The impact of mobile devices such as smartphones and tablets has not only changed consumers' habits, but also exposed development engineers to serious challenges from diversified hardware platforms and shortened development time. In particular, the launch of Microsoft Windows 8 in late October 2012 will mark an extension beyond x86 platforms to include ARM architecture. To meet the challenges of working under such a complicated development environment, firmware engineers need a set of BIOS tools that can support multiple hardware platforms without disrupting the continuity of the BIOS development experience.US-based American Megatrends Inc. (AMI), a founding member of the Unified EFI (UEFI) Forum and a leading player in the global BIOS industry, has long been aware of these challenging market conditions. With this in mind, AMI hosted the "Touch the Future with Aptio V: The Innovative UEFI BIOS" technology forum at the Howard Civil Service International House in Taipei on October 5, sharing information about recent conditions and trends in the market, as well as providing an in-depth review of AMI's newly launched Aptio V UEFI BIOS Firmware. The event also featured a content-rich exhibition area to let participants experience the latest and most powerful development tools from AMI on the latest Windows 8-ready hardware.AMI maintains a large share of the global BIOS market and a long history of innovation since its establishment in 1985, with over 1,100 employees worldwide and branch offices in many countries. AMI entered the Taiwan market in 1986, in recognition of Taiwan's strengths in the IT industry. In addition to its established presence in the BIOS industry, AMI has also made notable achievements in such diverse market sectors as network storage solutions, remote platform management technologies, solutions for mobile devices and system design services. A perfect example of the diversity of AMI's success is the MegaRAID Host Bus Controller (HBA), which AMI turned into the market leader in its class for several consecutive years before selling the product division to LSI Corporation in 2001.AMI President and CEO Subramonian Shankar noted that "AMI has been closely monitoring market changes with the aim of providing complete solutions that the IT industry needs most. The Windows 8-supported UEFI 2.3.1 specifications are a good example of our approach. AMI is not only a founding member of the UEFI Forum, but also ahead of the competition by releasing the Aptio development platform with support these specifications, in order to give our partners an early start on preparations for the enormous business opportunities that are expected to come with the launch of Windows 8."The company's Aptio UEFI Firmware is perfect for cross-platform development, suitable for diverse environments from mobile devices to personal computers and servers. The recently launched, next-generation Aptio V from AMI is able to further reduce developers' learning time thanks to its ease of use, and can effectively shorten new products' time-to-market by incorporating previously developed program modules.Although the UEFI 2.3.1 specification is known for its focus on fast boot time, enhanced security functions and many other excellent features, in reality, user requirements from different market sectors may be completely distinct. For example, embedded devices may require accelerated boot times, while server equipment may require assistance from remote access service mechanisms to ensure security and system availability. In response, AMI has been extremely proactive in enhancing the functionality of its BIOS solutions to meet needs across the market spectrum. Its FastBoot capability is targeted at embedded devices to shorten system boot time to a mere 0.6 seconds, while AMI is currently engaged in the development of Aptio V for the 64-bit ARM platform to help bring a solution based on the ARM platform to the server market."AMI has also recently introduced a unique product called DuOS into the market which allows users to run both Windows and Android operating systems on x86-based hardware," noted Mr. Shankar. "We have observed that some consumers wish to run two operating systems on their tablets and created DuOS to enable Android to run under the Windows 7/8 environment without rebooting." Such innovative solutions not only satisfy the ever-evolving demands of the consumer market, but also allow AMI's partners to introduce unique and eye-catching products to enhance their competitiveness.Continuity of Development Experience Shortens Development TimeSince the birth of the personal computer, BIOS has always handled the tasks of initialization, hardware inspection and booting the operating system. As the IT industry continues to evolve at a rapid pace, the speed at which new hardware architectures enter the market is so fast that manufacturers and system designers are greatly challenged to quickly learn to use the development tools for these new platforms, as well as deal with an overall lack of qualified firmware engineers. In the face of such harsh conditions, a cross-platform BIOS development tool is the only real solution to the shortage of tool familiarization time and capable development personnel.AMI's Aptio UEFI development environment meets these challenges head-on, as it is easy to use and can significantly shorten the learning period for newly recruited engineers. In addition, its cross-platform support leverages senior engineers' valuable development experience, accelerating product launches for the consumer market.The newly-launched, latest-generation Aptio V inherits the strengths of Aptio 4 and adds several key innovations to improve development workflow, such as integration of the industry's latest EDK II implementation and an enhanced Visual eBIOS (VeB) development interface. Aptio V also enables continuity of previous development experience from non-EDK II projects to speed up the product development process by firmware engineers. Furthermore, the modular architecture and integrated programming library in Aptio V help reduce human errors and costs incurred from future product modifications.AMI's Director of Strategic Marketing, PaiLin Huang explained that "Aptio V represents AMI's latest efforts to satisfy the wide range of challenges that our partners routinely face. Thanks to its cross-platform support, Aptio V can reduce the number of lines in program codes, facilitate better use of personnel resources and shorten development time. It can also contribute to a sizeable reduction in the overall development cost." To further enhance support for its valued partners, AMI is also strengthening its services and providing all of the necessary tools and technology required by OEM and ODM partners in areas such as manufacturing, maintenance and customer support, with the goal of minimizing the challenges that these partners may face during development and production.Because Aptio V is built with the latest EFI Development Kit (EDK II) at its core, AMI's partners are assured of full support for the complete UEFI specifications with Aptio V. Its design is very similar to AMI's previous-generation UEFI Firmware, Aptio 4.6x; as such, key learning acquired with Aptio 4 is easily carried over to the new firmware platform. Another noteworthy point is that Aptio V retains many of the acclaimed features of Aptio 4, such as its diagnostic and debug capabilities, recovery, enhanced SMM service, PCI Bus support and multiple-language support. Retaining these features allows developers to preserve their design methods and extend existing projects to new platforms, such as those based on ARM hardware.In light of the rapid pace of changes in the consumer market, AMI has also added several new features to Aptio V to enhance the efficiency of its application. For example, Aptio V provides a number of import wizard functions that allow firmware engineers to quickly transfer their previous Aptio 4 modules, such as the EDK Package, to the new platform - which means that valuable code can still be used in future projects.Cross-platform Support Helps Clients Seize Windows 8 Business OpportunitiesAMI Vice President of Engineering Department Stefano Righi noted, "Aptio V is definitely the best choice for developing Windows 8-based products. In addition to multiple fast-boot options to choose from, it also supports several security specifications, such as TPM, Secure Boot and Secure Firmware Update, to allow users to launch products that suit market demand in a short period of time." Additionally, Aptio V offers a menu-based graphical user interface for adding or removing features, something that helps junior engineers maintain existing development projects with ease.For example, the Visual eBIOS (VeB) development environment supports multiple operating systems, including Windows and Linux, with cross-platform support for x86, x64 and ARM systems. Not only can VeB reduce the need for coding with complex commands, consistency between Aptio versions and hardware platforms means there is no need to re-learn how to use the tool. Instead, the VeB development environment allows firmware engineers managing different product lines to share their development experience, leading to improved product quality and stability.AMI understands clearly that cross-platform and cross-OS support are of utmost importance to firmware engineers. Mobile devices, which saw shipments of over 100 million units in 2011, are a great example of the need for such broad support. The majority of mobile devices shipped were based on the ARM architecture, in large part thanks its emphasis on power efficiency. But because development for ARM-based devices is significantly different from that for x86-based platforms, firmware engineers were often forced to re-learn the development tools as they moved between platforms. Aptio V solves this problem by enabling engineers to quickly transplant their x86 development experience and related applications onto the ARM architecture without any compatibility issues.Tony Lo, AMI Senior Manager of R&D explained that "Developers can easily transform existing program modules to ARM or Android environments through Aptio V's import tool. For firmware engineers that have been working with Aptio 4, it is truly a convenient and useful solution." In cases where engineers may not be overly familiar with the transform function, AMI also provides in-depth technical support to help enterprises quickly adopt the Aptio V toolset and will even provide assistance with transforming existing code.In short, to respond quickly to the business opportunities that will soon be triggered by Windows 8 and the onset of the mobile generation, AMI's cross-platform Aptio V is not only the most efficient development tool on the market, but also the best choice for enterprises to maintain their hard-earned competitiveness.MegaRAID is a registered trademark of LSI Corporation in the United States and other countries. Windows is a registered trademark of Microsoft Corporation in the United States and other countries. Android is a trademark of Google Inc. Linux is the registered trademark of Linus Torvalds in the U.S. and other countries.AMI CEO Subramonian Shankar explains how the company has been closely monitoring market changes to provide the IT industry with complete and timely solutions. According to Shankar, with regard to the Windows 8-supported UEFI 2.3.1 specifications, AMI is ahead of the competition by releasing Aptio V with full support for the complete UEFI specifications, giving its partners a head start towards the enormous business opportunities expected to come with the launch of Windows 8.AMI Director of Strategic Marketing Department PaiLin Huang discusses how the company's new Aptio V UEFI Firmware is a complete, multi-platform solution that meets all kinds of development challenges that partners may face.

Linear Technology Corporation recently introduced the LTM4641, a 4.5V to 38V input, 0.6V to 6V output, 10A step-down micron-module regulator with comprehensive electrical and thermal protection for loads such as processors, ASICs and high-end FPGAs.The LTM4641 micron-module regulator monitors input voltage, output voltage and temperature conditions. If any user-adjustable trip thresholds are exceeded, the LTM4641 responds within 500ns in the case of an output over-voltage fault, ceasing operation, and if necessary, activating external switches. One switch disconnects the input supply rail while the other discharges the output capacitors to protect the load.Additionally, when any trip threshold is exceeded, the LTM4641 will issue a logic level fault signal which may be used to initiate an orderly emergency shutdown sequence in the system. The adjustable trip thresholds are accurate to within ±2.7% over the full operating temperature range. As a micron-module regulator, the LTM4641 includes power MOSFETs, DC/DC controller, inductor, compensation and the protection logic circuits in a compact surface mount BGA package. The LTM4641 is designed for point-of-load regulation in robotics and industrial instrumentation, as well as rugged environments such as defense and avionics systems.When any trip threshold is exceeded, the LTM4641's protection circuitry classifies the fault in one of two categories, latching or non-latching. Normal voltage regulation will automatically resume once a non-latching fault such as input under-voltage, bias input under-voltage or input over-voltage has cleared. For latching faults such as an output over-voltage 38V, 10A rugged step-down micron-module regulator with fail safe load protection or a second input over-voltage threshold, the system must cycle the input power or supply a logic level signal to the LTM4641 in order to resume normal operation. An over-temperature fault can be classified by the user as a latching or non-latching fault by setting a logic level pin. The LTM4641 can be configured to autonomously restart after latchoff fault conditions have cleared.The output voltage is user adjustable from 0.6V to 6V with ±1.5% total accuracy over line, load and temperature. Additional features include output current sharing for loads requiring more than 10A, externally adjustable soft start, output over-current protection, switching frequency and output voltage tracking.The LTM4641 is packaged a thermally efficient 15mm x 15mm x 5.01mm RoHS compliant BGA with guaranteed operation over the -40°C to +125°C (E grade and I grade) or -55°C to +125°C (mp grade) internal temperature range. Pricing starts at US$25.95 each for 1,000-piece quantities. The LTM4641 is available for immediate delivery from stock.

Exar, a provider of high performance analog mixed-signal and data management products, has announced the XRP2523, a next-generation single channel switch for USB VBUS power distribution applications. The XRP2523 is compliant with the latest USB 3.0 specification as well as the established USB 2.0 specification. The new specification provides higher power to the downstream peripherals and enables more efficient battery charging over USB.The XRP2523 manages all aspects of the VBUS power distribution; providing a low on-resistance to meet the USB voltage regulation requirement, controlling transients during turn-on and hot plugging events and handling all fault conditions such as over current, short circuit or over temperature. The XRP2523 seamlessly interfaces with any USB controller through an active-high enable logic and channel fault flag.The XRP2523 is available in volume quantities and comes standard in a RoHS compliant, halogen free 5-pin SOT-23 package. The 1,000-unit suggested retail is US$0.69 each. Exar also offers an evaluation board for customers to quickly and easily test the features of the XRP2523.

Mentor Graphics recently announced a new formal-based technologies in the Questa Verification Platform that provide mainstream users with the ability to more easily perform exhaustive formal verification analysis. The new Questa AutoCheck technology delivers fully automated formal checking analysis, while the Questa CoverCheck tool provides 100% code coverage closure. The Questa Verification Platform now also offers expanded clock-domain crossing (CDC) capabilities.Formal verification offers exhaustive functional analysis of all possible design behaviors without the need to specify the test stimulus, enabling verification early in the design cycle, before creation of a simulation testbench. However, in the past, the promise of formal verification was only realized by verification teams with formal analysis experts that had to expend a high amount of effort to achieve results. The Questa platform changes all that by delivering a wide spectrum of formal applications that range from fully automatic formal checking with AutoCheck, a powerful, push-button technology that everyone can easily use, to property checking with custom coded assertions for advanced users. The Questa platform offers a broad arsenal of verification solutions that seamlessly blend simulation and formal-based technologies with common compilation and user interface features as well as the Unified Coverage Database (UCDB).The Questa CoverCheck technology also accelerates the process of code coverage closure. Code coverage closure typically involves many engineering weeks of effort to manually review code coverage holes to determine if they can be safely ignored and if not, to generate hand- crafted simulation tests to cover them. Questa CoverCheck makes it possible for non-expert users to leverage formal methods to complete this process by automatically identifying the set of reachable and unreachable coverage bins. Consequently, it significantly reduces the time required for code coverage sign-off, bringing predictability to the schedule. CoverCheck also ensures higher design quality by preventing bugs from slipping through the verification process due to mistakenly ignored code coverage bins.Concerning AutoCheck, it analyzes RTL designs and automatically synthesizes assertions that are then processed by powerful formal engines to check for correct sequential design behavior. Using AutoCheck, designs are easily verified to be free from common functional errors without the need to write a testbench or assertions. In addition, performance improvements based on breakthrough formal engines and formal model optimizations deliver improved quality of results and a significant decrease in compute resource consumption. This release also delivers Questa Formal Multi-Core, a new capability that enables multi-core and multi- computer distribution of formal jobs, further improving the throughput of formal analysis and optimizing the use of compute farm resources.

iWatt, a provider of digital-centric power management integrated circuits (ICs) has launched two new products that the company says will raise the bar for no-load standby power consumption and efficiency for 12W to 24W power adapter and charger applications. The two new digital pulse width modulation (PWM) controllers (iW1761) and (iW1762) expand iWatt's latest PrimAccurate controller platform, lowering power draw in standby mode to just 10mW at up to 12W output power (iW1761) and 20mW at up to 24W output power (iW1762).The iW1761 and iW1762 controllers offer even lower standby power consumption than iWatt's recently announced iW1699 and iW1760 with their respective 30mW (at 12W) and 50mW (at 40W) standby power consumption. All four devices exceed current energy standards in the markets in which the company competes, including the proposed stringent 2012 US Department of Energy (DOE) regulation requiring under 100mW AC/DC adapter standby power consumption and tighter efficiency requirements.The iW1761 and iW1762 meet the compact size and low power requirements of next-generation compact media tablet power chargers and adapters and the company noted that they also offer significantly greener and smaller solutions for AC/DC power adapters in a wide range of electronic products that remain permanently plugged in to the wall in standby mode, including set top boxes, satellite receivers and home networking equipment.In addition to very low standby power consumption, these new controllers take into account dynamic load response (DLR). Power supplies that achieve low standby power typically do so by entering a standby operating mode. However, when a load is applied, they need to "wake up" quickly to keep the output voltage from dropping too low. Dynamic load response is determined by the speed at which the system wakes up and responds to changes in the power load. The iW1761 and iW1762 offer a mix of low standby power with good DLR, while the recently announced iW1699 and iW1760 give designers options for higher DLR performance.The iW1761 and iW1762 are available in production quantities. They come in a standard, low-cost, 8-lead SOIC package. Pricing is US$0.34 for both parts in 1000-piece quantities.

Orbotech Pacific Ltd., the Asia Pacific subsidiary of Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs), is presenting the Company's latest digital production tools and value-added customer support services for creating a new PCB world at TPCA show in Taipei, Nangang Hall, 1F, Booth No. I116.Being introduced for the first time worldwide is the Sprint 120 inkjet printer with new DotStream Technology which delivers high speed and top quality for consistent, volume production of advanced legend designs. The Discovery II R2R automated optical inspection (AOI) system provides expanded capabilities to handle a full range of flexible PCB production requirements, including roll-to-roll automation and sheet-by-sheet modes.Demonstrations also include the Ultra Fusion 300 AOI system for leading-edge production of IC substrates and advanced HDI down to 10μm, the high speed PerFix 200 Automated Optical Repair (AOR) system for perfect repair of shorts and excess copper on the most advanced PCBs, including any-layer, HDI and complex high layer count applications, and InSight PCB pre-CAM software and other CAM/Engineering developments by Frontline PCB Solutions. Orbotech's Paragon Laser Direct Imaging (LDI) family will be highlighted with detailed discussions on customer utilization requirements and successful results worldwide.Orbotech's Customer Support Response Center and new Service Plus solutions will be featured. This includes the Orbotech APP Center, a collection of system-specific utilization reports and applications to monitor, analyze and maximize production performance for increased yield and operational efficiency."The new developments that we are presenting at this year's TPCA show are addressing the advanced production requirements that our customers are focusing on to be successful in today's competitive business environment," said Mr. Arik Gordon, President of Orbotech Pacific Ltd. "Across all of our product lines, we are taking many of our proven technologies to the next level with ground-breaking innovations that enable even greater performance for the production of finer and thinner products in larger volumes."About Orbotech Ltd.Orbotech Ltd. (NASDAQ/GSM: ORBK) has been at the cutting edge of the electronics industry supply chain, as an innovator of enabling technologies used in the manufacture of the world's most sophisticated consumer and industrial products, for over 30 years. The Company is a leading provider of yield-enhancing and production solutions, primarily for manufacturers of printed circuit boards, flat panel displays and other electronic components; and today, virtually every electronic device is produced using Orbotech technology. The Company also applies its core expertise and resources in other advanced technology areas, including character recognition for check and forms processing and solar photovoltaic manufacturing. Headquartered in Israel and operating from multiple locations internationally, Orbotech's highly talented and inter-disciplinary professionals design, manufacture, sell and service the Company's end-to-end portfolio of solutions for the benefit of customers the world over. For more information please see the Company's filings with the U.S. Securities and Exchange Commission at http://www.sec.gov/ and visit the Company's corporate website at http://www.orbotech.com/. The corporate website is not incorporated herein by reference and is included as an inactive textual reference only.

Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs), recently announced the introduction of Sprint 120, the company's latest generation of inkjet printers.Featuring new DotStream Technology, Sprint 120 delivers high speed and top quality for consistent, volume production of advanced legend designs. Sprint's digital printing solution shortens time-to-market with its easy, flexible operation that eliminates the entire screen mask preparation process and requires only one baking cycle."The Sprint 120 is answering the major inkjet printing challenge of how to best manage inkflow and curing without compromising on speed", said Mr. Richard Klapholz, President of the PCB Division at Orbotech Ltd. "At the same time, a key success factor in the system's development has been achieving consistent printing of today's complex designs at full production throughput. We believe that with these latest innovations, the Sprint 120 now turns digital legend printing into a cost-effective solution for medium and large volume PCB production."Sprint 120 with DotStream Technology achieves production quality in a single pass with precise drop control and optimized algorithms for fine text and filled areas. The system's customized print heads are specially designed for the challenges of electronics industry substrates and processes with features that extend their life. UV LED lights enable superior drop curing on-the-fly and printing of features down to 0.5mm. The result is high production quality with less passes than previous generation systems. With automatic measurements and scaling for each panel, registration accuracy of 35μm is attained. Incorporating a high depth-of-focus (DOF) of 1.5mm, Sprint's performs accurate and uniform printing over challenging surface topography. Fully integrated hardware, including vacuum table, clamps and retractable bridges, completely flattens the printing area to ensure top quality results on warped panels and a variety of thicknesses.About Orbotech Ltd.Orbotech Ltd. (NASDAQ/GSM: ORBK) has been at the cutting edge of the electronics industry supply chain, as an innovator of enabling technologies used in the manufacture of the world's most sophisticated consumer and industrial products, for over 30 years. The Company is a leading provider of yield-enhancing and production solutions, primarily for manufacturers of printed circuit boards, flat panel displays and other electronic components; and today, virtually every electronic device is produced using Orbotech technology. The Company also applies its core expertise and resources in other advanced technology areas, including character recognition for check and forms processing and solar photovoltaic manufacturing. Headquartered in Israel and operating from multiple locations internationally, Orbotech's highly talented and inter-disciplinary professionals design, manufacture, sell and service the Company's end-to-end portfolio of solutions for the benefit of customers the world over. For more information please see the Company's filings with the U.S. Securities and Exchange Commission at http://www.sec.gov/ and visit the Company's corporate website at http://www.orbotech.com/. The corporate website is not incorporated herein by reference and is included as an inactive textual reference only.

ABB, the leading power and automation technology group, has won orders worth around $50 million from Formosa Plastic Group of Taiwan for four gas-insulated switchgear substations to supply power to a new steel complex being built by its subsidiary, Hung Nghiep Formosa Hà Thĩn Steel Corporation, in Vietnam. The orders were booked in the third quarter.The new power infrastructure will support the first phase of the new Formosa steel complex being constructed some 400 kilometers south-east of Hanoi in the Vung Ang Economic Zone, Hà Thĩn province in central Vietnam. The complex, spanning 3,300 hectares will house four steel furnaces with a combined output of over 15 million tons a year, a 1,600 megawatt thermal power station and the Son Duong deep-water port with an annual throughput of 30 million tons.In the first phase of the project, two blast furnaces will be developed with a capacity of 4,300 cubic meters each. The complex will produce hot-rolled steel sheets and high-tech steel bars to help meet rising industrial demand. It will also boost socioeconomic development in the region and create thousands of jobs."These substations will enhance power transmission capacity and improve quality and reliability of supply for critical processes and sustain productivity at the new steel complex," said Brice Koch, head of ABB's Power Systems division. "We will leverage our advanced technologies, project management capability and extensive experience to execute this extensive project and contribute to the development of Vietnam's infrastructure."ABB is responsible for the design, engineering, supply, installation and commissioning of the substations. Key product supplies include gas-insulated high- and medium-voltage switchgear and transformers. ABB will also deliver the SCADA (supervisory control and data acquisition) system, telecommunications equipment and the substation automation, control and protection systems compliant with the IEC 61850 global standard, to enable remote monitoring and control of power assets from central control rooms. The project is scheduled for completion by 2014.ABB is the world's leading supplier of turnkey air-insulated, gas-insulated and hybrid substations with voltage levels up to 1,100 kilovolts. These substations facilitate the efficient and reliable transmission and distribution of electricity with minimum environmental impact, serving utility, industry and commercial customers as well as sectors like railways, urban transportation and renewables.ABB (www.abb.com) is a leader in power and automation technologies that enable utility and industry customers to improve their performance while lowering environmental impact. The ABB Group of companies operates in around 100 countries and employs about 145,000 people.

Apple has introduced an all-new version of its 13-inch MacBook Pro featuring a Retina display and all flash storage in a new compact design. At 0.75-inch and 3.57 pounds, the 13-inch MacBook Pro with Retina display is 20% thinner and almost a pound lighter than the current 13-inch MacBook Pro.The new MacBook Pro packs more than four million pixels into its 13-inch Retina display. The 13-inch Retina display uses IPS technology for a 178-degree wide viewing angle, and has 75% less reflection and 28% higher contrast than the current generation, Apple claimed.The 13-inch MacBook Pro with Retina display features 2.5GHz Intel Core i5 processors with the option to choose faster 2.9GHz Intel Core i7 processors, Intel HD Graphics 4000, 8GB of 1600MHz memory, and up to 768GB of flash storage. Two Thunderbolt and two USB 3.0 ports allow users to connect to multiple displays and high-performance devices, and a new HDMI port offers quick connectivity to an HDTV. The 13-inch MacBook Pro with Retina display also features a FaceTime HD camera, dual microphones, improved speakers, three-stream 802.11n Wi-Fi, Bluetooth 4.0, and a MagSafe 2 power port.The 13-inch MacBook Pro battery delivers up to seven hours of wireless productivity and can remain in standby for up to 30 days. With the all new Power Nap feature in OS X Mountain Lion, the MacBook Pro with Retina display stays up to date while it sleeps.The 13-inch MacBook Pro with Retina display is available with a 2.5GHz dual-core Intel Core i5 processor, 8GB of memory and 128GB of flash storage starting at US$1,699; and with 256GB of flash storage starting at US$1,999.Meanwhile, Apple also unveiled a completely new iMac with a new design, display with reduced reflection, and faster processors. The machine features Intel's third-generation quad-core processors, Nvidia graphics and an new storage option called Fusion Drive.Redesigned from the inside out, the new iMac features an aluminum and glass enclosure with up to 40% less volume than its predecessor and an edge that measures just 5mm.The new iMac also features a completely reengineered display that reduces reflection by 75% while maintaining its color and contrast. In the new design, the cover glass is fully laminated to the LCD and an anti-reflective coating is applied using a high-precision plasma deposition process. Every iMac display is individually color calibrated using an advanced spectroradiometer, apple said.The new iMac features third-generation quad-core Intel Core i5 processors that can be upgraded to Core i7, and the latest Nvidia GeForce graphics processors. Every new iMac now comes standard with 8GB of 1600MHz memory and a 1TB hard drive, and customers can choose to configure their iMac with up to 32GB of memory and a new 3TB hard drive, or 768GB of flash storage.Fusion Drive is a new storage option that gives customers the performance of flash storage and the capacity of a hard drive. It combines 128GB of flash with a standard 1TB or 3TB hard drive to create a single storage volume that intelligently manages files to optimize read and write performance.Apple also updated the Mac mini with third-generation dual-core Intel Core i5 and quad-core Intel Core i7 processors that are up to twice as fast and have integrated graphics that are up to 65% faster. Mac mini comes standard with 4GB of 1600MHz memory with support for up to 16GB.The 21.5-inch iMac is available with a 2.7GHz quad-core Intel Core i5 processor and Nvidia GeForce GT 640M for a suggested retail price of US$1,299; and with a 2.9GHz quad-core Intel Core i5 processor and Nvidia GeForce GT 650M for a suggested retail price of US$1,499. The 21.5-inch iMac will be available in November through the Apple Online Store, Apple's retail stores and Apple authorized resellers.The 27-inch iMac is available with a 2.9GHz quad-core Intel Core i5 processor and Nvidia GeForce GTX 660M for a suggested retail price of US$1,799; and with a 3.2GHz quad-core Intel Core i5 processor and Nvidia GeForce GTX 675MX for a suggested retail price of US$1,999. The 27-inch iMac will be available in December.The Mac mini is available with a 2.5GHz dual-core Intel Core i5 processor, 4GB of memory and a 500GB hard drive for a suggested retail price of US$599; a 2.3GHz quad-core Intel Core i7 processor, 4GB of memory and a 1TB hard drive for a suggested retail price of US$799; and a 2.3GHz quad-core Intel Core i7 processor, OS X Server, 4GB of memory and two 1TB hard drives for a suggested retail price of US$999. The Mac mini is already available for purchase.Apple Retina Display-featured 13-inch MacBook Pro notebookPhoto: CompanyApple new iMac all-in-one PCPhoto: Company

Apple has introduced iPad Mini, a new design that is 23% thinner and 53% lighter than the third-generation iPad. The new iPad Mini features a 7.9-inch multi-touch display, FaceTime HD and iSight cameras with 10 hours of battery life. Apple also announced the fourth-generation iPad featuring a 9.7-inch Retina display with new Apple-designed A6X chip and FaceTime HD camera. Both iPad Mini and fourth-generation iPad come with iOS 6.iPad Mini comes in a new aluminum and glass design that is 7.2mm thin and weighs 0.68 pounds. The 7.9-inch multi-touch display has 35% more screen real estate than 7-inch tablets and up to 67% more usable viewing area when browsing the web, the vendor said, adding it comes with a dual-core A5 chip.iPad Mini features dual-band 802.11n Wi-Fi support for speeds up to 150 Mbps, which is twice the Wi-Fi performance compared to previous iPad models, Apple said. iPad Mini is available in Wi-Fi + Cellular models including support for LTE and DC-HSDPA.iPad Mini and fourth-generation iPad both feature support for the Lightning connector. Existing iPad Smart Covers and the iPad Smart Case are compatible with fourth generation iPad, and new polyurethane Smart Covers custom-designed for iPad Mini are available in pink, green, blue, light gray, dark gray and red for US$39.iPad Mini with Wi-Fi models will be available in black and slate or white and silver on Friday, November 2, for a suggested retail price of US$329 for the 16GB model, US$429 for the 32GB model and US$529 for the 64GB model. The fourth-generation iPad with Wi-Fi models will also be available on Friday, November 2, in black or white for a suggested retail price of US$499 for the 16GB model, US$599 for the 32GB model and US$699 for the 64GB model.iPad Mini with Wi-Fi + Cellular and fourth-generation iPad with Wi-Fi + Cellular will start shipping a couple of weeks after the Wi-Fi models, beginning in the US on AT&T, Sprint and Verizon. iPad Mini with Wi-Fi + Cellular will be offered for a suggested retail price of US$459 for the 16GB model, US$559 for the 32GB model and US$659 for the 64GB model. Fourth generation iPad with Wi-Fi + Cellular for AT&T, Sprint and Verizon will be offered for a suggested retail price of US$629 for the 16GB model, US$729 for the 32GB model and US$829 for the 64GB model. Additionally, iPad 2 is available at US$399 for the 16GB Wi-Fi model and just US$529 for the 16GB Wi-Fi + 3G model where they are sold now.Apple iPad Mini Photo: Company