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Tuesday 23 January 2024
Chenbro announces next-gen high-performance server chassis with latest Intel and AMD platforms
With the global development of AI technology, there is a significant increase in demand for high-performance servers in both cloud computing and data center applications. Chenbro has proudly introduced next-generation server chassis solutions tailored for the latest Intel and AMD platforms to meet market demand...
Monday 22 January 2024
Cincoze slim embedded computers - demonstrating power of one computer, two purposes
Rugged embedded computing brand – Cincoze continues to deepen its embedded computer range. Two newly launched industrial computers (P2202 Series and P1201), released in 2023, have been widely favored by customers for their thin and light design, especially in mobile devices (AGV/AMR), control cabinets, and other space-constrained applications...
Friday 19 January 2024
What's difference between Matter 1.0, Matter 1.1, and Matter 1.2?
In 2019, Amazon, Apple, Google, and Zigbee Alliance members came together to form Project Connected Home over Internet Protocol (CHIP), a working group building a new standard that enables IP-based communication across smart home devices, mobile apps, and cloud services, and ultimately unites the smart home.
Friday 19 January 2024
iCatch Technology introduces MIPI A-PHY automotive SerDes solution based on Valens Semiconductor's connectivity technology at Automotive World Tokyo 2024
iCatch Technology, a leading AI image processing IC design company, announced today a collaboration with Valens Semiconductor, a world leader in high-performance connectivity solutions, on an innovative AI-enhanced multi-channel surround view monitoring system based on Valens Semiconductor's MIPI A-PHY high-speed and long-range sensor connectivity technology...
Friday 19 January 2024
BIWIN launches CXL 2.0 DRAM to empower cutting-edge computing
CXL, an advanced interconnect technology, facilitates high-bandwidth, low-latency connections between host processors and devices like accelerators and memory buffers. It addresses the "memory wall" challenge, ensuring consistency between CPU/GPU memory and connected device memory, enhancing heterogeneous computing performance...
Thursday 18 January 2024
ECSIPC showcasing smart retail and industrial computing solutions at ISE Barcelona 2024
ECS Industrial Computer Co., Ltd., (ECSIPC) is pleased to announce its participation in ISE 2024 where it will showcase its latest smart retail solutions, IPC motherboards, and two new LIVA mini-PCs that are ready for applications including digital signage, smart vending machines, kiosks, factory automation equipment and AOI.
Thursday 11 January 2024
Crypto Quantique joint venture with iMQ Technology to enable quantum secure chip-to-cloud connection
In a strategic move aimed at expanding its presence in the Taiwan market, Crypto Quantique, a prominent quantum-safe cybersecurity solutions provider, has unveiled a strategic partnership with iMQ Technology, a leading innovator in MCUs (Microcontrollers) and security chips.
Wednesday 10 January 2024
GUC taped out UCIe 32G IP using TSMC 3nm and CoWoS technology
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 32Gbps per lane, the highest UCIe speed, for AI/HPC/xPU/Networking applications. UCIe 32G chiplet interface provides an industry-leading bandwidth density 10Tbps per 1mm of die edge (5Tbps/mm full duplex)...
Tuesday 9 January 2024
Lelon Electronics enhances operational flexibility to prioritize automotive and high-end segments
Lelon Electronics started as an OEM contract manufacturer of aluminum capacitors 47 years ago. It has since evolved into one of the world's top ten aluminum capacitor makers. Lelon recently embarked on constructing state-of-the-art production plants in Suzhou, China, and Thailand to satisfy the demand for automotive, high-performance computing, and other applications...
Tuesday 9 January 2024
SK Hynix CEO Kwak says memory playing pivotal role in AI era, ready to provide customized solution to each customer
SK Hynix held a press conference titled "Memory, the Power of AI" on the sidelines of CES 2024 in Las Vegas where its CEO Kwak Noh-Jung laid out the company's vision in the AI era.