GameLoop TV, a revolutionary 24-hour, 7-day-a-week free gaming channel, is set to transform video game discovery and accessibility with its innovative application of NEXTGEN TV technical capabilities. Launching next week at CES 2025 in Las Vegas on NEXTGEN TV channel 3.2, GameLoop TV will bring the engaging world of gaming directly to viewers' living rooms with no additional hardware or subscriptions required. Demonstrations of GameLoop will be available at the CES exhibit of ATSC, the Broadcast Standards Association, in Central Hall 20340 during CES next Tuesday through Friday.At the heart of GameLoop's innovation is the channel's exciting "Play Now" feature, which allows viewers to instantly play games showcased on the channel simply using their TV remote or mobile phone. The channel's friendly and entertaining hosts demonstrate how to play each game and invite the audience to jump right in by choosing "Play Now" at any time. This seamless fusion of watching and playing fulfills the promise of interactive television while ushering in a new era of entertainment perfectly suited to today's engaged viewers.The company also announced distribution agreements with television leaders Sinclair Broadcast Group and Gray Media. "We are excited to be bringing this groundbreaking 'Play Now' innovation to TVs nationwide," said Zane Vella, Chairman and Co-Founder of GameLoop TV, "and thrilled to be doing it with the innovative leaders at Sinclair and Gray."GameLoop TV's lineup includes games from its premier partner, Play.Works, the world's leading provider of games on TV and is known for bringing iconic titles like Wheel of Fortune, Pac-Man, and Tetris to TV audiences worldwide. The channel will also introduce innovative new games, including Planet Crossword, the first collaborative crossword experience designed for television."GameLoop TV demonstrates the unmatched power of the NEXTGEN TV platform to seamlessly integrate streaming video and interactive gameplay in ways that were previously unimaginable on traditional broadcast television. This is a game-changer for broadcasters and viewers alike," said Anne Schelle, managing director of the Pearl TV business group of TV station owners.Visit GameLoop.TV to find out when GameLoop will launch in TV markets and to explore the next generation of gaming and entertainment.

RoyalTek, a global leader in satellite positioning and wireless communication technology, is proud to announce its latest innovations at CES 2025. Building on its legacy of excellence since 1997, RoyalTek continues to lead the industry with advanced solutions in GPS, automotive radar, AI cameras, and wireless communication.Showcasing Next-Generation SolutionsAt CES 2025, RoyalTek highlights a range of breakthrough products designed to meet global regulatory standards and enhance vehicle safety and intelligence:1. BSIS/MOIS/RPAS Radar SystemsRoyalTek's 77GHz Blind Spot Information System (BSIS), Moving Off Information System (MOIS), and Rear Parking Assist System (RPAS) comply with European and American UN regulations (UNR151/UNR159/UNR158). These systems deliver exceptional detection accuracy and ensure compliance with stringent safety requirements.2. RTK Surrounding RadarFeaturing innovative pattern technology and a 180° Field of View (FOV), the RTK Surrounding Radar enables comprehensive vehicle detection. This solution supports one radar on each side of the vehicle, ensuring precise surrounding detection for enhanced safety and operational efficiency.3. Motorcycle Radar with Smart ClusterDesigned specifically for motorcycles, this radar integrates seamlessly with a Smart Cluster that includes navigation and wireless communication capabilities. This solution elevates rider safety and connectivity, ensuring a superior experience for motorcyclists.4. AI Camera SolutionsRoyalTek introduces AI-driven camera systems for a variety of applications, including:AVM/DMS & ADAS Functions: Advanced Vision Monitoring, Driver Monitoring Systems, and Advanced Driver Assistance Systems for smarter driving.RCD & RCTA AI Rear Cameras: Rear Collison Detection and Rear Cross Traffic Alert capabilities for improved rear-view safety.Global Compliance and Industry LeadershipRoyalTek's commitment to regulatory compliance and technological excellence ensures its solutions are ready to meet the demands of the global market. By aligning with UN regulations and leveraging advanced design principles, RoyalTek delivers safety and innovation to customers worldwide.Innovative Technology Backed by Quanta Inc.As a member of Quanta Inc., a Fortune Global 500 company, RoyalTek benefits from the seamless integration of leading-edge technology and manufacturing expertise. With facilities in Taiwan, Shanghai, and Thailand, RoyalTek is positioned to serve a diverse range of customers with unmatched precision and reliability.Visit Us at CES 2025, Join us at Booth #3260, located in the LVCC, West Hall, Las Vegas, Nevada, to experience our innovative technologies firsthand.

Empowering creators and gamers with reliable and efficient technologyDatotek, a trusted provider of storage and memory solutions based in Taiwan, is excited to participate in CES 2025. Established in 2005, Datotek has built a solid reputation in the storage industry over nearly two decades. At CES 2025, Datotek will be presenting a range of advanced solutions designed to meet the diverse needs of content creators, gamers, and tech enthusiasts.Introducing Datotek's latest products at CES 2025Datotek continues to strengthen its position in the market with a variety of innovative products tailored for high-performance applications. From external SSDs to high-speed gaming memory modules, Datotek aims to provide reliable and efficient technology to users worldwide.ARES Q3: magnetic external SSD for content creatorsOne of the key products showcased at CES 2025 is the ARES Q3 Magnetic External SSD, designed for mobile filmmakers and content creators. Offering read speeds up to 1,600MB/s and write speeds up to 1,500MB/s, the ARES Q3 ensures quick file transfers and enhanced productivity. With MagSafe-compatible magnetic attachment, this SSD provides a secure connection to iPhone 15 Pro / Pro Max and newer models, minimizing the risk of accidental disconnections.Ideal for 4K ProRes HDR recording, the ARES Q3 allows users to record high-quality videos directly onto the portable SSD, eliminating the need for secondary transfers. The device's shock-resistant durable construction ensures durability, while its compact design offers portability for creators on the move.ARES Q4: native USB4 portable SSDDatotek is also excited to present the ARES Q4 Series, which features the world's first native USB4 portable SSD. With read speeds up to 4,000MB/s and write speeds up to 3,600MB/s, the ARES Q4 delivers unmatched data transfer performance. This drive is optimized for 4K ProRes HDR recording and is compatible with a wide range of devices, including smartphones, tablets, gaming consoles, and computers.The ARES Q4 is designed for users who need high-performance storage in a portable form factor. Its shock-resistant build, compact size, and lightning-fast transfer speeds make it an essential tool for professionals in the media and gaming industries.DDR5 Armor Lite: gaming memory with stunning RGB lightingAlso featured at CES 2025 is Datotek's DDR5 Armor Lite gaming memory, engineered for exceptional performance and energy efficiency. Built on the advanced DDR5 architecture, these modules deliver faster speeds, improved multitasking, and up to 20% reduced power consumption compared to previous generations. Ideal for gaming and content creation, the Armor Lite combines cutting-edge performance with stunning RGB lighting effects, customizable to match any gaming setup.Supporting Intel XMP 3.0 and AMD EXPO, the DDR5 Armor Lite offers easy overclocking, allowing users to maximize their system's potential with minimal effort.Aethon Series: PCIe Gen5 SSDs for extreme performanceFor users who demand the highest performance, Datotek introduces the Aethon Series of PCIe Gen5x4 NVMe M.2 2280 SSDs. Designed to meet the needs of next-generation AI PCs and high-performance computing, the Aethon SSD delivers read speeds up to 12,000MB/s and write speeds up to 10,000MB/s. For even greater demands, the Aethon Plus model offers enhanced read speeds of up to 14,000MB/s and write speeds of up to 12,000MB/s. Optimized for gaming, video editing, and AI-driven workloads, these drives ensure seamless operation in data-intensive applications, making them the ideal choice for creators and professionals leveraging AI PCs and PCIe Gen5 technology.Looking ahead: Datotek's commitment to long-term growth and innovationWith nearly extensive experience in the storage and memory industry, Datotek is dedicated to delivering reliable, high-performance solutions for both professional and consumer markets. Focused on creating durable, high-quality products, the company continues to innovate and adapt, meeting the evolving needs of users worldwide. Datotek's commitment to excellence reflects its vision of enhancing daily life and professional productivity through dependable technology.Milestones and vision for the futureGuided by our motto, "Delight Your Life", Datotek has been an established presence in the memory products industry for nearly two decades. While our largest markets are the Americas and China, we are targeting Japan as a growth market in 2025 due to evolving geopolitical dynamics. By 2028, we aim to be among the Top 3 memory product companies in Taiwan, and by 2032, achieve a position in the global Top 5. Driven by innovation, integrity, and excellence, Datotek is dedicated to shaping the future of memory technology worldwide.Visit Datotek at CES 2025CES 2025 will take place from January 7 to 10, 2025, at the Las Vegas Convention Center. Datotek will be located at Central Hall No. 22018, and we look forward to welcoming visitors to explore our latest products and solutions.For more information about Datotek and its products, visit https://www.datos.com.tw/.

SK Hynix (or "the company") announced today that it will showcase its innovative AI memory technologies at CES 2025, to be held in Las Vegas from January 7 to 10 (local time).A large number of C-level executives, including CEO Kwak No-jung, CMO (Chief Marketing Officer) Justin Kim, and Chief Development Officer (CDO) Ahn Hyun, will attend the event. "We will broadly introduce solutions optimized for on-device AI and next-generation AI memories, as well as representative AI memory products such as HBM and eSSD at this CES," said Justin Kim. "Through this, we will publicize our technological competitiveness to prepare for the future as a 'Full Stack AI Memory Provider1'."1Full Stack AI Memory Provider: Refers to an all-round AI memory provider, which provides comprehensive AI-related memory products and technologiesSK Hynix will also run a joint exhibition booth with SK Telecom, SKC, and SK Enmove, under the theme "Innovative AI, Sustainable Tomorrow." The booth will showcase how SK Group's AI infrastructure and services are transforming the world, represented in waves of light.SK Hynix, which is the world's first to produce 12-layer HBM products for the 5th generation and supply them to customers, will showcase samples of HBM3E 16-layer products, which were officially developed in November last year. This product uses the advanced MR-MUF process to achieve the industry's highest 16-layer configuration while controlling chip warpage and maximizing heat dissipation performance.In addition, the company will display high-capacity, high-performance enterprise SSD products, including the 'D5-P5336' 122TB model developed by its subsidiary Solidigm in November last year. This product, with the largest existing capacity, high power, and space efficiency, has been attracting considerable interest from AI data center customers."As SK Hynix succeeded in developing QLC2 (Quadruple Level Cell)-based 61TB products in December, we expect to maximize synergy based on a balanced portfolio between the two companies in the high-capacity eSSD market," said Ahn Hyun, CDO at SK Hynix. The company will also showcase on-device AI products such as 'LPCAMM23' and 'ZUFS 4.04,' which improve data processing speed and power efficiency to implement AI in edge devices like PCs and smartphones. The company will also present CXL and PIM (Processing in Memory) technologies, along with modularized versions, CMM(CXL Memory Module)-Ax and AiMX5, designed to be core infrastructures for next-generation data centers.2QLC: NAND flash is divided into SLC (Single Level Cell), MLC (Multi-Level Cell), TLC (Triple Level Cell), QLC (Quadruple Level Cell), and PLC (Penta Level Cell) depending on how much information is stored in one cell. As the amount of information stored increases, more data can be stored in the same area.3Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that provides power efficiency and high performance as well as space savings. It has the performance effect of replacing two existing DDR5 SODIMMs with one LPCAMM2.4Zoned Universal Flash Storage (ZUFS): A NAND Flash product that improves data management efficiency. The product optimizes data transfer between an operating system and storage devices by storing data with similar characteristics in the same zone of the UFS, a flash memory product for various electronic devices such as digital cameras and mobile phones.5Accelerator-in-Memory based Accelerator (AiMX): SK Hynix's accelerator card product that specializes in large language models using GDDR6-AiM chipsIn particular, CMM-Ax is a groundbreaking product that adds computational functionality to CXL's advantage of expanding high-capacity memory, contributing to improving the performance and energy efficiency of the next-generation server platforms6.6Platform: Refers to a computing system that integrates both hardware and software technologies. It includes all key components necessary for computing, such as the CPU and memory."The changes in the world triggered by AI are expected to accelerate further this year, and SK Hynix will produce 6th generation HBM (HBM4) in the second half of this year to lead the customized HBM market to meet the diverse needs of customers," said Kwak Noh-Jung, CEO at SK Hynix. "We will continue to do our best to present new possibilities in the AI era through technological innovation and provide irreplaceable value to our customers."

Ampere, the intelligent electric EV pure player born from Renault Group and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the next step in their strategic co-operation, starting in 2026, with a multi-year agreement between STMicroelectronics and Renault Group on the supply of Silicon Carbide (SiC) power modules, as part of their collaboration on a powerbox for the inverter for Ampere's ultra-efficient electric powertrain. Ampere and STMicroelectronics worked together on the optimization of the power module, the key element in the powerbox, to get the highest performance and best competitiveness in the e-powertrain, leveraging Ampere's expertise in EV technology and STMicroelectronics' expertise in advanced power electronics."This agreement is the result of the intensive work carried out with STMicroelectronics. By working upstream together, we were able to optimize and secure the supply of key components for our electric powertrains, to offer high-performance EVs with increased range and optimized charging time. It perfectly aligns with Ampere's strategy to master the entire value chain of power electronics for its e-powertrain, leveraging STMicroelectronics' expertise in power modules," said Philippe Brunet, SVP of Powertrain & EV engineering, Ampere."ST is at the cutting edge of the development of advanced power electronics enabling the mobility industry to improve the performance of electrified platforms. With the optimization of these higher-efficient products and solutions to meet Ampere's performance requirements, and our vertically integrated silicon carbide supply chain, we are supporting Ampere's strategy for its next generation of electric powertrain," said Michael Anfang, Executive Vice President Sales & Marketing, Europe, Middle East and Africa Region, STMicroelectronics. "ST and Ampere share a common vision for more sustainable mobility and this agreement marks another step forward in improved power performance to further contribute to concrete improvements to carbon emissions reduction by the mobility industry and its supply chain."Power modules, composed of numerous silicon carbide chips, manage and convert electrical power from the battery to drive the electric motor. They play a crucial role in the efficiency of the electric powertrain and battery range, as well as energy regeneration features, making them a key element of the efficiency of an electric car. They also contribute to the smoothness and responsiveness of driving.STMicroelectronics and Ampere have collaborated on a powerbox for the supply of energy to Ampere's new generation of electric motors. The powerbox is designed for optimum performance-size ratio across Ampere's line-up, on 400 Volt battery EVs and for Segment C-EVs with 800 Volt batteries, enabling greater autonomy and faster charging. 800 Volts is one of the key levers to achieve the 10%-80% quick charge in 15 minutes or less. This agreement is fully aligned with Ampere's strategy to master the entire value chain of the electric vehicle, particularly by working further upstream with its partners and ensuring the best efficiency at each step.As an integrated device manufacturer (IDM), STMicroelectronics ensures the quality and security of supply to serve carmakers' strategies for electrification. The collaboration with Ampere on the silicon carbide power modules and powerbox demonstrates STMicroelectronics' leadership and system-level experience in advanced power electronics, including its packaging expertise.Additional Technical InformationThe powerbox combines three SiC-based power modules, an excitation module, which provides the necessary electrical excitation to the motor or generator for controlling the magnetic field within the motor, and a cooling baseplate designed to dissipate heat from the back side of the power module, simplifying the thermal management and cooling process.