Lenovo has announced new all-in-one (AIO) desktops with a simpler ergonomic design featuring optional multi-touch screens, improved cable management and new mounting options with the ThinkCentre UltraFlex stand allowing for vertical, rotate and tilt movements, including a fully flat position optimized for touch.The ThinkCentre E93z is 48mm thick, and is a 10-point multi-touch display that combines height, tilt, pivot, and recline adjustments to maximize ergonomic comfort and productivity for an improved Windows 8 experience, said the company, adding the unit has a 21.5-inch Full HD display and is powered by up to a 4th Generation Intel Core i7 processor and available with a 1GB NVIDIA GeForce 720 discrete graphics engine on selected models.Lenovo announces its new E93z monitor Photo: Company

Asustek Computer has announced the release of its MB168 Series portable USB-powered monitor, a 15.6-inch companion display designed for notebooks and desktops. Both power and video signal are supplied over a single USB 3.0 cable, removing the need to carry a bulky power adapter and video cable. With a slim 8mm profile and weighing 800g, the MB168 Series is the world's slimmest and lightest companion display and is ideal for simple dual-monitor set-ups and presentations, according to the company.The MB168 Series has a mercury-free LED-backlit display that consumes just 5W in active use and 0W in standby mode.The device is available in both 1920 by 1080 Full HD and 1366 by 768 resolutions, with both models requiring just a single USB 3.0 connection for the video signal and power. The MB168 Series is also backward compatible with USB 2.0 ports, with only a slight difference in display brightness.The MB168 Series features Asus EzLink technology that offloads graphics processing from the PC to dedicated hardware in the monitor. As a result, a desktop or notebook can drive up to five MB168 Series monitors at the same time, regardless of its own graphics capability, it just needs sufficient USB ports. EzLink senses ambient light levels and adjusts monitor brightness accordingly, and automatically rotates the image between landscape and portrait modes, as required, said Asustek.Asustek releases MB168 Series portable USB-powered monitorPhoto: Company

Asustek has announced Z87-Deluxe/Quad, featuring the Thunderbolt 2 technology certified by Intel. Based on the new Intel Z87 chipset and ready for the latest fourth-generation Intel Core processors, the Z87-Deluxe/Quad ATX motherboard has two Thunderbolt 2 ports for connecting up to 12 devices at once. Each port has up to 20Gbit/s transfer rate and is backwardly compatible with Thunderbolt 1.The original Thunderbolt standard has four separate transfer channels - two upstream and two downstream - with a maximum transfer rate of 10Gbit/s per channel. Thunderbolt 2 combines these four channels into two 20Gbit/s bi-directional channels, which are four times faster than USB 3.0, according to the vendor. Together with DisplayPort 1.2 support, this enables Thunderbolt 2 to simultaneously deliver high-resolution video to Ultra HD displays and communicate with other devices, such as hard drives. With the onboard HDMI port, the Z87-Deluxe/Quad can drive three Ultra HD displays at once.Thunderbolt 2 also supports daisy-chained connections with up to six devices on each port.Asustek Z87-Deluxe/Quad motherboard with Thunderbolt 2 supportPhoto: Company

Entegris, Inc., a leader in contamination control and materials handling technologies for highly demanding advanced manufacturing environments, and imec, a world-leading research center in nanoelectronics, announced they are collaborating to advance the development and broaden the adoption of 3D integrated circuits.3D IC technology, a process by which multiple semiconductor dies are stacked into a single device, is aimed at increasing the functionality and performance of next-generation integrated circuits while reducing footprint and power consumption. It is a key technology to enable the next generation of portable electronics such as smartphones and tablets that require smaller ICs which consume less power.One of the key steps in 3D IC manufacturing process entails thinning semiconductor wafers while they are bonded to carrier substrates. Handling such thinned 3D IC wafers during the production process can result in wafer breakage, edge damage, and particle generation. A standardized, fully automated solution that supports the handling of multiple types of wafers would result in a significant cost reduction and pave the way toward further development and scaling of 3D IC technologies. Imec and Entegris are working on creating a solution to safely transfer and handle multiple kinds of 3D IC wafers without the risk of breakage and other damage that may occur during the 3D production process."We are excited to work with the imec team, which is a key research center leading technology innovation for the semiconductor industry," said Bertrand Loy, president and CEO of Entegris. "Our current collaboration is aimed at leveraging our wafer handling expertise and technology to reduce contamination and breakage by applying full automation to the handling of thin wafers during 3D wafer production. This project builds on our previously completed work with imec to develop dispense and filtration methods to reduce bubble and defect formation during the dispense of material that is used to temporarily bond 3D wafers to carrier substrates," said Loy."This collaboration with Entegris aims at developing a solution toward fully automated handling of multiple types of 3D IC wafers," stated Eric Beyne, Director of imec's 3D integration research program. "Such a general solution would imply a significant reduction of the development cost, which is key to the realization of a scalable and manufacturable 3D IC technology."To learn more about Entegris' comprehensive suite of filtration and wafer handling solutions, see Entegris at booth 176 at SEMICON Taiwan, September 4-6, 2013. For more information, please contact Entegris at: asia_news@entegris.com. Join our SEMICON Taiwan event (http://on.fb.me/19ibAdQ) on Facebook to stay connected with the latest announcements before and during the show.Learn more about imec's 3D integration research at the Tawain edition of the IMEC TECHNOLOGY FORUM, organized in conjunction with SEMICON Taiwan and in collaboration with SEMI on September 4, 2013 at the Taipei World Trade Center Nangang Exhibition Hall, Taipei, Taiwan. For more information: http://www.itf2013taiwan.be/About EntegrisEntegris is a leading provider of a wide range of products for purifying, protecting and transporting critical materials used in processing and manufacturing in the semiconductor and other high-tech industries. Entegris is ISO 9001 certified and has manufacturing, customer service and/or research facilities in the United States, China, France, Germany, Israel, Japan, Malaysia, Singapore, South Korea and Taiwan. Additional information can be found at http://www.entegris.com/.FFS_300mm_Open-300

GIGABYTE Technology, a leading manufacturer of motherboards and graphics cards, announced its latest range of 8 series motherboards based on the new Intel H81 Chipset (PCH) supporting the latest 4th generation Intel Core processors. GIGABYTE Intel H81 series motherboards include ATX and Micro-ATX models, bringing together a unique blend of features and technologies that offer the absolute best in terms of quality, durability and overall lifespan.GIGABYTE H81 series motherboards stand out from the competition with signature features that guarantee the utmost in both performance and reliability. High quality components for key areas of the motherboard are joined by an updated and improved UEFI DualBIOS which offers a customizable, full HD BIOS environment, plus the new GIGABYTE App Center, which combines key GIGABYTE applications in a simple, unified interface. GIGABYTE H81 series motherboards also provide additional USB 3.0 ports and support the latest 4K resolution displays on both HDMI and DisplayPort.GIGABYTE Ultra Durable 4 PlusGIGABYTE Ultra Durable 4 Plus focuses on "Ultra Performance" and "Ultra Safe", with a range of features and component choices that provide optimal performance, cool and efficient operation and extended motherboard lifespan.Ultra PerformanceGIGABYTE uses All Solid Caps (Capacitors) and Low RDS(on) MOSFETs which are rated to work at higher temperatures to provide a longer lifespan. specially designed to produce lower switching for faster electric current charging and discharging, Low RDS(on) MOSFETs have lower power consumption during the switching process, resulting in a faster switching process and less heat generation.Ultra SafeGIGABYTE motherboards feature GIGABYTE DualBIOS, an exclusive technology from GIGABYTE that protects arguably one of your PC's most crucial components, the BIOS GIGABYTE DualBIOS means that your motherboard has both a 'Main BIOS' and a 'Backup BIOS', making users protected from BIOS failure due to virus attack, hardware malfunction, improper OC settings or power failure during the update process.High ESD protection for USB and LAN (USB 3.0 only)GIGABYTE H81 series motherboards raise the bar in terms of protecting your system, providing advanced electrostatic discharge (ESD) protection for both your Ethernet LAN and USB ports, both common sources of ESD-related failures. Each LAN and USB port is paired with a dedicated protection filter that can withstand high electrostatic discharges, protecting your system from common electrical surges and even direct lighting strikes.Additional USB 3.0 portsGIGABYTE H81 series motherboards feature an onboard USB 3.0 host controller that provides an additional four USB 3.0 ports. Together with USB 3.0 ports provided by the Intel H81 chipset, users can enjoy SuperSpeed connectivity on a total of six USB 3.0 ports.4K Ultra HD supportGIGABYTE H81 series motherboards provide native 4K support with integrated IntelR HD Graphics via HDMI or DisplayPort. 4K resolution is the next technological milestone in high-definition content delivery, utilizing approximately 4,000 pixels on the horizontal axis, more than four times today's standard HD pixel density.New GIGABYTE UEFI DualBIOS with Dashboard ModeTake control of how your BIOS looks and feels with the new GIGABYTE UEFI DualBIOS, a fully customizable user interface that allows you to adjust overclocking and performance settings in real-time. With smooth mouse control and shortcuts for fast navigation, the new and exclusive Dashboard Mode gives users complete access to all data related to your motherboard, including CPU, graphics and memory clocks, temperatures and voltages.New GIGABYTE App CenterGIGABYTE App Center gives you easy access to a wealth of GIGABYTE apps that help you get the most from your GIGABYTE motherboard. Using a simple, unified user interface, GIGABYTE App Center allows you to launch all GIGABYTE apps installed on your system. The GIGABYTE App Center is also customizable with three attractive color schemes.The GIGABYTE App Center includes:*EasyTune*@BIOS*EZ Setup*Live Updates*USB Blocker*Smart Recovery*Smart Time LockMore information about GIGABYTE H81 series motherboard can be found at the GIGABYTE website here: http://www.gigabyte.com/products/list.aspx?s=42&jid=2&p=2&v=31GIGABYTE GA-H81-D3

ATO Solution specializing in the design and manufacturing for NAND Flash (CEO: Park, Chan Woong) announced to complete the development of 1Gbit NAND SPI (Serial Peripheral Interface) Flash memory, which is the first designed by ATO Solution in Korea, on August of 2013 followed by the existing 256Mb, 512Mbit, 1Gbit SLC NAND flash memory series.In general, SPI Flash Memories in the current market are based on NOR Flash cell structure, on the other hand, ATO Solution's 1Gbit SPI NAND Flash is based on NAND Flash cell structure with NOR SPI interface. It is the first product designed by ATO Solution's own patented SPI technology.The SPI NAND Flash developed by ATO Solution's own specialized design technology is having extremely higher reliability than NAND Flash and achieving high performance as Nor Flash has. This new NAND SPI Flash product is the next generation SLC NAND Flash to eat NOR Flash market. It challenges the density limitation and the disadvantages of high market price with Nor Flash's intrinsic structure in SPI market. Furthermore, it is expected to be an alternative SLC NAND Flash memory, which can replace the NOR Flash chip in current application system without any additional expense for using of ECC controller to utilize the traditional SLC NAND Flash, and it can compete with Nor SPI through an compatible package size 8 pin WSON (8mmx6mm) type. This small form factor Package would be much helpful for customer's cost competitiveness because it can help to save main board space and simplify it from customer's aspects. It would be available to do sourcing of products with price competitiveness around 50% lower in comparison to Nor SPI Flash.Especially, even the 1bit ECC (Error Correction Code) engine is built in the same die, the spare cell area of NAND Flash Memory is kept to allow the customer's convenience and trace to more higher reliability & quality due to customer can use dual ECC operation both imbedded ECC engine in NAND SPI and NAND Controller's ECC in outside it is fully customer choice. Its frequencies, which are one of the most important scale for performance indication, is 133MHz (15pF) which is the fastest speed of NAND SPI in the World thus it is explained that ATO Solution's NAND SPI is the very advanced product not only in price competition point of view but also in technical aspects.As ATO Solution is completed of 1Gbit NAND SPI development following up the 256Mbit/512Mbit/1Gbit SLC NAND Flash products on 2013, set a forth low-density NAND Flash product line up to the primary building and have identified NAND Flash marketing strategy in a fields of low density NAND Flash market, with stable supporting to customers with differentiated service in the Embedded Core Storage market, being a leading company for NAND SPI in the industry. From year 2015, the NAND SPI market demand is expected to be more than 200 million units and be grown year after year for the coming years through migration from Nor SPI NAND and Discrete SLC NAND to SPI NAND Flash.At the present, ATO Solution is progressing to register its 1Gbit SPI NAND with consumer chipset companies' reference design such as mobile baseband chipsets, DSP, and Application Processor. In addition, it is preparing for coming mass production sooner for Korea, China, Asia, Europe and North America market, in detail mobile phones, set-top box, black box, digital TV, such as the consumer market. Even though with focusing on low cost smart phone set, will expand NAND SPI market share and lead to be popularization of NAND SPI in the World.Park, Chan-Woong (CEO) of ATO solutions Co., Ltd. said "With starting of 1Gb SPI NAND, upper-class products as 2Gb and 4Gb are on the roadmap. We plan to make ATO Solution as a leading company of NAND SPI products through continuous innovation and enhance the competitive ownership". He also released the ambitious plan. "ATO will be the leading fabless company in the World with the development of high quality products continuously and the customer satisfaction".

Lenovo has expanded its end-to-end enterprise solutions portfolio with a new thin client, the Lenovo ThinkCentre M32.Lenovo's ThinkCentre M32 thin client offers customers a choice of a flexible Linux-based thin client operating system, LeTOS or Windows Embedded Standard 7. The thin client also features Lenovo Terminal Manager (LTM) software that helps customers manage thin client assets.The Lenovo ThinkCentre M32 thin client is powered by Intel Celeron processor and will be available in October 2013, starting at US$259.

Samsung Electronics has introduced the latest iteration of its professional grade Series 9 monitor, the SB971, featuring quad high-definition resolution and wide viewing angles.The monitor features Samsung's professional-grade Plane Line Switching (PLS) panel technology, ensuring that the accurate color reproduction can been viewed at wide horizontal and vertical angles.The SB971 design has been updated from the original SB970 monitor and no longer includes a glass cover on the bezel, minimizing glare and resulting in 100% SRGB visibility, added Samsung.All of the monitor's internal components are housed in a round aluminum base. The base also includes all I/O ports and a USB hub. It also supports DisplayPort, Dual Link-DVI and HDMI video connections, and features built-in 7W stereo speakers and a Mobile High Definition Link (MHL) for MHL-enabled smartphones and tablets.Samsung SB971 monitorPhoto: Company

GIGABYTE, a leading manufacturer of motherboards and graphics cards, announced its new FM2+ motherboard lineup supporting the forthcoming 'Keveri' AMD APUs with support for existing socket FM2 Trinity and Richland APUs.GIGABYTE A88X motherboards feature a number of features and technologies and also include the first AMD G1-Killer gaming motherboard, the G1.Sniper A88X which includes GIGABYTE AMP-Up Audio, a range of advanced audio technologies that are designed to give audio enthusiasts and PC gamers more control over their motherboard audio than ever before. GIGABYTE A88X series motherboards also offer unique GIGABYTE features, including UEFI DualBIOS, Digital Power delivery, as well Triple Display support.Ready for Kaveri on AMD socket FM2+GIGABYTE A88X series motherboards feature the new FM2+ APU socket, and are designed to get the most from forthcoming Kaveri AMD APUs, while preserving compatibility for current AMD FM2 APUs. FM2+ AMD APUs offer native support for 8 GT/s PCI Express gen 3.0 as well as DX11.1 support integrating the high performance 'Steamroller' core. AMD socket FM2+ APUs also offer native support for 4K resolution displays on HDMI and DisplayPort.GIGABYTE A88X series motherboards: G1.Sniper A88X, F2A88X-UP4, F2A88X-D3H, F2A88X-HD3, F2A88XM-D3H, F2A85XM-DS2, F2A88XM-HD3GIGABYTE A88X series motherboard

GIGABYTE, a leading manufacturer of motherboards and graphics cards, announced its new FM2+ motherboards including the newest addition to its G1-Killer range of gaming motherboards, the GIGABYTE G1.Sniper A88X. Debuting two exclusive audio features including GIGABYTE USB DAC-UP, an exclusive feature optimized for users employing a Digital-to-Analog Converter, and Gain Boost which provides high gain output for advanced headphones and speakers, the GIGABYTE G1.Sniper A88X provides the highest caliber onboard audio experience for discerning audiophiles."We've had a lot of customer interest in expanding our G1-Killer gaming motherboard range to include an AMD platform model." commented Henry Kao, Vice President of GIGABYTE Motherboard Business Unit. "By also developing unique audio features that make a real difference to the overall experience, we're confident this board will be a real hit with gamers and audiophiles alike."GIGABYTE AMP-UP Audio: redefining motherboard audioGIGABYTE AMP-UP Audio combines a range of unique features and technologies that are designed to give audio enthusiasts and PC gamers more control over their motherboard audio than ever before.USB DAC-UPFeaturing a gold plated USB 2.0 port, GIGABYTE USB DAC-UP provides clean, noise-free power delivery to your Digital-to-Analog Converter. DACs can be sensitive to fluctuations in power from the other USB ports, which is why GIGABYTE USB DAC-UP takes advantage of an isolated power source that minimizes potential fluctuations and ensures the best audio experience possible.GIGABYTE USB DAC-UP also allows the port to be configured in BIOS for enthusiast system configurations which do not require USB power to the DAC. This makes it suitable for high-end audio enthusiasts building extreme fidelity audio systems.Gain BoostTo further optimize the audio experience provided by the onboard OP-Amp, GIGABYTE motherboards also debut Gain Boost. Gain Boost provides onboard switches to select between 2.5x and 6x amplification modes depending on output device. Most OP-Amps are capable of providing a high-gain audio output that is ideal for high-end headphones and speakers that have higher impedance headroom. Gain Boost allows users to switch between 6x and x2.5 amplification modes depending on the speakers or headphones being used.Upgradable onboard OP-AmpGIGABYTE motherboards are the world's first to feature an onboard operational amplifier (OP-Amp). OP-Amps are commonly found in high-end audio equipment and offer not only amplification of the audio signal, but a superior audio experience generally. The motherboard's OP-Amp is mounted on a socket which allows users to physically switch out and try different OP-Amps which offer distinct and nuanced properties that make the audio clearer, punchier and more life-like. Additional OP-Amps can be purchased separately to further expand audio capabilities.Audio noise guardTo help protect and insulate the the Realtek ALC898 audio processor and onboard amplifiers from electrostatic interference (ESD), the GIGABYTE G1.Sniper A88X motherboard features an audio noise guard that essentially separates the board's sensitive analog audio components from potential ESD pollution at the PCB level. LED trace path lighting illuminates to show the separation of the PCB layers.Nichicon Pro Audio CapsThe GIGABYTE G1.Sniper A88X motherboard uses the highest quality Nichicon MUSE ES series audio capacitors at each channel layout. These professional audio capacitors deliver the highest quality sound resolution and sound expansion to create the most realistic sound effects for professional gamers.Gold Audio Plated HardwareThe GIGABYTE G1.Sniper A88X motherboard uses top quality gold plated hardware for improved connectivity and long lasting durability for the USB DAC-UP port and audio connectors. Gold has superb signal conductivity and will not tarnish over extended periods of use. The Realtek ALC898 audio processor is also shielded by a gold-plated cover which eliminates electrostatic interference.GIGABYTE G1.Sniper A88X: ready for Kaveri on AMD Socket FM2+The GIGABYTE G1.Sniper A88X motherboard features the new FM2+ APU socket, and is designed to get the most from forthcoming 'Kaveri' AMD APUs, while preserving compatibility for current AMD FM2 'Trinity' and 'Richland' APUs.FM2+ AMD APUs offer native support for 8 GT/s PCI Express gen 3.0 as well as DX11.1 support, integrating the high performance 'Steamroller' core. AMD socket FM2+ APUs also offer native support for 4K resolution displays on HDMI and DisplayPort.GIGABYTE G1 Sniper A88X