AVEXIR Technologies Corp., the world's manufacturer in exclusive patented breathing LED & plasma tube technology memory products, announced two ASUS ROG certified memory products - IMPACT series & Red Tesla series last year. Two memory products have undergone extensive testing and validation by ROG engineers, and only the very best succeed. Double assurances of quality and performance from ASUS ROG and Avexir, double values for purchasing.IMPACT seriesIMPACT series retained the exclusive LED light bar patented technology and added Mayan-inspired markings on heat spreaders, exactly presenting ROG feature and spirit. Being low height, IMPACT series has no clearances issues with CPU coolers. It gives you a fitting design at remarkable performance. Moreover, IMPACT series utilized the latest LED light guide bar and released Red LED color only to perfectly match ASUS ROG spirit.Red Tesla seriesRed Tesla series is re-designed from Raiden series. To perfectly express the core spirit of ROG, plasma tube lighting effect has changed to red color lighting effect. Also, heat spreaders design is based on black/ red color with Mayan-inspired markings.Both products above are high performance DDR4 gaming memory modules. They are built for your confidence which passed 16 hand-picked AIST (Avexir Ic Sorting Technology) processes. Specification of speed is from 2666MHz. ROG certified memory performance enhancement via Ai Overclock Tuner. One Intel XMP 2.0 profile at rated speed. Moreover, they contain lifetime warranty.Please contact with local distributors, on-line shops or retail shops for purchasing.AVEXIR Technologies Corp. marketing@avexir.com.twImpact series & Red Tesla: ROG certified edition is carefully tuned for Asus Republic of Gamers series motherboard from inside out.

The Critical Materials Council for Semiconductor Fabricators, originally established by ISMI/SEMATECH in the early 1990's, will be run by TECHCET CA LLC starting January 01, 2016. Under its new name CMC Fabs, the membership-based organization of semiconductor fab & fabless manufacturers will continue working to identify and remediate issues impacting the supply, availability, and accessibility of both current and emerging semiconductor process materials. In keeping with SEMATECH tradition, the work of the international council takes place in a non-competitive environment for the benefit of the semi device fabrication community. Topics addressed are identified and prioritized by the member companies.The organization has a new website at cmcfabs.org, which includes an overview of the Council's mission, news of upcoming events and a Members Only portal for access to minutes of monthly phone/WebEx meetings and workshop details. The site also features access for Members to the TECHCET Critical Materials Reports and the related quarterly updates.The next face-to-face meeting of CMC Fabs will take place May 03-06, 2016 in Hillsboro, Oregon. The meeting will include the annual CMC Materials Seminar held on May 05-06 that is open to the public. Sessions include a market briefing, supply chain issues and methods, the evolution of emerging materials in ALD / ALE, and the materials revolution around carbon. Speakers will be drawn from fabs, suppliers and analysts to address topics of concern and interest to the Council, and the semiconductor materials supply chain.CMC Fabs is a unit of TECHCET CA LLC, a firm focused on Process Materials Supply Chains, Electronic Materials Technology, Materials Market Research and Consulting for the Semiconductor, Display, Solar/PV, and LED Industries. The company has been responsible for producing the SEMATECH Critical Material Reports since 2000. For additional information about these reports and about membership in CMC Fabs please contact Lita Shon-Roy or Jerry Yang at info@cmcfabs.org +1-480-332-8336, or visit our websites at www.techcet.com and www.cmcfabs.org.

NANIUM S. A., acknowledged for its experience in designing and developing innovative semiconductor packaging solutions, today announced it has developed a 3D Wafer-Level System-in-Package (WLSiP/WL3D) solution that integrates more than 40 different components. The final units measure 8 mm x 8 mm x 1 mm and are Fan-Out Wafer-Level Packages, produced on large diameter reconstituted wafers, a technology with proven volume manufacturability that was developed in-house."We were challenged by a customer to develop a package with several active and passive components including a large number of SMD parts - so far assembled on a PCB based module - in a single System-in-Package" explains Elisabete Fernandes, the responsible project manager. "To achieve a small form-factor, we had to attach an active silicon die as a hanging die (WLCSP) at the bottom side of the package inside the Ball Grid Array (BGA). The combination of these technologies enabled highly dense side-by-side (2D) and face-to-face (3D) assembly, ultimately reducing the original space required for this functionality by 5X."The resulting package was qualified and, according to the customer, NANIUM's units not only achieve the same performance as the previously used PCB based module solution, but even exceed them in what concerns electrical performance. This was only possible due to the reliance on Wafer-Level Fan-Out (WLFO), the fastest-growing advanced packaging technology in the industry, capable of enabling Wafer-Level System-in-Package (WLSiP) and heterogeneous 3D integrated package solutions (WL3D).This type of densely packed system solution is especially applicable to space constrained applications like wearables, health and well-being, sports and fitness, autonomous vehicles like cars and drones, and IoT devices in general.NANIUM recently published a new datasheet "Embedded Wafer-Level System Integration (WLSiP & WL3D)", and will be presenting the above solution at the "SEMI European 3D Summit", along with other Wafer-Level Packaging technology innovations. The event will be held in Grenoble, France from January 18th to 20th, 2016.About NANIUMNANIUM (http://www.nanium.com/) is an outsourced semiconductor packaging, assembly and test provider, and a world-leader in 300mm Wafer-Level Packaging. The company provides Wafer-Level Chip Scale Packaging (WLCSP) and was among the first in the world to offer Wafer-Level Fan-Out (WLFO) in high volume manufacturing. Nowadays, NANIUM stands as a leader in WLFO, a technology that combines minimal form-factor with superior performance, high integration density, and high reliability. To date, NANIUM has shipped over 550 million WLFO packages.

Leading semiconductor test equipment supplier Advantest Corporation has opened registration to attend its VOICE 2016 Developer Conference, being held in San Diego, California, on May 10-11 and for the first time in Hsinchu, Taiwan, on May 18. The upcoming events mark the 10th anniversary of this popular international forum, which features technical presentations, a Partners' Expo, multiple networking events, and opportunities for in-depth discussions about Advantest's test platforms as well as handlers, test cell solutions and related technologies and - new for 2016 - product engineering content. Learn more about the VOICE 2016 "10 Wonders of Technology" theme and additional event details on the VOICE website at https://voice.advantest.com/."This prestigious technical conference offers members of Advantest's global user community a real opportunity to take part in maximizing the efficiency and cost effectiveness of semiconductor testing," said Simondavide Tritto, technical chairman of the VOICE 2016 Developer Conference and Advantest senior staff application engineer. "Attendees will gain and share valuable insights, build long-lasting relationships and learn about Advantest's newest test equipment, handlers and applications. We will also have some exciting special features and surprises to celebrate the 10th anniversary of VOICE. Join us for the best VOICE yet!"Online registration is now open at https://voice.advantest.com/registration. The 20% early registration discount for the San Diego event ends March 4. The registration fee will increase on March 5. Group discounts are also available; email mktgcomms@advantest.com for details. Those interested in attending VOICE 2016 in Taiwan should email mktgcomms@advantest.com for more information.Registered VOICE 2016 attendees are encouraged to make their hotel reservations early. The deadline for the San Diego Paradise Point Resort & Spa is April 17, 2016. Additional hotel information for both events is available on the VOICE website at https://voice.advantest.com/hotel. For companies interested in supporting VOICE 2016, a limited number of sponsorship opportunities are still available for both locations. Details are posted at https://voice.advantest.com/sponsor.Follow #VOICE2016 on Twitter @Advantest_ATE.About Advantest VOICE 2016Managed by a steering committee of volunteer representatives from Advantest and its customers, VOICE is the leading conference for the growing international community of users and strategic partners involved with Advantest's V93000 and T2000 SoC test platforms as well as Advantest memory testers, handlers and test cell solutions. The conference, celebrating its 10th anniversary in 2016, offers a unique opportunity to take part in making semiconductor testing operations as efficient and cost-effective as possible. Attendees gain and share valuable insights, build long-lasting relationships and learn what's new about Advantest test equipment, handlers and applications.

At a press event kicking off CES 2016, Nvidia has unveiled artificial-intelligence technology that will let cars sense the environment around them and pilot a safe route forward.Nvidia CEO Jen-Hsun Huang revealed Drive PX 2, an automotive supercomputing platform that processes 24 trillion deep learning operations a second, 10 times the performance of the first-generation Drive PX, now being used by more than 50 companies in the automotive world.The new Drive PX 2 delivers eight teraflops of processing power and is the size of a lunchbox, in contrast to earlier autonomous-driving technology being used today, which takes up the entire trunk of a mid-sized sedan, Nvidia said.Huang announced that Volvo will be the first automaker to deploy Drive PX 2.The Sweden-based automaker will lease 100 XC90 luxury SUVs outfitted with Drive PX 2 technology. The technology will help the vehicles drive autonomously around Volvo's hometown of Gothenburg, and semi-autonomously elsewhere.Huang noted that a number of automotive companies are already using Nvidia's deep learning technology to power their efforts, getting speedups of 30-40X in training their networks compared with other technology. BMW, Daimler and Ford are among users, along with innovative Japan-based startups like Preferred Networks and ZMP.Nvidia's end-to-end solution for deep learning starts with Nvidia Digits, a supercomputer that can be used to train digital neural networks by exposing them to data collected during time on the road. On the other end is Drive PX 2, which draws on this training to make inferences to enable the car to progress safely down the road. In the middle is Nvidia DriveWorks, a suite of software tools, libraries and modules that accelerate development and testing of autonomous vehicles.DriveWorks enables sensor calibration, acquisition of surround data, synchronization, recording and then processing streams of sensor data through a complex pipeline of algorithms running on all of the Drive PX 2's specialized and general-purpose processors.Nvidia Drive PX 2 automotive supercomputing platformPhoto: Company

The IoT, big data, and cloud open up various smart applications from homes, factories, cities, to homeland security and disaster prevention and management. "When IoT is applied from cities to remote areas in various environments, in order to generate the best values, one must customize accordingly for tight integration," said YC Cheng, Assistant VP of NEXCOM's IoT Automation Solutions Group.Take oceanographic observation for example. Observation sites are rurally located, adding difficulties to power supplying and last-mile data transmission. Gateways in this case should be designed with energy-efficiency to leverage solar, wind energy, or storage batteries for 24/7 operations. They can help operators better understand asset conditions with the monitoring of blade speed, battery's degeneration, temperature, and humidity to avoid system malfunction and data loss.Regarding telecommunication, wireless broadband (WB) is one of the best networking options. Combining Wi-Fi, mesh networking, hopping, high power radio frequency, and directional antennas, WB builds up a wide-coverage wireless network, which offers multi-channel data transmission with high availability, thus simplifying Internet coverages in rural areas. With the commercialization of wireless 802.11ac standard, dashing wireless technologies could further support city-wide, bandwidth-hungry projects like city surveillance and free public Wi-Fi services, relieving 3G/LTE workloads.NEXCOM centers on IoT gateways with focuses on power efficiency, integrated sensing technologies, IoT protocols, and cloud integration. With industrial-grade, high-speed, and wireless hotspot technologies of IWS series, NEXCOM helps ride on the cloud and add more application values with the harmonic balance between economic growth and the environment.For more information about NEXCOM, please visit http://www.nexcom.com/To shine from cities to outskirts, IoT gateways must adapt to local circumstances to extract true value of IoT.

Global electronic components distributor Digi-Key Electronics, the industry leader in electronic component selection, availability and delivery, is announcing they have surpassed shipping its 50 millionth package in the history of the company."Digi-Key has been serving electronic design engineers and 'Makers' in our industry before they were even called 'Makers' since our very beginning in 1972," according to Dave Doherty, President. "So recognizing this milestone of shipping our 50,000,000th package was something we wanted to celebrate. But we also wanted to recognize our customers who have driven our success; and not just a single customer, because we do business with well over 400,000 different companies each year."In celebration of this key milestone, Digi-Key has been featuring key customers in regions all around the world. In North America, Plexus in the US was recently recognized for their role in this unique milestone with the presentation of a "bronze package" award presented to Dale Kratz, Global Commodity Director by Chris Porter, Area Director, Business Development North Central for Digi-Key.Plexus is known for providing electronics design, manufacturing and aftermarket services to companies with mid-to-low volume, higher complexity products. They have been delivering comprehensive Product Realization solutions to customers for more than 35 years.Plexus was selected by Digi-Key as they typify the broad range of products and services they provide to enable innovation in the marketplace.Digi-Key provides engineers with over 1.2 million products in stock and ready for immediate shipment, as well as access to more than 4.6 million components online. The company is an authorized distributor for 650+ quality name-brand manufacturers, ensuring customers get the latest technology, state-of-the-art products, unparalleled service, and continual new product introduction.Digi-Key also supports the design process with numerous EDA and design tools, plus a comprehensive BOM manger tool. The company's main objective is to accelerate the time to market for design engineers around the world.About Digi-Key ElectronicsDigi-Key Electronics, based in Thief River Falls, Minn., is a global, full-service provider of both prototype/design and production quantities of electronic components, offering more than three million products from over 650 quality name-brand manufacturers. With over one million products in stock and an impressive selection of online resources, Digi-Key is committed to stocking the broadest range of electronic components in the industry and providing the best service possible to its customers. Additional information and access to Digi-Key's broad product offering is available at http://www.digikey.com/.Plexus in the US has been recognized with the presentation of a "bronze package" award presented to Dale Kratz, Global Commodity Director by Chris Porter, Area Director, Business Development North Central for Digi-Key.

Indium Corporation was presented with the Global Technology Award for Best Products - Americas for InFORMS high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.InFORMS are revolutionary in their ability to provide uniform bondline thickness. An uneven solder bondline thickness can cause stress at the thinner sections, leading to delamination and premature failure during the operational life of the module. The uniform bondline thickness created by InFORMS prevents this stress.InFORMS also ensure high reliability by reducing voiding.In testing, InFORMS have shown to improve the reliability of the interconnect to at least 3,500 thermal cycles, which drastically exceeds the typical reliability specification of 1,500 passive thermal cycles for -55/+150 degrees C.Sponsored by Global SMT & Packaging, the Global Technology Awards have acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for the past 10 years.For information about InFORMS, visit www.indium.com/informs or email askus@indium.com.Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.For more information about Indium Corporation, visit http://www.indium.com/ or email abrown@indium.com. You can also follow our experts, From One Engineer To Another (#FOETA), at www.facebook.com/indium or @IndiumCorp.InFORMS

The IIoT essence lies in providing instant response, adding values to applications through the interweaving of internet resources and data analysis. "Despite the cloud and the Internet of Things (IoT) are in the limelight, the touchdown of big data analysis still needs to utilize field devices," said Alex Perng, NEXCOM Chief Technology Officer.With colossal amounts of data volume and variety, the cloud is swamped with data receiving and storing from end devices. Dispersedly deployed at the source of the data and with smaller amount of data to process, edge computing simultaneously filters, analyzes, and interprets field data, thus improving response time and efficiency.Apt for edge computing tasks, IoT gateways help implement predictive maintenance with preliminary collecting and analyzing operating data and identify if the equipment is operating normally, or if it is necessary to shift production lines, or to notify engineers to schedule parts replacement. Real-time information eliminates unnecessary production interruptions while owners can use enterprise backend servers or cloud services in case there is a need for notification.The web-based configuration tool, NEXCOM IoT Studio, is built for simplified deployment. Connection is easily configured with simple clicking and dragging steps. Each piece of data can be viewed as an input for analysis, an event trigger, or a node linking to the cloud. Depending on applications, each node can be send to multiple clouds via built-in cloud connection, averting issues like incompatible data format or protocols.Through smart IoT gateways and NEXCOM IoT Studio configuration tool, edge computing is brought to the front end for timely and responsive judgments. With technical expertise in IoT gateways, NEXCOM has been working with numerous businesses to take the lead in IIoT opportunities.For more information about NEXCOM, please visit http://www.nexcom.com/Edge computing can increase response efficiency, save network bandwidth, and relieve cloud workloads.

Imagination Technologies (IMG.L) and PEZY Computing K.K. announce a strategic partnership focused on development of next-generation efficient high performance computing (HPC) systems. Through the collaboration, PEZY, a Japan-based processor company, will integrate Imagination's highly efficient 64-bit MIPS Warrior CPUs in its next-generation PEZY-SC2 many-core processors for supercomputers and other high-performance applications.With its first generation PEZY-SC processors, PEZY-based supercomputers already occupy the top three positions on the Green500 list, a biannual ranking of the most energy-efficient supercomputers in the world. These top supercomputers were created combining PEZY's large-scale many-core processors and the submersion liquid cooling systems created by its sister company ExaScaler. The next-generation compute platform will integrate MIPS host processors on-chip with 4k cores for much higher performance and greater efficiency.Motoaki Saito, M.D., Ph.D., PEZY founder, president and CEO, says: "Imagination's industry leading technologies, combined with its vision for the future, make it an ideal partner for us as we take our innovations to the next level. To address important emerging opportunities in areas such as supercomputing and artificial intelligence, we are building a long-term strategic alliance with Imagination that we believe will change the HPC world and offer disruptive solutions in many other application areas as well. The forthcoming PEZY-SC2 will be quite powerful, unique and still energy efficient thanks to Imagination's 64-bit MIPS Warrior CPUs and its flexible configuration offered to PEZY. PEZY-SC2 powered by Imagination's 64-bit MIPS Warrior CPUs will be more than a game changing processor in many ways and we are looking forward to propelling the technology advancements in the HPC world."Hossein Yassaie, CEO, Imagination, says: "Through our long-term strategic partnership with PEZY, we look forward to undertaking a range of projects with an eye on creating ground-breaking solutions. Imagination and PEZY share a strong and common vision of the future where computing is about delivering the highest performance at the best efficiency. Such an objective requires state-of-the-art design innovations at both the silicon and system levels. PEZY's focus on efficiency has seen it rise to a leadership position confirmed by independent benchmarks. We share with PEZY a philosophy of designing for the best possible power, performance and area and we look forward to helping them enable the next generation of the world's most efficient high-performance computing systems."