Elpida Memory announced that it had developed a 1Gb DDR3 SDRAM that delivers a speed up to 2.5Gbps. The new copper interconnect-based DDR3 SDRAM is targeted for servers and high-end PCs. Sample shipments are scheduled to begin by the end of August.The new DDR3 SDRAM uses a copper interconnect process that is superior to aluminum in terms of transmission characteristics, Elpida highlighted. By taking maximum advantage of these characteristics during the design phase new circuitry can be developed that enables even faster products that continue to need little power.The new DDR3 SDRAM supports data rate ranging from 667Mbps to 2.5Gbps. It can also meet DDR3 standard 1.5V as well as ultra-low 1.35V and 1.2V voltage requirements. In addition, it achieves data rates of 2.5Gbps at 1.5V and 1.8Gbps at 1.2V, considerably faster than the current industry standard of 1.6Gbps at 1.5V.As a result, the new product's ability to operate at an ultra low voltage of 1.2V can contribute to lower power consumption, which is especially important in the case of large-memory capacity extended-use server applications. Also, for high-end PCs geared to high-speed operations an operational speed of 2.5Gbps enables a significant system performance upgrade.Photo: Company, August 2008.

Biostar Microtech International has launched the T-Series TA790GX A2+, an integrated motherboard based on AMD's 790GX chipset with an integrated ATI Radeon HD 3300 GPU. The motherboard supports AMD Phenom-series multi-core processors and dual-channel DDR2 1066 memory, and provides optimized overclocking ability, according to the company.The T-Series TA790GX A2+ offers dynamic power management which can be switched between performance and power savings when using everyday applications. Biostar TA790GX A2+ motherboard specifications Item Detail CPU Support Supports AMD Phenom series/Athlon 64 X2, 64, FX and Sempron processors FSB 1066MHz Chipset AMD 790GX+SB750 Socket AM2+ Memory DDR2 667/800/1066 Sideport Memory DDR2 64MB PCIe x16 Gen. 2 2 PCIe x1 Gen. 2 2 SATA 3Gb/s 6 e-SATA 3Gb/s 6 GbE 1 USB 2.0 10 Integrated video ATI Radeon HD 3300 Audio 7.1 Channel HD Audio DVI/HDMI 1/1 Source: Company, compiled by Digitimes, August 2008Biostar TA790GX A2+ motherboardPhoto: Company

Toshiba announced the launch of 32GB embedded NAND flash memory modules that the company claims are the largest density yet announced, with the modules also having full compliance with the e-MMC and eSD standards. Samples will be available in September 2008, and mass production will start in the fourth quarter. The new 32GB embedded devices combine eight 32Gbit NAND chips fabricated with Toshiba's 43nm process technology and also integrate a dedicated controller. Full compliance with JEDEC/MMCA version 4.3 and SDA version 2.0, high speed memory standards for memory cards as defined by the MultiMediaCard Association (MMCA) and SD Card Association (SDA), respectively, supports standard interfacing and simplified embedding in products, reducing development burdens on product manufacturers. Toshiba offers a line-up of single-package embedded NAND Flash memories which include a controller to manage basic control functions for NAND applications: LBA-NAND memory, which has a NAND interface; eSD large capacity chips with SD interface; and e-MMC with an HS-MMC interface. This comprehensive line-up, available in densities ranging from 1GB to 32GB, supports application in a very wide range of products. Toshiba: e-MMC and e-SD specifications roundup Item e-MMC e-SD Interface JEDEC/MMCA Ver 4.3 standard HS-MMC interface SDA Ver 2.0 standard SD interface Power Supply Voltage 2.7 to 3.6V(memory core)/ 1.7V to 1.95V (interface) 2.7 to 3.6V Bus width x1 / x4 / x8 x1 / x4 Writing speed Target 10 MB/s (Sequential mode) Target 18 MB/s (Sequential/Interleave Mode) SDA standard Class 4 Reading speed Target 20 MB/s (Sequential mode) SDA standard Class 4 Temperature -25 degrees - +85 degees celsius -25degrees - +85 degees celsius Package 153-ball FBGA (+16 support Ball�^ 153-ball FBGA �]+16 support Ball�^ Source: Company Toshiba introduces new embedded NAND flash in high densitiesPhoto: Company

Elpida Memory announced today that it is ready to launch a 16GB Fully Buffered DIMM (FB-DIMM) that is composed by 2Gb of DDR2 components. Sample shipments of the new B-DIMM will begin later this month. Mass production is expected to get underway in the fourth quarter of 2008.In addition to achieving greater memory density and multiple-rank function to significantly upgrade system performance, Elpida said it has applied 2Gb DR2 low-power DRAMs and Integrated Device Technology (IDT)'s low-power advanced memory buffer (AMB) device to achieve a level of power consumption comparable to existing 8GB products and to contribute to lower system power requirements."The inclusion of the IDT low power AMB device helps Elpida achieve twice the capacity without impacting power consumption, which is critically important for today's power-hungry computing platforms," said Sean Fan, vice president and general manager of memory interface division at IDT.Elpida intends to complement its presence in existing markets by using its new large-capacity FB-DIMM as a vehicle to enter new markets, such as FB-DIMM for ultra high-end servers and work stations, the company stated.Elpida prepares to volume produce 16GB FB-DIMM in the fourth quarter of 2008Photo: Company

Micron Technology has announced the introduction of its next-generation RealSSD solid-state drives (SSDs) for enterprise computing (P200) and notebook applications (C200).Both SSDs are sampling now with mass production expected in the fourth quarter of 2008. Additionally, Micron's Lexar Media subsidiary plans to bring this latest RealSSD architecture to consumers in the fourth quarter of 2008.P200 drives are available from 16GB to 128GB capacities in a standard 2.5-inch form factor. Using single-level cell (SLC) NAND technology, the P200 provides 3Gb/s SATA-based sequential read and write speeds up to a maximum of 250MB/s.In addition to the performance leap over conventional HDDs, Micron highlighted the power and reliability advantages of P200. The drive operates at 2.5W in active mode and under at 0.3W when idle. It also provides improved wear-leveling capabilities across its high-performance SLC write cycles, offering a mean time between failure (MTBF) rate of approximately two million hours compared to 300,000 to 500,000 MTBF of an HDD.Designed using Micron's multi-level cell (MLC) NAND process technology, C200 drives will be available in 2.5- and 1.8-inch form factors. The 2.5-inch C200 will be offered up to 256GB and 1.8-inch versions range from 32GB to 128GB. Using a 3Gb/s SATA interface, the C200 products provide a read speed of up to 250MB/s and a write speed of up to 100MB/s.The new RealSSD lineup from MicronPhoto: Company

Toshiba has unveiled Toshiba iSense, a 2.5-inch external HDD series with storage capacities of 160GB, 250GB and 320GB, which will launch in the Taiwan market this month, according to Toshiba Digital Media Network Taiwan.Toshiba iSense features shock sensor and ramp loading technologies, dimensions of 81×16.6×127mm (W×H×D) and a weight of 171g, Toshiba Taiwan indicated. Toshiba plans to offer a 400GB version in the future, Toshiba Taiwan noted.Toshiba's iSense 2.5-inch external HDDsPhoto: Jimmy Hsu, Digitimes, July 2008

With Nvidia announcing the launch of its latest GeForce 9800 GTX+, 9800 GT and 9500 GT GPUs, graphics card makers including Micro-Star International (MSI), Asustek Computer, Gigabyte Technology, Foxconn, Biostar and Leadtek Research, have all launched related products. Nvidia GeForce 9500GT and 9800GT specifications GPU GeForce 9500 GT GeForce 9800 GT Processor Cores 32 112 Graphics Clock (MHz) 550 600 Processor Clock (MHz) 1400 1500 Texture Fill Rate (billion/sec) 8.8 33.6 Memory Clock (MHz) 800 (GDDR3) and 500 (DDR2) 900 Standard Memory Config 256/512MB (GDDR3) and 512MB (DDR2) 512MB Memory Interface Width 128-bit (GDDR3 and DDR2) 256-bit GDDR3 Memory Bandwidth (GB/sec) 25.6 (GDDR3) and 16.0 (DDR2) 57.6 NVIDIA SLI-ready 2-way 2-way NVIDIA PureVideo Technology PVHD PVHD NVIDIA PhysX-ready Yes Yes NVIDIA CUDA Technology Yes Yes HybridPower Technology No Yes GeForce Boost No No Bus Support PCIe 2.0 x16 PCIe 2.0 x16 Maximum Digital Resolution 2560×1600 2560×1600 Maximum VGA Resolution 2048×1536 2048×1536 Standard Display Connectors Two Dual Link DVI (GDDR3) and Single Dual Link DVI (DDR2) Two Dual Link DVI, One HDTV output Multi Monitor Yes Yes HDCP Yes Yes HDMI Via adapter Via Adapter Maximum GPU Temperature (in C) 105 105 Maximum Graphics Card Power 50W 105W Minimum System Power Requirement 350W 400W Supplementary Power Connectors None One 6-pin Source: Nvidia, compiled by Digitimes, July 2008 MSI N9800GT series graphics cardPhoto: Company MSI N9500GT series graphics cardPhoto: Company Asustek EN9500GT TOP/DI/512M graphics cardPhoto: Company Gigabyte GeForce 9500 GT series graphics cardPhoto: Company Gigabyte GeForce 9800 GT series graphics cardPhoto: Company Foxconn GeForce 9500 GT series graphics cardPhoto: Company Foxconn GeForce 9800 GT series graphic cardPhoto: Company Biostar Sigma Gate V9503GT21 and V9502GT51 graphics cardsPhoto: Company Leadtek WinFast PX9500 GT series graphics cardPhoto: Company

In addition to Asustek Computer's Eee Box and Micro-Star International's (MSI's) Wind PC, Synnex is also ready to ship its Lemel Q to heat up the nettop market in August, according to channel sources.Asustek's Eee Box will launch on July 30 in Taiwan.Synnex's upcoming 3-liter Lemel Q PC Smart deluxe nettop is based on the Intel Atom 230 processor and priced around NT$13,900 (US$455.7). The nettop will also be offered bundled with a 19-inch LCD monitor for NT$18,888.Although larger than the Eee Box, the Q PC Smart includes a built-in DVD burner enabling a more flexible multimedia experience. MSI's Wind PC also includes support for an optical drive but is a much larger 5-liter design. Lemel Q PC Smart deluxe nettop specifications Item Detail CPU Intel Atom 230/1.6G/512K L2/533MHz processor OS Windows Vista Home Premium Memory 2GB DDR2 667MHz (1xDIMM, Max 2GB) ODD DVD-Super Multi burner HDD 160GB VGA Intel GMA950 with shared memory up to 256MB L2 Cache 512KB Chipsets Intel 945GC PSU 60W Size 240(length) × 185(width) × 70(height)mm, around 3.1L Source: Company, compiled by Digitimes, July 2008Lemel Q PC Smart deluxe nettopPhoto: CompanyMSI Wind PC nettopPhoto: Joseph Tsai, Digitimes, June 2008Asustek Eee Box nettopPhoto: Company

Asustek Computer has released the M3A79-T Deluxe motherboard equipped with the AMD 790FX/SB750 chipset and support 140W CPUs.The M3A79-T Deluxe supports HyperTransport 3.0, four PCI Express 2.0 x16 slots, ATI Quad CrossFireX technology and the AMD OverDrive. The motherboard also equipped with Asustek's Precision Tweaker 2 to offer overclocking potential and Express Gate. Asustek M3A79-T Deluxe motherboard specifications Item Detail CPU AMD AM2+ / AM2 CPU Support Chipset AMD 790FX + SB750 Memory DDR2 1066* / 800 / 667 / 533 * DDR2 1066 is supported by AM2+ CPUs only System Bus Up to 5200MT/s HT3 interface Expansion Slots Four PCI Express 2.0 x16 Two PCI Storage Six SATA 3Gb/s ports with RAID 0, 1, 5, and 10 support One Ultra DMA 133 / 100 / 66 One eSATA 3Gb/s port (SATA On-the-Go) LAN Gb LAN Audio 8-channel HD Form factor ATX Source: Company, compiled by Digitimes, July 2008Asustek M3A79-T Deluxe motherboard Photo: Company

Fujitsu PC Asia Pacific has introduced its latest enhanced LifeBook tablet-convertible PCs, the LifeBook T5010 and LifeBook T1010. Both notebooks include a 13.3-inch WXGA 1280×800 widescreen on an extended glass cover pivoting on a bi-directional hinge.Designed for extreme usability, the LifeBook T5010 and LifeBook T1010 feature a Status LED that allows the system status to be seen even if the screen is closed, a scroll sensor adjacent to the screen to facilitate control and a slide power switch to reduce inconvenience due to blunders while rotating the screen. There is also a two-way speaker that ensures uninterrupted music and sound even if the screen is closed, highlighted the company.The LifeBook T5010 and T1010 both adopt the Intel Centrino 2 platform using Core 2 Duo processors (Penryn) and are Windows Vista compatible. The notebooks also feature DDR3 memory (1066MHz).The LifeBook T5010 also features Active Digitiser to provide precision and accuracy for writing, while the notebook also has a swappable modular bay that makes the machine lighter with the use of the weight saver and extends machine usage time with the aid of a modular battery.The LifeBook T1010 is fitted with a Passive Digitiser that supports stylus writing and pointing.Fujitsu LifeBook T5010 tablet-convertible PCPhoto: CompanyFujitsu LifeBook T1010 tablet-convertible PCPhoto: Company