Applied Materials to raise Besi stake to 20% as hybrid-bonding orders surge

, DIGITIMES, Taipei

Oct 27, 2026, 11:27 0

Applied Materials and Besi jointly developed the Kinex integrated die-to-wafer hybrid-bonding system. Credit: Applied Materials

Applied Materials plans to increase its stake in Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) to approximately 20% from 9%, deepening its involvement in advanced chip packaging as demand for hybrid-bonding equipment accelerates.

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