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Tuesday 24 September 2024
GUC announces adoption of HBM3E IP by CSP data center
Global Unichip Corp. (GUC), the Advanced ASIC Leader, is pleased to announce that its 3nm HBM3E Controller and PHY IP have been adopted by a leading Cloud Service Provider (CSP) and several High-Performance Computing (HPC) solution providers. This cutting-edge ASIC is expected to tape out this year and will feature the latest 9.2Gbps HBM3E memory technology.
Monday 23 September 2024
Wolfspeed unveils cutting-edge silicon carbide module solution to boost clean energy capacity
Wolfspeed, Inc. (NYSE: WOLF), the global leader in silicon carbide technology, today unveiled a silicon carbide module designed to transform the renewable energy, energy storage, and high-capacity fast-charging sectors through improved efficiency, durability, reliability, and scalability...
Monday 23 September 2024
Small and mighty: how Asus NUC enables Aira's AI-tracking surveillance solutions
AI is transforming the way we live and work, and for companies like Aira, the real challenge is to turn AI applications into practical solutions that can be implemented at scale...
Monday 23 September 2024
SK Hynix applies CXL optimization solution to Linux
SK Hynix Inc. announced today that the key features of its Heterogeneous Memory Software Development Kit (HMSDK)1 are now available on Linux2, the world's largest open-source operating system.
Thursday 19 September 2024
MEAN WELL promotes green energy innovation focusing on 4 major energy fields and providing comprehensive applications
With the rapid changes in global climate, environmental issues have garnered significant attention. Additionally, the demand for green energy solutions has increased across various industries. However, the market still faces numerous challenges, ranging from inefficient energy conversion to the complex integration of systems and the lack of comprehensive solutions.
Wednesday 18 September 2024
LitePoint embraces new opportunities for growth with innovative wireless testing solutions
LitePoint, a leading provider of wireless testing solutions, hosted "Future First, Smart Testing" innovative testing technology seminars in Taipei and Hsinchu on July 23rd and August 8th, 2024...
Friday 13 September 2024
Henkel Adhesives helps customers unlock growth for next-generation advanced packaging
SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to connect Taiwan and global semiconductor ecosystems. The high demand and getting larger-sized AI chips require advanced packaging technologies to improve performance and time to market while reducing chip manufacturing costs and power consumption...
Thursday 12 September 2024
Importance of cloud threat modeling for business security
While the cloud offers a lot of benefits for businesses, it also presents new security challenges. As cyber threats become more sophisticated and frequent, businesses must be proactive in protecting their digital assets.
Thursday 12 September 2024
Three-in-one charger developed by ASUS IoT helps TIDC realize vision for smart parking
Urbanization brings with it massive demand for parking spaces. The construction of smart parking systems then becomes an essential strategy for solving traffic problems and enhancing habitability. Taiwan International Development CO...
Thursday 12 September 2024
EDOM Technology joins Silicon Labs in Electronica India 2024 to promote innovative wireless connectivity technologies
Asia's best solutions partner, EDOM Technology (TWSE: 3048), is partnering with Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, to showcase a series of innovative wireless connection technologies and solutions at electronica India 2024, including Bluetooth, Matter, Wi-Fi, and Wi-SUN...