Chenbro, a pioneer in the design and manufacturing of rackmount systems, announced that its innovative RM25324 2U 24 Bay high-density storage server chassis has won the iF Design Award 2022 in recognition of its unique structure and innovative design. The exclusive dual-load design is optimized for convenience and safety.The iF Design Award is one of the world's most prestigious design awards. Originating Germany in 1953, the iF seal reflects excellence in 5 areas: idea, form, function, differentiation, and impact. The winning product, RM25324, won over the 132-member jury, made up of independent experts worldwide. The competition was intense: almost 11,000 entries were submitted from 57 countries in hopes of receiving the seal of quality. Considering server products are not recipients of distinguished awards, garnering such an accolade has unveiled the strength of Chenbro's server chassis design and its focus on application needs."Being recognized by the iF Design Award has clearly showed the strength of Chenbro's off-the-shelf (OTS) products, to focus on user experience and product innovation," stated Corona Chen, President of Chenbro. Chenbro is committed to cultivating a full range of design and R&D talents and conduct in-depth interviews with system integrators and end customers in different vertical industries to understand a user's perception of the server chassis. To meet users' needs, Chenbro extends the innovation of OTS products to the application needs of end-users.Chenbro RM25324, 2U 24-bay high-density dual-load storage server chassis, with exclusive slide rails, only requires extending half of the fuselage from the cabinet; its dual-load and tool-less maintenance are tailored to quick deployment and efficient upkeep. The user-centered design focuses on the needs of information personnel to maintain, replace, and install hard disks in real-time. In addition, the reliability and safety of the dual-load function of the chassis are specifically designed for the exclusive bilateral thermal airflow, achieving the best results among similar products. Numerous tests have verified the rackmount's weight bearing capacity to ensure server stability without impeding the remainder of the cabinet. RM25324 was designed to meet the demands of users in the data center environment and provide an unprecedented engineering operational experience.As a high-density storage server chassis, RM25324 can install up to 24 hard drives with a 3.5-inch SATA/SAS interface at a 2U height, supporting horizontal database expansion up to 400TB raw capacity per server. The optional kit on the back of the chassis can support two 2.5-inch SATA hard drives to provide consistent response time for cold and hot data layering mechanisms. RM25324 redefines cold and hot data storage durability. It is the best solution for big data storage, capable of fulfilling various application demands such as data storage, security monitoring, NVR/DVR, database, file server, and more.Eric Hui, Executive Vice President of Chenbro, further pointed out, "Server enclosures require constant design innovation. We establish flexible module components through modular design, fulfill compatibility verification, and realize agile and reliable product development." Chenbro provides customers with high-quality products and services, balancing sustainable design and high quality. Chenbro's commitment to "Whatever's Inside, Chenbro Outside," reflects that regardless of the industry changes in demand affecting the server configuration, Chenbro can continue to innovate according to user needs to provide various server chassis products.The exclusive dual-load design is optimized for convenience and safety.

iCatch Technology (iCatch) has focused on image signal processing (ISP) technology and Camera SOC for over two decades and aggressively invested in research and development in more machine learning (ML) related technology and application.Now iCatch has collaborated with Prophesee on Event-based Metavision sensing projects that integrated iCatch's V57 AI vision processor with the new Sony Semiconductor Solutions ("SSS") stacked Event-based Vision Sensor IMX636, realized in collaboration between SSS and Prophesee.iCatch built the OpenMVCam development platform for all algorithm partners and ODM customers to design a variety of AI products, systems and applications on many market segments like surveillance, smart healthcare, in-cabin monitor system, smart home, industrial automation, smart city and so on.iCatch also provides a high customized service and an excellent image quality system to become the eyes of all of machine vision equipment and smart devices in the future.SSS's Event-based Vision Sensor can be the input source for iCatch AI vision processor, based on iCatch built-in NPU acceleration engine and proprietary CV processing hardware engine. It can integrate Prophesee Metavision Intelligence SDK and other 3rd party's machine vision algorithms to support end customers' AI vision applications such as DMS and OMS in automotive in-cabin, patient/elder fall detection in home healthcare and hospitals, intruder detection in home surveillance, anomaly detection in industrial automation, gesture control in smart home appliance, eye tracking in AR/VR and so on.Prophesee as the inventor of most advanced neuromorphic vision system in the world, has developed the groundbreaking Event-based Vision method for computer vision applications. Inspired by the human retina, Event-based vision sensor features pixels, each powered by their own embedded intelligent processing, allowing them to activate independently when they detect a relative change in the illumination intensity (i.e motion).This new approach significantly reduces power consumption and the amount of processed data while offering ultra high-speed acquisition, strong low-light and HDR performance.iCatch AI vision processor with built-in hardware event decoder can natively support SSS's Event-based Vision Sensor IMX636 without external FPGA or interface chip as event decoder for better system cost. It features built-in NPU acceleration engine and CV processing engine to provide the acceleration and optimization required in machine vision algorithms. In addition to iCatch key advantage in low power design and high flexibility in the optimization in human vision and machine vision applications, with event based vision sensors and 3rd party partner's machine vision algorithm, iCatch AI vision processor can fulfill all machine vision applications in a variety of use cases and edge computing ecosystem.Detail of iCatch https://www.icatchtek.comDetail of Prophesee https://www.prophesee.ai/ Detail of Sony Semiconductor Solutions https://www.sony-semicon.co.jp/e/iCatch V57 + IMX636 realized in collaboration between SSS and PROPHESEE, can be used in home care and gesture detection applicationPhoto: iCatch/ Sony/ Prophesee

MiniLED is an up and comer in the displays category, particularly for tablets, TVs and gaming monitors. This relatively new technology, used for backlighting LCD displays, offers deeper blacks, improved contrast ratios and brighter panels, compared to traditional LED-backlit LCD technology. But there is a challenge that looms as miniLED moves into mass production: miniLED backlight units require a substrate – either PCB or glass – covered with white solder mask. Why does the manufacturing process with white solder mask present a challenge? To better understand, let's look at the benefits of miniLED, why white is the preferred solder mask, and the resulting manufacturing challenges.According to an Omdia report, "OLED and LCD Supply Demand & Equipment Tracker – 2Q21 Analysis," shipments of LCD panels with miniLED backlights are expected to grow from 9.7 million units in 2021 to 37.9 million units in 2025. More specifically, TVs and tablets are the leading miniLED applications, with significant growth predicted for TVs through 2025. The use of miniLED for notebook PCs is also gaining traction and predicted to increase in volume during the same period. MiniLED is becoming a popular choice for OEM designers because it provides better contrast, richer colors and improved image quality, and can be a cost-effective alternative to OLED.OLED vs. miniLEDOLED is a popular technology, with self-luminous displays and panels that do not require a backlight unit due to their light-emitting characteristics. OLED can provide better color contrast than miniLED, but it is often quite expensive and there are some disadvantages in lifespan and performance in outdoor environments. MiniLED, on the other hand, has excellent brightness, reduced energy consumption, high refresh rate and a wide color gamut with less design complexity. As a result, many of the largest TV, tablet and notebook manufacturers are eager to adopt miniLED technology since it offers quality and other improvements over standard LED technology and is more cost effective than OLED.To provide all these benefits, the solder mask exposure process for miniLED-based devices requires high accuracy and yield. Manufacturers must be able to achieve superior accuracy to meet the demanding specifications of miniLED-based products, as required by the designers. Direct imaging (DI) for the solder mask exposure process is an ideal solution for this because it enables high accuracy, while overcoming challenges such as panel topography, distortion and fine features, all of which can influence product quality and yield.MiniLED backlight unit on a large-size TVAdvantages & Challenges of White Solder Mask for miniLEDDesigners of miniLED BLU (backlight units) devices typically require that the substrates manufactured by their supply chain will be covered with white solder mask, which has a very high reflectivity rate (>90% in many cases). This enables the high contrast and brighter colors that deliver a sharper image on TVs, tablets and notebooks/PCs. All these substrates, whether PCB or glass, are produced with openings to receive the miniLED chips in the next stage of assembly, either package on board (POB), chip on board (COB) or chip on glass (COG). Highly accurate and uniform opening dimensions are critical to the quality of the miniLED end-product.There are three factors in the white solder mask DI exposure process that can create challenges for manufacturers: the first is accuracy, the second is quality and yield, and the third is capacity which also translates to cost.MiniLEDs range from 50 to 300 microns in size, and they must be positioned very accurately, with an extremely small standard deviation. For example, the uniformity of the solder resist openings (SROs) on the substrate cannot deviate more than ±5 microns for some applications. High-end devices typically require higher accuracy. Achieving such strict registration accuracy is even harder when the panel targets are covered with thick white solder mask, and a special illumination or sophisticated algorithm is required to acquire the target position with high accuracy.Quality is the second challenge, relating to uniformity of the solder resist openings and to strict undercut requirements. The white solder mask used for miniLED production scatters most of the illumination wavelength, so the exposure UV light is not absorbed as it would be with other solder mask colors, resulting in an inferior solder mask polymerization process. An undercut is formed when the bottom part of the solder mask layer is not fully polymerized during the exposure process. This may lead to the possibility of a peel off. Severe undercut (see image below) is often problematic for miniLED manufacturers. Minimal undercut (see image below), which creates robust dams, is a requirement for high quality and high yield. The creation of robust dams with minimal undercuts requires the use of an optimized wide range of illumination wavelengths in the exposure process, to expose the reflective, thick white solder mask.To address cost, manufacturers of PCB or glass substrates for miniLED devices need to maximize production capacity and optimize their cost per print. This can most easily be achieved by using a high throughput solution that also addresses the unique challenges of white solder mask exposure mentioned above.Left: White solder mask dam with minimal undercut. Right: White solder mask dam with severe undercutWhat's next?As demand for miniLED-based consumer electronics increases, new and innovative advanced solder mask exposure methods are needed to meet high accuracy, quality and capacity requirements. Direct imaging solutions that overcome the challenges of white solder mask exposure are necessary for manufacturers to produce high-quality substrates at mass-production levels to meet rising demand for tablets, TVs, gaming monitors and more in the coming years.Visit us at Touch Taiwan to learn more about KLA's white solder mask direct imaging (DI) solution and how it can boost production of your MiniLED backlight unit. The article is composed by Michal Itzik, Product Marketing Manager, KLAFrom 27-29 April, you can find us at Touch Taiwan, Nangang World Exhibition Center, Hall 4F, Booth #M834.

In 2020, 5G infrastructure went live commercially around the world, thanks to 5G wireless technology, which is meant to deliver high-speed Internet, massive bandwidth, and wide connectivity. AIoT was viewed by many industries as the last piece of the 5G puzzle. In order to successfully deploy 5G networks, performance enhancements with high speed and reliability are essential. With AEWIN new released SCB-6913 industrial platform which has the feature sets of stability, expandability, and the ability to be combine with our customization services, we are ready to assist system operators in developing the next generation of high-performance 5G network communications platforms.Since the 4G era, networking has been a key function for many different types of equipment, yet the limitations of 4G bandwidth and Internet speeds have relegated the 4G communication standard to be used mainly in the design of consumer equipment. The era of smart technologies has rapidly increased the networking requirements of non-consumable equipment, 5G was designed to cater to industrial and commercial applications. Today, the commercialized 5G makes it possible to serve applications such as VR/AR entertainment, smart healthcare, smart factories, and autonomous vehicles. Aside from smart applications, enterprise communications and network infrastructure have also been migrating from its traditional MPLS and xDSL to 5G networks. The demand of the SD-WAN equipment supporting 5G has grown to address this trend.SCB-6913 is the solution to response to the market demand that designed specifically to operate reliably in the harsh environment and/or harsh conditions. SCB-6913 utilizes a fanless design and sealed case that is highly dust-resistant, water resistant, and malfunction-resistant, which ensures availability. Though some might believe that fanless designs result in poor cooling, AEWIN's advanced cooling design ensures that there is no negative impact to equipment performance. In terms of communication design, the SCB-6913 has 3 built-in M.2 interface sockets allowing connections to two 5G modules and one Wi-Fi module. The 5G modules increase Internet bandwidth and support up to 4 SIM cards, allowing systems to simultaneously support different operators.From an application perspective, the SCB-6913 is suitable for use in systems with strict requirements regarding stability and network reliability, especially in harsh, dusty environments such as factories or in-vehicle systems. The fanless design allows systems to operate with higher stability, reduces the time and cost of repairs, and creates a superior office environment by eliminating noisy fans. Also, the large number of 5G interfaces in the SCB-6913 enhances backup mechanisms and can be applied in logistics vehicles, trains, high-speed rail, and other systems that require cross-regional operation to ensure there is no impact to communication quality. The Wi-Fi module allows local IoT devices to transfer data via 5G to backend control centers to instantly handle various unexpected situations.In addition to advanced networking functionality, AEWIN also provides comprehensive design services that assist clients with applying the SCB-6913 optimally in the rapid development of high-performance next generation network platforms. AEWIN has stated that current device operators lack of sufficient information when selecting models during the pre-development phase, which causes them to take on risks in the development process. If the performance of a product does not meet expectations, the result is either delaying and readjusting development schedules or shipping products with poor performance. Off the shelf (OTS) products offered by AEWIN allow device operators to conduct tests when selecting models and obtain accurate data before moving onto the development phase to ensure products are launched on schedule with the expected quality. Device operators can also utilize AEWIN's OTS design and customization services to increase product features. Current OEM/ODM server suppliers offer design services, but orders must achieve a minimum threshold; in contrast, AEWIN provides customization services even at low product volumes. Special designs can be applied to firmware, hardware, and organizations to better meet market demands.Enterprises are increasingly reliant on the Internet and therefore the quality of network equipment has a major impact on competitiveness. The SCB-6913's features such as fanless design and numerous network interfaces allows operators to build stable, reliable network communications platforms, thereby helping them gain a foothold in the 5G era and capitalize on massive smart business opportunities.

Taiwan's industrial computer industry has attracted worldwide attention. Within numerous vertical integration applications, smart transportation has always been the main application with profitability expectations. Sintrones, a manufacturer of in-vehicle computing systems, has accumulated more than ten years of experience in complete development since its establishment in 2009. It has successfully broken new ground in important markets like Europe and the United States.Its advantages lie in mastering the capabilities of complete system design and manufacturing. After many years of cooperation with end-user customers in Europe and the United States, it has engaged in interaction and obtained inspiration from its numerous esteemed customers' first-hand product technologies and constantly challenged its design capabilities. It has continued to develop various key products that can be used in vehicles in harsh scenarios. Based on the company's revenue, the European market accounts for more than 40%, and the US market accounts for 30%. The Company has refined its capabilities in operations and profitability in major global markets.In an interview, Chairman and General Manager Mr. Kevin Hsu said that to adapt to the new era in transportation heralded in by electric vehicles (EV), there are a large number of new types of intelligent applications that continue to drive the development of in-vehicle computing technology; the traditional "On-board Unit" (OBU) has been expanded to a more diversified "Road-side Unit" (RSU) product segment, and significant new business opportunities are set to be introduced gradually over the next several years. Sintrones has been able to glimpse a future city framework built of new intelligent transportation systems, including "charging stations, smart poles, smart signage systems, and roadside intelligent video analytics," each application requiring the investment of resources to build customized corresponding special functions.A deeply considered design that incorporates wide temperature, wide voltage, and software initialization has won customers and the market praiseIn terms of technical advantages, to be as inclusive as possible, Sintrones has been able to take full advantage of the design range of comprehensive voltage power supplies, from 12 - 24V and to 48V—and there are even systems, such as cutting-edge rail transit systems, with unique specifications for DC 110V. Sintrones has created a complete product line to fit various industrial application standards, and it has also obtained several major quality certifications.Mr. Hsu further explained that the high-current, high-voltage design required in fan-less heat dissipation technology is quite difficult. At present, Sintrones possesses several key patents in heat dissipation design and continues to maintain its leading edge in the field. In addition, the in-vehicle computing system has a very comprehensive response plan for vehicle emergencies. In the example of a vehicle that picks up students to and from school, a backup battery will be activated immediately upon a sudden power failure after an accident. The computer system will use the 5G or 4G network to transmit a distress signal and location data simultaneously to medical units, the students' parents, and school teachers. These are all examples of Sintrones' custom-designed in-vehicle systems for specific applications.Sintrones' in-vehicle computer provides a complete solution for increasingly diverse intelligent transportation applications, including monitoring commercial driving behaviors and automatic driving assistance capabilities in vehicles such as police cars, fire engines, school buses, trains, ships, etc. It has a high degree of flexibility, supports a wide range of peripheral devices and network connections, and is adaptable to various vehicle management systems, such as those used in the user scenarios of fleet management, vehicle maintenance systems, and self-driving computers. Sintrones has specially built a variety of software initialization functions in advance to help customers quickly set up the software to complete a combination of various functions. For such efforts, the Company has won a fair share of praise from customers. This is different from other competitors who need to go through time-consuming design changes before they can gain support. For Sintrones, product timeliness and thoughtful design are the keys to achieving crucial competitive advantages.Advanced GPU card configuration enhances the application of high-function artificial intelligence in in-vehicle systems.Since high-performance artificial intelligence applications rely on the computing power of high-end GPU cards, vehicle-mounted computers that integrate GPU computing power form the core issues of fierce competition within the industry; thanks to its flexible designs such as fan-less heat dissipation and unique wide temperature, Sintrones is currently one of the very few in the industry that can provide in-vehicle computers supporting 200W high-end GPU cards. It has successfully entered the application field of high-end self-driving vehicle systems. The test of an uncrewed self-driving bus in cooperation with a renowned French self-driving vehicle company is continuing certification for system operation. In addition, more and more public transportation requires actual measurement of fail recovery and emergency backup, and simultaneous potential business opportunities will contribute to the stable profitability of Sintrones's operations.It is also worth mentioning that INTEL, AMD, and Nvidia were the main processor designs in the past. Due to the needs of automotive systems, Sintrones's product line has increased support for NXP processors, which will further expand the future product layout. In addition, for the practical application of 4G/5G, Sintrones has achieved considerable gains due to its participation in constructing the European Expressway Electronic Toll Collection (ETC). However, due to costs and the timetable for the gradual popularization of telecom operators, the current demand for 5G applications is still slightly lower than that of 4G LTE.Allying with AU Optronics to strengthen strategic partnership and layout future automotive systemsSintrones mainly focuses on the application field of commercial vehicles. Due to the differences in technical specifications, market size, and cost structure for the intensely competitive passenger car market, Mr. Hsu has adopted a slow and steady strategy. He has actively formed a close strategic partnership with AU Optronics. Due to the variety of intelligent functions in vehicles, interior panels have skyrocketed, such as infotainment systems, brilliant rear mirrors, bright instrument panels, heads-up displays, and many electronic control units (ECUs). This suggests that large display panel manufacturers have an increasingly dominant position. For Sintrones, there are considerable potential business opportunities, but such options require a complete layout and preparation.The two parties have cooperated to create an Autonomous Mobile Robot (AMR) project. The parties have also launched various cooperative development projects for the Smart Cockpit system used in vehicles. For projects just on the cusp of initialization, there is the first-time promotion of charging station applications. The trend of electric cars has affected earth-shaking changes in the automotive market. The current new development is towards the role played by RSU, especially for the active improvement of safety in self-driving systems. The diversified integration of intelligent poles and intelligent traffic signs also brings new business opportunities for RSUs of in-vehicle computers.At present, applications of EV charging stations, which have increased in demand, have sprung up one after the other. For example, various integrated applications have included electronic payment, digital signage, and ATM banking systems. Since there are onboard computers behind the scenes of different guide and self-service systems (Kiosks), Sintrones and system integrators have already started developing solutions and designing integrated kits. In response to the varied business opportunities in the electric vehicle market in the next ten years, Sintrones has performed product development and preparation.Despite undergoing shortages of materials and the haze of market changes in 2021, Mr. Hsu remains optimistic about the growth potential of Sintrones in 2022. The current priority is to lock the development pace of the North American market and meet the opportunities offered by electric vehicles and charging stations in the United States. In these couple of years, Sintrones will rapidly increase its revenue share in the US market and actively prepare for the future of the automotive market.In response to the varied business opportunities in the electric vehicle market in the next ten years, Sintrones has performed product development and preparation. Currently, there is the first-time promotion of charging station applications and the integration of intelligent poles and smart traffic, which also brings new business opportunities for RSUs of in-vehicle computers.The unmanned self-driving bus system in cooperation between Sintrones and a renowned French self-driving vehicle company represents a successful entry into the application field of high-end self-driving vehicle systems. It will contribute to the stable profitability of Sintrones's operations.

The Indian electric vehicle market has shown tremendous growth in the past few years, a trend which is expected to witness exponential growth in the future. The driving factors for the growth of the EV market are the government incentives and subsidies for EV infrastructure developments. Also, increasing awareness regarding the environmental impact due to emissions from automotive vehicles and increasing fuel prices strengthens market growth. Electric vehicles are considered environmental friendly alternatives for transportation and are very likely to replace conventional vehicles in the future.According to a latest report, EV sales in India continue to grow impressively with sales in December 2021 reaching around 51K units, with a month-on-month increase of 21% and a year-on-year increase of a massive 240%. In 2022, sales are expected to reach a figure of 500K units.The EV market can be placed into several segments such as vehicle type, vehicle class, top speed, region, etc. The vehicle type segment gives a clear distinction of electric vehicles available for consumers. It includes passenger cars, two-wheel vehicles and commercial vehicles. In terms of volume, the two-wheel segment followed by passenger cars are expected to dominate the market. However, a few factors may hamper the growth of the EV market such as a lack of EV chargers, charging infrastructure, high manufacturing cost, km range per charge, service, etc.HT45F5Q-xx SERIES ASSP MCUHOLTEK is contributing to the growth of the EV market by addressing the EV charger problem with the latest HT45F5Q-xx series of ASSP microcontrollers (MCUs). HOLTEK is providing a smart EV charger solution to efficiently charge batteries to ensure their long life. These ASSP MCUs have the part numbers: HT45F5Q-1, HT45F5Q-2, HT45F5Q-2A and HT45F5Q-3.Hardware:The hardware section in the HOLTEK's EV charger solution includes MCUs, reference designs (schematics, Gerber files, etc.) and calibration tools.When compared with traditional MCU solutions, HOLTEK's ASSP MCUs include an integrated battery charger module which has two sets of OPAs and DACs for voltage and current control. It also includes an OPA to amplify the charging current signal from a current sensing resistor. Other MCU features include an EEPROM, CRC checking and various serial interfaces.Currently, HOLTEK is offering three EV charger reference designs suitable for the Indian market which can help users with their rapid product development. The specifications are 48V/2A (150W), 24V/4A (150W) both with flyback topology and 48V/12A (650W) with dual-switch forward converter topology. A general block diagram of an EV charger reference design is shown below.The EV battery charger block diagram of HT45F5Q-xx MCUPhoto: HOLTEKThis suggested smart charging system can support both lithium-ion and lead-acid battery types and includes features such as programmable charging voltage and current, over-temperature, reverse polarity and short circuit protection, LED charging status indicators, etc.Calibration tool design details are also available for reference allowing users to develop their own EV charger calibration hardware.SOFTWARE AND FIRMWARE:HOLTEK has also released a battary charger development workshop for firmware development. This software tool provides a GUI for users to generate firmware in a user-friendly manner. Users can set the charging voltage, current, and other parameters to generate firmware using a standard charging process. Later, the workshop-generated firmware can be modified to include user-defined code.The HT45F5Q-xx series charger volume production calibration platform is also available to help with the calibration process. A charging voltage and current accuracy of up to ±1% after calibration can be achieved here.The use of these software tools can greatly shorten the development period and improve the production efficiency.BENEFITS OF USING HOLTEK ASSP MCUs FOR EV CHARGER APPLICATION:The integrated battery charger module in the HT45F5Q-xx MCUs eliminates the need for external components such as DACs and OPAs which reduces the design complexity, resulting in smaller PCB areas and lower BOM costs.HOLTEK also provides complete technical resources such as block diagrams, application circuits, PCB files, source code, etc., to help users to develop their EV charger products.The availability of technical resources and workshops significantly simplifies the overall development process and helps with rapid product development which reduces the product time-to-market. To learn more about HOLTEK EV charger solutions, please contact your HOLTEK sales representative or email krishna@holtek.com.tw.

FSP has released the latest Bronze efficiency PSUs. Four models include 230V and worldwide input voltage; the wattages consist of 750W/850W. FSP bronze power supply provides various options from low wattages like 300W to high wattages such as 850W. Regardless of the power requirements of your devices, FSP can meet all your needs.As the hardware requirements of computer components and gaming specifications are getting higher and higher, CPU and GPU power consumption is increasing recently, and PSUs need to keep up with the times and supply enough power to the system. FSP750/850-50AAC and FSP750/850-51AAC released by FSP is not only meet the regulation of the Intel PSDG ATX 12V V2.52, but its efficiency reaches 80 PLUS Bronze efficiency level. Single unit +12V can provide a more stable and pure electricity which can support high-end graphic cards such as NVIDIA RTX 3080. The 12-cm sleeve bearing fan can supply more than 88% high cooling efficiency and maintain a low-noise environment. It is a new PSU option with bronze efficiency PSU for entry-level players.FSP750/850-50AAC and FSP750/850-51AA comply with the latest safety regulation 62368 certification. Multiple circuit protection mechanisms are provided, such as over current protection (OCP), over voltage protection (OVP), short circuit protection (SCP), over power protection (OPP), and over temperature protection (OTP). It allows gamers to enjoy their entertainment without worrying about abnormal conditions of equipment due to insufficient power.FSP's power supplies have high performance, high stability, and a complete product assortment to meet users' requirements. Please feel free to contact us and choose the right power supply.

China Securities Regulatory Commission (CSRC) registered Loongson Technology Corporation Limited (Loongson)'s application for an initial public offering (IPO) on the STAR Market. CIP United Company Limited (CIP United) hereby congratulates Loongson.CIP United: Exclusive MIPS Technology licensor in Chinese marketAs the exclusive licensor and operator of MIPS technology in China, Hong Kong and Macao, CIP United has complete innovation and derivative rights to MIPS technology, and can sublicense its customers to be covered by patent protection worldwide from the risk of patent infringement. In the future, CIP United will continue to work with the customers to develop independent and controllable innovative technologies and products based on MIPS technology, and contribute to the "Chips Made in China".Over the past two decades, hundreds of millions of chips developed and shipped based on the MIPS architecture by eminent Chinese chip companies such as Ingenic Semiconductor, Actions Semiconductor, Montage Technology, and Spreadtrum Communications have become the cornerstone of "Chips Made in China".Loongson's IPO: Major revenue from MIPS, and least 'audited' MIPS shipment in Chinese market?As MIPS licensees in China, Loongson and its predecessors have been using the MIPS architecture for more than 20 years. According to Loongson's prospectus, in the period of 2018 to 2021 (Loongson Prospectus Reporting Period), more than 80% of Loongson's revenue was derived from products based on the MIPS architecture.Up to the end of 2021, CIP United has licensed IP exceeded 500 million units. Referencing to Loongson's IPO documents, in the Chinese market, its total number of shipment of chips based on the MIPS architecture authorized Loongson has contributed approximately 0.55% to CIP United's IP shipment. In net, Loongson chips accounted for about 0.15% of the annual IP shipment in 2018, about 0.37% in 2019, about 0.85% in 2020, and about 0.56% in 2021. In those years, Loongson's yearly shipments volume was ranked bottom amongst the top manufacturers.Loongson's IPO: Breach and infringement risks?Loongson's IPO documents indicate it still has ongoing disputes with CIP United that are subject to pending arbitration related to breach of MIPS Technology license agreement in Hong Kong and pending litigations regarding infringement in China.In the arbitration, Loongson was alleged by several breaches including without limitation using unlicensed MIPS technologies, modification of MIPS technology, under-reporting or concealing royalties without acceptance of a proper audit by the licensor. CIP United insists Loongson to accept audit, submit all overdue royalty reports of MIPS technology owed to CIP United and pay these royalties as an IPO candidate.In the litigations, Loongson's 3A5000 chip and its architecture "LoongArch" were sued for infringement of MIIP architectures. Loongson have not yet published LoongArch architecture Volumes 2 and 3, which is not acceptable among the practice in the architecture providers in past decades. According to the "Virtualization[1] Instruction Technology Analysis Opinion" issued by Shanghai Silicon Intellectual Property Exchange Centre Co., Ltd., the virtualization of Loongson's LoongArch architecture is highly similar to that of the MIPS architecture. Further, this analysis report has been endorsed by two leading edged industry experts from the Hong Kong University of Science and Technology and the International Semiconductor Association, a global organization.Loongson's IPO Going Forward: Compliance Issues?Over 20 years, Loongson is about to go public in the STAR Market. Loongson accepted investment from state-owned assets, and therefore is seen as a model of CPU companies in China. It shall further comply with the stringent capital market and intellectual property regulations, and shall make full disclosures that its business, financials, technical independence and products are fraud-less - especially intellectual property issues. Otherwise, it is likely to affect the healthy development of Chinese semiconductor industry, lead to serious loss of state-owned assets, and damage to the public investors and Chinese capital market's international creditability. These discredits are no less than those of the Hanxin scandal, which delayed Chips Made in China over 10 years. The public will continue to keep an eye on these compliance issues in STAR Market. With faith in the regulatory and fair competition, CIP United looks forward to overseeing Loongson's foregoing compliance be properly delivered before official IPO.CIP United is committed to work with the Hi-Tech communities to jointly develop Chinese semiconductor industry and capital market, strengthen higher protection of intellectual property in China, and support China to become an innovative nation.*Note[1]: Virtualization is a module of MIPS technology licensed to Loongson.IP shipments, growth trend and forecast since CIP establishmentPhoto: CIP United

Digi-Key Electronics, which offers the world's largest selection of electronic components in stock for immediate shipment, has been recognized by global interconnect supplier partner Harwin with the Global Performance of the Year award. Digi-key was chosen for its first-rate new product introduction (NPI) activity, the responsiveness of its team to customer demands and exceptional sales performance."We are honored to be recognized for our performance by our valued supplier partner Harwin," said David Stein, vice president of global supplier management at Digi-Key. "This award is proof of our great partnership and our team's commitment to on-time delivery and customer service. We're proud to offer Harwin's high-reliability solutions to our customers."Harwin is the original designer and manufacturer of the high-reliability interconnect families Gecko (1.25mm pitch), Datamate (2mm and 4mm pitch), M300 (3mm pitch) and their newest Kona series (8.5mm pitch). These unique products offer high-reliability connectivity with vibration, shock and temperature resilience for challenging environments and applications – from aviation to space, motorsport, defense, medical and industrial."Digi-Key has continued to set the highest standards when it comes to the service it provides, and Harwin recognizes how hard its staff work to keep achieving more," said Andrew McQuilken, chief revenue officer at Harwin. "The comprehensive support of new product introductions, the large quantities of stock carried to rapid response to customer demands and the continued growth figures being recorded are clear testaments to this."Visit the Digi-Key website to view the full list of Harwin products available through Digi-Key.Matt Nemec, director, supplier business development at Digi-Key, was presented with the Global Performance of the Year award from Doug Steele, head of distribution sales Americas for Harwin.

Industries worldwide are moving towards "Smart" technology and promoting digital transformation with new technologies such as in AI, 5G, and IoT is a crucial strategy for many companies. However, most companies are developing their own technology, which has led to AIoT being applied in a fragmented manner. System integrators usually require a longer lead time and resources to build customized systems for their clients when faced with complex market requirements. AMobile, a joint venture of Arbor Technology and MediaTek, stated that the firm has many years of experience in IIoT smart technology, provide customized designs and ODM/OEM services.Hence, AMobile can assist equipment suppliers that specialize in smart safety and security, healthcare for the elderly, pandemic prevention technology, retail and warehousing, IoV, IoT, etc, to quickly develop products in shorter amounts of time to swiftly seize market opportunities.AMobile devotes great effort to industry applications. The company connects conventional instruments and panels with relevant telecommunications solutions, thereby promoting telecommunication applications in instruments. This makes it more convenient for the industry to upload data when using conventional instruments, thereby accelerating the process and enhancing efficiency. Conventional instruments can also be more wildly applied thanks to telecommunication technology. For instance, digital data can be uploaded easily to the cloud for record-keeping and analysis. Moreover, the equipment can also be managed on the cloud to reduce errors and enhance maintenance. The G60 Mobile Inspection Solution was designed for factory inspection application, and combines wireless communications, radios, and thermal imaging instruments. The smart water meter combines conventional dashboards with AI and thus simplified the process with enhanced efficiency. The solution improved meter reading accuracy and lowered human error rates. Therefore, AMobile's innovations also received recognition from various international design awards, such as the German Red Dot Design Award and Japanese Good Design Award.AMobile has indicated that thanks to its many years of development in AIoT, its relevant technologies have become rather mature. However, successfully integrating these smart equipment or systems in different industries requires further integration among software, hardware, front-end and back-end systems. Only then can a piece of equipment have diverse functions and thus provide the best user experiences and optimize process efficiency. Take the logistics industry for example. In the past, handheld devices within the industry could only be used to record the delivery of goods. But with AMobile's 5G industrial-grade and robust handheld device and tablet, both of them connected to a cloud platform. That equipment can transfer massive data with low latency, high accuracy in positioning, smart navigation, smart delivery, data collection, and data analysis. These advantages can lead to a 20% reduction in operational cost and a 30% boost in work efficiency. In addition, they also lead to better operational performance and management efficacy. In industrial security, AMobile adds AI recognition functions. Users can use edge computing to analyze data promptly and detect, receive reminders and analysis regarding security, all on the cloud.Under this trend, manufacture and system integration must excel in their professional know-how and further market research. In order to fulfill every customer requirement, AMobile is well versed in the technical advantages of industrial controls and processors. The company has well-rounded and flexible professional abilities to satisfy clients' wide range of requirements. AMobile has pointed out that the industry has entered an era of the professional division of labor. Each business must utilize external professional suppliers to solve technical issues to optimize resources best. Currently, the market is fragmented, and different clients have various system specifications and functional requirements. AMobile's ODM also provides flexible services, which means equipment business owners can choose according to their requirements and abilities for a collaboration that benefits all. For instance, equipment business owners can discuss product applications and innovations with ODM suppliers. Examples include electrical switchboard manufacturers requiring thermal imaging modules for application of electrical safety, the construction or the healthcare industries needing always on health monitoring solution, Etc. AMobile can provide professional suggestions with the company's own expertise and experience in industrial computing and communication, responsible for function design, structural design, component selection, ID design and manufacturing. In addition to ODM service, AMobile also provides OEM services. Clients who choose the OEM services. The clients choose OEM services with a product with a pre-existing design and specifications. AMobile can offer appropriate solutions to assist clients in quickly entering the manufacturing stage. After the product has been manufactured, the client only needs to focus on marketing, thus significantly reducing costs and solving issues related to production capacity.AMobile has pointed out that applications of AIoT have become more diverse. This poses a great challenge to allocating resources and the professional skills of equipment suppliers. AMobile's OEM and ODM services allow it to be a company's best partner, swiftly satisfying clients' needs from different areas and building a cost-efficient system, thereby creating a win-win situation in the market.AMobile Intelligent is committed to offer excellent customer experience and satisfaction, we provide quality products and solutions with innovations that connects the world with intelligent technologies.