reports, audit status, and corporate governance reform

Samsung secures Faraday 2nm ASIC order, broadening AI and HPC footprint

AUO returns to a third-quarter loss as panel demand weakens

Memory price surge clouds peak season; Chinese brands' 4Q26 smartphone shipments to drop over 35%

GlobalFoundries bets on FD-SOI for robots and cars

Texas Instruments, NXP point to data centers and robots as industrial chips rebound

Intel CEO sees quantum computing as third pillar

BYD eyes ultra-luxury sedan priced above CNY2 million

Silicon Motion posts fourth straight revenue record, eyes 100% 2026 growth

China AI stock bubble bursts as STAR 50 plunges 40%, erasing billions in market value

Taiflex, E Ink accelerate PTFE development for AI connectivity materials

Elite Material posts record 3Q26 revenue on AI demand

Analysis: Can Kazakhstan really be Europe's AI factory?

ASE Holdings raises 2026 capex to US$11.5 billion after profit surge

Oct

29

2026

LandMark orders surpass 2026 revenue; capacity to expand sixfold

Commentary: fire at Episil threatens tight epitaxial wafer supply

UMT reports 71% revenue growth as LEO satellite demand drives expansion

Qisda's commercial drones enter production as physical AI expands its growth strategy

ADATA posts record 2026 profit as AI demand intensifies memory supply pressure

TSMC buys AUO Taichung plant for NT$38.8B; Quanta deal scrapped

Virgin Galactic moves new spacecraft, targets commercial flights in 2027

DeepSeek, Moonshot accused of distilling OpenAI's Astra

Analysis: Samsung's record quarter came from higher prices, not more chips; expects buyers to get no relief before 2028

Delayed Taiwan drone tenders hit Coretronic unit as it partners with US firm Aevex

Server CPU shipments set to surge 46% in 2027, with AMD eyeing revenue crown

Marvell reportedly in advanced talks to acquire Lumentum in AI optics deal

Nvidia under probe by US justice officials over Hugging Face acquisition

LB Semicon to expand PMIC capacity under 10-year Qualcomm deal

KLA: wafer fab equipment market exceeding US$200B in 2027

SDC chief meets Applied Materials executives amid FMM-free OLED push

NXP wins Volkswagen role in software-defined vehicle architecture

Kuen Tong debuts on TPEx Emerging Board, riding LEO satellite and AI cooling dual engines

CyberLink blasts Apple over developer account suspension

UMC targets 10% ASP growth in 2027 as AI revenue share heads toward 25% within three years

CXMT to start HBM3E production despite low yields amid tight domestic market

Commentary: China's luxury cars reshapes market, causing global brands to lose ground

Starlink V3 rollout lifts Win Semiconductors' 2027 satellite outlook as optical communications ramp up

Taiwan's Ministry of Environment deploys digital twin to simulate urban cooling

Samsung, SK Hynix invest KRW110 trillion as memory supply boost slips to 2028

China's auto supply chain shifts from price wars to value competition

SenseCore captures nearly half of China's neocloud market as heterogeneous chips boost compute efficiency

Samsung targets physical AI as Lee Jae-yong leads robotics push

LGD invests in Guangzhou for world's first 111-inch OLED line

Nvidia trims HBM4 bandwidth for Rubin platform, sources say

Analysis: Google opens its AI chips to rivals but won't say if it makes money

Memory surge leaves CPI stable, hits consumer electronics hardest

Taiwan central bank head deems AI bubble crash scenario extreme

Samsung EUV data leak case: researcher in university partnership indicted

AI, semiconductors drive foreign investor gains, weakening Taiwan dollar

Nvidia's Rubin Ultra cooling: 0.1mm microchannels vs vapor chambers

Team Group earnings per share surges 1,483% in 3Q26 as new plant targets 50% capacity boost

Microsoft cloud and AI revenue in 1QFY27 surge past expectations, driven by robust Copilot and Azure growth

LG Electronics ties AI cooling and robot plans to new plants and a 2030 humanoid target

AUO's microLED setback in smartwatches, comeback in Peugeot cockpit

Macronix halts NOR expansion, phases out ROM, bets NT$30B expansion on eMMC NAND

SiC and GaN demand reshapes design, reliability and supply stability

Foxconn Tech Day 2026: Three EV signals to watch

Global Technology's first automotive chip headed for Hyundai, Kia

Intel CTO: process gap with TSMC down to a few points, but scale still lags

Phison wins Micron supplier awards for third straight year

Parade Technologies faces near-term revenue pressure as notebook demand weakens

Niche memory price rally lifts Ingenic's third-quarter profit 2,595%

Unitree Robotics posts 56% revenue growth in first nine months of 2026

Asus notebook shipments hold steady as commercial PCs offset gaming decline

Huawei deploys Tau Law in base-station design, rolling out new wireless baseband overseas

AerosoarX skips the mega-factory to take on global drone makers

KT turns AI tokens into a telecom utility with 500-model enterprise platform

Samsung's AI memory boom drives record profit as device division stays in loss

SpaceX's AI spending surge opens doors to direct orders for Taiwan ODMs

Chief Telecom's 3Q26 gross margin tops 50%

AerosoarX seeks to reshape Taiwan's drone industry through allied defense networks

Apple ends its touchscreen holdout with OLED MacBook Pro, with Samsung Display reported as sole panel supplier

Google's cloud expansion strengthens AI business but strains cash generation

Samsung's Harman expands China plant for ADAS, automotive computing

Google's Gemini 4 Carbon takes top spot on independent AI index, but most users must wait

Anduril, Qualcomm team up on domestic computing to rebuild the hardware supply chain

ASM's earlier growth target puts supply chain execution in focus

LG's business diversification supports earnings as consumer demand stays weak

KLA's stronger outlook puts process control capacity in focus

Samsung Electro-Mechanics says AI customers are locking up 2027 MLCC and substrate supply

Microsoft's cloud growth outpaces infrastructure spending delays

Japan reportedly moves to hand H3 rocket launches to Mitsubishi Heavy as early as 2027

Lenovo previews CES 2027 lineup focused on AI agents, hybrid AI

Onsemi reportedly in talks to buy AI power-chip startup Ferric for close to US$1 billion

Powertech shifts to advanced packaging as AI demand drives growth

Rokid launches full-color AI glasses with microLED display

Advantech opens Tustin HQ to strengthen North American R&D

DIGITIMES Insight: Kinsus Tech identifies three challenges for larger AI chip packages

iPhone Duo sales beat expectations as first batch sells out

Google launches Genie 4 world model for select game, film teams

Analysis: SpaceX–Tesla merger could reshape AI industry integration, capital allocation, US-China tech rivalry

Kinsus explores AlN ceramics beyond glass for AI advanced packaging

Amazon Leo wins FCC approval for Globalstar acquisition

Taiwan plans carbon fee-ETS dual approach to tackle emissions

Anthropic's IPO filing highlights China AI rivalry as model distillation, chip export controls emerge as key risks

Satellite industry faces major shake-up as data connectivity set to capture 68% of service revenue by 2035

PHP2Shell vulnerabilities expose global websites to severe cybersecurity risks

Kentec sees strong AI data center orders despite financing concerns

Samsung SDI wins 1GWh US battery storage deal

LG Innotek revenue tops KRW6T in 3Q26, profit halves

Taiwan's growth surge nears end; electronics, machinery stay resilient in 2027

Asus sees commercial PC prices rising nearly 10% in 2H26

Oct

28

2026

SFC to keep supplying blue host materials for Apple's OLED MacBook Pro, loses blue dopant orders to rivals

SK Hynix says customers want more than twice the HBM it can supply

UMC utilization tops 90% in 2H26 as AI demand drives expansion

Ex-TSMC CTO says Taiwan's research institutes get too much funding and train too little talent

Transformation in focus as display supply chain kicks off investor briefings

Oracle accelerates AI chip diversification with Cerebras, Google, and SambaNova deals

CHPT posts record 3Q26 results as nine-month profit jumps over 90%

HTC launches Vivee AI companion pet in US

Toyota accelerates robot commercialization as IKKA targets supply-chain opportunities

SK Hynix bets on EUV to extend 6F-squared DRAM as CXMT pushes 4F-squared

Cloud AI costs drive demand for on-premises computing, squeezing Asus RTX Spark supply

AI startups face scrutiny over revenue metrics used to promote rapid growth

Kentec targets CSP opportunities with AIDC infrastructure integration

AI reshapes China wealth rankings as ByteDance's Wenfeng Liang debuts at No. 7

Microsoft medical AI tops 80% accuracy in complex cases

PC makers reportedly shift production back to China as AI boom drives up component costs

India-based Spintronics AI weighs GaN chip fab in Madhya Pradesh

Alibaba wins injunction over Pentagon rule targeting shared lobbying firms

AMD to invest US$1 billion in Meta's stock sale as Helios racks enter testing

SK Hynix's Solidigm ties US$45B US NAND fab to Washington nod on China tool upgrade

SK Hynix's next bet goes beyond memory chips

Fujifilm to boost magnetic tape capacity 5x as AI data storage demand grows

SK Hynix looks beyond IPO to fund Solidigm's US expansion

Google TPUs land Oracle, with OpenAI reportedly next

SK Hynix's next AI memory bet isn't HBM

Unimicron steers resources to Taiwan AI substrates with NT$50.9B equipment orders, Japan unit sale

Corning hits US$20 billion run-rate goal early as optical demand drives next growth phase

IC designers MediaTek, Realtek, and Parade face 3Q26 earnings tests

Celestica says awarded programs already put 2028 demand above its 2027 outlook

Micron recruits in South Korea for Taiwan roles as Taoyuan strike dispute persists

Anthropic's surging compute demand fuels ASIC prospects, favoring Broadcom over MediaTek

Seagate sees a multi-year storage upcycle as long-term deals lock up supply through 2028

Seagate's pricing gains strengthen profitability as HAMR transition advances

NXP's automotive content gains, industrial demand strengthen its growth outlook

Corning's AI fiber growth puts capacity delivery, customer funding in focus

Apple leans on AI silicon as reviewers call its Mac refresh incremental, question iPad mini pricing

NXP lines up software-defined vehicles, industrial AI and data centers for double-digit growth in 2027

SK Hynix's record quarter shows AI demand turning memory into a contracted, supply-limited business

Simmtech steps up SOCAMM investment as BT substrate supply tightens

Nvidia DSX POD targets AI factories as Microsoft and AWS push modular data centers to the edge

Semiconductor equipment is not AI chip growth's biggest bottleneck

Cambricon profit jumps 131%, CEO says firm never gave 1 million-chip forecast

TLB develops SOCAMM3 substrates; Vietnam plant to break ground

Google prioritizes frontier AI as cloud capacity runs short

Huawei elevates consumer chief Gang He to board as consumer unit gains strategic weight

Goke Microelectronics raises KGD packaging prices again

Samsung DX division opens Suzhou robotics R&D hub

MiCo Ceramics acquires idle LGD plant for KRW150 billion to boost semiconductor component capacity

FarEasTone, Elveo Mobile expand satellite-to-phone connectivity in Taiwan

CXMT reportedly prioritizes China demand, rejecting Apple's DRAM inquiry

Germany diversifies transport fuels to cut carbon emissions as HVO 100, eSAF reshape global supply chains

Skymizer partners with Egis to develop 12nm and 6nm AI accelerators

From superconductors to optics: The six Silicon Valley startups bringing AI bottleneck solutions to Taiwan

Macronix posts record 3Q26 profit as gross margin hits 70%

SpaceX turns Nvidia GPUs into long-duration assets with US$40 billion Apollo deal

Analysis: 3M's investment in Genius Electronic Optical puts EBO mass production to the test

Analysis: What happens if Claude demand cools before its compute bills do?

For Taiwan's geothermal sector, institutional barriers outweigh drilling challenges

Oct

27

2026

Jensen and Musk both think aging GPUs are worth more than the books show

Tesla sees Cybercab becoming a new growth bet amid declining auto revenue

Australia's AI build-out hits the grid: how a delayed power line wiped out AUD3 billion

Chinese EVs push imported models ahead of South Korean vehicles

Pat Gelsinger warns AI compute efficiency must jump 10,000x amid power, memory, and fab constraints

Nvidia DSX POD challenges traditional AI data center construction

Infineon and ASMedia team up on end-to-end USB 20Gbps setup for AI cameras

JIMTOF 2026 draws 94 Taiwan machine tool exhibitors

Anthropic IPO filing shows the US govt is trying to be frontier AI's customer and gatekeeper

AI spending surges, Microsoft opens exit door to 60,000 employees

SoftBank eyes US$50B Malaysia AI data-center expansion

AI data centers drive cooling, power, modular infrastructure demand

Anthropic IPO filing exposes massive compute buildout spanning TPUs, GPUs, and dedicated data centers

PSMC capacity crunch holds back Jeju Semiconductor's growth

Broadcom, financial firms agree on US$63 billion funding for Anthropic chip purchases

Mitsubishi Materials scales thermistor capacity sixfold amid AI boom

AI demand squeezes automotive memory, pushing automakers to take control of chip supply

China AI token debate highlights challenge of monetizing compute

The Anthropic IPO filing: 14-fold 1H26 revenue growth behind a US$80.75 billion paper loss

Kazakhstan positions AI infrastructure as a potential export industry after Nvidia CEO's visit

US designates helium as critical material amid Middle East supply shock

Ennostar's optical push could add new growth engine for 2027 and onward

AMD, Nvidia target substrate capacity amid 4x expansion constraints

Fujifilm expands South Korean capacity to meet AI chip demand

FANUC raises forecast as AI, automation demand drives record revenue

Charts: Why German automakers are becoming marginalized in US BEV market

Nvidia says GPUs last 8 years, unlocking AI financing

Meta launches US$35 billion equity raise, funds US$60 billion at-the-market program for AI build-out

Applied Materials to raise Besi stake to 20% as hybrid-bonding orders surge

Nvidia's Berlin keynote highlights AI scaling challenges in Europe

Samsung, SK Hynix eye 2Q27 shipments of 8-layer HBM4 to Nvidia

AWS, Google challenge CUDA as AMD, Intel cut AI switch costs

Inside SKT’s push to turn SK Hynix’s fabs into an AI business

China supply-chain price hikes strain domestic demand

Vietnam's first fab reportedly faces doubts over 2027 target

Fine M-Tec rejects component blame as foldable market outlook remains positive

DRAM price gains fall short as supply shrinks up to 50%

AI data center boom risks squeezing power chip supplies for auto, electronics

Weekly news roundup: iPhone Duo shipment target revised upward amid display issues

Japan sets JPY100 billion push to commercialize perovskite solar cells

HCLTech and Rapidus open India centers to support semiconductor engineering

India's smartphone shipments hit a decade low in 3Q26 amid rising prices

As iPhone Duo inner screens crack, Samsung capitalizes on foldable surge

Intel to acquire quantum computing software firm Classiq

Anthropic's IPO filing puts TSMC, HBM, direct leasing at the center of AI compute risk

Tamil Nadu adds independent chip subsidy route as Indian states vie for investment

OPTOELEC seeks AI data center orders as Himax advances CPO optics

China's Neolix eyes Korean assembly of autonomous delivery vans in 2027

Hyundai supplier SL eyes first overseas robot deployment in US

Tata Communications plans up to US$450 million fibre network linking India's AI hubs

KAR bets on fleet monitoring as South Korea expands robotaxi trials

ByteDance denies AI micro-dramas consume over half of China's AI computing power

Amkor turns to customer prepayments as global packaging investment accelerates

Cadence bets on its own chip design AI models as Synopsys teams up with OpenAI

Cadence says chip design demand is broadening beyond AI as analysts test margins, rival targets

India sets October 2028 target for homegrown smartphone brand

Celestica's AI growth puts capacity in focus as revenue outlook reaches US$40 billion

Cadence raises 2026 outlook as AI design demand drives record backlog

Amkor gross margin climbs to 18.3% as computing mix offsets consumer weakness

Samsung Executive Chairman reportedly eyes RX unit visit for humanoid robot push

DIGITIMES Insights: AI servers move toward 800V DC as vertical power delivery promises higher efficiency, lower transmission losses

Cheng Mei develops materials for advanced packaging glass substrates

Sunic System wins overseas OLEDoS equipment order

Oct

26

2026

Interview: From afterthought to bottleneck, circuit boards move to the heart of AI hardware

Meta prioritizes high-margin AI inference as Wiwynn, Quanta eye CPU server demand

Taiwan wafer-testing supplier Hermes Testing Solutions commits more than US$215 million to advanced chip testing expansion

Podcast highlights: TSMC's 3nm demand story, Samsung HBM shift, and A14 ramp

India roundup: India's tech build-out opens new markets, but foreign suppliers are first in line

Oct

25

2026

Nvidia unveils OOI CPO prototype for post-2028 AI needs

China clears DeepSeek, MiniMax for overseas AI deployment

Namuga expands beyond Samsung with humanoid robot camera modules

Chinese automakers capture record 14.6% Europe market share as looming hybrid import curbs spur shipments

AI data centers drive Taiwan's electrical firms into modular, EPC markets

Meta’s AI commitments surge to US$825 billion, testing financing power

Texas Instruments sees up to $1,000 in chip content per humanoid robot as analog supply tightens

Column: Will general-purpose models overtake Physical AI?

Magnate Technology sees aerospace, semiconductor growth opportunities

Moonshot's Singapore hiring shows how China's open-model labs plan to get paid abroad

Tesla-SpaceX merger tests whether Musk's technology empire is worth more together

Interview: The story of LEACHIM, a working humanoid robot from the 1970s

Oct

24

2026

Mitsubishi Electric, ABB form joint venture for power distribution business

Nvidia rejects near-term memory glut fears, leaves CXMT cooperation open

SpaceX's 80,000-site push turns Starlink from satellite overlay into full mobile challenger

Bosch to spin off automotive business as Asian rivals intensify pressure

AIDC launches Taiwan's largest industrial microgrid with 9MW/54MWh energy storage capacity

LGES Poland plant nears breakeven as utilization rebounds

Oct

23

2026

Doosan Robotics targets automakers, chipmakers as Chinese rivals cut prices

Taiwan's inaugural semiconductor strike pauses as nearly 70% of Micron Taoyuan Union rejects new bonus offer

Semco's 61-week MLCC lead times give suppliers upper hand in AI supply chain

Lenovo mounts AI comeback with Nvidia Vera Rubin NVL72 deliveries and US plant expansion

Chinese luxury carmakers face barriers in Europe's premium market

Japan targets 2nm medical AI chip with IBM design, Rapidus eyed for foundry

Nvidia B300 chips reportedly surface on China Telecom-linked network, raising export-control questions

First chip-level device on the list: US FCC bans two devices with Huawei HiSilicon chips under new rule

Samsung reportedly orders final tools for first Taylor fab as Texas site nears 2nm output cap

Taiwan's top telecom spins off AI surveillance unit, plans global push with local hardware makers

Apple reportedly taps BOE for LCD iMac development, keeps OLED timetable in question

TSMC advances CoPoS packaging at Taoyuan Longtan site

Rapidus courts US AI customers ahead of planned 2H27 2nm mass production

Commentary: How long can the humanoid robot bubble last? Unitree's valuation correction puts physical AI to the test

Chinese phone brands beat Samsung, Apple to high-refresh OLED

FCC grants Intel a waiver to foreign robot ban to prevent chip disruptions

China's weak car market squeezes automakers, suppliers and dealers

Analysis: Nvidia's Vera CPU takes on Intel and AMD with a platform play

JCET's AI profit surge sets up US$2.73 billion advanced packaging expansion

US signs up to US$389 million in CHIPS R&D deals for power chips and fusion

Anthropic launches Claude Duet to automate cross-app tasks

DIGITIMES Insight: BCI grasping reaches market; implant stability and chip heat keep advanced uses beyond 2030

Tesla, Nvidia reportedly invest KRW3.7 trillion to secure Samsung Electro-Mechanics ABF capacity

Taiwan sits out global chip selloff, thanks to typhoon

Care robots need AI modeling, physics simulation to understand humans

Mounting R&D and memory costs push Huawei to borrow US$2.3B from six Chinese banks

TSMC reportedly surveys suppliers on rare-earth-free motors as China's export-control pause nears legal expiry

ChainSea Information Integration lists, targets AI revenue growth by 2027

Analysis: Nvidia's DSX POD reshapes AI factory supply chains

India becomes Taiwan's third-largest machine tool export market

Tech Mahindra teams up with SpaceXSI to scale AI-assisted software engineering for enterprises

SK Hynix halts Solidigm IPO review in face of broader AI and market volatility

Apple's foldable iPhone Duo launches in China with delivery stretching into 2027

Tesollo develops robot hands as AeiROBOT tests humanoids for shipyard work

Apple's iPhone Duo and touchscreen MacBook could accelerate OLED TDDI adoption

Monitors take over as LG Display's large OLED growth engine while auto panels stall

Western Digital bets on pricing and HAMR, not new capacity, as Toshiba plans to double output

LG Display sees foldables growing faster than expected, but Apple's first foldable panels reportedly go to a rival

Jensen Huang warns Europe risks falling further behind US, China in AI

Western Digital argues AI's longer payoff lies in stored data, not compute

AI cuts chip R&D cycles to 9 months, says Etron chair

DeepSeek reportedly raises US$15B as IPO plans gather pace

LG Display returns to profit as OLED mix offsets chipflation drag

Unitree's cumulative G1 humanoid robot output reaches 10,000–20,000 units

LG Display pitches mask-free FLiPP as its answer to rivals' 8.6G OLED lines

Western Digital widens margins on pricing and exabyte growth

Why is TSMC suddenly looking at Texas?

Interview: TI sees liquid cooling shift to tray-level control in AI data centers

India's CleanMax partners with Apple, Meta to supply green power for AI data centers

Elan targets drone market with solutions contributing revenue in 2026 and 2027

LG home appliance chip volume tops 1 million; spins off startup PADO to target GPU compute leasing

Salesforce Taiwan targets double-digit growth as AI adoption accelerates

CHT launches AI imaging unit, targets IPO

Analysis: Can Tesla's thruster-equipped Roadster hit public roads? US, China, EU regulations pose hurdles

Samsung Foundry targets automotive, edge AI chips with 8LPU+

AUO reshapes businesses with 'quasi-holding company' model

UMC, AP Memory advance AI chip power delivery with validated DTC silicon capacitors for advanced packaging

Oppo targets premium smartphone growth with global Find X10 launch

Taiwan, UK expand offshore wind, CCUS energy cooperation

Lam Research sees WFE topping US$200 billion in 2027

PSMC eyes Taiwan, Japan, Singapore for 3D AI foundry expansion

Compal and Verda expand AI cloud infrastructure partnership

Midea's Clivet targets AI cooling market with compressor redesign

SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production

AMEC ships first Primo Domingo selective etching system, targeting critical gaps in China's advanced 3D chipmaking

Oct

22

2026

Micron overhauls pay in Taiwan as unions push for profit sharing

PSMC raises mature-node prices again, targets 20% increase in 2027

Taiwan-France semiconductor alliance strengthens with CPU pact between SiPearl and Egis Group

ADEPT Taiwan holds inaugural in-person meeting as PLP and substrate standardization efforts gain momentum

U-Power listing highlights Taiwan's growing need for high-speed EV charging

MIPI expands beyond smartphones into AR glasses and humanoid robots

Infineon, Nvidia push gallium nitride power for 800-volt AI data centers

Chi Yi Hsin Technology's Arizona fab projects drive order backlog to NT$4.476B

Apex Science & Engineering expands automotive and medical display push

Analysis: Musk's thrusting Roadster takes off, but questions remain up in the air

Tesla's Megapack boom meets AI power crunch, but margin gains raise questions

Texas Instruments posts rising Q3 sales across data centers, cars, industry

Samsung reportedly overhauls DRAM, NAND R&D incentives to retain talent and accelerate next-gen memory chips

Taiwan's Aero Win expands role in next-gen engine programs amid global aircraft backlog

China's L3 autonomous driving adoption tipped to top 35% by 2030, raising stakes for automakers

Samsung DX division postpones meeting amid bonus tensions

Why Terafab approached South Korean suppliers first

OpenAI acquires Orchestra Bio to advance AI drug development

Unitree showcases H2-X as China's humanoid robot output tops 100,000

Inside Nvidia DSX POD: How a factory-built AI data center could go live in 14 days

Japan sets execution plan for 17 growth strategies

BOS, LG, and HANA Micron team up on Korean automotive chiplets

Racing Electric Instrument expands across drone systems

Amazon backs 960MW nuclear project for AI power

Amazon spends US$220B on AI as power delays squeeze cash flow

Analysis: Why Tesla needs to manufacture Optimus robots before its humanoid AI is ready

Amazon to invest over EUR160B in Germany for AI, cloud and logistics

Intel begins Arizona Fab 62 equipment installation, advances Ohio project as AI CPU demand surges

Apple, Google push PCB supply chain toward net zero amid challenges

Hyundai rethinks AAM strategy as Tesla Roadster sparks flying-car buzz

Meta says compute, not demand, now limits Muse; pushes shared standard for AI shopping agents

SDC supplies over 70% of major laptop brands' OLED panels

iPhone Duo preorders surge, but sales momentum remains uncertain

Tesla's Robotaxi test enters harder phase: turning autonomous miles into transport business

Exclusive: Apple raises iPhone Duo shipment target 44% on strong preorders

LG robot unit Bear Robotics expands China outsourcing

Lam Research builds India supplier base to capitalize on Semicon 2.0 localization push

Nvidia becomes AI's central bank as cloud startups face mounting pressure

Charts: China's smartphone market bounces back from summer lows on new launches

Sibelco to build quartz plant in North Carolina, extending US chip onshoring to raw materials

Samsung patent boosts AI server memory efficiency without adding GPUs

Unimicron warns of double-booking risks as AI PCB capacity race strains supply chains

Charts: Nvidia's China AI chip lead shrinks 80% as Huawei closes in

Walrus Pump sees slower demand for higher-capacity AI cooling pumps

Nvidia's AI factory strategy points to a broader shift in computing, industry

Nvidia lines up six suppliers to expand substrate, packaging, and testing capacity

Memory surge drives phone makers from LTPO to LTPS

Micron skips 4F² for 3D DRAM as CXMT pushes ahead

Tesla's new Roadster opens two paths for Taiwanese suppliers, from EV components to aerospace

Apple eyes high-end HomeView with robotic arm by 2027

China's IC designers expand into AI server memory interconnects beyond DDR5

Jio's record IPO tests global appetite for India's homegrown telecom stack

Humanoid robot maker PAL says wheels could handle 80% of the market

Elon Musk expands South Korean supplier network for Terafab

Texas Instruments' analog recovery broadens as 12-inch investment turns into margin

IBM's growth rebounds after a summer stumble, led by software and servers

Meta's advertising engine keeps pace with its AI build-out as legal costs cut into profit

Nvidia pitches factory-built AI data centers and hardware-enforced agent controls at GTC Berlin

Tesla's car margins recover, but spending on AI and robotics absorbs the gain

Taiwan's FTC blocks Grab's Foodpanda acquisition over competition concerns

GoldKey Technology posts record 3Q26 profit as industrial share rises

Chief Telecom's CTSP AI data center bookings exceed 50%

TASA satellites reach orbit to test coordinated LEO broadband links

Unimicron, STATS ChipPAC, Wistron address advanced packaging bottlenecks in AI system integration

Taiwan tech supply chain eyes Texas for first US industrial cluster

Samsung's Nvidia HBM bid raises four strategic concerns

ESMT sees memory price momentum extending through 4Q26, 2027

Syscom, Japan's CIJ sign AI partnership for overseas expansion

Khgears targets humanoid robot joints, eyes 2027 mass production

Russia considers reinstating parallel imports of Samsung, SK Hynix products amid memory shortages

3M calls Largan partnership key step for US$2 billion EBO market

2nm and CoWoS expansion lifts Chi Yi Hsin Technology backlog to NT$4.5B

High-end ASIC demand drives TGV adoption as TPK weighs further Taiwan expansion

Analysis: Tesla's flying Roadster promises thrills, but can technology outrun the law?

Holy Stone targets 50% South Korea revenue growth by 2027

Analysis: Musk combines rocket technology with Roadster 2, leveraging synergies across his business empire

Hyundai revamps lineup as Taiwan's hybrid car market enters two-year battle over powertrain systems

TECO targets AI data center cooling as commercial aircon share nears 60%

Oct

21

2026

Micron reaches deal with Taiwan union to introduce quarterly profit bonuses in FY27

Li Auto chip subsidiary Mahe Xin raises CNY1.6 billion in equity financing as automakers aim to become chipmakers

Cloud AI to drive chip growth in 2027 as Taiwan suppliers seek opportunities beyond weak consumer edge AI

Infineon, Wolfspeed pivot to 8-inch SiC to cut costs and meet rising AI power demand

Sony keeps chip unit as imaging sensors, TSMC partnership drive strategy

Samsung shifts M2800 modem to 2nm, frees 4nm capacity for HBM base dies

Samsung Display accelerates MPO and inkjet OLED development for laptops and monitors

HD Hyundai Robotics unveils dual-arm robot as FIX 2026 opens

Samsung, SK Hynix reportedly upgrading China NAND fabs to fend off YMTC amid softening US stance

AMD and Intel align PyTorch CPU optimizations around oneDNN

Micron's Taichung union deal eases Taiwan DRAM strike risk; Taoyuan dispute remains unresolved

Qisda integrates four companies to build scalable rack-scale AI solutions

Anthropic's IPO spotlight falls on its potential US$750 billion AI compute tab

Murata develops world's smallest NTC thermistor, targets 2027 mass production

China launches state-owned data group as market-facing arm of its AI infrastructure push

PCB material shortages persist as capacity expansion extends beyond 2029

Taiwan PCB output set to top NT$1 trillion as VP touts AI opportunity

Qualcomm plans global performance-based layoffs from November

US sanctions five Chinese entities over trade secret theft tied to ex-Google engineer

Micron funds critical minerals processing at Indium Corporation's New York facility

CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026

CATL's profit growth slows, sharpening focus on 50% energy-storage revenue target

AMD: Physical AI demands more than TOPS

DIGITIMES Insights: AI server PCB upgrades drive explosive demand for advanced backdrilling equipment

AMEC seeks South Korean foothold through MOCVD trials with SK Keyfoundry, Magnachip

Chinese nickel producers weigh coordinated HPAL cuts in Indonesia

TSMC and others turn LCD plants into AI assets as LG Innotek weighs acquisition

Zhen Ding Technology showcases AI infrastructure and terminal PCB lineup

Axcelis plans US$35 million semiconductor facility in South Korea

Analysis: From rockets to fabs, SpaceX's TeraFab bet pushes vertical integration into the semiconductor era

Micron faces potential Taiwan strike, union cites Samsung, SK Hynix profit-sharing benchmark

Sony bets on cinema-grade audio, mobile accessories to counter smartphone sales slump

Apple expands US iPhone supply ties with Perryman and Qnity

SpaceX pushes AI scaling into industrial realm as power equipment becomes limiting factor

How ByteDance, Alibaba, Tencent are testing the boundaries of US AI chip restrictions

Memory costs weaken e-reader demand as E Ink cuts 2026 outlook

REI targets drone, robot markets

Vertical Aerospace's liquidity squeeze clouds 2029 eVTOL certification target

AI chip scaling shifts into 3D, with performance per watt the new benchmark, says former TSMC VP

Toppan, Keio University validate quantum AI image generation

Samsung reportedly shifts foundry focus to 4nm, 5nm as 2nm deals take longer

Advanced PCB drilling faces growing demand from AI and high-speed applications

Supermicro lifts quarterly sales estimate as AI demand outpaces forecasts

Foxconn and Mitsubishi Electric target SDV with L4 autonomy and EV drive systems

Beyond broadband: SpaceX maps Starlink's expansion into aviation, mobile, next-gen capacity

Starlink, FPT deploy satellite internet terminals on Vietnam islands

LX Semicon uses AI agents to cut display chip design time by 80%

AI customers seek 3-year partnerships as Unimicron calls for Taiwan PCB supply chain collab

Samsung Electro-Mechanics wins KRW360.5 billion memory substrate deal as AI demand drives expansion

Memory chip inflation accelerates smartphone brands' retreat from low-end devices

Breaking AI's memory wall: former TSMC VP charts a path with HBM, optical links and 3D stacking

Taiwan's September export orders jump 62.4% on AI demand

Nvidia's Vera CPU signals a broader shift in AI infrastructure

Samsung Electro-Mechanics extends long-term contracts to memory substrates, totaling KRW4.3T

Contrel, FSE combine laser and plasma processes for advanced packaging

Taiwan promotes Hsinchu science-park model to Mexico and Poland

Packaging-to-board integration emerges as key gap as AI reshapes electronics supply chain

Robot hands get cheaper, but factories still want proof

Huawei-linked Yinwang gives CATL battery swapping a wider route into smart vehicles

Foreign suppliers stand to gain first as India's chemical makers chase Tata's chip fab

Amazon open-sources TorchNeuron to bridge PyTorch, AWS Trainium

Japan plans JPY400 billion boost for Rapidus 2nm push

SpaceX returns to operating profit in 3Q26; Super Intelligence revenue overtakes Connectivity

AI infrastructure faces four hurdles: Power, construction, technology, funding

Musk and Anthropic test rival models for sharing AI wealth with the public

Oct

20

2026

Unimicron chairman sees substrate sizes reaching 14x current scale by 2030

Jensen Huang urges Germany to embrace physical AI at Berlin summit

Samsung eyes six foldables for 2027, including a rollable phone

Japan's MMX mission launches successfully, gains edge over China in race for first Mars system sample return

Global Tek's new Thailand plant enters trial production in 3Q26, targeting AI liquid cooling and aerospace opportunities

Intel requests FCC waiver from US foreign robot ban, citing impact on US chipmaking

Chief Telecom starts NT$3.3 billion AI data center in Taiwan

Wistron Medical Technology and Chang Gung University expand AI elder-care training

AI server demand lifts Tongtai drilling orders through 2027

US firms eye Malaysia to diversify rare earth supply chains

AUO selects glass substrate specs for semiconductor processes, not size rivalry

Taiwan anchors US chip revival, SEMICON West spotlights trusted partners

AI servers drive TVS and ESD demand for Yea Shin Tech

Thermaltake expands AI workstation lineup on edge AI demand

Samsung's HBM4 supply lock-in exposes limits of China's CXMT as Apple and Tesla seek DRAM alternatives

BYD's China EV battery market share slips as overseas installations surge 66.5%

Daeduck Electronics targets 2029 ceramic substrates for AI packaging

Genius Electronic Optical partners with 3M on EBO development

Hygon's revenue jumps 58% on AI chip demand, but growth slows amid 51% stock slump

Powertip Technology transitions into a solutions provider as demand and costs rise

South Korea's US$1.66 billion humanoid robot push puts auto suppliers in focus

DeepSeek-Huawei chip co-design could shift AI training away from Nvidia

Nvidia says South Korea has Vera CPU customers, LG robot results ahead

OLED monitor panel shipments set to overtake TV panels in 2028

China tightens drone export controls, extending restrictions to critical components, technologies

Kioxia targets higher-value AI storage with Nvidia partnership, advanced NAND technology

AI substrate bottleneck shifts from design to manufacturing

Nscale set to lose Microsoft as anchor tenant over UK power delays, adding uncertainty to IPO

China's S2C–HyperSilicon merger targets hardware emulation gap in domestic EDA with Empyrean backing

FIC Global targets doubling business in 2027 on optical module orders from eight of world's top 10 makers

LGD continues microLED development despite Apple's exit

Exclusive: Apple's MacBook Neo pressures Microsoft to cut specs for low-cost 12-inch Surface

Micro LED optical interconnect targets AI racks amid unsettled standards

Intel says it is the only high-volume fab for 12-inch InP silicon photonics as co-packaged optics nears deployment

IFA CEO: Taiwan tech to leverage core silicon strengths to counter China's momentum

Malaysia says data center investors must fund transmission upgrades

Japan's H3 rocket takes on first deep-space mission as MMX targets Mars moon sample return

Apple sets October 28 event, eyes first touchscreen MacBook Pro

Amkor triples Gwangju investment as AI packaging demand grows

TiMotion targets robot market as Vietnam plant is set to open by year-end

Taiwan's behind-the-meter energy storage faces space, cost barriers as ITRI proposes three solutions

TPK targets 2028 TGV mass production with NT$6 billion investment

China's tech-driven commerce plan pushes AI into phones, PCs, and robots

Alibaba's XuanTie tops 6 billion RISC-V chip shipments, expands into AI servers with C950

Foxconn's FoxBrain 2.0 sets sights on physical AI with VLM, VLA ambitions

South Korean govt, SK Hynix launch KRW2 trillion loan guarantee program for chip suppliers

Sandisk to be exclusive storage provider for Meta VR Glasses

DJI launches Dock 4 drone station, faces US market restrictions

Taiwan industry seeks nuclear restart and utility relief amid energy costs boom

Commentary: Samsung's US 2nm ramp faces no room for error

Yale develops fluidic memory chip using water flow, microfibers

Tech giants race to train FDE talent as AI deployment gains urgency

ChatGPT hits 60,000 advertisers as OpenAI cuts prices

US orders DeepSeek removed from federal civilian IT systems

Hanmi Semiconductor establishes US hub to support AI packaging customers

Analysis: China's proposed AI export controls reach beyond chips to design IP, computing infrastructure

Zhen Ding launches PCB talent development platform with National Central University, partners

Google demonstrates magic state cultivation on Willow, cutting errors by about 40-fold

Nvidia seeks Taiwan government affairs director amid deeper local push

Analysis: China's proposed AI export controls target top-ranked foundation models, advanced agents

China's auto market contracts, Europe alone grows, Taiwan auto suppliers face risks

MediaTek's Google TPU v9 faces potential delay over glass substrate yields, but 2026 orders remain strong

Samsung transfers 126 technologies free of charge to 99 smaller Korean firms

DIGITIMES Insight: AI packaging power reaches kilowatt scale as thermal design moves toward the die

Taiwanese server makers deepen Mexico investments amid US AI spending boom

SK Hynix moves AI data centers from processor-centric to memory-centric design

Analysis: US backing grows, but Intel insists turnaround remains independently run

Exclusive: US energy storage supply chain faces mounting pressure as import restrictions and manufacturing bottlenecks disrupt deliveries

AI dividend drives Taiwan's memory makers from trough to transformation

DIGITIMES Insights: Renewable energy bottlenecks in South Korea, Taiwan, Singapore slow memory chipmakers' RE100 progress

Commentary: China's EV brands own the Paris Motor Show floor, but still yet to land on Macron's guest list

Huawei-Chery Luxeed gains independent EV license

South Korea's FIX 2026 to feature robots from HD Hyundai, Doosan

IT panel market struggles to pass on costs: monitors hold flat, notebooks slide

OCP 2026 shifts AI competition from chips to rack-scale systems

Oct

19

2026

DeepSeek updates V4.1 Flash to improve AI agent performance

Podcast highlights: Microsoft Maia 300 leads 2nm race, TSMC's US strategy shifts, Intel EMIB-T faces yield challenge

Samsung targets Exynos 2700 expansion as Huawei advances Kirin chips

Anthropic offers Blackstone more than 10% return in US$60 billion AI chip financing deal

Solution Finders Part 2 of 2: TSMC's first CTO said no to Intel twice but still wonders what if

Weblink International secures AvePoint agency rights to expand AI governance

Action cameras gain momentum as camera demand fragments

Elon Musk points to China's 2028 DRAM supply surge to challenge Samsung, SK Hynix pricing power

ACM Research bets on panel-level packaging and overseas growth as adoption risks persist

Canon Taiwan sees strong global camera demand in 2026 and 2027

Solution Finders Part 1 of 2: the DARPA challenge behind TSMC's success

From LCD powerhouse to AI enabler: Taiwan's display industry reinvents itself after 30 turbulent years

SiC powering the future: market scaling meets IDM synergies

Toyota eyes full SDV lineup by 2030, rolling Arene across 50 models

China's 420GWh storage boom enters a quality reset as Beijing reins in overcompetition

Sanan Optoelectronics faces corp governance turmoil amid Micro LED breakthroughs

Foxconn, Mitsubishi Electric form alliance in automotive equipment business

IBM and Siemens collaborate to advance nanostack chip architecture

Von Ardenne's flexible equipment targets unsettled panel-level packaging market

Exclusive: Wooptix targets leading chipmakers with wafer metrology technology, eyes production adoption within 3-5 years

Toyota to deploy gigacasting in China as Shanghai Lexus plant targets 2027

China probes Huawei-JAC Maextro V800 over brake pedal failure

Anthropic opens Singapore office, signs AI cooperation agreement

Taiwan launches first proof-of-concept project for green-power time shifting

Terafab exposes Tesla's growing tensions with Samsung and TSMC

Interview: Zeiss SMO president says High-NA EUV ready for mass production, orders booked through 2027

SK Hynix advances chip inspection technology as 3D memory pushes conventional metrology to its limits

Lens Technology enters AI server cooling market with US$25 million PMG takeover

Anthropic signs first Canada data center lease

iBase Solution targets AI data center EPC contracts with modular liquid cooling, energy storage expertise

Memory giants lock in up to 70% of capacity under long-term deals as AI demand reshapes industry cycles

AUO, Largan Micro LED debate highlights optical communications uncertainty

DIGITIMES Insights: SpaceX moves closer to independent mobile network as Starlink expands spectrum holdings beyond satellites

China proposes tighter export controls on AI and solar technologies

CXMT eyes nearly US$20 billion profit as AI-driven DRAM shortages fuel earnings turnaround

Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup

AUO expands AI businesses as it seeks its next growth curve

TSMC's only South Korean VCA partner ASICLAND eyes AI chip growth via Taiwan R&D

TECO shifts toward integrated solutions as AI drives demand for power, infrastructure

Nvidia backs OpenClaw, putting robotics potential, agent security in focus

Malaysia unveils six locally designed chips, but commercial adoption is the real test

Micron develops robot memory as Samsung, SK Hynix target physical AI

Infineon extends Wolfspeed wafer deal to 8-inch silicon carbide

US defense startups turn to Taiwan for local production partnerships

Hyundai creates RX team to accelerate Atlas humanoid robot production

Memory squeeze leaves Brightek short on chips; Chinese automakers line up for Nantong plant

EU eyes AI defense as it tests China's open-weight models

Beyond displays: AUO eyes co-packaged optics, glass core substrates for AI-era growth

Chenming Hu urges universities to 'find the solutions', targets world-class Taiwan semiconductor sector

AI data-center expansion shifts focus to time-to-power

AI memory demand lifts Samsung, SK Hynix 2027 outlook

Exclusive: Chinese energy storage giants reportedly exit US as two-way tech restrictions open door for non-Chinese suppliers

Amazon Leo tops 400Mbps in test, targets Starlink market

TECO's modular data center validation nears completion

Weekly news roundup: Tata's Dholera fab faces test; how Intel's CEO helped reshape its comeback

Nvidia's custom HBM pulls Samsung onto TSMC's 3nm process, report says

India roundup: Tata chip bets face execution test as India semiconductor ecosystem expands

Semiconductor equipment demand rises as risks curb AI bubble

Lite-On showcases 800VDC power technology at Nvidia MGX event

EU bet on minimum import prices risks repeating solar mistakes in EV battle

ByteDance Seed launches AI safety team, global recruitment drive

Space solar outsourcing heats up as Taiwan targets non-SpaceX players

South Korea's TelePIX wins global satellite contracts, targets 2027 launch of AI-powered optical payload

Taiwan seeks international quantum collaboration in critical 5-year push

Oct

18

2026

Exclusive: EnterpriseSG positions Singapore's semiconductor SMEs for bigger roles in global chip supply chains