American Megatrends Inc. (AMI), a global leader in BIOS and UEFI firmware, server and remote management tools, data storage products and unique solutions based on the Linux and Android operating systems, is proud to announce the launch of OEM server systems with Aptio V support for Diablo Technologies' Memory1.Over the span of a year, AMI worked alongside Diablo Technologies to integrate AMI's flagship Aptio V UEFI firmware features with Diablo's Memory1 system memory module. With AMI's support for Diablo's Memory1 technology, OEMs in the server industry can expect higher capacities and greater performance when creating their system solutions. Together, Aptio V and Memory1 not only add memory capacity and economic value to OEMs, but also provide the tools to create high quality hardware solutions for their end users. The first shipment of server systems with this support is now publicly available and Aptio V is updated for Memory1 to support 3rd and 4th generation Intel Xeon (D- and E-series) server processors.Aptio V from American Megatrends represents the "next generation" of UEFI BIOS firmware and comes fully equipped with support for the latest UEFI specifications. AMI leads in the UEFI/BIOS industry with over 30 years of development experience - and Aptio V is designed to exceed the expectations of various market segments, specifically the server, embedded, tablet, client, and ARM markets.Diablo Technologies' flagship Memory1 is a system memory solution that efficiently optimizes big data applications by providing up to 2TB of application memory in a single, dual-socket server. Memory1 128GB all-flash DDR4 DIMMs integrate seamlessly with standard servers without changes to the operating system, hardware or applications. With Memory1, OEMs can significantly lower the total cost of ownership for end users - creating more performance per server to benefit big data analytics, database and cloud applications. Diablo's system memory solution is production released and available now through select server OEMs."This partnership with AMI has enabled a rapid market launch and the success of Memory1 in delivering Big Memory for Big Data," said Mark Stibitz, Chief Executive Officer of Diablo Technologies. "Incorporating Memory1 support into Aptio V, the industry's leading UEFI firmware solution for servers, provides multiple advantages to OEMs and end-users, along with the confidence of having a robust, easy to deploy, industry-standard solution.""The collaboration between AMI and Diablo Technologies to integrate Aptio V with DDR4 Memory1 modules is another sign of our commitment to embrace the very latest hardware protocols and standards in server design," said Subramonian Shankar, President, CEO and Founder of American Megatrends. "We share the excitement of Diablo Technologies to be able to provide our OEMs with support for this technology, as we see its vast potential as the industry continues to move towards high-capacity, low cost, energy-efficient memory solutions for datacenter and big data applications," he continued.

Socionext Inc., an emerging leader in advanced SoC technology for video and imaging systems, today announced the release of SC2M15, a new codec IC designed for video transmission equipment. The device can process decoding, transcoding and encoding of H.264/HVC video and audio signals with a single chip, and is suitable for applications including digital broadcasting and video streaming through Internet Protocol among others. Socionext will start volume shipments of the SC2M15 at the end of September.In addition to the conventional digital broadcasting, new applications such as video distribution through Internet Protocol (IP), infrastructure surveillance and medical imaging are driving the expansion of the video transmission equipment market. Requirements for these kinds of equipment include higher stability and lower overall system cost. To keep pace with such needs, the transition is underway from software-based to hardware-based architectures. Socionext's new codec IC meets those challenges, providing essential functions such as transcoding of multiple video streams and high image quality encoding at low bit rates.Developed based on the company's long-time experience on signal processing technology, the SC2M15 is equipped with all the necessary and sufficient functions for video transmission, which includes simultaneous transcoding of three channels of H.264 / full-HD video and audio, high image quality encoding at a low bit rate such as 1080i60 and 2Mbps. In addition, the SC2M15 is designed as a slave-type device, meaning it can be controlled by external CPU through serial interface, giving users the freedom to design various equipment for wide range of applications including digital broadcasting, security systems, and medical imaging, as well as video capture and in-house video communication systems.Socionext aims to be the world's leading solution provider in the video transmission equipment market, by offering advanced codec products like SC2M15 and related services.About Socionext Inc.Socionext is a new, innovative enterprise that designs, develops and delivers System-on-Chip products to customers worldwide. The company is focused on imaging, networking, computing and other dynamic technologies that drive today's leading-edge applications. Socionext combines world-class expertise, experience, and an extensive IP portfolio to provide exceptional solutions and ensure a better quality of experience for customers. Founded in 2015, Socionext Inc. is headquartered in Yokohama, and has offices in Japan, Asia, United States and Europe to lead its product development and sales activities. For more information, visit socionext.com.SC2M15

The world's first SiP (System in Package) processed LoRa+MCU solution is presented today through the extraordinary collaboration between the world-leading Internet of Things solution providers Gemtek Technology and AcSiP. Gemtek Technology is a renowned wireless broadband manufacturer, as AcSiP is a professional module manufacturer.SiP shrinkage is one of the core technologies of module miniaturization. And by applying this superior advanced technology into the production of LoRa+MCU integrated products under the SiP semiconductor packaging framework, Gemtek Technology (http://www.gemtek.com.tw/giot/index.html) and AcSiP (http://www.acsip.com.tw)combined/ have successfully come up with a 13mm x 11mm module, which is relatively smaller in size in contrast to the former 18mm x 18mm module. This excessively decreased footprint requirement in terms of PCBA space, which could render more flexibility and broader potentials for future customer product designs due to its miniature size and may well benefit the now popular wearable device products on the market. LoRa-MCU SiP module is the highly anticipated solution for the consumer electronics industry in recent years.The current LoRa+MCU SiP joins togther the advantages of small-size and high-integration, which not only enables end product designs to be lighter in weight, but also simplifies the PCBA design, and therefore significantly reduce the time and cost in customer induction, research and development.Gemtek and AcSiP are the pioneers in introducing the LoRa+MCU SiP product to the world. LoRa chips are developed by Semtech. MCU (Microprogrammed Control Unit) are developed by STMicro. This SiP package has incorporated the crystal, RF switch and matching circuits etc. With the support from the original manufacturers, it draws the goal to achieve high-level integration for solution providers within the industry closer to market expectations. And with the cooperation among these original companies, applications and availability may be enhanced to a higher standard. LoRa wireless technology emphasizes the quality features of long distance, high penetration, high sensitivity etc., which may complement the shortfalls seen between BT/Wi-Fi and 2G/4G. The LoRa wireless technology demonstrates infinite possibilities and is expected to achieve higher grounds.The LoRa solution provides a complete set of SDK/HDK package, which is compatible with LoRaWAN and may help customers to accomplish various application developments via a faster pace. AcSiP has mentioned that with the support of a simple solution and robust technical foundation, they aspire to promote the establishment of more LoRa devices, in a way to accelerate and expand the scope of applications associated with the Internet of Things.Overseeing all advantages, the LoRa+MCU SiP is expected to replace the former LoRa solution that used to adopt module or CoB packaging methods and will be engaged in a wider span of LoRa applications, which includes home automation applications as in wearable devices, domestic tracking devices, machinery and merchandise tracking devices, home-care applications, landslide and waterlevel monitors, pollution prewarning systems, smart electricity meters etc. Smart city street and relevant management facilities may employ the technology to improve the prospects of living.Gemtek and AcSiP are the pioneers in introducing the LoRa+MCU SiP product to the world.

With just a few weeks to go to the biggest 5G event in the region, we would like to announce our confirmed Show Headline speakers sharing the latest in 5G, 5G architecture, services and much more!Hear it first at 5G Asia!• Tay Yeow Lian, MD Networks, SingTel, will be speaking about SingTel's Journey to 5G• Park Jin-Hyo, Senior Vice President-Network Technology R&D, SK Telecom, will be speaking about SK Telecom's Journey Towards 5G Commercialization• Fred Xiao, NFV&Cloud Chief Marketing Expert, Huawei, will be speaking about 5G Road to a Super Connected World• Takehiro Nakamura, VP & MD 5G Lab, NTT DOCOMO, will give an update of NTT DOCOMO activities toward 5G deployment in 2020 and beyond• Subbu Subramanian, Engineering Director, Facebook, will be speaking about Flexible Network Architectures for Ubiquitous 5G LTE• Boudewijn Pesch, VP Sales, JAPAC. Oracle Singapore, will be evaluating the Road to 5GPeople currently registered include:• Head of Development, AirAsia Bhd• CTO, Altel• CFO, Arete M Pte Ltd• CEO, AzQtel• Chief Advocacy Officer + Director, Binary HealthCare• CEO, Cateleya• Group CFO, Celcom• Chief Scientist, Wireless Technologies, China Mobile Research Institute• Senior Vice President and Captive Head, Comcast• Vice president & chief technology officer of Antenna Systems, CommScope• Head of Content - APAC, Dailymotion• Chief Corporate Affairs Officer, DiGi Telecommunications• Senior Engineering Director, Facebook• CEO, First Media/Bolt of Indonesia• Chairman, KDDI R&D labs• CTO, Lanka Bell Ltd• Chief Operating Officer, M1 Limited• Vice President, NTT DOCOMO• IT Manger, SingPost Ltd• Senior Vice President, SK Telecom• AVP, StarHub Ltd • Vice President - Product Architecture, Telstra• AGM, U Mobile Sdn Bhd• Head Roaming Manager, VIETTEL (Cambodia)• Head, Service Management Asia , Vodafone Global Enterprise• CEO, YTL Communications.......and many more! Download the full attendee list here.

Filled with cutting-edge content, future-focused product demo's and unrivaled opportunities to meet with the LTE and 5G ecosystem, 5G Asia is THE event in the APAC region to set you on the path for the connected future. Co-located with Network Virtualisation and SDN Asia, 5G Asia provides the platform to discuss the future of wireless networks & technology in the APAC region - the most advanced LTE & 5G markets in the world.Formally known as LTE Asia, 5GAsia conference offers attendees the opportunity to discover how the most innovative operators are getting 5G ready, along with how they are starting to optimize their LTE Networks through Carrier Aggregation, LTE-A, VoLTE, Video and RCS.Moving towards a connected generation where connectivity is a key challenge, the show will hear from IoT experts for the first time to share use case for 5G networks, while the demo zone in the exhibition will show hands-on examples of what the future holds.Click here to register now OR, if you are an operator in the APAC region, you can register for your free operator pass.Website: https://tmt.knect365.com/5g-asia/

Apple has introduced the iPhone 7 and iPhone 7 Plus. The iPhone 7 series is the first water and dust resistant iPhone. The iPhone 7 and iPhone 7 Plus will be available in more than 25 countries beginning September 16.The iPhone 7 features a 12-megapixel camera with a f/1.8 aperture and 6-element lens. The iPhone 7 Plus features the same 12-megapixel wide angle camera as iPhone 7 and adds a 12-megapixel telephoto camera that together offer optical zoom at two times and up to 10 times digital zoom for photos.Coming later in 2016, the dual 12-megapixel cameras also enable a new depth-of-field effect, using both cameras on iPhone 7 Plus to capture images, while technology including Machine Learning separates the background from the foreground.The camera systems also feature new Apple-designed image signal processor, which processes over 100 billion operations on a single photo in as little as 25 milliseconds, new 7-megapixel FaceTime HD camera, advanced pixel technology and auto image stabilization; and new Quad-LED True Tone flash that is 50% brighter than iPhone 6s including a sensor that detects the flickering in lights and compensates for it in videos and photos, according to Apple.The new custom-designed Apple A10 Fusion chip features a new architecture. The smartphones also have a longer battery life than its predecessors. The A10 Fusion's CPU now has four cores, integrating two high-performance cores that run up to two times faster than iPhone 6, and two high-efficiency cores that are capable of running at just one-fifth the power of the high-performance cores. Graphics performance is also more powerful, running up to three times faster than iPhone 6 at as little as half the power, enabling a new level of gaming and professional apps, according to Apple.Both phones include support for up to 25 LTE bands and LTE Advanced for three times faster data rates than iPhone 6 at up to 450 Mbps. For customers in Japan, iPhone will now support the FeliCa contactless technology, bringing the ability to use credit and prepaid cards, including on iD and QuicPay domestic networks, and Suica, Japan's transit card issued by JR East.New stereo speakers offer sound that is two times louder than iPhone 6s, offering increased dynamic range of sound and a higher quality speakerphone. The new iPhone comes with EarPods with Lightning connector as well as a 3.5mm headphone jack adapter that allows customers to use old headphones and accessories.The new AirPods, Apple's new wireless headphones, feature the new Apple W1 chip. The AirPods harness the power of Siri, allowing users to access their personal assistant with a double tap.The iPhone 7 and iPhone 7 Plus come in a design in silver, gold and rose gold finishes and introduce two all-new black finishes, a black finish that has an anodized matte appearance, and an jet black finish that has a deep, high-gloss look. The new jet black finish is accomplished through a nine-step process of anodization and polish for a uniform, glossy finish, according to Apple. An entirely reengineered enclosure results in a water resistant iPhone offering protection against spills, splashes and dust.The new iPhone features a new Retina HD display with a wide color gamut for cinema-standard colors, color saturation and color management. There is an all-new solid-state Home button on iPhone 7, which, working in tandem with the new Taptic Engine, provides more precise and customizable tactile feedback.The iPhone 7 and iPhone 7 Plus will be available in silver, gold, rose gold and the new black finish in 32GB, 128GB and 256GB models starting at US$649, and the new jet black finish will be offered exclusively on the 128GB and 256GB models.Through Apple's iPhone Upgrade Program, customers in the US, and for the first time in the UK and China, can get an unlocked iPhone 7 or iPhone 7 Plus, with the protection of AppleCare+, choose their carrier and have the opportunity to upgrade to a new iPhone every year. The iPhone Upgrade Program is available with monthly payments starting at US$32.3Customers will be able to order the iPhone 7 and iPhone 7 Plus beginning September 9, with availability beginning September 16, in Australia, Austria, Belgium, Canada, China, Denmark, Finland, France, Germany, Hong Kong, Ireland, Italy, Japan, Luxembourg, Mexico, Netherlands, New Zealand, Norway, Portugal, Puerto Rico, Singapore, Spain, Sweden, Switzerland, Taiwan, UAE, the UK, US Virgin Islands and the US.The iPhone 7 and iPhone 7 Plus will be available in Andorra, Bahrain, Bosnia and Herzegovina, Bulgaria, Croatia, Cyprus, Czech Republic, Estonia, Greece, Greenland, Guernsey, Hungary, Iceland, Isle of Man, Jersey, Kosovo, Kuwait, Latvia, Liechtenstein, Lithuania, Maldives, Malta, Monaco, Poland, Qatar, Romania, Russia, Saudi Arabia, Slovakia and Slovenia beginning September 23. The iPhone 7 and iPhone 7 Plus will also be available to customers in India beginning October 7.The new Apple-designed wireless AirPods including charging case will be available for US$159 beginning in late October. All iPhone 7 and iPhone 7 Plus models will include EarPods with Lightning Connector and a Lightning to 3.5 mm Headphone Jack Adapter, also sold separately for US$29 and US$9, respectively.Apple-designed accessories including leather and silicone cases in a range of colors will be available starting at US$35 and iPhone 7 Smart Battery Case will be offered in black and white for US$99. Lightning Docks in several color-matching metallic finishes will also be available for US$49.Apple iPhone 7 and 7 PlusPhoto: Company

Entegris Inc. (NASDAQ: ENTG), a leader in specialty chemicals and advanced materials solutions for the microelectronics industry, is proudly celebrating its 50th year of helping customers solve their critical materials challenges and enhance their manufacturing yields."It has been an exciting journey for us that began with the emergence of Moore's law and that has tracked the growth of the semiconductor industry into a $330 billion market," noted Bertrand Loy, president and chief executive officer of Entegris, at the semiconductor industry's annual SEMICON West trade show in San Francisco. Mr. Loy continued: "Today, we are thrilled to be in a position to help enable the many innovations our customers continue to develop, not only in the microelectronics market but in an increasing array of industries."Entegris was formed in 1966 as Fluoroware, a startup company serving early microelectronics manufacturers. After merging with EMPAK in 1999 and rebranding itself Entegris, the company went public in 2000. The company expanded in 2005 with the merger with Mykrolis, a spinoff from Millipore, and again in 2014 with the successful acquisition of ATMI, a publicly held supplier of high-performance electronic chemicals. Today, with approximately 3,500 employees worldwide and more than $1 billion in annual revenue, Entegris stands as one of the largest global, high-performance, specialty chemical companies serving the microelectronics industry."Our success has been built on strong corporate values and has centered around teamwork, innovation and dedication to excellence, which have allowed us to introduce a number of market-leading product platforms throughout the years. We could not have achieved this milestone without the support of our customers and suppliers, and the dedication of our employees. I am grateful to all and I invite everyone to celebrate this milestone with us," Mr. Loy added.Over its 50-year history, Entegris has brought hundreds of innovations to its markets, including many technology "firsts." Among its notable products are Integra valves, Spectra FOUPs, PrimeLock fittings, Torrento liquid filters, SDS safe gas delivery systems and NOWPak liquid dispense systems. Industry "firsts" include the first linear wafer carrier, first wafer shipper, first wafer suspension system and the first 300mm FOUP (wafer carrier)."I am truly excited about what lies ahead for Entegris. We are addressing dynamic markets that increasingly rely on the kind of high-performance purity solutions we are known for. With our strong technology platform and our relentless focus on operational excellence and innovation, we look forward to continuing to deliver for our customers and our strategic partners," Mr. Loy concluded.Entegris products will be on display during SEMICON West on the second floor of the W Hotel near the Moscone Convention Center. Or, for more information, visit the company's website at http://www.entegris.com/.About EntegrisEntegris is a leading provider of yield-enhancing materials and solutions for advanced manufacturing processes in the semiconductor, life sciences and other high-technology industries. Entegris is ISO-9001 certified and has manufacturing, customer service and/or research facilities in the United States, China, France, Germany, Israel, Japan, Malaysia, Singapore, South Korea and Taiwan. Additional information may be found at http://www.entegris.com/.Entegris Celebrates 50 Years in Business. Company traces its roots to the 1966 founding of fluoroware

Clientron has introduced its latest POS terminal (PT3200), featuring quality and cost-effective benefits, to play in the Retail and Hospitality Point-of-Sales market place. PT3200 has a neat and sleek enclosure design, and its affordable price makes it suitable for either Entry-level or Mainstream POS markets.With a solid, bezel-free front panel design, PT3200 remains attractive with easy cleanness. The strong panel design offers IP64 water and dust-proof protection with an optional 6H degree scratch-proof P-Cap touch screen.Featuring fan-less system design for long life span, PT3200 works with an Intel power efficient quad-core processor. For peripheral support, it provides options including 1D/2D barcode scanner, RFID reader, iButton, fingerprint reader, smart card reader, VFD, and 8" /10.4"/15"customer displays. To enhance the user experience, PT3200 comes with an easy access 2.5" HDD tray for install and maintenance. It also supports industrial standard VESA mounts for different applications/environments such as Self-service Terminal, Price Checker, and Digital Signage for product promotion.With decades of experiences in embedded platform design and manufacturing, Clientron offers high quality POS terminals with flexible mounting options, and easy maintenance for lower TCO (Total Cost of lifetime Ownership) availability. Clientron is a true IDM (Integrated Design and Manufacture) vendor of POS devices, and is not just an assembler of other makers' products; so users can rely on Clientron products to give them the best performance, a professional POS wherever goods or services are provided.PT3200 samples are available now. For more details about our products, please contact your Clientron sales representative, or visit us at our website: http://www.clientron.com/Clientron to debut its POS Terminal PT3200 with quality and cost-effective benefits

Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) earned a Best of Show Award with its T5851 tester at the 11th Annual Flash Memory Summit, held August 9-11 in Santa Clara, Calif. The awards presented at the summit provide the highest honors in the flash memory and solid-state storage industry.In the category of Most Innovative Flash Memory Technology, Advantest's T5851 system was recognized for changing the way flash memory is tested to improve the performance, availability, endurance and/or energy efficiencies of electronic products. The T5851 provides multi-protocol support in one tool for high-performance universal flash storage (UFS) devices and PCIe BGA solid-state drives, minimizing customers' capital investments and deployment risks. Its tester-per-DUT architecture and proprietary hardware accelerator deliver the fastest test times in the industry, contributing to a lower cost of test.The T5851 is designed for high-volume testing, as well as reliability and qualification testing, of protocol NAND devices. This flexible system can be configured to test up to 768 devices in parallel by using an automated component handler such as Advantest's M6242 system."We are proud to receive this industry acknowledgment of the innovative advances that we bring to the market for non-volatile memories, which are so vital to low-power, mobile applications," said Masuhiro Yamada, executive officer with Advantest. "Our T5851 system is designed for system-level testing of these devices while still providing the reliability, low-cost and high-volume productivity that the market needs.""The booming market for new consumer electronics utilizing flash storage creates the challenge for a scalable platform for testing flash memory," said Jay Kramer, chairperson of the Flash Memory Summit's Awards Program. "We are proud to select Advantest's T5851 for the Best of Show Technology Innovation Award as it is available in both production and engineering models to address a wide range of test program environments while providing the versatility to test the memory ICs powering smart phones, tablets and ultra-portable laptops."About Flash Memory SummitFlash Memory Summit, produced by Conference ConCepts, showcases the mainstream applications, key technologies and leading vendors that are driving the multi-billion-dollar non-volatile memory and SSD markets. FMS is now the world's largest event featuring the trends, innovations and influencers driving the adoption of flash memory in demanding enterprise storage applications as well as in smartphones, tablets and mobile and embedded systems.About Advantest CorporationA world-class technology company, Advantest is the leading producer of automatic test equipment (ATE) for the semiconductor industry and a premier manufacturer of measuring instruments used in the design and production of electronic instruments and systems. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also focuses on R&D for emerging markets that benefit from advancements in nanotech and terahertz technologies, and has introduced multi-vision metrology scanning electron microscopes essential to photomask manufacturing, as well as groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest established its first subsidiary in 1982, in the USA, and now has subsidiaries worldwide. More information is available at www.advantest.com.

After more than 30 years of supplying advanced materials and delivery systems to the global semiconductor industry, the Electronic Materials business of Air Products is expected to soon be fully operating as Versum Materials.With the spin-off of the business from Air Products planned for October 2016, Versum will publicly introduce its new identity and capabilities at SEMICON Taiwan, September 7-9, 2016. Versum will showcase, in Booth #138 - 4th Floor, the innovative products and services that make the company one of the industry's largest and most respected suppliers."Given Versum's focus on the semiconductor market as well as our significant presence in Asia, SEMICON Taiwan presents an ideal opportunity to introduce ourselves as a new standalone company and communicate how we will build upon the market leadership we've established over many decades," said Guillermo Novo, who will be CEO of Versum Materials, Inc. after the spin-off.As Versum, we will be more committed than ever to collaborating with our customers to make the future possible for them and their consumers worldwide. We will structure our entire business around meeting the evolving needs of the semiconductor, display and LED markets now and for years to come."At the SEMICON Taiwan show, Versum will be promoting its next generation CMP slurries, ultra-thin dielectric and metal film precursors, formulated cleans and etching products, and delivery equipment which continue to revolutionize the semiconductor industry. Information on the products and services displayed at the show will be available at www.airproducts.com/semicon.