Founded in 1993, Prodrive Technologies designs and manufactures mission-critical products that combine advanced engineering, innovative manufacturing, and global expertise. The company empowers semiconductor equipment manufacturers and customers across multiple industries to accelerate innovation and achieve operational excellence. Headquartered in the Netherlands, with regional hubs in the USA, Japan, and China, Prodrive Technologies serves the semiconductor, medical, life sciences, energy, infrastructure, and industrial markets. Its customer-centric approach, deep engineering expertise, and vertically integrated manufacturing enable fast time-to-market, superior quality, and scalable systems.The company's portfolio spans optical and e-beam cameras, embedded computing systems, high-precision motion control and drives, and RF plasma power solutions. These offerings are available as off-the-shelf products, customized systems, or turnkey solutions.With its broad product range, flexible business model, and decades of experience in the semiconductor sector, Prodrive Technologies is now also exploring opportunities in Taiwan. As home to the world's largest semiconductor foundry and a growing ecosystem of equipment manufacturers, Taiwan represents a potentially strategic market where Prodrive's innovation, quality, and speed-enabled by its unique vertical integration-can create significant value.

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In addition to its headquarters in the Netherlands, the company has operations in Singapore and China Suzhou. The key technologies of Boschman are silver sintering and Film Assisted Molding (FAM). Boschman uses a pressurized silver sintering process in module packaging to address the stringent challenges and difficulties of power module interconnect technology. The power module market is experiencing substantial growth in Europe and China, driven by the accelerating adoption of electric vehicles (EVs), expansion of renewable energy systems, and increased demand for energy-efficient industrial and consumer electronics. The power modules require sophisticated packaging for high-temperature, high-power, and high-reliability connections. The FAM technologies for protection against harsh environments like high humidity and vibration, as well as to manage thermal and electrical stress. On the other hand, silver sintering offers superior thermal and electrical conductivity compared to traditional soldering process, while FAM with its vacuum-assisted films prevents voids during molding, leading to more reliable and high-performing power modules with better thermal management.Boschman began its journey by developing and manufacturing module packaging molds, then expanded into the research and development of silver sintering packaging equipment. And the company continues to invest in and develop advanced packaging technologies. Boschman specializes in serving the global electronics assembly and semiconductor back-end packaging industries, providing advanced sintering equipment using advanced high-pressure sintering technology. Specifically tailored to the needs of customers of varying sizes and production scales, Boschman's sintering equipment offers a variety of solutions suitable for R&D doing small batches, small- to medium-volume pilot production, and large volume manufacturing environments.Boschman has many years of experience in cooperation with Taiwanese industries, especially in power electronics and components manufacturing service vendors that provide power management, power electronics, and thermal solutions. Among the new business opportunities, OSAT (Outsourced Semiconductor Assembly and Test) companies serve a broad range of semiconductor clients, is one of the key types of customers in Taiwan for Boschman. OSAT customers are providing back-end packaging services such as Tire Pressure Monitor Sensors (TPMS) and other automotive sensors for customers, which has enabled Boschman to gain the benefits.Talking about the business model, Boschman provides customers with packaging design and development, as well as silver sintering process equipment to meet the needs of the automotive supply chains and power system industries. It also provides design proofing and small-batch assembly production services to customers. One more thing, Boschman and Powertrim Technologies, another Dutch company exhibiting at the Netherlands Pavilion, have a collaborative upstream and downstream relationship. These two companies collaborate in the manufacturing of automotive and power module systems in Europe, jointly serving leading Auto and industrial customers.

Fonontech B.V. is a device solution provider and startup company based on Impulse Printing technology. Impulse printing technology can be described as a novel additive manufacturing technology that allows for parallel transfers high-resolution conductive patterns to enable the rapid and precise printing of micrometer scale interconnections. This technology offers high-speed low-cost manufacturing, is well suited for process equipment to create complex 3D structures and achieve further miniaturization of electronic devices. The rapidly growing opportunities in AI-driven electronics push the technology forward. These unique solutions have considerable potential, and on May 16, 2025, Fonontech received the good news of a $9.5 million seed round investment.Currently, Fonontech equipment is being used to address wire bonding speed issues in chip packaging. Wire bonding is a viable solution for connecting chips to external pins or for silicon interlayer structures in advanced packaging. This process is typically used in back-end chip manufacturing, particularly flip-chip bonding. Fonontech equipment offers higher pin density, optimized electrical performance, and smaller package sizes.While conventional wire bonders can only print one line at a time, Fonontech Impulse Printing technology is much faster. Because its parallel printing solution can transfer contacts covering an entire area at a time, the speed increase is astonishing. According to on-site testing and monitoring, Fonontech Impulse Printing technology can achieve speeds up to 100 times faster than wire bonders.Currently, Fonontech equipment can successfully bonding with a minimum size of 20 micrometers, and in the future it will further achieve a dimensional accuracy down to a few micrometers. In the booth of Fonontech showcased the Impulse Printing demo kit, a scaled down version of the industrial equipment. In addition to selling the equipment itself, the company also integrates Impulse Printing print head modules into customers' production lines for special tailored applications.The equipment can be used for transfer printing onto wafers, PCBs, or other manufacturing processes, such as connecting signal pins on the side of a display chip to the signal contacts on the back side of the display panel. The bestselling point of this equipment is speed and cost effectiveness to reduce material waste and carbon emissions. The company's product is marketed as a replacement for wire bonding machines. Furthermore, the company currently is developing Taiwan market and running ongoing collaborative projects through testing and verification with potential clients.

Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking heritage, the company offers product design support, prototyping, and manufacturing services for power modules used in electric vehicles, the energy industry, and industrial applications. The rapidly growing automotive industry is driving significant demand for compound semiconductors and back-end packaging to support the growth of power modules, creating a strong demand for power module packaging and manufacturing technologies. The company offers full support to allow power module manufacturers to predictably build quality products at the most competitive price.The Powertrim Flex Line, the flagship manufacturing platform, provides high performance handling, assembly and testing technology for automated power module manufacturing. With its modular architecture, the Flex Line covers the core trim and form processes as well as adjacent process steps like laser marking, laser de-flashing, optical inspection, quality control, testing, loading and unloading.The main focus of Powertrim Technologies is in providing power module back-end packaging equipment and tooling. Through different modular machine designs, they are assembled into production configurations that meet the customized needs of various power module products. The company also provides the well-designed tools to help customers implementing both prototyping, qualification and rapid serial or mass production of power modules.Furthermore, electrification of the automotive transmission system by either battery or hybrid electric motors, new industrial power applications and the massive growth of renewable energy solutions accelerate the need for power modules. With these, Powertrim provides manufacturing equipment, supporting a wide range of power electronics applications, and is strategically collaborating with supply chain partners to centralize services and resources for the EV market, a move designed to meet fluctuating demands efficiently.The existing flagship production line implements a system designed to adapt quickly to changes in product type and quantity, allowing for the efficient production of a variety of power module products on one single machine, hence Flex Line. With this concept, the company is capable of switching between complex product sizes in under 15 minutes. In addition, it can also provide a series of optional add-on units, including loading/offloading modules, laser marking & de-flashing, automatic optical inspection, MES integrated system, which providing software linking to ERP/MES enterprise software platforms. These different arrangements can be flexibly matched and assembled to meet the manufacturing needs.With a presence in the Netherlands, known for its cutting edge semiconductor front-end and back-end equipment, Powertrim Technologies combines precision engineering with scalable automation to unlock markets such as automotive, energy and industrial power applications. At Semicon Taiwan 2025, Powertrim aims to work together with Taiwanese customers to create new opportunities.

Tempress is a leading manufacturer of diffusion and thin film deposition equipment, with over 55 years of experience in thermal process technology. We support innovators in semiconductors, power, MEMS, photonics, memory, life sciences, and coating industries in producing high-value materials and devices. Our production systems are built for R&D applications but also for  automated, high-volume production and meet the rigorous standards of modern chip manufacturing. Tempress solutions cover essential thermal processes such as oxidation, annealing, diffusion, and LPCVD, offering precise temperature control to achieve optimal properties in silicon wafers.Tempress established an early presence in Taiwan (1999), earning recognition across the region's semiconductor sector. Our local experts ensure smooth coordination between customers and our product team in the Netherlands, providing hands-on support and technical guidance.We collaborate globally with universities and research institutes to drive innovation and continuously improve our technology. At Tempress, we deliver more than equipment-we build lasting partnerships backed by dependable service and worldwide support.

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation, light etching and processing, as well as UV photoresist curing and charge erase. It also manufactures UV curing equipment, focusing on equipment used in compound semiconductor processes. These equipment are used in the production of wide-bandgap semiconductor power devices such as silicon carbide (SiC) and gallium nitride (GaN), as well as other important processes such as communication power amplifiers (PAs).Trymax has been established for over 25 years and has a considerable customer base and brand recognition in the Taiwanese market. At Semicon Taiwan 2025, the company primarily serves to promote its products and connect with key clients. With a product portfolio ranging from 100mm to 300mm wafer size, Trymax's clients are on both sides of the Taiwan Strait becoming major suppliers to the manufacturers of power amplifiers and RF components. In the global presence, Trymax has significant market shares at foundries, IDMs and wafer level packaging houses for end applications in Power semiconductor, automotive, MEMS, LED and CMOS.Trymax's NEO series plasma dry descum systems are suitable for cleaning and activation processes in the semiconductor industry, offering high efficiency, uniformity, and repeatability. These systems utilize RF/microwave power to generate high-energy, disordered plasma under vacuum conditions. They can process a wide range of substrate sizes and offer a variety of processing technologies for flexible customer selection, meeting the needs of diverse semiconductor process technologies.Trymax continuously innovates to support its customers’ needs. In addition to the compound semiconductor processes, it is also widely used in application fields such as MEMS microelectromechanical systems, microfluidic devices, SOI substrate manufacturing, advanced packaging and optoelectronic displays. Among them, the global installed capacity of NEO system equipment has exceeded 300 sets.

Invest in Holland /Netherlands Foreign Investment Agency (NFIA) is the national investment promotion service of the Netherlands. It operates as part of the Dutch Ministry of Economic Affairs, supporting foreign companies in establishing and expanding their businesses in the Netherlands. The organization works with a network of regional partners and has a global presence through its worldwide network of offices, including one in Taipei, to facilitate foreign investment and economic development.  With 25 offices worldwide, Invest in Holland has over 40 years of service experience. The Taipei office assists Taiwanese companies in developing their businesses and R&D IN EUROPE and expanding the opportunities in the Netherlands. The services include to provide customized information on the Netherlands, relevant business locations, Dutch legislation and tax regulations, labor law, permit procedures, government incentives and much more through in-person or digital meetings. With a population of over 18 million people, the Netherlands economy relies on international trade. It is highlighting the importance of foreign investment to strengthen its innovation ecosystems and achieve future economic goals. The network of Invest in Holland actively promotes this idea by focusing on sectors like high-tech industries, and sustainable energy, where collaborations between companies, government, and knowledge institutions drive innovation and economic resilience. Right now, more than 230 Taiwanese companies have setup their European headquarter or R&D center in the Netherlands. Many of which companies are in the Semiconductor and ICT-related sector, eg CHROMA, DELTA ELECTRONICS, MIC, ADVANTECH, and etc.Invest in Holland actively creates opportunities for industrial clusters to develop in the Dutch market by attracting Taiwanese companies and fostering collaboration between businesses, high-tech research institutions, and government, enabling Taiwanese companies to quickly integrate into the local operation and accelerate business development. One important thing, Invest in Holland's services are entirely free for all foreign companies, both new and established, that are looking to expand their operations into the Netherlands. This is a benefit provided by the Netherlands government and its network of partners. These public services offer guidance, practical solutions for establishment, and connections to the right resources and partners to help international businesses succeed in the European market.

Brainport Industries Campus (BIC) is a development project for an industrial park in Eindhoven, the Netherlands. Phase one (BIC 1) has been completed, encompassing 105,000 square meters of existing buildings, surrounding public space, and parking. The site is home to several high-tech manufacturing companies and educational institutions. Expansion plans are currently underway, with the newly expanded BIC 2 campus expected to double the size of BIC 1, reaching 300,000 square meters. More than 40 pioneering companies are already established on the campus. BIC is the largest campus expansion in the Netherlands for years to come.Notably, ASML, the Dutch EUV lithography equipment giant, is considering expanding to the northern part of the BIC 2 campus. In 2024, ASML announced plans to establish a subsidiary in the BIC Industrial Park by 2030, accommodating thousands of employees. The Brainport Industries Campus development company stated that it aims to provide startup facilities, co-innovation spaces and built to suit manufacturing space for high-tech companies.In partnership with Invest Holland and the Brabant Development Agency (BOM), the park will offer Taiwanese companies the option of establishing regional business units or research centers in the Netherlands through support services provided by the industrial park.The campus aims to attract leading companies in cutting-edge technology fields, including semiconductor related technologies, photonics, quantum and additive manufacturing. BIC and Invest Holland jointly unveiled this plan at Semicon Taiwan 2025, offering the access to advanced facilities, a strong open innovation ecosystems and encouraging Taiwan's high-tech industries participating in this collaboration opportunity.

Axelera AI is a startup targeting Edge AI applications. Leveraging its Metis AI Processing Unit (AIPU) chip, embedded hardware AI inference acceleration cards, and Voyager SDK software solutions, the company specializes in imaging application solutions for applications in edge nodes. Unlike AI systems developed in high-density cloud data centers, Edge AI computing offers energy efficiency, information security, low latency, and fast speed of response, rapidly powering real-time vision and smart detection applications for embedded AI systems. Axelera AI's technology offerings span 4K/8K image resolution real-time image recognition, security surveillance, campus safety, and drone imaging, pioneering a new model for the development of high-performance AI inference in diverse fields. The company's Metis chip boasts a computing performance of up to 214 TOPS (TeraOPS) of inference performance at INT8 precision. For example, using ResNet-50 Convolutional Neural Network (CNN) model doing object segmentation and analysis, a single Metis chip can achieve a high processing speed of 3200 frames per second (FPS), providing stable, real-time analysis capabilities while consuming only approximately 10W. This balance of performance and environmental benefits has attracted significant market attention.Meanwhile, the AI inference acceleration cards integrated with Metis chips are also a major product line. There are two types of accelerator cards that support M.2 and PCIe interfaces, which can quickly meet the needs of system integrators, OEM customers and industrial PC (IPC) makers. With these flexible connection interface, Axelera could engage the business with various embedded AI system makers.In addition to the hardware lineups, Axelera's software support is also a key factor in its success. The Voyager SDK software suite facilitates hardware and software integration for system integrators. There are open source software framework currently available on GitHub for computer vision and enabling customers to solve their AI business requirements. This Voyager SDK comes with a Model Zoo, a catalog of turnkey AI models, allowing customers either to import their own AI models or choose from Model Zoo models. These offerings significantly reduce developing time and excels in functional completeness and efficiency.Axelera AI's business model is based on collaboration with system integrators and OEM clients, encompassing joint development of AI projects and customized data architectures, providing clients with one-stop, high-performance Edge AI solutions. Axelera AI is working closely with major Taiwanese industrial PC vendors and OEM/ODM clients to develop key applications for financial and research institutions, medical solution providers and other public facilities that prioritize data security, privacy, and safety. This initiative aims to create emerging applications for Edge AI and unlock its significant value.

Fastmicro B.V. is a manufacturer of surface particle defect detection systems and equipment established over 15 years ago. The main product lines include sample surface particle defect scanning, particle deposition measurement instruments, and particle defect detection systems for applications such as compound semiconductor wafers, glass wafers, masks, and EUV/DUV mask pellicles.The ranging product offerings of Fastmicro include analytics software to cover a wide variety of applications and processes, in-line defect inspection systems, transportable scanners and scanning module for system integration. The company's technology can detect particles down to 100 nanometers in size. It offers various operation modes, with inspection speeds up to 400 wafers per hour, and can provide inspection reports in ISO standards or PDF format.Fastmicro was initially established through a collaboration with the Netherlands Organization for Applied Scientific Research (TNO) to develop and research surface particle detection technology. Because the cleanliness level within semiconductor front-end processing plants and cleanrooms is crucial to the stability and yield of advanced semiconductor manufacturing, detecting tiny particles significantly impacts their operational needs. Today, tiny particles have a wide variety of composition, Fastmicro equipment plays a proactive role.Because the company's equipment has the advantage of fast detection speed, it usually only takes about ten seconds to complete surface particle defect detection, which has been well recognized by customers. The standard equipment is roughly the size of a household microwave oven. The operative procedures start to use swab or sampling tool to collect a sample from the surface of an object, which is then placed into the detector to read the particle count. Fastmicro adheres to NIST standards and uses PSL (Polystyrene latex) material for calibration and particle measurement. They also provide an OEM design model, providing flexible integration scanning modules to precision semiconductor equipment customers, covering wide-area scanning and diverse testing needs.The company began expanding its international business in 2022. At Semicon Taiwan 2025, in addition to engaging with Taiwan major foundry clients, the company is also entering the semiconductor equipment manufacturing supply chains. During equipment assembly, it is necessary to first confirm that the parts and components meet the product cleanliness level requirements before entering assembly. Each manufacturing link of supply chain requires confirmation that particle defect detection meets standard requirements, so Fastmicro equipment present strong business opportunities. This is currently the company's main market opportunity for expansion in Taiwan.