Introduced in the 1960s, offshoring became a primary cost-savings business strategy for industries to outsource manufacturing operations to Asia. However, as supply chain constraints intensified within the past couple of years, many businesses have considered transferring operations back to nearby countries. This practice, known as nearshoring, has emerged to create a buffer against supply chain disruptions.As a result of offshoring, the US now only domestically manufactures 12% of the chips it designs. Comparatively, Taiwan manufactures over 60% of the world's chips. The lack of varied resources within the electronic component industry has caused bottlenecks within the global supply chain. Diversifying resources would add necessary support and reduce the impact of shocks and shortages.According to an April 2020 Thomas survey, 64% of North American manufacturers reported they are likely to bring manufacturing production and sourcing back to the Americas. Latin America, specifically Mexico, is poised to profit the most from this developing trend. More recently, Latin America saw a 156% increase in hiring from foreign companies, particularly for software engineers.European, Middle Eastern and African companies have been looking to neighboring countries in Central and Eastern Europe and North Africa as nearshoring options. In response to COVID-19, Ernst & Young conducted flash research and found that in Europe, 88% of respondents were contemplating nearshoring over low-cost areas outside of EMEA. Sixty-one percent were seeking to reduce reliance on dominant source countries like China.Despite its attractiveness, nearshoring is costly, and it will take years to move operations. The total cost for US and European companies to move manufacturing out of China would come to $1 trillion over the next five years. Relocating to a new country also adds pressure to the local economy. If a company were to withdraw just one percent from China and nearshore to a country like Poland, Poland would have to increase its production by 25%. The cost, compounded by how long these changes could take, is enough to make some companies wary.Even with the concerns associated with nearshoring, many companies have already begun transitioning their operations closer to home. A prime example is Samsung Electronics, which has set the goal of becoming the world's biggest semiconductor firm by 2030. To assist the growth of its business, Samsung has prioritized local partnerships with domestic parts manufacturers and local material suppliers. With moves like this, Samsung and others that opt for a nearshoring business model will bolster their local economies and offer essential flexibility in the supply chain.Nearshoring has emerged as a strategic answer to lack of diversified resources caused by offshoringPhoto: Fusion Worldwide

NeoGene Tech, a Guangzhou-based technology platform provider of designing and fabricating ultra-thin vapor chamber devices for 5G smartphone application, has announced its Level 3 PWS (Print Wick Structuring) COMBO technology has overcome the bottleneck and limitation of traditional copper mesh wick technology in two-phase working fluid transportation and circulation efficiency inside a big-area and super-narrow-space vapor chamber device.Up to date in the industry, the thickness of vapor chamber in production for smartphone applications is still at over 0.3mm, NeoGene said. Most smartphone brands keep seeking advanced technology among their supply chain to pursue vapor chamber devices as thinner as possible. The thickness of vapor chamber at 0.2mm as well as device area at over 5,000mm2 is always the dream to the industry since thermal management issue will become more critical as never before.NeoGene cited industry experts as noting that the space of liquid channel and vapor channel inside the vapor chamber will be tremendously limited totally at only 100um if the device thickness is just at around 200um. Once the distance between the evaporator and the condenser is too far and device area is too wide, it is almost mission impossible to accommodate an appropriate thinner copper mesh wick structure and to have enough vapor space as well to ensure that the two-phase working fluids can be efficiently transported and circulated inside the device to enable the device keeping acceptable thermal performance."Based on our MagicWick-Inside Technology Platform, the Level 3 PWS COMBO technology adopts selective screen printing technics and co-sintering processes to make three different MagicWick structures with different thicknesses and patterns in order to perform different functions in different flow channels and regions simultaneously," said Jeffrey Chen, CEO of NeoGene Tech."Three different kinds of MagicWick paste materials (MW-A, MW-B, MW-C) were screen printed in different area on etched copper alloy substrate and were baked to form the SWOES (Semi-Wick-On-Etched-Substrate), and then proceed to become the MWOES (Magic-Wick-On-Etched-Substrate) before device packaging process. Different from PWS Level 1 and Level 2 technology, PWS COMBO technology is a way of solving different limitation issues simultaneously inside an ultra-thin and ultra-big vapor chamber by having a novel flow channel design and combo wick structuring. It is very easy to conduct the multiple wick structuring processes in mass production by adopting automatic screen printing and baking technique and continuous decomposition and sintering furnace," said Chen."The Level 3 PWS COMBO technology is actually an ultra-thin vapor chamber design and fabrication approach for laterally balancing the efficiency of liquid channels and vapor channels in ultra narrow space. By having novel flow channel design and different magic paste recipes, the MagicWick-Inside VC devices made by Level 3 PWS COMBO technology with thickness at only 0.2mm (with +0.02 tolerance) and the size at 5000mm2, can be working very efficiently at 5W, and the surface temperature difference (delta T) between evaporator and condenser with distance at 70mm is measured at around 2 degrees C. Thanks to the collaboration of MagicWick A (wick thickness ~35um) in liquid channels and MagicWick C (wick thickness <10um) in vapor channels, the anti-gravity transportation speed of liquid working fluid from condenser to evaporator is measured at over 20mm/sec," added Chen.NeoGene Tech's authorized thermal module maker, Jieqiao Electronics, will be the first player to adopt PWS COMBO technology in 0.23max big-area vapor chamber mass production, and this technology will be also opened for all thermal module makers once the MagicWick-Inside Technology Platform license program is reached and conducted accordingly, according to Chen.Photo: NeoGene Tech

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles for low-risk, high-yield production of ASICs with TSMC 2.5D and 3D Advanced Packaging Technology (APT). The platform supports TSMC's CoWoS-S, CoWoS-R, and InFO technologies. GUC provides a total solution: silicon-proven interface IPs, CoWoS® and InFO silicon-correlated design, signal and power integrity, thermal simulation flows, and high volume product proven DFT and production tests.GUC has many years of high-volume production experience of CoWoS-S (silicon interposer) products with HBM using in-house and 3rd party PHY and Controller IPs. InFO design and simulation flows were silicon-correlated using many GLink testchips in N7 and N5 (GLink is GUC die-to-die interface IP family). Recently GUC validated the CoWoS-R (organic interposer) testchip using GUC's 4Gbps HBM2E PHY and Controller IPs, implemented in TSMC N5. Interposer design, layout, signal and power integrity (SI/PI) simulation flows using an organic interposer were correlated with silicon testing results. Now GUC owns a full set of silicon-proven interface IPs, a silicon-correlated design, and simulation flows for all types of TSMC 2.5D technologies. This allows our customers to choose the most optimal solution for any CPU, GPU, AI, HPC and Networking product.While 2.5D multi-die integration is mature and already widely used by GUC, emerging 3D multi-die integration allows the next level of connection density, power efficiency, and very low latency. GUC leads ASIC industry with GLink die-on-die interface IP using TSMC's N5 and N6 processes. The IP design and simulation flows will soon be silicon-validated for different 3D IC packaging."In 2021, GUC made a breakthrough by developing next-generation HBM3, GLink-2.5D, GLink-3D IPs as well as validating CoWoS-S/R and InFO design platforms. GUC keeps collaborating with TSMC to reduce the barrier for the most advanced 2.5D and 3D technologies, enabling our customers to develop high performance, cost efficient products and to bring them quickly to high volume manufacturing", said Sean Tai, president of GUC. "GUC successfully enabled many AI, HPC, and Networking customer products adopting TSMC CoWoS-S and InFO technologies. With availability of CoWoS-R and 3DIC platforms we provide the most comprehensive design and manufacturing service to our customers.""We are first in the market with HBM3 PHY and the highest performance HBM3 Controller. We also lead the industry with GLink-2.5D IP for die-to-die interconnect, providing unmatching 2.5 Tbps/mm beachfront efficiency (full duplex) and 0.30 pJ/bit power. These IPs can be used in all types of TSMC's 2.5D platforms. Soon, we will validate GLink-3D at 9 Tbps/mm2 (full duplex) and it will open an era of 3D ASICs", said Igor Elkanovich, CTO of GUC. "The unique combination of in-house IPs, silicon-correlated design flows for all types of TSMC technologies, and high volume production experience allow fast development and production ramp-up of huge scale AI/HPC/Networking products."To learn more about GUC's HBM3/2E, GLink IP portfolio and InFO_oS, and CoWoS® total solution, please contact your GUC sales representative directly or email guc_sales@guc-asic.com.GUC provides 2.5D and 3D multi-die APT platform solution for AI, HPC, Networking ASICs

The emergence of 5G, Artificial Intelligence (AI) and Internet of Things (IoT) technologies can unlock digital transformation to meet the needs of various industries such as manufacturing, healthcare, urban infrastructure, etc. While Cloud solutions are becoming indispensable technology, challenges around the system performance, privacy, and complexity stimulate connected technology innovation for Edge Computing. AEWIN provides innovative hardware to handle evolving edge computing needs to keep ahead of the competition. The most recent releases of SCB-1932C and SCB-1937C purpose-built servers add speed, flexibility, reliability and maximal computing power to support diverse edge computing for multi-access edge computing (MEC) and AIoT applications.AEWIN's solutions provide better data security, and efficient control over continuous operation in AI-based applications such as in-vehicle systems, facial recognition, and manufacturing equipment. The distance between system computing units and the edge must be as close as possible to reduce delays caused by excessive load on the upper layer computing platform and mid layer network bandwidth. However, the physical space inside edge equipment is limited, which means the dimensions of boards and components must be drastically reduced. Furthermore, cooling issues can also impact the performance of computing units. These factors have caused challenges in product development SCB-1932C and SCB-1937C addressed these issues with small footprints and double-width GPU designs.In terms of dimensions, both the SCB-1932C and SCB-1937C are 600mm in length, a mere 3/4 of the 800mm units commonly found in other servers. The smaller footprint allows for better space utilization while also catering to expandability, thereby achieving an excellent balance between flexibility and performance. On top of that, the frontal access design has 2 key advantages:*No need to dismantle the entire case for maintenance, which increases convenience.*Increased product reliability due to the cooling facilitated by the frontal configurations of network ports and accelerator cards.The double-width GPU massively increases AI performance for edge computing. Compared to the current single-width GPUs used to perform AI inference on edge equipment, double-width GPUs provide both functions of inference and training. After sufficient data has been captured through a period of operation, double-width GPUs can retrain models in real-time and continuously improve the AI accuracy of edge equipment.Nevertheless, AEWIN has both Intel and AMD CPU options as integration benefits to match users' selections.*SCB-1932C integrates with 3rd gen Intel Xeon scalable processors. which has been on the market quite a while; it boasts high market share in the high-performance computing market as well as comprehensive support for peripheral technologies.*SCB-1937C integrates with AMD EPYC 7002/7003 series processors; it promotes advanced manufacturing processes and aggressive pricing strategy.These two major brands bring benefits to the table with different key competitive positioning. Ultimately, users' needs will determine which CPU brand is right for them by taking the budget and applications into considerations.SCB-1932C and SCB-1937C can be applied in MEC, networking equipment, and AIoT systems; AEWIN also provides comprehensive services to support these applications. We boast industry leading designs in system architecture, platform support, accelerator card modules, and NVMe modules focused on networking applications. The BIOS, firmware, and mechanism designs by AEWIN are customizable to meet different customers' requirements and needs.In an increasingly competitive market environment, availability and product launch schedule become critical factors that impact competitiveness. However, the manufacturers/customers only discover their products' performance falls short of expectations during the development phase. This results in extended development stage of the projects or launching underperforming products. An off the shelf (OTS) solution offered by AEWIN can ease the problem by allowing customers to conduct testing prior to model and solution selection. By verifying the products in advance, products can go-to-market on schedule successfully with controlled quality. Aside from the advantages, OTS can also be combined with AEWIN's customization services to expand into a series of products. While other OEM/ODM designed manufacturers offer value-added services, they do not necessarily accept projects with low volume and high diversity as orders must achieve a minimum quantity threshold. AEWIN provides OTS customizable firmware, hardware, and mechanisms to satisfy the customization requirements and launch schedule expectations, thereby improving the product competitiveness and taking advantage of new business opportunities in both edge computing and AI markets.

MSI, the world's leading PC brand, today announced the kick-off of the MSI Creator Awards 2022! The MSI Creator Awards which has been loved by all creators for three consecutive years is held to recognize and encourage the most creative and outstanding creators around the world. In addition to three categories: Graphic Design, 3D Creation and Film, there will be MSI Special Prize and People's Choice, so that more creations have the opportunity to be favored.Submit Now: Submission Close: May 30th 23:59 PST Where to submit: https://www.msi.com/Landing/creator-awardsEncouraged by receiving thousands of amazing works of art every year, MSI determines to continue the celebration for creators. Winners will be prized with MSI's latest Creator series laptop PCs, desktops, graphic cards or monitors, totally valued at over $35,000.MSI will choose one entry from all categories for MSI Special Prize that best presents MSI's brand spirit. Besides, there is a new People's Choice added this year. From 6/15 to 6/30, there will be online voting for the most popular artwork. All netizens who participate in the voting will have the chance to win the MSI VIGOR GK30 COMBO Gaming keyboard and mouse set.To salute the aesthetics of the virtual world, MSI Creator Awards 2022 will take "Create Your Utopia" as the competition theme. We continue to provide creators with a platform to create and show, and are committed to launching cutting-edge products with perfect craftsmanship to fuel more creative energy to creators. We look forward to seeing what it will be like for activities, games, social life, traveling and learning in the Metaverse while the world is gradually moving towards the virtual one. Metaverse creators, let's create your ideal utopia with tech and aesthetics!", said Sam Chern, Vice President of Marketing at MSI.The MSI Creator Awards winners will be evaluated by a panel of recognized experts from various fields, who have worked at Disney, won the Emmy Award, participated in the production of Cars and Toy Story, Hollywood photographers, League of Legends and other well-known game characters designer. MSI is to deliver a balanced assessment from these industry experts with their extensive knowledge, enthusiasm and expertise, ensuring that the winning entries are truly outstanding and worthy of receiving the awards. These juries will also present online sessions during the submission period on MSI YouTube and Facebook to share professional skills and interesting thoughts.MSI Online Session: TIME: Every Saturday 21:00 PST from Mar 12th to May 7th Where to watch: https://www.msi.com/Landing/creator-awards/newsMSI: https://www.msi.com/MSI Facebook: https://www.facebook.com/TheOfficialMSIMSI Instagram: https://www.instagram.com/msi/MSI YouTube: https://www.youtube.com/user/MSI/featuredMSI Twitter: https://twitter.com/msitweetsSubscribe to MSI RSS Feeds via https://www.msi.com/rss for real-time news and more product info.

Fusion Worldwide has acquired Prosemi Mfg Pte Ltd, a large-scale electronic component test house in Singapore. With the supply chain experiencing historic constraints leading to lengthy turnaround times, this addition will further Fusion Worldwide's mission to provide world class sourcing and fulfillment, while enhancing its ability to sustain the highest levels of quality standards."The collaboration of Fusion Worldwide and Prosemi marks an important moment for our company. Quality is always at the forefront of our business and this acquisition demonstrates our continued dedication to excellence. We look forward to providing our customers with the shortest turnaround times possible as we navigate the consistently variable market," said Tobey Gonnerman, president of Fusion Worldwide.Over its 22-year history, Prosemi has become a trusted source for testing electronic components among some of the world's largest CEMs and OEMs. Fusion Worldwide's already-distinguished standards of quality will be enhanced by Prosemi's state-of-the-art equipment, processes, and expertise."Prosemi remains committed to providing the best manufacturing and testing services that exceed expectations," said K.H. Siau, founder and CEO of Prosemi. "Our new partnership with Fusion Worldwide will help us continue to deliver top quality resources in the semiconductor, electronics and PCBA assembly industries."Since its establishment in 2001, Fusion Worldwide has been steadfast in its promise that quality is a given. The combined 40 years of industry expertise between Fusion Worldwide and Prosemi illustrates the reliability and dedication to a future of continued quality excellence. This extension of Fusion Worldwide's suite of services furthers its goal to provide swift, first-rate strategic sourcing solutions in response to inevitable supply chain shocks.Fusion Worldwide acquires Singapore-based Prosemi ManufacturingPhoto: Fusion Worldwide

Monitors are seen as the last mile for many smart systems. However, as application fields increase in variety, this last mile must also provide more functional specifications so that users can have an experience that is both convenient and eye-opening. The DP-173X-UHD industrial touch monitor recently launched by Atemitech Corporation, a key subsidiary of Getac Holdings Corp, provides industrial users with a stable, highly efficient human-machine user experience in its products through MiniLED backlight modules, unique composite materials developed by Atemitech, and a number of unique designs.More flexible monitor design goes beyond the existing solutions on the marketAtemitech Corporation's DP-173X-UHD industrial touch monitor uses a MiniLED backlight source. Past MiniLED LCMs would integrate the timing controller chip and the LED driver chip into the LCM control board. But since this method would limit the selectable brands of timing controller chips, Atemitech Corporation proposed two other circuit structures, each of which going beyond the limitations imposed by existing timing controller chip solutions on the market.Atemitech's first solution (hardware) is to insert a bridge between the output interface of the main board and the input interface of the panel. This bridge integrates the local dimming ASIC and the MiniLED driver chip. After the image signal undergoes local brightness calculation by the local dimming control chip for each frame, brightness control of the local backlight is completed through the MiniLED driver chip. The second solution is to connect the MCU bridge to a USB interface. The calculation of local dimming is performed by special software at the backend of the operation system. After the calculation, local grayscale is sent by the MCU to command the MiniLED driver chip to complete the operation. Using either the first or second solution, the MiniLED driver chip used in the DP-173X-UHD supports 576 local dimming zones.In addition, highlighting the 100,000:1 ultra-high contrast ratio of the DP-173X-UHD's MiniLED HDR, the projected capacitive (PCAP) touchscreen, and full-black display after optical bonding, the ink black color must be adjusted for consistency with the chromatic aberration of the monitor, which also allows the screen area of the DP-173X-UHD to display Integrated Black Panel (IBP) effects in the borders when in a dark state.Impact resistant, light-weight, and flexible shape—Atemitech's unique composite material offers obvious advantagesIn terms of the panel, the cover lens of the DP-173X-UHD adopts Atemitech's unique composite material. At present, most cover lenses on the market are made of glass or plastic. Atemitech's unique composite materials and manufacturing process boast impact resistance, light weight, and shape flexibility (the material can be curved), which are far superior to those of glass. The stress of the composite sheet during extrusion can be released by controlling the temperature and flow rate of the process, which reduces rainbow pattern effects. The composite sheet produced by extrusion molding with coating technology has the most obvious advantages among all the cover lens solutions using different materials, making it suitable for vehicle-mounted monitors, industrial controls, military use, and other outdoor scenarios where safety and practicality are of paramount importance.The unique composite front panel used in the DP-173X-UHD can provide customers with a complete solution. Atemitech optimized the surface hardness, anti-glare/reflection, anti-fingerprinting, and other optical properties of the composite sheet through its coating technology. In addition, it can also adjust the transmittance and ink colors of the lens according to design requirements, which gives the display a "true black" effect, allowing users to feel the high levels of visual texture in the display. In addition, the introduction of hot pressing makes Atemitech capable of producing curved front panels. Atemitech provides complete solutions in the processes of bonding unique composite materials and touch touchscreens and in the optical bonding of MiniLED panels. It possesses the ability to satisfy end-client design requirements for cover lenses, while also having the ability to monitor the entire process with efficacy in real time, thus ensuring product quality.Atemitech Corporation's LumiBond sunlight readable monitor solution provides the most stable visual experienceAs for the touch screen, both the touch screen and control board of the DP-173X-UHD can be customized according to customer needs. This product adopts 17.3" projected capacitive touch technology. In addition, the DP-173X-UHD has incorporated Atemitech's LumiBond solution.LumiBond is a technology solution developed by Atemitech that is designed to improve the usability of touch screens; it has been applied to touch monitors in various products, including the DP-173X-UHD. LumiBond maintains clear visibility of the screen even under strong ambient lighting, all without sacrificing brightness, contrast, and color saturation. The outstanding color display capability of this solution is mainly the result of two technologies: the first is Atemitech's exclusive low-power, high-brightness backlight module technology, which gives the UHD LCD display a brightness of up to 2000 nits (cd/m2) that can remain clearly visible even under direct sun lighting. The second technology eliminates the air gap between the LCD and touch screen, thereby greatly lowering visual interference and allowing more of the light generated by the backlight to emit, reducing the interference from ambient lighting.LumiBond also enables the DP-173X-UHD with mode-switch for operating the display with gloves and in the rain (since water also has conductive properties).In a low-temperature environment, humid air forms water droplets when it comes into contact with the relatively colder glass, and the droplets will be misinterpreted by the touch screen as fingertips. LumiBond can alter the sensitivity of the screen for operating in water, thereby reducing the possibility of malfunction. LumiBond also reduced the gap inside the display to maintain the temperature of the screen glass; this reduces the chance of cold air entering the display and allows the heat inside the device to be transferred to the touch screen surface, ensuring its normal operation.In addition, LumiBond applies a transparent resin layer to eliminate condensation between the touch screen and LCD layer. At the same time, it enhances the strength of the LCD panel and the touch module assembly, so that it can withstand large collisions, vibrations, and falling, while also maintaining stable operations in a wide temperature range of -30°C-85°C, making it very suitable for outdoor systems.With the popularization of smart systems, there are ever more functional requirements for touch monitors in systems operating in harsh environments, such as factory human-machine interface and process monitoring, vehicle mounting, automatic service machines, medical treatment, games, aerospace, energy, or oil extraction. Since stability, image rendering effects, and a convenient operation interface are all combined in the DP-173X-UHD, it can optimize both the user experience and the work efficiency of operators.Atemitech holds to its rich OEM & ODM experience, solves usage pain points for its clients, continues to introduce high tech, and pursues development of new technologies; with its own process technology as its core capability, Atemitech generates high added-value through design, processing, and manufacturing, providing complete solutions for its OEM & ODM customers.The Atemitech DP-173X-UHD industrial touch monitor.Comparison of light emission modes of the MiniLED Touch Monitor and LED lightbar Monitor.Comparison of LumiBond 2.0 Optical Bonding for Touch Displays and Non-Bonding.

Fusion Worldwide is expanding its footprint throughout EMEA with the opening of locations in Paris, France, and Udine, Italy. The EMEA region currently has two offices, and with this expansion, Fusion Worldwide will continue to build on its fundamental principle to provide local service across the globe. "EMEA is an important area in the electronic components space. With many of the world's largest automotive and industrial automation suppliers located here, we can better serve customers across the continent by meeting them where they are and support them locally" said Behzad Monfared, Vice President of Sales, EMEA. Fusion Worldwide has had a presence in EMEA since 2008 when it opened its headquarters in Amsterdam. In 2019, it opened an office in Munich. Over this time, regional expansion has allowed Fusion Worldwide to become the premier global electronic component open-market distributor. Additionally, the unprecedented growth Fusion Worldwide has experienced in the last 24 months has provided the opportunity for the EMEA headquarters to move to the state-of-the-art Adam Smith Building in Riekerpolder, Amsterdam. At 1000 square meters (10,764 square feet), the new headquarters is double the size of its original location."We chose to have our office in this building as it has the capacity to support our growing team. The convenient location is perfect to welcome our customers from all over the world," continued Monfared.Globally, Fusion Worldwide has 21 locations spread across four continents.

Since the pandemic outbreak in 2020, enterprises around the globe have accelerated the trend of digital transformation to meet the challenges brought about by the changing business environment. Naturally, artificial intelligence has become the most critical technology for these enterprises. AI technology combined with data analysis can be used in manufacturing to achieve optimization of production lines and prediction of equipment health, as well as other goals, which have allowed for great strides on the road to smart manufacturing. Similarly, e-commerce operators can analyze consumer shopper behavior, which is then used to recommend the most suitable products to customers as they browse the web, which increases the rate at which they can close deals. The trend also applies to smart medical care—the medical care industry can use AI technology to perform medical 3D rendering, image optimization, and image diagnosis and analysis to help doctors identify potential lesions and provide patients with superior medical services.In addition, there is a strong demand in the market for AI workstations. Applications such as data science, rendering, and visual design are indispensable for AI servers; this includes developing AI/ML models, 3D simulation, advanced visual development, rendering, data science, professional visualization, professional video streaming, among others.In light of these trends, Chenbro Micom launched the SR113 4U Rackable Tower Server Chassis, installing up to 5 general-purpose graphical processing unit (GPGPU) cards matched with the proprietary motherboard, making it ideal for AI deep learning, Big data analysis, and AI applications in other fields. At the outset, the SR113 was designed to meet the needs of complex application scenarios. For that reason, in addition to supporting both vertical and rackable modes, it adopts a standard 4U height and slide rails that can be used with a cabinet, making maintenance of replacement of parts convenient for IT personnel. Therefore, the product is not only suitable for SMEs or units that have no immediate need for expansion, but when there is a demand for expansion in the future, it is also installable in the data centers or IDC server rooms of medium-to-large enterprises, without the added worry of wasting valuable cabinet space.One of the most significant features of the SR113 4U Rackable Tower Server Chassis is that it boasts the industries' most excellent flexibility and compatibility. First, it can use with Super Micro X12DPG/X11DPG and Tyan S7105 motherboards, supports 11 slots, and allows simultaneous installation of up to 5 GPGPU cards; the result is impressive AI computing power and big data processing and analysis power, all in a single server, meaning massive savings of valuable cabinet space. It goes without saying that if enterprises do not have such requirements, they can also choose a chassis that supports eight slots. When used with other standard ATX motherboards, 4 GPGPU cards can also be installed, with enough computing power for most projects. It is also worth mentioning that this chassis supports SSI EEB specification motherboards and allows the installation of up to 8 full-height PCI-E expansion cards.Looking to ensure the smooth operation of AI applications, Chenbro Micom has also added many thoughtful and practical designs to the SR113 4U Rackable Tower Server Chassis. The first is in the power supply: its 80+ platinum power supply supports Redundant CPRS specification, ensuring that the 5 GPGPU cards can maintain stable operation and reduce overall energy consumption while maintaining high energy conversion efficiency. If an enterprise chooses an 8-slot chassis, it can use a PS/2 interface power supply.Next, Chenbro Micom has also designed a comprehensive heat dissipation mechanism to support the stability of the operational processes on the AI server. Here, "comprehensive" means not just four high-speed fans inside the chassis to discharge hot air but can also install an external high-speed cooling fan on the back of the chassis.Last of the meticulously thoughtful designs is an exclusive GPGPU card retaining bracket, preventing unfortunate GPGPU card collisions during transportation. As for storage space, there are 2 x 5.25" brackets, 1 x 3.5" brackets, and two brackets that support 4 x 3.5" hot-swap.One more thing worth mentioning is that, in the face of frequent data leakages, Chenbro Micom also places greater emphasis on protection work; the SR113 chassis is specially equipped with a front bezel lock, supports key lock, and has a 3-wire intrusion switch and a Kensington security slot to prevent the unfortunate event of data theft.On increasing enterprise visibility and facilitating equipment management, Chenbro Micom also provides customized logo badge services, adding enterprise-specific identification logos in the front of the server; or, it can mark servers with different colors to make data center equipment management more convenient and more efficient.All in all, for enterprises looking to build HPC/AI training, deep learning, machine learning, 3D simulation and animation, scientific simulation and analysis, and big data analysis environments, the SR113 4U Rackable Tower Server Chassis is, without doubt, an option that shouldn't be overlooked.

LILIN, a leading AI video solution provider, launches Self+AI Cloud Service, providing modular AI plug-ins that allow users to convert pre-trained object models into a common package for LILIN front-end AI cameras to use with behaviors for creating various AI applications. The image inference process requires no PC, and the results can then be integrated via Python or C# SDKs, or sent through hardware by digital output, which performs a "one-stop" AIoT edge solution.The LILIN Edge Computing Aida 7 Series cameras are powered by the Ambarella CV Series SoC with a 4-core Arm Cortex-A53 CPU that can operate at 1.0GHz, with a high-speed AI GPU chip, and 1GB of eMMC flash memory, the performance can beat most of AI USB sticks and stay with mainstream PCs.The Self+AI Cloud, developed by the LILIN AI team, converts the Tiny Yolo AI model into a compatible format running by the Ambarella CV Series SoC and packaged in an LPKG (LILIN Package) for distribution to compatible cameras without writing a single line of code. With the rich behavior settings of LILIN cameras, the threshold for developing AI applications becomes extremely low.A typical case is the implementation of ship-tracking. The Ship and Ocean Industries R&D Center in Taiwan uses a LILIN PTZ camera which carries NEMA 4X, IK10, IP68 certified, and infrared operation to identify vessels and track them.Dr. Zhou Xianguang, Chief Executive Officer of the Ship and Ocean Industries R&D Center, said "The LILIN AI platform and its cameras are innovative, allowing our AI algorithms to be smoothly integrated. The AI conversion cloud developed by LILIN also significantly shortens the development phase for our team members to deploy solutions. Edge computing cameras definitely will play an important role in future AI applications.LILIN also offers Python and C# code on Github for any engineer familiar with these languages to immediately fork and develop.Know more: https://links.meritlilin.com/60mLILIN released 4K AI cameras that can be loaded with YOLO models for inferencing and a Self + AI conversion cloud that helps package users' pre-trained models.Photo: Company