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Thursday 25 May 2023
Wincomm demos up-front medical & industrial panel PCs at Computex Taipei
Wincomm Corp. welcomes your visit to Wincomm at Booth No. K1125a during Computex Taipei, on Mar 30 to June 2, 2023 at Nangang Exhibition Center Hall 1F, in Taipei, Taiwan.In 2023, Wincomm invites all our business partners and industrial decision makers to empower Industrial & Medical Computing Solutions including medical grade, food grade, full IP waterproof and explosion-proof grade ePlatforms, and to build IIoT to AIoT infrastructures together.Healthy Life from EMR, AI in Surgery and Seamless Integration for Smart Hospital Wincomm medical panel PC has proof its design value with excellent design for years. In 2023, we are pleased to announce brand-new series entering the up-front design from mobile medical cart AIO, WMP-22P/24P series, point of care traditional selection, WMP-15J/19J series, powerful medical AI panel pc, WMP-24K series and new box pc, WPC-789, and medical OR pc, WMP-22T/24T-PIS series, featuring on excellent power management, high computing power up to Intel 12th generation Alder Lake Core i, and fan-less solutions. With remote management IoT API platform, it is ready for most e-Healthcare solution makers to build infrastructure as best edge computing solutions. Besides, Imedtec, a leading innovative solutions provider that empowered by AIOT in medical industry, now released Telehealth Solution integrated with Wincomm medical cart AIO pc series, which combines patient information, video and vital signs data into a single platform, making it easier to have virtual consultations with various specialists and to provide timely, specialized care to patients.Better Life from Full Waterproof/Dustproof and Explosionproof HMI for Hygienic FactoryDedicated on highest quality industrial panel PC innovation, the Wincomm stainless panel PC series have granted full IP waterproof testing, 100% dustproof guarantee, wider temperature up to -20 to 60 degree C in shelf, sunlight readable and new explosionproof series for outdoor, food, extremely rugged environment applications. Ranging from Intel Celeron Processor J Series (code name: Elkhart Lake), WTP-8J66 series, low power solution, and up to 12th Generation Intel Core i5 Processors (code name: Alder Lake), WTP-9H66 series, high computing power solution, with 15", 19" and 22" panel size for selection. For IP66 front panel PC for various industrial applications, we demonstrate WLP-7J20 series with Intel Celeron Processor J Series (code name: Elkhart Lake) and WLP-7H20 series with12th Generation Intel Core i5 Processors offering 10.1", 10.4", 15", 15.6", 19", and 22" for selection. Enable with intelligent innovated management for power versus computing best utility and wireless remote device management system, Wincomm is proud to announce best solutions to build IIoT application toward better life.Welcome to Visit Wincomm Booth No. K1125a at Computex 2023
Wednesday 24 May 2023
Manz AG develops breakthrough production solution of panel-level packaging to seize growth of automotive semiconductors
Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in Penang, Malaysia. The participation of this exhibition reflecting the company's focus on a total production solution of high-density packaging technologies that fulfill the high global demand for automotive chips. Highlighted within the Manz booth will be recent advancements in developing leading-edge Fan-Out Panel Level Packaging (FOPLP) solutions for ensuring higher efficiency and lower manufacturing cost.Manz has built the industrial largest 700 x 700 mm process area FOPLP redistribution layer (RDL) production lines. Combined with this work, the company provides Total Fab planning from customized process development, equipment construction to the integration of upstream and downstream manufacturing production lines. The full range of service helps automotive chipmakers facing the critical technological challenges of fine-pitch copper line formation in redistribution layers of FOPLP process. These innovative solutions satisfy the demand for high production yields, excellent Cu-plating uniformity, and high-density packages to deliver high performance power management ICs for electric vehicles. With our full strength to drive FOPLP production solutions forward, we assist customers to pursue breakthrough production methodology as well as ESG targets by increasing energy efficiency, and waste reduction.Despite semiconductor market showing slowdown in 2023, automotive IC sector looks to sustain the strong growth. According to Prismark, Advanced Driver-Assistance Systems (ADAS) and electric powertrain systems both have expected to grow at CAGR of 13% and 18% from 2022 to 2027, respectively. In the past two-year, the automotive semiconductor market has experienced silicon chips shortage, IC substrates capacity constraints and the packaging material cost rising. Facing the new normal of post pandemic and geopolitical instability, the IDMs, OSAT, IC Substrates and PCB makers aggressively turn to lower cost and high Interconnect innovation for a novel boosting of scale. FOPLP gets attractive because it could save IC substrate usage, reach the design of fine-pitch patterning, meet the requirements of high electric conductivity, and improve high heat dissipation.FOPLP increases the performance of PMICs.Electric vehicle architectures are rapidly evolving to accommodate high power density devices, multiple power electronics and controller ICs. The RDL technology provides high density of fine pitch metal interconnects that redistribute the I/O access to integrate multiple dies into one single package. With the line width and spacing (L/S) specification of 5/5µm ranges, Manz RDL production solutions enable a significant reduction in thickness, weight, and manufacturing costs of the packaging while performing complex pattering and complicated layers design to satisfy high density packaging requirements.Build FOPLP RDL production lines with the largest 700 x 700 mm process area in the industry.Manz AG has drawn on its core competencies of wet chemistry, automation, metrology, and inspection technologies to develop the industrial largest process dimension of 700 x 700 mm RDL production lines. The RDL process takes one-third of the overall manufacturing cost of FOPLP technology. That's why Manz's equipment has a crucial role to play. Collaborating with key customers, Manz AG has already built complete production lines not only for a pilot run but also a ramp-up of mass production to verify the precision adjustment of the Cu-plating process applied in large area of redistribution layers and overcome the major technical challenges including uniformity of cu-plating pattering, high resolution and high electrical connectivity.Excellent uniformity, high thickness and fast speed of Cu-plating increase production yields plus assist customers for ESG targets.Cu-plating is an integral part of the RDL process. Manz integrates its own pre-and-post chemical wet processes to ensure excellent electroplating panel surface uniformity at 92%. The Cu thickness could reach 100 μm and above. These newly developed processes increase chip density, heat dissipation and a high current density of up to 5 ASD to ensure higher process speed to boost overall manufacturing capacity. The unique automatic gentle handling and jig-free vertical electroplating systems, which can save the material purchase cost, as well as reduce the consumption of electroplating chemicals and the cost of maintenance to help customers achieving ESG targets.Total Fab Solutions enable highly profitable business models for FOPLP.Manz actively expands the reach of its Total Production Solutions to provide the services to build from single equipment to automated production lines with the integration of upstream and downstream manufacturing lines. This approach enables the tight collaboration among Manz and the global IDM, OSAT and semiconductor foundry service providers to develop a comprehensive plan for success by increasing competitiveness and maintaining the strong positioning of supply chains.Manz AG, leveraging an open-architecture and modular design concept, provides a comprehensive technology portfolio fulfilling the requirements of RDL process optimization and the flexibility to fit different stages of FOPLP production expansion. Seeing the huge growth of global automotive chip demand, Manz AG's production solutions transform FOPLP as the prevailing technology in the advanced packaging market.Manz FOPLP RDL production solutions with proven records for mass productionManz Jig-free Vertical Electroplating ━ a key tool to optimize the productionPMIC Packaging by FOPLP production line
Wednesday 24 May 2023
As global automotive chip market undergoes changes, WPG Holdings adopts strategies to optimize supply chain services
With a new wave of smart energy vehicles entering the market, competition in the global automotive semiconductor industry is changing. In light of this trend, WPG Holdings, a leading global semiconductor component distributor, together with its subsidiaries—WPI Group, SAC Group, AIT Group, and YOSUN Group—successfully held the Automotive Technology Application Exhibition in Shanghai and Shenzhen, China. The exhibition provided insight into the changes occurring in the industry's supply-and-demand chain and highlighted the company's main strategies with regard to horizontal integration of chip manufacturers and vertical integration of automakers to optimize up- and downstream cooperation in the automotive semiconductor supply chain. These strategies will significantly maximize chip supply efficiency and create a win-win situation among automakers, chip manufacturers, and WPG Holdings.Evolving competition in the automotive chip marketEric Ho, Chief Marketing Officer of WPI Group, pointed out that smart energy vehicles are very diverse, creating demand for differentiated components. Additionally, the continuous upgrading of component specifications has prompted automakers to require a wider range of chip solutions. Kevin Lin, Vice President of CN Business Group at AIT Group, explained that in the past automakers mainly purchased components that complied with vehicle regulations. With the development of smart and electric vehicles, however, demand for components that do not need to comply with vehicle regulations has been growing in the past two years. As a result, chip demand among automakers and tier-1 suppliers has become more intricate.Due to this development, as well as an acute awareness of the importance of stable chip supply following the disruptions of the COVID-19 pandemic, the industry's chip procurement methods are undergoing changes. Andrew Man, Chief Marketing Officer of SAC Group, explained that some automakers have started to bypass tier-1 suppliers and directly collaborate with MCU suppliers to shorten the design process, ensure stable supply, and achieve cost reduction goals.In response to increasing demand and different procurement patterns of downstream customers, upstream chip manufacturers have begun consolidating in order to expand product lines and increase chances of winning orders from automakers. Indeed, the entire automotive semiconductor industry supply chain is experiencing drastic change.Optimizing supply chain to create a win-win situationIn order to continue its role connecting up- and downstream sectors in the industry, WPG Holdings is integrating the resources and capacities of its four subsidiaries to promote two integration strategies and optimize cooperation models in the global automotive chip supply chain.Integrating horizontally with chip manufacturers and deploying diversified solutionsEric Ho stated that automotive chips have a wide range of applications and that WPG Holdings has been actively involved in many of them for more than 10 years, providing customers with comprehensive solutions. Among WPG Holdings' 250 product lines, more than 50 are automotive-related, covering almost all automotive applications, including ADAS, controllers, EIC systems, passive components, connectors, and others.Among YOSUN Group's nearly 60 product lines, 26 are related to automotive chips, with extensive technology coverage, said Jerry Chen, CEO Special Assistant at YOSUN Group. He pointed out that in response to the booming development of the new energy vehicle market in recent years, YOSUN Group has initiated an EV project to meet the changing needs of the market and customers. By consolidating the EV strategies of the sales, PM, FAE, and solution teams, as well as combining various technologies and chip requirements inside and outside the vehicle, YOSUN Group provides customers with rich and complete solutions. In addition, with the global service layout of WPG Holdings, the results that the company has achieved so far are remarkable. It has gained widespread recognition from automakers, customers, and the market. This has underlined the value of WPG Holdings to automakers, tier-1 and tier-2 manufacturers, and OEMs in the EV market.Integrating vertically with automakers and tier-1 manufacturers to provide customized technical servicesAndrew Man stated that SAC Group established an automotive electronics business team seven years ago and a technical team five years ago. Today, SAC Group has nearly 100 employees who are well-versed in the automotive industry. Among all its subsidiaries, WPG Holdings now boasts up to 300 engineers. These engineers not only have ISO-26262 certifications but also possess special skills and certifications related to MCU. They delve deeply into the needs of automakers and tier-1 manufacturers and provide customized technical services.Using AIT Group's business as an example, Kevin Lin further explained that it has many tier-1 customers, each with different requirements. Therefore, AIT Group leverages the collective strength of WPG Holdings to deliver optimal services to automakers and tier-1 suppliers through diversified solutions and customized technical support capabilities. This ensures that all the processes of the chips handed over by WPG Holdings can be completed smoothly and efficiently, from assembly to components and complete vehicles.As the automotive industry is transforming, WPG Holdings continues to serve as a critical distributor, aiming to provide automakers with the most suitable and diverse chip solutions and services, help chip manufacturers establish clear advantages in the changing market environment, and gain favor from automakers.
Wednesday 17 May 2023
CEO of TCO Development on list of Sweden most influential people in sustainability
The organization behind the sustainability certification TCO Certified is TCO Development. TCO Development works globally towards a future where all IT products have a sustainable life cycle. The international team is headquartered in Stockholm, Sweden, with team members working remotely at several continents around the world.Soren Enholm, the CEO at TCO Development, has, once again, been named one of Sweden's most influential people in sustainability. The list of 101 people is put together every year by the Swedish magazine Aktuell Hallbarhet.It is a great honor to be on the list to highlight the importance of more sustainable IT products. And with a record high interest in certified products it is satisfying to see that purchasers' demand for TCO Certified push the IT industry in the right direction. Together we drive progress toward sustainable IT products and circular solutions, says Sören Enholm.The story of TCO Certified began more than 30 years ago. Sören has led the work since 2009 and it is the second year in a row he is on the list. The sustainability requirements of TCO Certified affect how more than 100 million IT products are manufactured each year. The requirements are tightened every three years — towards a more circular design, safer chemicals, a reduced product carbon footprint and better working conditions in factories. To challenge the industry and drive the development of more sustainable IT products, the criteria go beyond legislation and industry standards.TCO Certified is available for 12 product categories, including computers, mobile devices, display products, imaging equipment and data center products. Compliance is independently verified, both pre- and post-certification. All product models can be found at Product Finder.
Tuesday 16 May 2023
DataVan to create smart airport and enhance passenger experience with AI retail technologies at COMPUTEX
Taiwan's leading retail equipment manufacturer, DataVan (3521.TWO), has been actively implementing intelligentization strategies in recent years. By introducing new technologies, improving software and hardware integration, and expanding research and development capabilities, DataVan provides clients with comprehensive smart solutions for operation and management, presented at this year's COMPUTEX, one of the largest computer and technology trade shows in the world.In response to the surge in outbound tourism since the Chinese New Year holidays this year due to the lifting of travel restrictions, DataVan will create a "Smart Airport" on-site at COMPUTEX to optimize the travel and outbound experience with its latest AI retail technologies and equipment. According to DataVan, the reason for choosing "airport" as the scene to showcase its AI solutions is not only to respond to current events, but also because airports include areas such as travel information, duty-free shops, and lounges, which traditionally require a large amount of manpower for reception. By introducing more smart retail solutions with AI technologies, not only can the manpower shortage problem be effectively solved, but the shopping experience of passengers can also be highly optimized. In addition, it can provide store owners with more data analysis, allowing them to formulate more precise marketing strategies, and it is conducive to the successful implementation of more applications.DataVan states that the focus of smart airport is on the integration of hardware and software, highlighting three major features: The first one is DataVanGPT, an AI recommendation system that utilizes innovative GPT (Generative Pre-trained Transformer) technology, combined with the latest slim kiosk "Genius" by DataVan, which provides travel, navigation, and recommendation information services through voice queries. It also incorporates e-commerce and membership management system applications, creating greater commercial value. Secondly, AI Vision, which utilizes AI eye-tracking analysis technology, can analyze the direction and time of customers' eye focus in front of the store shelves, and can convert the attention hot zone data into accurate marketing applications with advertising benefits. Thirdly, AI Waiter, a smart voice ordering service system that uses AI voice and intelligent recommendation systems, will be integrated with DataVan's kiosk "Venus", demonstrating an innovative interactive self-service ordering system that can simultaneously use voice recognition and touchscreen.In addition to the AI systems, DataVan will also showcase a variety of innovative retail application software and hardware, including several new platform-based desktop POS systems, mobile payment terminals, Kitchen Display Systems (KDS), smart beer dispenser, and the cloud POS management platform "DataVan Central" that supports both Windows and Android systems, providing clients with a one-stop-shop service to meet their diverse needs. Welcome to explore DataVan's solutions at K0802 booth.DataVan provides clients with comprehensive smart solutions for operation and management, presented at COMPUTEX 2023.
Monday 15 May 2023
APD showcases innovative medical power supplies at CMEF 2023, garnering market attention
The global medical equipment market has been growing steadily in recent years, and the market size is now close to USD $100 billion; according to research, China's medical equipment market size has now become the second largest market in the world right after the United States. Taiwan's leading power supply company, Asian Power Devices (APD), participated in the CMEF China International Medical Equipment Fair held in Shanghai from May 14-17, and showcased a full range of highly reliable medical power supplies on-site (Hall 8.1/A02). During the exhibition, APD attracted the attention of leading medical equipment manufacturers worldwide by showcasing their products' quiet and efficient features, compact and portable design, as well as their exceptional product performances.Continual Innovation, R&D and Manufacturing Strengths Lead the IndustryCommitted to the power industry for almost thirty years, APD has now become the long-term strategic partner of many global leading medical manufacturers. APD obtained the "ISO 13485 Medical devices Quality Management System Standards Certificate" in 2015, has been certified with the "National Grade High-thech Enterprise" qualification year after year, and was even honored with the title of "Champion products in the Manufacturing Industry of Shenzhen City" with its medical power supplies in 2023. The General Manager of APD's Power System Business, Rax Chuang, stated that: "The China medical market is extremely important to APD; we have continually and actively invested resources in product R&D design and factory processes. Winning this honor shows that the manufacturing technologies and processes of APD has reached leading international standards, and this is one of the most important reasons why APD has continually won the trust of global customers."In order to ensure that its products comply with the latest standards of the industry in terms of safety, EMC, energy efficiency standard research and certification testing, APD invested large amounts of resources to establish laboratories for the highest levels of safety regulations in the industry, including the "UL safety lab" and "Electromagnetic compatibility (EMC) lab", that can maximize the coverage and meet the certification standard requirements of power products by different customer industries to help customers launch their products into the market faster. Recently, with the enforcement of China's latest version of the GB 9706.1-2020 standard for medical power supplies starting from May 1st, APD also invested resources to study and interpret the differences in the regulations, and investigate the differences in product-related safety designs to ensure that its products comply with the latest version of the medical safety standard.Diverse Power Applications with both Safety and PerformanceAs the construction of medical facilities accelerate after the pandemic, medical application devices are becoming more diverse and are flourishing. APD's highly reliable medical power supplies are now widely applied on devices such as ventilators, oxygen generators, humidifiers, monitors, infusion pumps, in vitro diagnostics (IVD), endoscopes, ultrasounds, electric hospital beds and electric wheelchairs. In addition, due to the development of the medical aesthetic market in recent years, APD has also invested in the application of various medical devices such as beauty instruments and hair removal devices, continually developing power products that can meet the diverse needs of medical customers.Since medical devices have special usage environments, medical power supply products have more rigorous requirements for safety and reliability. All of APD's medical power supply series comply with global medical product safety regulations IEC60601 and UL60601 series standards, and provide 2 x MOPP insulation protection design; they also have extremely low leakage currents to maximize the safety of patients. The peak current of the power supplies is as high as 300% or more, able to provide a stable power supply even if medical devices have transient high current requirements. The best heat dissipation is also provided for the products; APD adopted CAE auxiliary simulation on the designs of its medical power supplies to optimize their cooling architecture and make sure the medical devices can operate safely and steadily. Optimized electromagnetic interference structure designs were also adopted inside the products to improve their anti-interference performances and safety. Meanwhile, APD medical power supplies also have high tolerances for electrostatic and fast bursts, as well as over-voltage, over-current, over-temperature and other protective functions, and are able to highly ensure the stability of medical devices and the safety of patients. They are also very quiet while operating, so are able to provide patients with a calm, peaceful environment while resting. In addition, APD's embedded power supplies can also be widely applied in other rigorous environments and still ensure safe and steady product operations; the safety of the products is outstanding.The Group Continues to Expand its Production Capacity and Increase its Operational Energy APD continues to grow and surpass the industry with an annual revenue growth of 15% using its profound R&D capabilities and stable and high efficiency power supply products. It has continually innovated its technologies, improved its production technology and optimized its processes actively, and the various plants of the Group have been fully equipped with highly automated production equipment, vastly improved its production efficiency and product quality. In order to ensure that the Group can continue to improve its production capacity, APD's new Shenzhen Pingshan plant was completed and began operation in September of 2022. This is APD's third largest production base in China after Shenzhen plant one and plant two, driving the expansion of APD's total production capacity to a new milestone. The General Manager of APD's Power System Business, Rax Chuang, stated that APD will continue to innovate its technologies and expand its global production capacities in the future, and use highly-efficient production services to provide the most competitive medical power solutions for its global customers.
Friday 12 May 2023
Silicon Catalyst announces "Silicon Startups Contest" in partnership with Arm
On May 10, 2023, Silicon Catalyst, the world's only incubator focused exclusively on accelerating semiconductor solutions, announced a "Silicon Startups Contest" in partnership with Arm. The contest is organized and administered by Silicon Catalyst and is directed towards early-stage entrepreneurial teams developing a system-on-chip (SoC) design using Arm processor IP, proven in more than 250 billion chips shipped worldwide.The contest offers an opportunity for silicon startups to win valuable commercial, technical, and marketing support from Arm and Silicon Catalyst. The winner will receive Arm credit worth $150,000, which could cover IP fees for a complete embedded system, or significantly contribute to covering the cost of a higher performance application. In addition, both the winner and two runners-up will receive:Access to the full Arm Flexible Access for Startups program, which includes:• No cost, easy access to an extensive SoC design portfolio including a wide range of Cortex processors, Mali graphics, Corstone reference systems, CoreLink and CoreSight system IP.• Free tools, training, and support to enhance your team• $0 license fee to produce prototypes• Cost-free Arm Design Check-in Review with Arm's experienced support team• Entry to an invitation-only Arm ecosystem event with a chance to be featured and connect with Arm's broad portfolio of silicon, OEM and software partners• Investor pitch review and preparation support by Silicon Catalyst, with an opportunity to present to the Silicon Catalyst Angels group and their investment syndication network."We believe that Arm technology is for everyone, and early-stage silicon startups trust Arm to deliver proven, validated computing platforms that enable them to innovate with freedom and confidence," said Paul Williamson, senior vice president and general manager, IoT Line of Business at Arm. "Since its launch, Arm Flexible Access for Startups has enabled around 100 startups with access to our wide portfolio of IP, extensive ecosystem and broad developer base, and we look forward to seeing what creativity this prize inspires in the exciting new startups that enter this contest."The contest is open to startup companies in pre-seed, seed, and Series A funding, that have raised a maximum of US$20 million in funding. All contest applicant organizations will be considered for acceptance to the Silicon Catalyst Incubator/Accelerator. Judges include senior executives from both Arm and Silicon Catalyst."Arm was the first member of our ecosystem to join as both a Strategic Partner and an In-Kind Partner. Their Flexible Access program is a game-changer for startups. Through this program, silicon startups can move fast, experiment with ease, and design with confidence – so it's a highly valuable part of the contest prize," stated Pete Rodriguez, Silicon Catalyst CEO. "Entrepreneurial teams entering the contest will also automatically be applying to our Incubator, with the winning company receiving credit with Arm that could give them a significant head start in the commercialization of their product, as well as the opportunity to present to the Silicon Catalyst Angel investment group and their syndication network of investment partners."The contest will run from May 10, 2023 through to June 23, 2023. The contest winner and two runner-up companies will be announced in early July 2023. Contest rules and application details can be found at https://siliconcatalyst.com/arm-sic-contest-2023About Silicon Catalyst"It's about what's next"Silicon Catalyst is the world's only incubator focused exclusively on accelerating semiconductor solutions, built on a comprehensive coalition of in-kind and strategic partners to dramatically reduce the cost and complexity of development. More than 900 startup companies worldwide have engaged with Silicon Catalyst and the company has admitted 97 exciting companies. With a world-class network of mentors to advise startups, Silicon Catalyst is helping new semiconductor companies address the challenges in moving from idea to realization. The incubator/accelerator supplies startups with access to design tools, silicon devices, networking, and a path to funding, banking and marketing acumen to successfully launch and grow their companies' novel technology solutions. Over the past seven plus years, the Silicon Catalyst model has proven to dramatically accelerate a startup's trajectory while at the same time de-risking the equation for investors. Silicon Catalyst has been named the Semiconductor Review's 2021 Top-10 Solutions Company award winner. More information is available at www.siliconcatalyst.comAbout Silicon Catalyst AngelsThe Silicon Catalyst Angels was established in July 2019 as a separate organization to provide access to seed and Series A funding for Silicon Catalyst portfolio companies. What makes Silicon Catalyst Angels unique is not only the investment group's visibility into a semiconductor-focused deal flow pipeline, but our membership is comprised of seasoned semiconductor veterans who bring with them a wealth of knowledge along with their ability to invest. Driven by passion and a desire to 'give back', our members understand the semiconductor market thanks to a lifetime of engagement in the industry. When you couple our members enthusiasm, knowledge, and broad network of connections with companies that have been vetted and admitted to Silicon Catalyst, you have a formula that is to date, nonexistent within the investment community. More information about membership can be found at www.siliconcatalystangels.comContact InformationSilicon Catalyst Richard Curtin, Managing Partner richard@sicatalyst.comSilicon Catalyst UK Sean Redmond, Managing Partnersean@siliconcatalyst.uk
Tuesday 2 May 2023
iCatch Technology unveils CR3 automotive AI imaging SoC for in-cabin sensing
iCatch Technology, a leading Taiwan-based AI image processing IC design company, announced its innovative CR3 Automotive AI Imaging SoC for in-cabin sensing applications at the recent AutoSens InCabin Show held in Phoenix from March 15th to 17th, 2023. The event showcased the latest advancements in in-cabin technology and safety, including emerging trends in driver and occupant monitoring systems (DMS/OMS), and the future outlook for the industry and regulation.iCatch Technology delivered a presentation on smart cockpit monitoring with event-based sensor technology. Photo: AutoSens In-Cabin Phoenix, 2023During the event, iCatch Technology delivered a presentation on the topic of "Emerging Event-Based Vision Sensor Technology Enhances Driving Safety and Privacy in Smart Cockpit," to an engaged audience.The presentation highlighted the innovative use of event-based edge AI technology to monitor cognitive states in real-time, enabling quick responses to driver's distraction with privacy protection. iCatch Technology's in-cabin sensing technology was aligned with the increasing demand for in-cabin monitoring systems (DMS/OMS) in the automotive industry, which provide crucial data on driver and occupant behavior, enabling proactive safety measures and addressing privacy concerns. According to Euro NCAP assessment, DMS will be standard in all new vehicles by 2025, making it a key focus area for iCatch Technology."We are excited to unveil our CR3 Automotive AI Imaging SoC at the AutoSens InCabin Show," said Weber Hsu, CEO of iCatch Technology. "With our innovative event-based vision technology and sensor fusion solution, we are enabling advanced driver and occupant monitoring systems that enhance driving safety while ensuring privacy protection. We are proud to be at the forefront of driving advancements in in-cabin sensing applications and contributing to the future of automotive safety."The head pose and gaze detection results by processing event-based image data are shown with the corresponding normal color image. Photo: iCatch TechnologyIn addition to the presentation, iCatch Technology also showcased their latest advancements for Enhanced In-Cabin Safety and Privacy. The solution features their CR3 Automotive AI Imaging SoC, which enables real-time monitoring of driver behavior and reliable detection of distractions, using event-based AI algorithms and auto-switching RGBIR sensor with HDR technology. The CR3 is a comprehensive AI Imaging solution for in-cabin sensing applications, with its proprietary image processing pipeline, computer vision DSP, and Neural Processing Unit integrated into a single chip, empowering OEMs and Tier-1s to realize camera-based in-cabin sensing solutions with improved latency and privacy protection.
Friday 28 April 2023
AUO Display Plus' smart P.O.D. (place-on-demand) solution introduced to Taoyuan International Airport departure lounge
AUO Display Plus (ADP), a subsidiary of AUO Corporation, has successfully introduced it's Smart P.O.D. (Place-on-Demand) Solution into the airport departure lounge to improve passenger experiences during their wait times. ADP's Smart P.O.D. Solution has been introduced, for the first time, in Taoyuan International Airport Terminal 2 departure lounge, allowing business travelers to effectively utilize their pre-flight time for seizing business opportunities at any time.With the lifting of border restrictions and the resumption of international business travel, the level of passenger traffic at Taoyuan Airport has increased by 21 times at the beginning of this year compared to the same period last year. Passengers' pre-flight waiting time needs to be used more efficiently. In collaboration with Omni Media, a subsidiary of CHOICE COMPANY, ADP installed two Smart P.O.D. Solutions in the Terminal 2 departure lounge, allowing business travelers to effectively use their pre-flight time for work or meetings. It has been in use for almost a month now, and the usage rate during the pre-flight waiting time has exceeded 90%.Taoyuan International Airport state that they have been actively promoting software and hardware service upgrades to improve the experience for global passengers at the airport. They hoped that the ADP's Smart P.O.D. Solution will provide a comfortable and convenient pre-flight waiting experience, making Taoyuan International Airport the first choice for global travelers.ADP's Smart P.O.D. Solution creates a dedicated, independent work and meeting space that can be used by hybrid working business travelers at any time, without being distracted by the bustling airport crowds and environment. Smart P.O.D. Solution is equipped with an environmental control system, excellent sound-proofing and privacy glass that automatically activates when in use. Travelers can simply scan the QR code on the door to access the user page, and follow the instructions to easily make a reservation.In addition, the ADP's Smart P.O.D. Solution helps Taoyuan International Airport to effectively utilize space and integrate marketing resources. By using digital signage on both sides, managers can schedule content such as travel or destination-related information for passengers through the cloud-based content management platform and broadcast at specific times of the day.According to Jerry Lee, AVP of Public Display Integration Service Business Unit at AUO Display Plus, "AUO Display Plus' Smart P.O.D. Solution is the first of its kind to be introduced at Taoyuan International Airport, helping the airport to provide more convenient software and hardware integration services that improve the work efficiency of international business travelers during their travels. ADP will also continue to cooperate with Taoyuan International Airport and create a richer passenger experience by integrating Omni Media's comprehensive multimedia resources."In response to the trend towards hybrid working models, ADP expects to introduce more Smart Enterprise Solutions to help business people and corporations improve work efficiency in large transportation hubs such as airports, train stations, and transport hubs.Travelers can simply scan the QR code on the door to access the user page, and follow the instructions to easily make a reservation.AUO Display Plus' Smart P.O.D. Solution allow business travelers to effectively use their pre-flight time for work or meetings.Smart P.O.D. Solution creates an independent working space for business travelers, away from the distractions and bustle of the airport environment.ABOUT AUOFounded in 1996, AUO is an enthusiastic, technology-driven company, delivering products and solution services that advance the frontier of innovation for display, system solutions, industrial intelligence, healthcare, and energy. The company is based in Taiwan and operates across Asia, the US and Europe, with a global team of 38,000 people. Additionally, AUO has also been named to the Dow Jones Sustainability World Index since 2010. AUO's consolidated net revenues in 2022 were NT$246.79 billion. For more information, please visit AUO.comAbout AUO Display PlusAUO Display Plus is AUO's industrial and commercial display subsidiary and offers a complete end-to-end display service, from R&D to sales and customer service. AUO Display Plus integrates its leading display technologies with value-added software solutions for retail, enterprise, education, transportation, and healthcare. AUO Display Plus collaborates with partners in different domains to co-create complete solutions and one stop services that help businesses accelerate their smart transformations and create greater value. Headquartered in the Hsinchu Science Park, Taiwan, AUO Display Plus operates global offices in Mainland China, Japan, the United States, and Europe. AUO Display Plus Website: www.auodplus.com/zh-TWSafe Harbour NoticeAUO Corporation ("AUO" or the "Company") (TWSE: 2409), a global leader of TFT-LCD panels, today announced the above news. Except for statements in respect of historical matters, the statements contained in this Release include "forward-looking statements." These forward-looking statements are based on our management's expectations, projections and beliefs at the time regarding matters including, among other things, future revenues and costs, financial performance, technology changes, capacity, utilization rates, yields, process and geographical diversification, future expansion plans and business strategy. Such forward looking statements are subject to a number of known and unknown risks and uncertainties that can cause actual results to differ materially from those expressed or implied by such statements, including risks related to the flat panel display industry, the TFT-LCD market, acceptance of and demand for our products, technological and development risks, competitive factors, and other risks. In addition, our Annual Report contains other information on these and other factors that could affect our financial results and cause actual results to differ materially from any forward-looking information we may provide. We undertake no obligation to update or revise any forward-looking statements to reflect subsequent events, new information or future circumstances.For more information, please contact:AUO Corporate Communication DivisionJessie Lee Tel: +886-3-5008800 ext 503206 Email: jessie.jc.lee@auo.com
Friday 28 April 2023
Avalue launching Intel Atom embedded industrial motherboards, EMX-EHLP, with Intel Celeron/Atom SoC BGA processor
Avalue Technology, a global industrial PC solution provider and an associate member of the Intel Internet of Things Solutions Alliance, is bringing the new Intel Atom Embedded Industrial motherboards, EMX-EHLP, with Intel Celeron/Atom SoC BGA Processor (Elkhart Lake Platform 4.5~12W). This motherboard brings with huge improvement on performance and bug step ahead with Intel UHD Graphics target entry-level application market. With improved performance, I/O capability, and security features, EMX-EHLP is the ideal motherboard for gaming, retail, digital signage, ATM machines, surveillance, and parking management systems, etc.Thin Mini ITX motherboard EMX-EHLP features flexible I/O supports 2 x USB 3.1 Gen.2 and 2 x USB3.1Gen 1 at I/O, 4 x USB 2.0, 4 x RS-232, 2 x RS-232/422/485 with DC power input 12~ 24V. It supports one DP and one HDMI display and LVDS co-lay with DP for all kinds of applications.This motherboard design with two M.2 slot: M.2 B-Key SATA/PCIe/USB supports WWAN+GNSS or SSD and E-Key support Wifi module, PCI-e x1 and USB2.0 signal. Also, EMX-EHLP offers four Intel 2.5 Gigabit Ethernet with TPM2.0.Avalue EMX-EHLP embedded industrial motherboard