Thermalytica, a spin-off startup from Japan's National Institute of Materials Science (NIMS), has developed an ultra-low density and lightweight silica-based thermal insulation material. The material, TIISA, is revolutionary in its structure; its volume can expand up to ten times larger than traditional aerogel when compared at the same weight.
Blumind is pitching a farsighted approach of neural network processing using an all-analog architecture for AI applications to be more sustainable in the future. The company has completed the latest phase of R&D and is now looking to commercialize its high-performance, low-cost, and sustainable AI chips.
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, has released the full Season 3 of its "City Digital" video series, which explores the evolution and future of IoT in the automotive industry.
As more players enter the cryptocurrency space, mining becomes more complex and requires more computing power. As a result, many people who used to mine cryptocurrencies using their own hardware are now finding it unsustainable due to high electricity bills and hardware wear and tear. Therefore, cloud mining has become an attractive option.
Fan-out panel level packaging (FOPLP) offers advantages in cost control, high-density integration, and high reliability. After years of research and development, the technology has matured and its scope of application has gradually expanded beyond vehicle-mounted applications. It has become a critical packaging process for next-generation RFIC used for low earth orbit satellites...
Global Unichip Corp. (GUC), the advanced ASIC leader, announced that they have silicon proved 8.4 Gbps HBM3 solution on TSMC's 5nm process technology. The platform was demonstrated at the Partner Pavilion of the TSMC 2023 North America Technology Symposium. It contains a fully functional HBM3 Controller and PHY IP and vendor's HBM3 memory using TSMC's industry leading CoWoS® technology.
The semiconductor manufacturing industry, which constantly pursues ultimate performance, small form factors, and minimal power consumption, has been continuously refining various technologies in recent years...
DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, announced that it significantly expanded its portfolio in the first two quarters of 2023 by adding 300 new suppliers across their core business, DigiKey Marketplace and Fulfilled by DigiKey program.
Today DTS, Inc., which creates extraordinary experiences, announced the official launch of immersive audio support for DTS Play-Fi Home Theater, the only whole-home wireless solution to support 12 channels of discrete sound, for a higher-fidelity listening experience...
