When it comes to Field-Programmable Gate Arrays (FPGAs), the market often thinks of Xilinx under AMD, the PSG division under Intel, and Lattice Semiconductor as the major providers. However, in recent years, Chinese companies have started to emerge, gradually gaining ground in the FPGA field.Gowin Semiconductor is one of the few Chinese chip design firms capable of independently developing FPGAs. Since its establishment in 2014 nearly ten years ago, Gowin Semiconductor has grown to about 250 employees. Jason Zhu, the CEO of Gowin Semiconductor, said that the Company was founded in a period of rapid development in China's internet industry. Investors had less interest in the relatively obscure FPGA field. However, Gowin did not only aim to satisfy the Chinese market demand from the beginning; it also sought to meet the needs of other regional markets as part of its long-term strategy. Hence, the Company initially invested in FPGA products with TSMC's 55nm process. Although this process was not the most advanced at the time, TSMC had introduced various versions including low-power consumption and embedded flash memory in their 55nm process, enabling Gowin to launch different grades of product lines according to market demands.Despite Using TSMC's 55nm Process, Product Still Boasts Market Differentiation and CompetitivenessJason Zhu pointed out that Gowin tried to find a suitable product strategy for its positioning at the time. Even though the 55nm process was used, Gowin offered more than double the number of I/O counts compared with other competitors of the same class. Gowin's chip reliability was greatly improved coupled with the high stability of TSMC's process, which significantly outperforms other foundries in terms of process variation. The chip reliability enabled Gowin to easily gain AEC-Q100 certification and quickly enter the automotive market. Jason Zhu also noted that Gowin has been widely accepted by many customers in recent years due to the shortage caused by the pandemic. Customers became aware of Gowin while seeking for alternatives and were further attracted by shorter delivery times. Effective technical support from various dealers also played a crucial role. These factors have gradually led to market recognition of Gowin's technical capabilities. To date, Gowin has shipped over 3 million automotive products.Diversified Collaboration in the Automotive Sector, Open to Any Cooperation PossibilitiesSpeaking of developments in the automotive market, Jason Zhu revealed that China's electric car market has been thriving in recent years. Car manufacturers have a high degree of control over power transmission systems and often opt for independent development rather than relying on other suppliers. Under the premise, SAIC Motor of China once utilized Gowin's FPGA for gearbox development. In regard to IGBT-related system design, some Chinese car manufacturers have adopted Gowin's FPGA chips instead of the traditional designs using automotive MCUs (Micro Control Units) to reduce overall system costs.For vehicle cockpit system applications, Gowin collaborates with well-known processor companies such as MediaTek and UNISOC. Jason Zhu pointed out that traditional automotive processors have a relatively limited number of MIPI design channels. However, the current development of vehicle cockpit systems has moved towards multi-screen output. As processors from MediaTek and other SOC vendors struggle to effectively respond to multi-screen output, Gowin's FPGA can overcome this problem. Playing a similar bridging role in the development of ADAS and autonomous vehicles, how can signals from automotive sensors like cameras, radar, and LiDAR be processed by NVIDIA's GPU? In fact, most early automotive FPGA products did not include a MIPI interface; but Gowin's FPGA comes equipped with the MIPI interface, supporting at least six camera image inputs.Moreover, automotive screen manufacturers are beginning to introduce miniLED technology, featuring local dimming that can instantly react to different brightness areas on the screen. Based on this demand, large car screen manufacturers like BOE and LG have started to cooperate with Gowin. Jason Zhu candidly stated that Gowin plans to attend an exhibition in Japan in the upcoming November, and BOE is willing to lend Gowin the design samples developed cooperatively for the exhibition.The digital rearview mirror is another automotive system with great emphasis on instant reaction. Jason Zhu mentioned that the system design is complex, involving optical imaging technology for image capture from automotive cameras, to screen output in digital rear-view mirrors. Image correction on its own, which enables the driver to identify the objects instantly, already entails different professional fields and considerable technical difficulty. Not to mention the various weather changes that must be dealt with, such as rain and fog. Clear display on digital rearview mirrors is imperative in all these conditions. Thus, Gowin maintains a close cooperative relationship with relevant solution providers.Actively Expanding into the Global Automotive Market Beyond Satisfying China's Domestic DemandRegarding the future development of Gowin Semiconductor and the automotive electronics market, Jason Zhu clearly states that Gowin not only aims to meet the demand of the domestic market in China, but also has considerable ambitions for regions such as Europe, America, Japan, and Taiwan.In Taiwan, for example, Gowin collaborates with local distributors and has substantial cooperation with leading providers of power supply and green energy solutions. In Japan, there are ongoing collaboration plans with top-tier car manufacturers. In the European and American markets, Gowin is currently working with German TÜV Rheinland to further obtain ISO 26262 functional safety certification for its products, facilitating quick entry into the supply chains of international car manufacturers.Gowin also has a next-generation automotive FPGA, Arora V, set to launch soon. It's expected to adopt TSMC's 22nm automotive process, representing a significant upgrade from the previous 55nm technology. Naturally, this brings substantial improvements in terms of power consumption and performance. Jason Zhu candidly stated that the launch of Arora V aims to follow the successful formula of the previous generation while carving out a unique market position different from traditional FPGA giants, aiming to address many pain points in the development of secondary automotive systems. Moreover, Arora V has made significant advancements in SerDES (Serializer/Deserializer) technology, which may have the opportunity to disrupt the dominance of traditional IDM companies in high-speed signal transmission for automotive applications. In the field of electric vehicles, as the next-generation SiC power semiconductors gradually become mainstream in the market, Gowin does not rule out collaborating with leading international SiC component manufacturers in the fields of inverter and OBCs.In summary, although Gowin Semiconductor is a rare Chinese FPGA chip design company with a history of only about ten years and a market share that is still not as substantial compared to international giants, Gowin's ambition in automotive and diverse vertical applications is still evident. The advent of its new 22nm product is expected to gradually strengthen its position in the FPGA market and provide more visibility.Jason Zhu, CEO of Gowin Semiconductor, stated that the forthcoming next-generation automotive FPGA Arora V will likely use TSMC's 22nm automotive-grade process, hoping to follow the successful formula of the previous generation to address many pain points in the development of secondary vehicle systems.Gowin Semiconductor's latest 22nm FPGA product series, Arora V, supports high-performance DSP for AI computations, high-speed LVDS interfaces, and ample BSRAM memory resources. Arora V simultaneously integrates an independently developed DDR3 interface and 12.5Gbps SERDES which supports various protocols, along with diverse packaging choices. It is highly suitable for applications in various industries, such as netcom, servers, industrial, medical, automotive, and power systems needs, etc.

DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, announced the launch of its new MedTech Beyond video series.Sponsored by NXP Semiconductors and RECOM Power, the MedTech Beyond is a three-part video series that dives into how medical devices are evolving and allowing for faster and more accurate diagnosis and treatment. From wearables to immersive tech and AI-powered innovations, the series explores how medical technology is creating opportunities to live longer, more fulfilling lives."As healthcare needs and technology both rapidly advance, DigiKey is proud to support the needed technology advancements," said Josh Mickolio, supplier business development manager – wireless and IoT for DigiKey. "Medtech advancements are enhancing every aspect of healthcare and ultimately leading to longer, more fulfilling lives.""Our power supplies play a pivotal role in enabling cutting-edge medical devices to operate flawlessly, ensuring precision and reliability," said Chris Wolf, president, RECOM Power. "At RECOM, we take pride in contributing to the advancement of medical technology, and we remain dedicated to powering a healthier and more connected world.""An important change in the medtech landscape is the 'scale' of care, as we see an increased need to manage healthcare in the home," said Luca Difalco, senior vice president, global sales offerings for NXP Semiconductors. "Our technology enables the democratization of health monitoring and diagnostics while helping to ensure the security of the data and device. The ability to offer advanced quality, long product lifecycles and a wide portfolio of offerings positions NXP well to help advance the medtech industry."The first of three videos in the series, "Holistic Health," is now live on DigiKey's website, and investigates the evolution of tech-assisted personal wellness and patient care. Personal wellness tech is no longer limited to counting steps. A new generation of patient care and personalized medical devices are using the latest technology to provide a better patient experience and a more holistic look at daily health.The second video, "Engineering Better Health Outcomes," explores how innovation happens behind the scenes with industry leaders. Given the critical importance of patient safety and security, medical device engineers, designers and supply chains face more pressure than most.The third and final video in the first season of the series, "Curing Tomorrow," examines the big thinkers investigating the next medtech breakthrough. From AI-powered diagnostics to predictive analytics, investigate how today's innovations are helping diagnose and treat the diseases of tomorrow.To learn more about the video series and how DigiKey is supporting the rapidly evolving medtech sector, visit the DigiKey website.

Prosemi Pte Ltd Singapore, a leading provider of electronic testing services, is proud to announce that it has been approved for ISO/IEC 17025:2017 and AS6171 (Detection of Suspect/Counterfeit Parts) accreditation from the ANSI National Accreditation Board (ANAB), Certification No. AT-3240. This accreditation is the international standard for the competence of testing and calibration laboratories. It is a prestigious accreditation that demonstrates Prosemi's commitment to providing high-quality testing services."We are very proud to have been awarded ISO 17025 accreditation," said Mr. Sheng Chuan Lee, Quality Director of Prosemi Pte Ltd Singapore. "This accreditation demonstrates our commitment to providing our customers with the highest quality testing services. We are confident that our ISO 17025 accreditation will give our customers the peace of mind of knowing that their products are being tested by a competent and accredited laboratory."To achieve ISO 17025 accreditation, Prosemi underwent a rigorous assessment by ANAB. The assessment included an evaluation of Prosemi's technical competence, management system, and quality assurance procedures. ANAB found that Prosemi meets all the requirements of ISO/IEC 17025.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is holding its first-ever ST Taiwan Tech Day at the Taipei New Horizon on November 2. The event is designed to provide valued customers and partners with the most up-to-date information on ST products and solutions to facilitate innovation and achieve success.With the theme "Our Technology Starts with You," this extensive technology event, ST Taiwan Tech Day, will offer insightful speeches and showcase over 40 demonstrations centered around four mega trends: Smart Mobility, Power & Energy, IoT & Connectivity, and Sensing the World. Attendees can experience first-hand the latest innovations and learn how ST's technologies are contributing to a safer, greener, and more connected world. It will also be a great opportunity to help developers and innovators stay ahead of the curve in today's rapidly evolving market.Innovation highlightsSmart MobilityZonal Gateway: Zonal Gateway acts as a bridge between the automotive central computer and traditional signal-based ECUs. This technology is supported by ST's wide range of automotive-grade products and enables Service-Oriented Architecture (SOA) with Data Distribution Service (DDS) protocol and Firmware Over-The-Air (FOTA). The Zonal Gateway offers a solution for modernizing automotive systems, allowing for seamless communication between different components and enabling efficient and secure updates.3rd-Generation SiC Modules: The industry leader in Silicon Carbide (SiC), ST offers a wide range of solutions to help developers improve the power efficiency and reduce the size and weight of automotive inverters with its 3rd-generation SiC modules. The traction inverter is a critical component in electric vehicles as it converts energy from the battery to drive the motors in the drivetrain. These converters must handle high power and currents, provide fail-safe operation, and handle EMC challenges. Alongside the SiC modules, ST's range of solutions includes AEC-Q101 qualified IGBTs, silicon and silicon-carbide MOSFETs and diodes, AEC-Q100 qualified galvanically isolated IGBT and MOSFET gate drivers, and SPC5 32-bit automotive microcontrollers. These offerings enable scalable, cost-effective, and energy-efficient EV traction inverter solutions.Power & EnergyDigital Power: ST's digital power solution is a comprehensive set of reference designs that empower designers to create efficient, feature-rich power supplies for a wide range of applications. The demo highlights two powerful solutions: the 25kW DAB DC/DC converter with ST's ACEPACK module, a highly efficient and reliable power converter ideal for industrial and automotive applications, and the 30kW Gen3 SiC MOSFET three-phase interleaved LLC solution with an STM32G4 MCU for ultra-high voltage EV charger -- a cutting-edge power supply designed to provide ultra-fast charging for electric vehicles.With these solutions, designers can create custom power systems that are efficient, reliable, and tailored to their specific needs.Precision Position Control: ST is a leading technology provider for motor control and servo drives, offering power device technologies, computational processing, isolated devices, industrial safety, ecosystem for industrial automation, connectivity, and predictive maintenance. With ST's state-of-the-art motor-control technologies, the motor can precisely control movement to a specific position. The demo consists of two small BLDC motors that can hold two shapes that do not fit together when they are in phase. The precision motor-control algorithm enables the rotation and movement of the shapes towards each other at any time, offsetting the relative position of the two shapes by 90 degrees while rotating. This unique position allows coupling between the shapes, with a rotation speed that ensures the phase shift is not noticeable, demonstrating precision position control in a harmonic movement coordinated simultaneously with other shapes.IoT & ConnectivityEdge AI Washing Machine Solution: This solution utilizes artificial intelligence (AI) to achieve unparalleled levels of energy and water efficiency by accurately measuring the weight of clothes inside the machine. The AI model generated by ST's NanoEdge AI Studio significantly improves measurement accuracy compared to traditional algorithms by analyzing and learning the features of current signals. This technology can advance the washing-machine industry to a next level by optimizing energy and water consumption while providing more accurate measurements.Compact Production Line with IO-Link System: The IO-Link automated product line demonstrates ST's total solution application in a smart factory, utilizing IO-Link technology to manage digital input/output, sensors, and solenoid air valve drivers. The demos include digital IO boards, sensor boards, and actuator boards from ST's Automation Competence Center's reference demo boards. The IO-Link products simplify the installation, setup, maintenance, and repair of factory automation systems, enhancing system flexibility to produce different product models. The IO-Link diagnostic function enables smarter and more reliable factory operations.Sensing the World3D Sensing Solutions: ST showcases the advanced imaging capabilities of the 3D stereo-vision camera solutions for machine-vision applications. The eYs3D stereo camera reference design features ST's high-performance, near-infrared VD56G3 global-shutter image sensors, ensuring the highest quality depth sensing and point-cloud creation. Additionally, the VD55H1 low-noise, low-power, indirect Time-of-Flight (iToF) sensor die, manufactured using advanced backside-illuminated, stacked-wafer technology, enables the creation of a small form-factor 3D camera capable of producing high-definition depth maps with a typical ranging distance of up to 5 meters in full resolution and beyond 5 meters with patterned illumination. This demo highlights ST's commitment to providing cutting-edge technology for machine-vision applications.ISPU for personal electronics: ISPU (Intelligent Sensor Processing Unit) is a new processing category embedded in ST's LSM6DSO16IS MEMS module. It is an ultra-low-power, high-performance programmable core that can execute signal processing and AI algorithms in real-time. The ISPU offers C programming and an enhanced ecosystem with libraries and 3rd-party tools/IDE, making it a state-of-the-art feature for any personal electronics.In addition to the insightful speeches and exciting technology showcase, more than 20 in-depth technical presentations covering Smart Mobility, Power and Energy, and IoT and Connectivity will provide a close look at the cutting-edge technologies that are shaping our world.To learn more about the exciting demos and program, please visit the ST Taiwan Tech Day event page.

MEAN WELL, the leading global supplier of Standard Power Supply (SPS), announces it will be participating in the 2023 Hong Kong International Lighting Fair Autumn Edition and showcasing its latest XLN series and theXLC series Compact Size LED Drivers, of which the power current output can be adjusted through NFC configuration. The company will also display an upgraded version of the XLG series with tunable digital light adjustments and new DALI-2 features, the LCM-40TW series of DT8 LED power supply driver, and the DC Centralized Bus Lighting Solutions. Visitors of the Lighting Fair will experience firsthand the systemic perfection of MEAN WELL's DALI and KNX lighting solutions.New product alert: XLN series and the XLC series Compact Size LED DriversBefore it officially goes to the market in November 2023, MEAN WELL's latest XLN and XLC series of miniature interior LED driver power supply will be shown at the Hong Kong International Lighting Fair. The new products have plastic coverings designed for Class II/2 and dual insulation. They are suitable for both interior lighting and commercial lighting with outstanding characteristics, including a constant power output, tunable power adjustments through NFC on the MEAN WELL App, 3-in-1 digital light adjustments, DALI-2, and other light adjustments through KNX, Bluetooth, Matter, and so on.MEAN WELL XLN and XLC series miniature interior LED driver power supply, featuring Class II/2 and dual insulation design and suitable for both interior lighting and commercial lightingThe XLN series are all wire types, and the XLC series are terminals either with a side covering (which makes them wire types) or without a side covering. Rex Lin, the product manager of MEAN WELL's Product Strategy Center, said the new series is meant to satisfy the diverse needs of MEAN WELL's customers. Miniature lighting, for example, requires an independent power supply due to the lack of space for an internal power supply and the need to meet regulations and make repairs. The new series ensures user safety and product quality by complying with IEC 61347 and UL 8750 specifications for lighting.DALI-2 features for higher product compatibilityMEAN WELL highlights the new DALI-2 features of its tunable XLG power supply series, allowing its customers to integrate with smart lighting controls. DALI, which stands for Digital Addressable Lighting Interface, is an international protocol for digital lighting controls in compliance with IEC 62386. As the DiiA association continues to work on new specifications of DALI-2 applications, the protocol provides clear and thorough specifications.MEAN WELL XLG power supply series covers constant current or voltage lighting applications, providing IP67 water-proof, 3-in-1 light adjustments, DALI-2 digital light adjustments functionalities for customers to perform integration on their smart lighting control systems."Standardization has brought many benefits. As of today, all products aligned with the DALI-2 protocol are compatible and interchangeable. That has solved many incompatibility issues we used to see," Lin said.While complying with the latest safety requirements, the XLG-DA2 series provides distinctive pairing applications with constant current or voltage lighting. With iron coverings, they allow for systemic integrations of DALI light controls with different types of interior and exterior LED lightings and are pairable with constant current lightings, such as streetlamps and projection lights, and constant-voltage light strips at 12V, 24V, and 48V.Tunable color temperature for a user-centric experienceBesides DT6 LED light control, MEAN WELL is adding DT8 features to the LCM-40TW series, aiming to create a more human-centric user experience. In compliance with the DALI association's IEC 62386-209 (DT8) standards, the series provides an automatic tunable color temperature based on users' lifestyles. The new feature makes lighting a part of the users' lives, creates a high-end ambiance, and helps improve users' wellness and work efficiency.The LCM-40TW series has two output circuits for two sets of LED lights with different color temperatures. They can pair with multiple power currents falling within 500 to 1050 mA. In addition, the series can change the color temperature of the lighting through DALI ports. Users can change the color temperature with a push button without connecting the lighting to a DALI master cable.Seamless integration of the DC Centralized Bus Lighting SolutionsAt the 2023 Hong Kong International Lighting Fair Autumn Edition, visitors can experience MEAN WELL's smart DC Centralized Bus Lighting Solutions integrated with DALI or KNX lighting systems. Designed for interior lighting, the DC Centralized Bus Lighting Solutions reduces power waste and saves power costs for users. The installation costs of the overall lighting system are also significantly lower.Tony Hsieh, Section Manager of MEAN WELL's Technical Service Center, said his team has completed many successful use cases over the years. For example, a boutique watch store at the Taipei 101 shopping mall has adopted DALI digital lighting. As demand for green buildings and carbon-neutral operations increases, MEAN WELL's distributors have contacted many property developers to expand sales of the solution, according to Hsieh. He pointed out that the remote software configurations of MEAN WELL's products make the set-up of lights, groups, scenarios, and sequences much easier and faster.Follow MEAN WELL's Virtual Expo, LinkedIn account, and YouTube channel for the latest product information if you cannot visit the 2023 Hong Kong International Lighting Fair Autumn Edition.

SK hynix Inc. announced today that it has started commercialization of the LPDDR5T (Low Power Double Data Rate 5 Turbo)*, the world's fastest DRAM for mobile with 9.6Gbps speed.SK hynix (or "the company", www.skhynix.com) said that it has obtained the validation that the LPDDR5T is compatible with Qualcomm Technologies' new Snapdragon® 8 Gen 3 Mobile Platform, marking the industry's first case for such product to be verified by the U.S. company.*LPDDR: Low power DRAM for mobile devices, including smartphones and tablets, aimed at minimizing power consumption and that features low voltage operation. The latest specifications are for the 7th generation, succeeding the series that end with 1, 2, 3, 4, 4X, 5 and 5X. LPDDR5T is a newly developed version by SK hynix, and an upgraded product of the 7th generation (5X), prior to the development of the 8th generation LPDDR6.SK hynix has proceeded with the compatibility validation of the LPDDR5T, following the completion of the development in January, with support from Qualcomm Technologies. The completion of the process means that it is compatible with Snapdragon 8 Gen 3.With the validation process with Qualcomm Technologies, a leader in wireless telecommunication products and services, and other major mobile AP(Application Processor) providers successfully completed, SK hynix expects the range of the LPDDR5T adoption to grow rapidly.The company plans to provide 16GB-capacity product, a combination of multiple single LPDDR5T chips, of which data processing speed is 77GB per second, equivalent to processing 15 Full-HD movies within a second.The LPDDR5T product also holds an edge in power consumption, performing at the lowest voltage of the 1.01~1.12V standards stipulated by the Joint Electron Device Engineering Council, or JEDEC.SK hynix applied the HKMG (High-K Metal Gate)** process to bring a remarkable improvement in both speed and power efficiency. With the adoption of this technology, the company expects the LPDDR5T to gain a large share of the market before the next-generation LPDDR6 is introduced.**HKMG: A next-generation process that uses a material with a high dielectric constant (K) in the insulating film inside DRAM transistors to prevent leakage currents and to improve capacitance. It reduces power consumption, while increasing speed. SK hynix was the industry's first to integrate the process in mobile DRAM in November."Generative AI applications running on our new Snapdragon 8 Gen 3 enables exciting new use cases by executing LLMs and LVMs on device with minimal latency and at the lowest power," said Ziad Asghar, Senior Vice President of Product Management at Qualcomm Technologies, Inc. "Our collaboration with SK hynix pairs the fastest mobile memory with our latest Snapdragon mobile platform and delivers amazing on-device, ultra-personalized AI experiences such as AI virtual assistants for smartphone users.""We are thrilled that we have met our customers' needs for the ultra-high performance mobile DRAM with the provision of the LPDDR5T," said Sungsoo Ryu, head of DRAM Product Planning at SK hynix.Ryu said that smartphones are expected to grow their presence as the key devices where the AI technologies are fully applied onto in coming years. "I believe the smartphone functions, backed by excellent DRAM for mobile, should continue to improve. We will continue to work toward strengthening our collaboration with Qualcomm Technologies to advance the technology in this space."

IoT applications are expanding in scope now that the technology has matured. Industrial computers that form a key part of the IoT network architecture must also continue to evolve in response to workflows and operating environments in different scenarios. The Human-Machine Interface (HMI) that serves as the bridge between users and devices requires high stability, high compatibility, and high tolerance. These attributes are essential to fulfilling system introduction goals such as improved performance and reduced costs. Industry veteran ADLINK supplies total solutions for HMI. In response to market demands, rugged display panels from AUO Display Plus have now been adopted to supply customers with HMI products that combine quality and reliability.AI Drives Need Reliable Processing Power and Fast Data Transfers Over Extended PeriodsSmart technology is now sweeping through global industries bringing new advances to HMI functionality. Derrick Tu, Business Development Manager of the Edge Visualization BU at ADLINK, states, "Edge computing is a product of AI technology and IoT. Industrial-grade tablets and displays need the ability to provide reliable processing power and fast data transfers over extended periods of time. System integration requirements have also emerged from large machines in factories and self-service kiosks in retail stores, leading to a growing emphasis on compatibility and expandability on a functional level." Certain fields have ruggedization and tolerance requirements due to their environments. Manufacturing equipment requires a wide temperature tolerance, as well as dust and vibration resistance. Medical fields involve frequent disinfection and require grime resistance.ADLINK has developed a complete portfolio of industrial-grade displays targeted at the above requirements ranging from 7" to 43" in size. Two more 32" and 43" large form-factor displays and the 4:3 aspect ratio were also introduced this year to satisfy the requirements of different customer applications.ADLINK Offers Products-as-a-Service with Flexible Specifications for Different ApplicationsFor touch industrial tablet PCs, ADLINK released an open tablet PC that supports customer customization of processing power, touch control display type, and I/O interface. ADLINK's proprietary Function Module supports customer-defined device functions and I/O. The ADLINK tablet-to-tablet connector guarantees compatibility between smart tablets. ADLINK will soon unveil models featuring a stainless-steel housing with M12 waterproof connectors, a fully flat fanless design, and compliance with the IP69K standard for full water, dust, and corrosion resistance. The unit can be hosed down with hot water, making it suitable for industries that require a clean production environment.Diversification of HMI Requirements See ADLINK Partner with AUO Display Plus to Build the Optimal User ExperienceRugged display panels from AUO Display Plus are now used across the full range of ADLINK industrial-grade displays and tablets to further enhance their ruggedness and durability. Tu notes, "AUO Display Plus is an AUO subsidiary specializing in industrial touch control technologies and large display form-factors suitable for outdoor or semi-outdoor environments. It is therefore a perfect complement to ADLINK's expertise in industrial computer technology." The post-pandemic era has led to greater diversification of HMI requirements in the market. The complementary partnership between ADLINK and AUO Display Plus will provide customers with greater product diversity and better specifications.There are three main advantages to the adoption of AUO Display Plus panels in ADLINK HMI products: 1. Improved durability to support extended system operation; 2. Improved clarity through high-brightness products that clearly display information both indoors and outdoors; 3. Improved usability with support for multi-touch controls that provide an enhanced user experience. Tu emphasizes, "ADLINK and AUO Display Plus both have more than 20 years of experience in industrial control. Customer requirements and pain points are therefore anticipated and overcome in advance during the product design phase. The next step for ADLINK is to leverage AUO Display Plus products for the development of specialized high brightness, semi-outdoor, and narrow bezel models."On top of enhancing product performance through partnerships, another key competitive advantage of ADLINK's industrial display and tablet business is its precise and well-developed one-stop customization service. According to Tu, "Long-term collaboration between ADLINK and leading vendors such as Intel, Qualcomm, MediaTek, and NVIDIA ensures the most forward-looking product support. This, combined with ADLINK's extensive experience in industrial computers and global locations, ensures the delivery of swift, professional customization services. Resultant products will not only meet current requirements but can also be customized to craft edge visualization solutions that offer high stability, compatibility, and tolerance for customers."For more information, please contact the ADLINK's website.Derrick Tu, Business Development Manager of the Edge Visualization BU at ADLINK. Credit: Company

Looking at the overall condition of the Printed Circuit Board (PCB) market in 2023, efforts to reallocate and adjust the electronics supply chain are palpable amidst the decline in demand for consumer electronic products and the economic impact of high inflation. However, these endeavors seem powerless in reversing the domino effect created by the risks in a recessionary environment. Even though the economy has been relatively conservative, several trends reveal some optimistic news from an analytical standpoint. First, the industry is excited over the robust demand capacity for IC substrates, strongly reflecting the long-term need for advanced IC substrates brought about by Beyond fifth-generation (B5G), Artificial Intelligence (AI), High-Performance Computing (HPC), and ADAS automotive chips. These potentially high-growth segments can be seen as new blue oceans for Taiwan's PCB industry.Maurice Lee, the chairman of the Taiwan Printed Circuit Association (TPCA), stated in an exclusive interview before the TPCA Show 2023 that despite the estimated downward revision of the total production value of the domestic PCB industry chain (PCB, equipment, and raw materials) to TWD $1.09 trillion in 2023, a yearly decrease of 18.9%, he still sees positive aspects in several developing industries. Firstly, the market demand and the main direction of technological development remain the same as predicted at the beginning of the year. The downturn in operation rates has led to a conservative investment in capital expenditure (Capex), causing a slowdown. PCB manufacturers are trying to enter new markets such as AI, automotive, and satellite, and are actively setting up new locations to disperse risks, setting up cornerstones for future growth as part of their transformation strategies.Taiwanese PCB Manufacturers and Supply Chains Actively Expanding into Southeast AsiaIn a turbulent geopolitical environment, the global electronics technology industry faces a "China + 1" trend. Key component PCBs cannot remain aloof, triggering cross-strait PCB manufacturers to move and set up in new countries such as Thailand. More than ten Taiwanese PCB companies have already chosen to set up factories in Thailand, at least eight of which are indicative manufacturers ranked within the global top 20. This wave of expansion southward also includes locations in Vietnam and Malaysia, with upstream PCB materials and process equipment manufacturers joining in. The clustering of PCBs encourages equipment manufacturers to establish service points close to their customers. The pattern of Taiwan's PCB industry and supply chain moving into Southeast Asia is apparent.For Taiwanese businesses, this Southeast Asian expansion differs significantly from the westward strategy of 2001. The shift to Southeast Asia mostly stems from pressure from customers. Amid the tense atmosphere of global geopolitics and U.S.-China tech competition, decisions for transformation to disperse risks are urgently needed although PCB still suffers from incomplete inventory destocking and lack of new demand. Challenges created by this southward investment include local personnel training, rising wage costs, an incomplete supply chain, and management impact due to linguistic and cultural differences. These are all operational challenges directly faced by Taiwanese PCB manufacturers and the supply chain.Innovation in High-end IC Substrates and Manufacturing Techniques Generate Remarkable Growth Momentum of AI Servers and Automotive BoardsFurthermore, Maurice Lee observed several key growth areas with IC substrates being an important growth engine. BT substrates used by CSP or tiny BGA chips are expected to see a reduction in the supply-demand imbalance until 2024. As for ABF substrates currently receiving a lot of attention, present demand mainly relies on high-grade cloud servers and robust growth driven by booming AI servers. The supply-demand gap needs to wait until at least 2026 for alleviation. Notably, although servers contribute only 6.8% to the overall production value of Taiwan's PCB industry, this kind of product is what Taiwanese companies excel in, and the high-growth prospects brought about by the AI market are just around the corner.The size of these high-end ABF substrates has quickly grown from approximately 20mm x 20mm to an area size of 110 mm x 110 mm, containing up to 24 layers of multilayer boards. The key to success for Taiwanese IC substrate manufacturers lies in yield as manufacturing technology thresholds and product unit prices are both high. Maurice Lee boldly predicts that the production value of AI servers will surpass cloud servers. The demand for AI servers is apparent with growth exceeding 30% in 2023, and it can maintain an annual growth rate of over 20% for the next few years. The explosive growth of AI servers and related applications could generate great production value, surpassing the production value of cloud servers as early as 2025 or 2026.Outside the strong development of AI servers, the performance of the automotive PCB market is also impressive. With the gradual increase in demands such as vehicle electrification, Autonomous Driving Assistance Systems (ADAS), and vehicle networking, a new car will grow from its past usage of 500-600 chips to over 1000 chips. Flexible Printed Circuit Boards (FPCB), HDI boards, and substrates all equally stand a good chance of achieving higher growth. Overall, automotive PCB is trending towards miniaturization and high functionality with major growth in applications such as millimeter-wave radar for ADAS, automotive sensors, etc. All the applications require advanced HDI technology, as well as soft, bendable FPCBs that can replace some automotive wire harnesses. The small size and high-density characteristics will gradually expand the application of automotive boards, making automotive PCBs an area where Taiwanese manufacturers can release their full potential.Maurice Lee emphasized, "The reason why Taiwan's PCB industry can stand out in the fiercely competitive international market is that we have the strongest supply chain globally." He encourages the industry to participate in the 24th TPCA Show 2023 and the 18th IMPACT International Packaging and Circuit Board Symposium. These exhibitions have great knowledge value. Participants can explore IC substrates, high frequency, high-speed PCB material developments, and focus on 5G-related applications such as semiconductor packaging, substrates, zero carbon emissions, smart factories, etc. One can also attend the International Electronics Exhibition, the AIoT Exhibition, and the Optoelectronics Exhibition besides the TPCA Exhibition, which altogether provides a technological feast, allowing the guests to grasp the complete dynamic of the PCB industry. The official website for TPCA activities is as follows: https://tw.tpcashow.com/

AMICCOM released a new generation of low current sub1-GHz wireless SOC, named A9129M0. AMICCOM continues to integrate the existing RFICs with MCU and roll-out highly integrated SOC products. The new A9129M0 SOC, like their previous generation products, come from integrating MCU with A7129, which have excellent RF performance and extremely low receiving current. The A9129M0 supports FSK modulation. This chip integrates high performance ARM Cortex-M0, built-in 128Kbyte Flash Memory, 16 Kbytes SRAM, 22 GPIOs and various digital interfaces. 2-wire ICE can be developed with Keil C.The maximum TX Power of A9129M0 is +12dBm, the receiving sensitivity is -118dBm @2 Kbps FSK. The A9129M0 also integrates a DC-DC converter to provide efficient power applications. With input voltage 3.3V for DC-DC converter, A9129M0 RX mode current is 4.16mA, TX mode current is 16mA (+10dBm). It also supports programmable RF output power (-30dBm ~ +12dBm) and programmable data rate (2kbps ~ 2Mbps).The MCU core of A9129M0 is ARM Cortex-M0, which can provide fast computing, user can adjust the MCU speed according to the overall power consumption requirements. A9129M0 has a flexible power management system, the current consumption in deep sleep mode is 110nA and the current consumption in sleep mode with internal timer (32KHz) turned-on is 1.3uA. The A9129M0 has a built-in AES128 co-processor which provides data protection and security. All above features make A9129M0 suitable for various low-power IOT applications. A9129M0 is equipped with a variety of digital interfaces such as UART, I2C, SPI. It has 2 PWM outputs, two 32-bit timers and one 32-bit dual timer. These interfaces share pins with 22 GPIOs, which can be used according to user's application requirements. A9129M0 is also equipped with 12bit ADC, which provides up to 8 channels for external signal measurement.Overall, the A9129M0 is a wireless transceiver SOC with high performance and low power consumption. It has excellent RF performance with 12dBm output power amplifier, and supports a variety of digital interfaces and I/O. Especially it's suitable for applications that are powered by battery and require a long-life cycle. All functions are integrated in the QFN5x5 package.For AMR application, wireless M-Bus is a communication protocol designed for remote reading of gas, electricity, and water. As global urbanization and resource management become increasingly crucial, the technology to effectively read and manage these resources is of paramount importance. AMICCOM can provide the wireless M-Bus protocol reference codes which support T-mode, S-mode, and C-mode to accelerate customer's development work.Supply and packaging:A9129M0 package is 5 mm x 5 mm QFN-40 and is now available from AMICCOM and its authorized distributors. Welcome to request IC samples and evaluation modules, and start development work. Please contact AMICCOM Electronics for more detail.sales@amiccom.com.tw

MKS Instruments, Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, announced that its strategic brands ESI (Laser Systems) and Atotech (process chemicals, equipment, software, and services) will present their combined product offering of leading manufacturing solutions for printed circuit boards and package substrate manufacturing at the upcoming 24th Taiwan Circuit Board Industry International Exhibition (TPCA Show 2023), and the 18th International Microsystems, Packaging, Assembly and Circuit Technology Conference (IMPACT 2023), to be held from October 25th to 27th, 2023 at Taipei Nangang Exhibition Center.By combining leading capabilities in lasers, optics, motion, process chemistry, and equipment, MKS is best positioned to Optimize the Interconnect, a significant enabling point for next-generation advanced electronics that represent the next frontier for miniaturization and complexity. The Optimize the Interconnect philosophy highlights the company's unique position in supporting the development of next-generation advanced PCB and package substrate manufacturing solutions for its customers and partners. "We are committed to enabling new technologies and increasingly smaller feature sizes by combining MKS' ESI laser drilling technologies with MKS' Atotech chemistry and plating equipment," stated Harald Ahnert, VP and GM of Chemistry."Pioneering Innovation through Expertise and TechnologyThe company's combined expertise and know-how across lasers, materials processing, and equipment technology provides numerous opportunities to facilitate collaboration, innovation, and continual ground-breaking solutions for its customers. "We recently installed new systems and process technology in one of our global technology centers to drive the production of next-generation package substrates and provide customers and OEMs alike quicker development cycles for new products and materials enabling high-end SAP technology that require <5/5 µm lines and spaces," added Harald.Embracing New Challenges, Expanding Horizons in PCB DiversityAnother example of MKS' contributions to innovation is the company's progress in flex, advanced HDI or substrate-like PCBs. Here our customer offering ranges from a comprehensive combination of optimized laser drilling and process chemistries to PCB manufacturing equipment. Customers benefit from the company's unique one-stop-shop destination for pre-treatment, via formation, plating, and final finishing with quick turn-around times that don't require an interruption in production, which enables our customers to deliver better yields, productivity, and performance. "For substrate-like PCBs, we are working with the industry to enable next generation mSAP technology," said Harald Ahnert, VP and GM of Chemistry.MKS' Atotech & ESI Unveiling Innovation at Booth N-718Experts from both brands will be available and ready to discuss latest industry trends and challenges at TPCA Show booth N-718 on the 4th floor of the Nangang Exhibition Hall 1. The dedicated onsite team will introduce new product combinations, including printed circuit board production equipment (wet-to-wet process equipment, laser systems and auxiliary equipment), chemistry, software, and related services.On the chemistry side, for surface treatment our highlights include EcoFlash S300, a new differential etching solution suitable for advanced IC substrates and Novabond EX-S2, our new high-tech adhesion promoter for ultra-fine lines and high-speed applications. For metallization our highlights include Printoganth MV TP2, a highly capable electroless copper process specifically designed for SAP fine line applications, and our even more enhanced Printoganth MV TP3 process enabling super thin Cu deposits for fine lines down to 2/2 µm L/S which you want to ideally combine with Cupraganth MV our new and revolutionary copper-based activation system. For electrolytic copper plating, we are highlighting our new insoluble reverse pulse plating solution for inclusion-free IC substrate core through hole filling for high aspect ratio, Inpulse 2THF2, and our production proven InPro SAP3 process for BMV filling with best uniformity at high current densities. For conformal high hole density IC substrate core plating we are promoting Cuprapulse IN, our new solution for excellent uniformity for high hole density boards.For final finishing our highlights range from OSP solution OS-Tech SIT 2, a new generation corrosion-free gold process for ENIG, ENEPIG, and EPAG to new type of immersion tin processes for flex PCBs, as well as for thick tin plating of µ-LED, IC substrates, or solder depot plating.On the laser equipment side, promotions include the latest Capstone (UV Laser for Flex PCBs) and Geode (CO2 laser for HDI and package substrate applications) capabilities.In addition to participating in the exhibition, the team is honored to once again be given the opportunity to host an IMPACT industrial forum. This year the focus is on "AI-enabling innovation in the era of advanced packaging." The exclusively invited speakers, together with MKS' Atotech experts, will present four relevant topics/papers on this theme on the 4th floor in room R504b, from 1:30 to 3:30pm on October 25. The team will also present seven additional papers during the general IMPACT technical conference from October 26 to 27, see tables below.TPCA Show highlights 2023 briefly: EcoFlash S300: Differential etching solution suitable for ultra-fine lines on IC substrates.Novabond EX-S2: Adhesion promoter suitable for ultra-fine lines and high-speed applications.Capstone: High-performance/throughput breakthrough productivity for flex PCB UV drilling.Geode A: CO2 laser system for high precision and high-speed ABF build-up laminate processing.Cuprapulse IN: Insoluble reverse pulse plating for high throughput HDI and MLB PCBs.Cupraganth MV: New Cu based activator system enabling high yield IC substrates.Printoganth MV TP2: State of the art electroless copper process for fine line SAP applications.Printoganth MV TP3: Upcoming electroless copper process for super fine lines L/S like 2/2 µm.Printoganth P2: Most capable horizontal electroless Cu process for excellent throw into BMVs and nano-void free deposits suitable for advanced dielectric materials (5G, FPCB, etc.).G-Plate: New equipment technology for PTH processes of next generation IC substrates enabling highest yields and cutting-edge fine line capability targeting L/S <5/5 µm.Aurotech G-Bond 3: New versatile gold bath for nickel/gold, nickel/palladium/gold and palladium/gold plating with non-toxic stabilizer replenishment to prevent the handling of KCN with low gold content and long lifetime.Stannatech Flex: tailored immersion tin process for battery flexible board with mitigated substrate and coverlay attack.PD-Core: Versatile Palladium plating solution for plating on copper and nickel with low Pd-content and long life time for reduced process cost.Stanna-CAT: Autocatalytic process for thick tin plating of µ-LED, ICS, or solder depot plating.Silvertech C: New silver-plating process that co-deposits 1-2% w/w carbon and produces a highly electrically conductive surface.Protectostan LF-E: New sustainable post-treatment to protect the plated tin and tin alloy surfaces of connectors and integrated circuits (ICs) from discoloration under high temperature / reflow and tarnishing under high heat high humidity conditions.vPlate: Vertical continuous plating equipment for advanced HDI and IC substrate achieving uniformities of below 7%.Optimize the InterconnectIMPACT MKS' Atotech Industrial Forum speakers, location and timeIMPACT MKS' Atotech and ESI Technical Forum speakers, locations and times