Apple has announced the iPad Air featuring a 9.7-inch Retina display. Weighed one pound, iPad Air is 20% thinner and 28% lighter than the fourth-generation iPad, and with a narrower bezel the borders of iPad Air are thinner.
Orbotech Pacific Ltd., the Asia Pacific subsidiary of Orbotech Ltd., a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs) and IC substrates, is demonstrating advanced technologies for creating a new PCB world in Hall 4F, Booth #L924.
GIGABYTE Technology, a leading manufacturer of motherboards, graphics cards and PC systems, is proud to announce the latest addition to the GIGABYTE BRIX range of ultra compact PC kits, the GIGABYTE BRIX Projector...
Ideal for use in machine manufacturing industries such as semi-conductor manufacture, Advantech's Industrial Automation Group has launched an exciting new range of Web operator panels...
Indium Corporation introduces a new, high-reliability, low-voiding flux coating for solder preforms. LV1000 reduces false failures while increasing productivity, throughput yields, and component performance. This new halide-free (ROL0) material is especially suited for assembly processes in which the components don't allow for proper outgassing of volatized flux.
MSI is pleased to announce its new Graphics Cards based on AMD's new R9 and R7 200 series GPUs. Featuring new models in the OVERCLOCKING, GAMING and CLASSIC segments, MSI is catering to the needs of everyone gearing up for Q4's most anticipated gaming titles such as Battlefield 4. MSI's new R9 270X HAWK is an engineering masterpiece...
Clientron Corp., a world-leading supplier of thin client and embedded systems, is proud to unveil its new F800 thin client, which is based on the next generation Intel Celeron processor SoC with 22nm Silvermont microarchitecture, enabling a significant performance improvement over previous generation Intel Atom processors to deliver a better end-user experience.
Apotop, a Carry Technology Co. Ltd. global consumer brand, will showcase the company's latest accessories designed for the MacBook, a high performance portable external solid state drive, and portable multi-functional wireless devices at the Hong Kong Electronics Fair Autumn Edition from October 13th through October 15th.
Intel CEO Brian Krzanich has announced a collaboration agreement with Arduino, an open-source hardware platform in the maker and education community. Krzanich also unveiled the Intel Galileo board, the first product in a new family of Arduino-compatible development boards featuring Intel architecture.
Indium Corporation introduces a full line of soldering products that satisfy IPC's J-STD004B. The IPC's new 004B has stricter requirements for measuring halogens and electromigration risk. Indium Corporation's full line of PCB assembly products were specifically designed to meet these new international standards, which help to improve both first pass yields and long-term reliability.
