Instant open-banking payments have become a defining feature of the modern gambling experience. In Finland, new financial technology is being introduced in connection with upcoming regulatory reforms scheduled for 2026, allowing players to move money directly from their bank accounts with unprecedented speed. Similar systems are already spreading across Europe, with the difference striking when compared with older methods that sometimes left players waiting days for deposits or withdrawals. When you can move funds instantly, you gain confidence in the platform and can focus on the experience itself rather than wondering when a transaction will clear. These seamless banking options also reduce the risk of errors and disputes, creating a smoother interaction between you and the operator. For example, in the UK, by July 2025, open banking services had over 15.16 million users (nearly one in three adults), making 29.89 million transactions in that month alone. As regulations oscillate, you will likely see open-banking frameworks adopted more widely, making fast and secure transfers a new standard.Cryptocurrencies, Blockchain and Provably Fair PlayThe integration of cryptocurrencies has shifted from an experimental idea to a practical tool within online gambling. With blockchain technology, players can now verify that random number generation and game outcomes are provably fair, which reduces uncertainty and builds trust. In practice, this means you can look under the hood of a system and see exactly how outcomes are generated. Transaction times are another area where blockchain shines, as crypto withdrawals can clear in minutes, compared with the lengthy delays of traditional banking. The appeal grows further when you consider transaction costs: moving money with cryptocurrencies often avoids the heavy fees attached to cross-border banking. If you are an international player, this can make a meaningful difference to your overall experience: transparency, speed and lower costs combine to make blockchain an increasingly attractive option for casual users and high-frequency gamblers valuing efficiency.AI and Behavioural Insights Protect Players and Personalise ExperiencesArtificial Intelligence is now a cornerstone of how online gambling platforms operate, going well beyond basic customer service. Modern AI systems study patterns of play to identify early signs of problematic behaviour, allowing intervention before losses spiral. As a player, you may receive personalised alerts or nudges when your behaviour changes, which can help you maintain a healthier relationship with gambling. At the same time, AI is working to make your experience more engaging, with tailored game recommendations, bonuses and even interface layouts that reflect your preferences. Support has also improved: chatbots powered by machine learning are increasingly capable of resolving questions quickly, cutting down on frustration when you need assistance. This dual focus (protecting you from risk while also improving your enjoyment) illustrates how AI is becoming a key part of the balance between entertainment and responsibility. Resources like Kasinoranking.com are also playing a part in this space, helping Finnish players navigate features such as AI-driven safety tools, provably fair games and modern payment systems reinventing the market.Regulatory Tech, Player Safety & Transparent OperationsAcross many jurisdictions, regulators are demanding greater transparency from online gambling operators. In the United Kingdom, for example, financial risk checks are being introduced for players who deposit above certain thresholds, with new rules lowering the monthly trigger point from around £500 to £150. This means you may be asked to verify affordability earlier than before, reflecting a push to protect vulnerable groups. Game design is also subject to reform: features like autoplay have been restricted, minimum spin speeds have been mandated, with players now seeing running totals of time spent and net wins or losses. These measures may seem restrictive at first, but they exist to give you clearer visibility and more control over your gambling habits. At the same time, regulators are scrutinising how operators protect player funds, particularly in cases of insolvency, which adds another layer of reassurance. Ultimately, the combination of financial oversight and gameplay transparency creates a safer backdrop for everyone involved.Tokens, NFTs and New Incentives for EngagementDigital tokens and non-fungible tokens are redefining loyalty programs within the gambling industry. Instead of traditional points systems, some operators are experimenting with blockchain-based assets that can be collected, traded or redeemed across multiple platforms. You might, for example, earn a token for reaching a milestone that could later have value outside the original platform. Ultimately, this blurs the line between playing for entertainment and participating in a wider digital economy. For many players, such rewards increase engagement and make the experience feel more interactive. As an illustration, Scandinavian markets are particularly receptive to these innovations, as players there are accustomed to advanced fintech features and transparent regulation. With new models emerging quickly, it is worth watching how digital rewards influence future gambling ecosystems and how they may connect to broader financial markets.Key TakeawaysFintech is reinvigorating online gambling in fundamental ways: first, the rise of open banking means you can move funds with a level of speed and simplicity that would have seemed impossible just a few years ago; second, cryptocurrencies and blockchain are bringing transparency to outcomes and efficiency to transactions, while AI is tailoring experiences and spotting risks in real time. In tandem, regulators are also stepping in, raising standards for safety and transparency to keep operators accountable. On top of this, new forms of digital rewards, from tokens to NFTs, are offering novel ways to engage. As a player, you now find yourself at the intersection of finance, technology and entertainment, where every year brings new tools and safeguards. Keeping up with these changes helps you make better choices and enjoy a more rewarding experience in a rapidly transforming terrain.How Fintech Innovations Are Transforming Online Gambling. Unsplash

Tescan Group in September 26, 2025  announced the acquisition of FemtoInnovations, a leading innovator in ultrafast laser technologies, and the creation of a dedicated Laser Technology Business Unit (LT BU) headquartered at the University of Connecticut (UConn) Tech Park. The new unit expands Tescan's correlative and multimodal portfolio for semiconductor, biomedical device manufacturing, and advanced research markets. FemtoInnovations brings to TESCAN a unique and disruptive laser platform-technology already proven in demanding workflows and attracting strong interest from leading global players across semiconductors, advanced manufacturing, and high-tech industries. "Bringing FemtoInnovations into the Tescan family is a strategic step that strengthens our ability to deliver end-to-end workflows. By combining ultrafast laser micromachining with our leading imaging and analysis platforms, we're enabling customers to move faster from problem to insight across failure analysis, sample preparation, R&D, and advanced manufacturing," said Jean-Charles Chen, Chief Executive Officer, Tescan Group.  Tescan will unveil the portfolio at ISTFA 2025 (Pasadena, CA) in November. "Our team has always been driven by the pursuit of innovation and the development of disruptive laser processing technologies. By combining our ultrafast laser systems with Tescan's leading imaging and analysis platforms, we are creating a powerful new dimension of integrated workflows. This partnership will accelerate discovery and redefine what's possible for our customers. We are excited to combine forces and contribute to Tescan's legacy of excellence and innovation," said Sina Shahbazmohamadi, Co-Founder, FemtoInnovations. The Laser Technology BU will be headquartered at the University of Connecticut Tech Park (UConn), tapping into its research ecosystem, talent and infrastructure. It will work in close synergy with Tescan's Electron Microscopy and Micro-CT business units to deliver integrated workflows beginning in 2026. A new FLAME Center (FemtoInnovations Laser Advanced Manufacturing & Engineering) will be established at the Innovation Partnership Building of UConn Tech Park to fast-track R&D, applications and workflow development. From a strategy standpoint, the decision centered on three things: the caliber of the FemtoInnovations team, the maturity of its ultrafast-laser platform for real-world workflows, and a clear cultural fit with customer-driven problem solving.  To learn more about Tescan, feel free to visit their website or subscribe their offcial LinkedIn account.Credit : Tescan

Digital innovations are detrimental to the growth of online entertainment platforms. The industry itself has seen an immense shift over the years, changing how people consume and create entertainment. Now, anyone can easily create a form of entertainment, monetize it, or opt to be an audience. Gaming's Digital TransformationThe gaming industry has one of the most noticeable growths over the years. Online platforms emerged, entirely changing how people can play and interact. Games become more accessible on multiple platforms, lowering the need for costly consoles. Even for casino games, which started as physical machines, are now more common online. As technology advances, players increasingly look for the best online casino that delivers seamless and secure experiences. Some online casinos have also offered apps that make the online betting experience easier and more flexible. Among all the digital innovations, Virtual Reality (VR) and Augmented Reality (AR) have become the trigger for developers to keep pushing. The industry wanted to broaden the digital world of gaming that blurs the lines between the physical and digital worlds. Meanwhile, Cloud gaming services eliminate hardware barriers. Esports has grown to become a billion-dollar industry. It's now housing professional leagues with massive audiences. In addition, social features are breaking into the gaming industry. It further ensures players can have social interaction while gaming. These features attract diverse demographics that extend beyond traditional gamers. The Streaming RevolutionStreaming platforms blew up and fully changed how content is distributed and consumed. Platforms like Netflix, Amazon Prime, and Disney+ lead the industry. They've equipped their platforms with features that can cater more to audiences. These include personalization capable of giving algorithm-driven recommendations. It has become easier for people to find entertainment catering to their preferences. Younger generations spend less time watching television. Some have completely left television for streaming platforms. This shows how networks must adapt to the changes and change their strategies to remain relevant. Now, streaming platforms are major content producers. They change how stories are told with billions invested in original programming. With the internet supporting streaming and smart TV technology delivering enhanced graphics quality, viewers can consume content that's of much better quality than traditional content. The Evolution of Music StreamingCassette tapes and MP3 players have been completely replaced by music streaming. At the beginning of the smartphone and the internet era, people needed specific software to play music. However, music streaming platforms have evolved into something that benefits the artists and listeners more. Platforms like Spotify and Apple Music are now the primary way people listen to music. The downside is that it's harder for artists to sell physical albums. To adapt to this change and innovation, they found new ways to monetize their music without sacrificing consumers' comfort. Artists now receive streaming revenue. As the landscape keeps changing, artists and fans will likely see more ways that they can engage with their favorite musicians and platforms, bringing new ways to make these artists flourish. Technologies on Live PerformancesBefore digital innovations, fans could only watch their favorite artists perform physically. They need to attend the concert venues and might struggle to do so if their idols are performing two countries away from where they live. Digital technologies bring live performances closer. Be it concerts or Broadway shows, artists can connect with more fans through live streaming or other technologies. Virtual Reality technology has also played a big part in enhancing live performances. It gives fans more dimension, a better online viewing experience than just watching on their device's screen. Virtual Reality amps up the immersion significantly. Despite not being physically present in the venue, fans can enjoy the live performance with a similar experience from the comfort of their home. Concert production also ensures that their stage settings in real life contribute to the online experience. They use elaborate lighting, better sound, and will edit the resulting video with effects that enhance the audience's overall experience. Social MediaSocial media has transformed into a place where various entertaining content is gathered. It's also now a place where people have the freedom to be creative and where fans can engage further with their favorite celebrities. Short-form video platforms open more paths for people to be creative. In addition, most social media platforms now allow users to live stream, enabling them to connect with people in real-time. This changes how people perceive creators and celebrities. They feel closer to their idols when they're active on their social media. With only one smartphone, anyone can build a brand for themselves and reach global audiences. Whether it's to promote themselves as an influencer or to open an online shop that's easy to access for everyone. New ways to enjoy content come from social media. There are Stories and Reels, which are innovations on how people can share or consume digital content. With built-in algorithms, social media ensures users remain engaged as they'll keep on finding content aligning with their interests. ConnclusionDigital innovation has fundamentally reshaped the landscape of online entertainment, empowering creators, enhancing audience experiences, and redefining how content is produced, distributed, and consumed. From gaming and streaming to music and live performances, technology continues to break barriers-making entertainment more immersive, accessible, and personalized. As platforms evolve and audiences diversify, the industry must remain agile, embracing innovation not just as a tool, but as a driving force behind the future of entertainment.The Role of Digital Innovation in Shaping Online Entertainment Platforms. Credit: Pixabay

Turkish President Recep Tayyip Erdogan met with Chinese President Xi Jinping at the Shanghai Cooperation Organization (SCO) summit in China. resulting in a multi-faceted agreement aimed at deepening cooperation across infrastructure, trade, and technology.A Key outcomes of the meeting was the alignment of China's Belt and Road Initiative with Turkey's Middle Corridor project. The plan features a southern branch of the China–Europe Railway Express, expanding freight routes via the South Caucasus. In addition, the two countries agreed to stimulate cooperation in 5G, renewable energy, and biomedicine. Ankara also reaffirmed its commitment to the one-China policy.Aligned with the summit, Turkey announced it will conduct a long-awaited 5G spectrum auction on October 16, 2025, with commercial services expected to launch to begin April 1, 2026.In the 700 MHz and 3.5 GHz bands, 400 MHz will be distributed among 11 frequency packages during the auction. Operators will pay in three installments, with a minimum total value of $2.125 billion.Eligible bidders include Vodafone Turkey, Turk Telekom, and Turkcell. Starting in 2029, operators will be required to remit 5% of their annual revenues to the Information and Communication Technologies Authority (BTK) 5% of their yearly revenues as part of the post-license consolidation process. Licenses will remain valid until the end of 2042.To strengthen its domestic technology sector and reduce reliance on foreign suppliers, the Turkish government mandates the use of locally produced infrastructure in the 5G rollout. Officials estimate the new network will deliver speeds 10 to 100 times faster than 4.5G.Machine-to-machine communications, smart city solutions, and industrial automation are great examples of enterprise applications. For consumers, the benefits will manifest as radically improved immersive experiences, such as lag-free cloud gaming, ultra-high-definition streaming, and seamless real-time interaction on low-latency online casino platforms. These advancements promise to make digital entertainment more responsive and engaging. Learn more about the latest developments in online casino technology, along with insights into current bonus structures.Turkey's move positions it as a regional telecom infrastructure leader. The October auction aligns with Erdogan–Xi pledges to integrate 5G into transcontinental logistics and trade infrastructure.Turkey is testing advanced 5G industrial use cases in addition to telecom rollouts. Together with Argela and Etiya, Turk Telekom is creating local 5G network-slicing technologies to facilitate charging frameworks and industry-specific applications. The company used 5G-Advanced ISAC technology to test real-time ship detection in a first for Europe, showcasing its port automation capabilities.Separately, Turkcell and Ericsson demonstrated how to use 5G standalone and network slicing to enable AI-powered robotics in factories, completing the first industrial autonomous mobile robot (AMR) demonstration in Turkey. These trials underscore how Turkey is positioning 5G not only as a consumer technology, but as a keystone of Industry 4.0 transformation.Additionally, China-Turkey's larger transportation and digital infrastructure strategy aligns with the 5G push. As a digital layer on top of physical connectivity, 5G is enhanced by the rail and Belt and Road integration agreements at the SCO summit.5G is a key technology for intelligent logistics, freight tracking, and trade automation as Turkey expands its Middle Corridor and connects BRI routes. China-Turkey trade reached US$48.3 billion in 2024, according to official data, and digital infrastructure is a vital value-added along that corridor.As projects come to fruition, it will become clear whether the summit produces more than diplomatic headlines. In addition to altering the speed at which data travels, Turkey's 2026 5G rollout could also alter the flow of capital, influence, and goods throughout Eurasia if it coincides with new rail links to Europe. The Erdogan-Xi meeting is more than just a handshake because of that possibility.If Turkey delivers on its 5G timelines and deepens its role in Belt and Road logistics, the country could emerge as a rare case study. A mid-sized economy using digital infrastructure to punch above its weight in global trade.5G AMR demo shows Turkey's push toward Industry 4.0 transformation. Credit: Pexel

In an exclusive interview with DIGITIMES ASIA, the Czech-based electron microscope manufacturer Tescan Group detailed a significant strategic transformation. This profound shift aims to address the growing complexity of the semiconductor industry, particularly the transition from traditional monolithic integration to advanced 3D IC and chiplet architectures.This evolution has severely intensified the challenges of failure analysis (FA) and quality control, demanding a fundamental re-evaluation of conventional inspection and metrology processes. Tescan's new mission moves the company beyond its traditional role as an instrument provider. Instead of simply selling equipment, the company now aims to partner with customers in a shared mission: to shorten the distance between a question and an answer.Driving Change: The Workflow-Centric VisionTescan's strategic pivot is underpinned by a philosophical shift embodied in its new tagline, "Accelerating the Art of Discovery." Tescan APAC Managing Director Sean Lee explained that this new direction reflects a fundamental shift in the company's market approach. "The branding itself is really trying to embark and refocus on why customers would like to choose us," Lee noted.The answer to this "why" is no longer satisfied by the specifications of a single machine. The complexity of modern heterogeneous integration requires more. Tescan is focusing on providing a holistic capability that addresses the entire failure analysis process, spanning initial R&D and pathfinding through to production ramp-up and field return analysis. The goal is clear: to remove friction in the journey from a technical query to a business-critical insight.To achieve this, Tescan has shifted from a product-centric approach to a solution- and workflow-focused mindset. This involves the tighter integration of hardware, software, automation, and deep application expertise. This systematic approach aims to empower teams to localize issues more rapidly, prepare samples with high reliability, and ultimately deliver quality results that lead to confident decisions and a strong Return on Investment (ROI). Tescan stresses that conventional, siloed techniques are no longer sufficient to identify and resolve the intricate issues introduced by these dense, heterogeneous designs, making this workflow approach critical to success in the chiplet era.Tescan emphasized the urgency of this industry transition. The semiconductor market is shifting from traditional monolithic integration, where all functions were built into a single technology at one time, to an era defined by entirely new and innovative architectures. In this new landscape, one of the most pressing challenges lies in addressing field returns and zero-mile defects in advanced packaging. As a provider of failure analysis and metrology solutions, Tescan views its mission as bridging the gap between a question and an actionable insight, enabling customers to identify and resolve issues with greater speed and precision.Integrated Metrology Workflow: A Systematic Path to Root CauseThe core of Tescan's technical solution is a powerful, integrated inspection and metrology workflow designed to overcome the structural complexity of 3D ICs. As Hervé Macé, Global Business Development Director for Semiconductor, emphasized, the new process seamlessly connects distinct technologies to provide a complete analytical pathway from the micro to the nano scale, eliminating the gaps and delays associated with isolated tools.Mace elaborated that Tescan's historic focus on tools like the Focused Ion Beam (FIB) was insufficient on its own. "Tescan in the past was a company that focused on focused ion beam, so spot focus traditional techniques for cross-section and delayering, but as a kind of isolated technique. And that's it. That was not enough to provide a full response." This realization drove the decision to develop a fully integrated workflow that leverages the benefits of all Tescan technologies, considering analysis from the micro to the nano scale.Tescan's workflow provides a streamlined, end-to-end pathway for advanced semiconductor failure analysis. This approach empowers engineers to move from problem identification to actionable insights with unprecedented speed and accuracy, meeting the demands of increasingly complex chiplet and 3D IC architectures.The process of failure analysis (FA) on complex packaging, such as 3D ICs, demands an integrated, multi-stage approach, which Tescan structures across three progressive scales-micro, meso, and nano-to provide comprehensive insights. The workflow initiates with Non-Destructive Insight (Micro Scale), leveraging X-ray Computed Tomography (Micro-CT), a non-destructive technique crucial for preserving the sample's integrity during initial inspection. This technique generates a high-resolution 3D map of the entire package, thereby enabling engineers to pinpoint defects or specific regions of interest at the micrometer level.Once the exact defect location is identified, the workflow seamlessly transitions to the Rapid Access (Meso Scale) stage, which focuses on gaining physical access to the target. This is achieved using a standalone ultrashort pulse laser. This technology is a game-changer, dramatically accelerating the traditionally slow processes of cross-sectioning and delayering by a factor of 1,000 to 10,000 when compared to conventional mechanical or chemical methods. The laser performs clean, precise cuts across a wide array of materials, including the diverse structures found in modern semiconductor packages. Critically, its near-zero heat-affected zone minimizes thermal impact, ensuring the chemical and structural integrity of the sample remains preserved while significantly reducing the preparation time required for advanced analysis.The final stage of the integrated process is Precise Analysis (Nano Scale). The prepared sample is transferred to a Focused Ion Beam (FIB) system, often employing a Plasma FIB for necessary large-area milling. The FIB enables highly detailed, high-magnification characterization, revealing the material's structure at the nanometer and even atomic scale. This systematic, three-stage process ensures a seamless flow from non-destructive localization to rapid material preparation, and finally to high-fidelity data acquisition, providing the definitive, actionable insights required for root cause analysis in the highly demanding chiplet era.Strategic Imperative: Closer to the APAC Advanced Packaging HubTescan's decision to establish a direct presence in Taiwan and deepen its broader APAC strategy is a calculated move to align with the epicenter of the global semiconductor packaging market. The strategy is driven by the clear recognition that Taiwan is a renowned hub for semiconductor expertise and high-technology advancement in both wafer fabrication and packaging.The necessity is purely strategic: the company estimates that 70–80% of the world's semiconductor packaging market is concentrated in Asia, primarily across Taiwan and mainland China. As the advanced packaging segment continues to experience explosive growth, Tescan's direct presence is imperative to effectively serve this dense customer base and engage directly with the industry's top engineering talent.When asked by the DIGTIMES if geopolitical issues were the primary driver, Sean Lee was quick to offer clarity. "I think if we put away the geopolitical situation, you realize that Taiwan is definitely a place where it's been renowned for all the expertise and all the high-technology advancement in terms of wafer, in terms of packaging," Lee asserted. "Coming direct presence in Taiwan gave us the ability to get close to the customers... it is actually strategically designed to come in direct so that we can get closer to those users that we really like to get close to, and get faster feedback."Tescan views this move as a "no-brainer" for serving the industry's most critical region. Furthermore, Lee noted that this proximity will provide additional regional benefits. "When you have a lot of the big names from Taiwan exploring outside of Taiwan, it will also benefit places like Southeast Asia and mainland China." This comprehensive strategy extends beyond Taiwan, including enhanced support via subsidiaries in Singapore and Korea, increased presence in China, and the establishment of a new logistics hub in Asia. This entire network ensures seamless regional coverage and better support for Taiwanese companies expanding into Southeast Asia, strengthening Tescan's regional footprint.Reshaping Success: Standardization and Customer EnablementA final, critical component of Tescan's strategy is its strong focus on customer enablement. The company has moved beyond simply supplying high-performance equipment to ensuring customers achieve their desired outcomes. This approach emphasizes working closely with customers to maximize the value of their tools, focusing on application expertise and workflow efficiency rather than just specifications on paper.To combat the inefficiencies inherent in repeatedly tailoring failure analysis processes for individual customers, Tescan is prioritizing standardization, recognizing it as crucial for delivering consistent and reliable results in the chiplet era. This commitment is built upon a robust two-pillar framework. The first pillar is Standardization and Automation, where Tescan develops highly repeatable, standardized workflows. These workflows are codified into specific software recipes and automation systems, allowing processes to be easily replicated across different customer sites and various technology nodes, supporting scalability and consistency as semiconductor technologies rapidly evolve.The second, equally critical pillar focuses on Customer Training and Enablement. This involves implementing disciplined and structured training programs designed to significantly strengthen customer expertise and promote continuous improvement across the board. By providing comprehensive education on the best practices for using these integrated systems, Tescan enables customers to fully leverage the standardized workflows.Enhanced Service and Support: Delivering Tangible Local ValueThe direct APAC presence translates into immediate and tangible benefits for customers in Taiwan and the wider region. The most significant operational improvement lies in the robust support structure, which features a clearer and quicker escalation path for all technical issues. Tescan has ensured that customers no longer need to navigate complex external channels for assistance; instead, they are connected directly with the nearest partner or direct subsidiary in their locality.This localized approach guarantees end-to-end service coverage, encompassing everything from installation and crucial recipe setup to software updates, all managed by local teams. This streamlined, localized support is paramount in the fast-moving semiconductor industry, as it drastically reduces potential downtime and accelerates the time it takes to process data, providing a critical competitive advantage.Tescan stated that the customer should expect "closer collaboration, faster support, clearer guidance with really measurable improvements in daily workflows and not just on paper." By integrating non-destructive insight, precise preparation, and more innovative software, Tescan is making a clear commitment to reduce the time from technical query to business-critical decision, helping its customers accelerate their own art of discovery in the demanding chiplet era. For more information, please visit Tescan offcial website or subsribe LinkedIn account.Tescan Solaris X 2- xenon plasma FIB for advanced packaging. Tescan

Seoul, October 1, 2025 - SK Group announced today that SK Chairman Chey Tae-won and OpenAI CEO Sam Altman met at SK headquarters in Seoul to sign a Letter of Intent (LOI) and a Memorandum of Understanding (MOU) to develop an AI Data Center in South Korea as part of the Stargate project.Chairman Chey Tae-won stated, "We are honored to participate as a core partner in the Stargate project, aimed at building future global AI infrastructure. By leveraging SK's integrated AI infrastructure capabilities from memory semiconductors to data centers, we will actively contribute to global AI infrastructure innovation and strengthen Korea's AI competitiveness at a national level."SK hynix signed a Letter of Intent (LOI) with OpenAI to supply High Bandwidth Memory (HBM) for the construction of a global AI data center under the Stargate project. The signing of the LOI reflects recognition of SK hynix's technological leadership and supply capability in AI-optimized semiconductor memory, as the company ranked no.1 worldwide in DRAM revenue in the first half of this year. SK hynix will establish a production system capable of promptly meeting OpenAI's HBM demand for up to 900,000 DRAM wafers per month. It is more than double the current HBM industry capacity, underscoring the immense semiconductor demand driven by the Stargate project.Through this partnership, SK hynix will actively support OpenAI's GPU procurement strategy, while the two companies have agreed to further expand their collaboration. Specific supply volumes and arrangements will be determined through further discussions as the project moves forward.SK Telecom signed an MOU with OpenAI to collaborate on building the AI Data Center in the southwest region of Korea as part of 'Stargate Korea.' Leveraging its solid experience in data center construction and operation, SK Telecom and OpenAI will jointly develop next-generation computing and data center solutions. They will also explore various AI service use cases for consumers and enterprises.This government-backed collaboration signifies SK Group's strategic alliance with OpenAI and is expected to contribute positively to the development of Korea's AI ecosystem by combining SK's accumulated technology and infrastructure with the synergy of global cooperation. SK's involvement in the Stargate project is anticipated to solidify the AI economic alliance between South Korea and the United States. Korea's strengths in manufacturing and telecommunications complement the U.S.'s leadership in AI technology, forming a mutually beneficial and globally influential partnership.Since 2023, Chairman Chey and CEO Altman have built a mutual trust through multiple meetings, sharing a consensus on future directions in semiconductors, data centers, and other fields. They have discussed the development of dedicated semiconductors and infrastructure to cope with the global surge in AI training and inference workloads. They have discussed innovative joint development of next-generation AI infrastructure, including new memory-computing architectures to overcome hardware bottlenecks for AI models."Korea has the vision, technology, talent, and infrastructure to lead globally in AI," OpenAI CEO Altman said. "We're proud to partner with SK hynix as part of our Stargate initiative, supporting Korea's leadership in AI and contributing to its continued success.""This partnership marks the official beginning of comprehensive technological innovation cooperation spanning from chip development to data center construction and operation," SK Chairman Chey Tae-won added. "We are confident this collaboration will set a new paradigm in the global AI landscape and significantly advance the AI industry's future."Meanwhile, SK Group is advancing its portfolio by positioning AI as a key growth driver and strengthening alliances with global technology leaders. In August, the company held the groundbreaking ceremony for the SK Ulsan AI Data Center, reinforcing collaboration with global partners and reaffirming its commitment to AI innovation.Sam Altman, OpenAI CEO(left) and SK Group Chairman Chey Tae-won (right). SK hynix

Wise Integration, a pioneer in digital control for gallium nitride (GaN) and GaN IC-based power supplies, today announced the release to production of its first fully digital controller, WiseWare 1.1 (WIW1101) based on the MCU 32 bits. This milestone innovation enables high-frequency operation up to 2 MHz, unlocking new levels of power density, efficiency, and form factor in compact AC-DC power converters.The product is now available and ready for volume production in customer-validated designs."This release marks a strategic milestone for Wise Integration's roadmap," said Thierry Bouchet, CEO of Wise Integration. "WiseWare 1.1 represents more than a product-it's a key pillar in our vision to redefine power electronics through digital control. It strengthens our value proposition in high-density power conversion and reinforces our leadership as GaN technology scales to mass adoption."Digitally Driven, GaN OptimizedUnlike legacy analog solutions, WiseWare 1.1 leverages the speed and switching capabilities of GaN (gallium nitride) through a proprietary digital control algorithm in a MCU 32 bits, that enables zero voltage switching (ZVS) across all power transistors.Designed specifically for totem pole power-factor correction (PFC) architectures in critical-construction mode (CrCM), this controller allows engineers to dramatically reduce the size, weight, and thickness of magnetic components while maintaining>98 percent efficiency.Customer-Proven Performance and Global MomentumWiseWare 1.1 supports a broad power range from 100 W to 1.5 kW, making it suitable for a wide array of modern applications requiring both compactness and high energy efficiency.Designed with flexibility in mind, WiseWare 1.1 works seamlessly with standard GaN across the full RDS(on) spectrum (drain-source on-resistance), giving power designers the freedom to choose the optimal transistor for each application-without compromising performance.Typical applications include�GHigh-efficiency AC-DC power converters, High-power density designs, Power supplies for servers, USB power delivery adapters for laptops and notebooks, and Switch-mode power supplies for monitors and displays.The WiseWare 1.1 platform has already demonstrated robust market validation, with multiple customer design-ins and live demos at PCIM Europe, one of the industry's most prominent power- electronics exhibitions. These demonstrations showcased 300W totem pole PFC converter boards using WiseWare 1.1 and WiseGan WI71060A transistors (RDS(on)=60mohms),operating from 90–264 VAC input to a 400 VDC output. At the same time, technical collaborations are progressing in Asia, reinforcing the company's global reach.Technical Highlights of WiseWare 1.1 (WIW1101): Switching frequency�Gup to 2 MHz, Control mode: CrCM ensuring full ZVS, Integrated protections: OCP, OVP, OTP, OPP, Inrush management : no need for relay or thermistor, Standby power: as low as 18 mW, EMC-compliant demoboard with>98 percent efficiency.Credit: WISE

Co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits, Peking University and organized by JWinsights (Shanghai) Technology Co., Ltd., the Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) was successfully concluded on September 25, 2025. Under the theme "AI Applications, Innovation Empowered", the GMIF2025 brought together leading representatives from across the memory industry value chain. Discussions centered on critical topics such as computing-storage convergence, AI deployment, and ecosystem collaboration.The 4th GMIF2025 Global Memory Innovation Forum concluded on Sept 25. Credit:GMIFThe GMIF2025 officially kicked off with the opening remarks from Rixin Sun, the President of Shenzhen Memory Industry Association (SMIA). Mr. Sun shared that with the rapid proliferation of AI technologies on the edge side in 2025, the memory and storage industry are stepping into the spotlight. The industry growth mode is shifting into a new structural phase characterized by high performance, high efficiency, and system collaboration. Since its inception, GMIF has upheld the vision of "connecting the memory ecosystem and fostering industry win-win collaboration," aiming to unite global industry forces, drive cross-sector cooperation, and accelerate the integration of China's memory sector into the global landscape.GMIF2025 opens with remarks from SMIA President Rixin Sun. Credit:GMIFIndustry leaders discuss AI-driven memory transformation and ecosystem integration. Credit:GMIFIndustry Leaders Gather to Discuss AI-Driven Transformation of Memory and Ecosystem IntegrationXiaomin Han, General Manager of Consulting Services from JWinsights, noted that the global memory market is entering an AI-driven upcycle, with smartphones, data centers, and new energy vehicles emerging as key growth drivers. In spite of the supply bottlenecks of high-end advanced chips, strong investment momentum from domestic internet companies is fueling faster-than-expected growth in the server market, which is projected to achieve large-scale commercialization by 2027. Meanwhile, Chinese players such as GigaDevice and UniIC are strengthening their presence in smartphones, servers, and edge AI through customized solutions, and are expected to make breakthroughs in emerging sectors by year-end.Guangyu Sun, Professor of School of Integrated Circuits, Peking University, highlighted that to improve computing efficiency, it is essential to optimize pathways, adopt hierarchical architectures, and implement fine-grained resource scheduling to balance bandwidth, capacity, and latency. In diverse scenarios such as smart devices and edge computing, system efficiency, security, and cost are the key factors determining technological deployment. As advanced packaging and related technologies become increasingly practical, the next phase of industry development should focus on precision control, heterogeneous integration, and ecosystem collaboration to enable large-scale commercialization.Kevin Yoon, VP and CTO, Memory Business Division, Samsung Electronics, pointed out that AI advancements are accelerating the shift in memory and storage toward higher performance, density, and energy efficiency. With data processing skyrocketing and system power nearing its ceiling, memory is now central to intelligent infrastructure. Leveraging interface upgrades, advanced packaging, and new materials, Samsung has rolled out products like GDDR7, delivering across-the-board gains in performance, capacity, and power efficiency.Maya Zhang underlined that data requirements in the AI era are characterized by high volumes, high performance and structural diversity. It's predicted that global data is expected to reach 200ZB by 2025, and unstructured data will account for about 80% of that total. The rise of multimodal data further increases complexity. The growing "heat" of data is accelerating the shift of storage architecture toward computing-storage convergence, with heightened demands on speed, capacity, and power efficiency.Wallace C. Kou, CEO, Silicon Motion, stressed that AI is fueling strong demand for large-capacity storage in both cloud and edge environments, with significant market growth expected next year. Industry players must strengthen collaboration in technology innovation, talent development, and ecosystem building.Benny Ni, GAR Sales VP, Solidigm, observed that AI is moving from model building to terminal applications. Edge computing and data security are becoming increasingly vital, and storage technologies need to meet the diverse demands spanning from large capacity to high performance.Storage and memory at the edge side emphasize more on intelligence, reliability and green innovation beyond performance. By adopting a "subtractive" approach, Maxio Technology achieves a significant balance between quality and cost, and is making more efforts to strengthen AI storage ecosystem through industry chain collaboration. Mr. Li summarized Maxio's vision as "One Chip, One Ecosystem, One Future", enabling the intelligent world with memory and co-creating a brighter future.Haibing Xie, Director, Application Design In Center, Intel China, introduced that Intel has taken a dual-pronged AI strategy of hardware (AIPC, data center) and software ecosystems. Intel is working with partners to build an open supply chain supporting over 900 large models and enhancing user experiences with voice control and other technologies to drive AIPC adoption.Xiaobing Wang, Director of Customer Projects from MediaTek, identified imbalances in edge AI computing power and efficiency as a major bottleneck, alongside thermal and bandwidth pressures. MediaTek is advancing its system through three key approaches: ensuring stable high-load performance with advanced cooling, reducing power consumption through process iteration, and lowering bandwidth dependency via algorithm and architectural collaboration, so as to achieve comprehensive breakthroughs through industry-wide cooperation.Industry leaders discuss AI-driven memory transformation and ecosystem integration. Credit:GMIFHan He, CEO of BIWIN, shared that BIWIN is transitioning from a module manufacturer to a solutions provider. With AI infrastructure investment projected to reach USD 3 trillion by 2030, BIWIN is leveraging its core expertise in media, controller and firmware R&D, and advanced packaging and testing. By continuously promoting its "Integrated Solution and Manufacturing (ISM)" strategy, BIWIN has established an all-around industry layout, aiming to deliver scenario-driven system solutions and accelerate computing-storage convergence.Zining Wu, Founder & Chairman, InnoGrit Corporation, highlighted that the surge of AI-generated data is forcing a radical shift in storage architecture. To match the processing power of GPUs, the industry is rolling out "AI SSDs" capable of hundreds of millions of IOPS and ultra-low latency. Technologies such as GPU Direct enable direct communication with GPU memory, extending HBM in data centers and delivering deterministic responses at the edge. Storage media are being divided into high-speed cache layers and large-capacity storage layers, forming a new generation of high-performance, hierarchical architectures that provide a solid foundation for computing breakthroughs.Matt Bromage, Head of Global Storage Business from Arm, projected that 70% of AI inference workloads will soon be processed at the edge. In response to the three key challenges of bandwidth, power cost, and software fragmentation faced by edge AI, the industry circle is making concrete efforts to comprehensively improve edge computing efficiency by innovating technologies including near-data computing, CXL high-speed interconnects, and chip-level security, combined with customized chip design, model quantization, and software-hardware co-optimization. These advances are expected to drive a thousand-fold leap in edge AI performance, accelerating the arrival of the Ambient Intelligence era.Xuewen Chen, Chief AI Scientist from GAC Group, showed that AI has moved beyond its role as a driver-assistance tool to become a central engine of industrial change. The intelligent technologies based on big data and Transformer architecture are reshaping industry competitiveness, which raises unprecedented new expectations for automotive storage in terms of capacity, speed and reliability, and creating a broad space for storage innovation and deployment in intelligent vehicles as well.Cheng Zhu, Product Director at China Greatwall, expressed that computing power, as a core productivity, is closely related with national economic development. Ranked as the 2nd largest computing capacity worldwide, China demonstrated a 30% growth rate in the past 5 years with over 10 million data center racks being deployed. AI computing has increased significantly. Underpinned by its full-stack technologies, China Greatwall has developed 120+ products and contributed to major national projects, providing secure computing foundations for government, finance, and other sectors.Shawn Xiao, Director of Ecosystem Partnerships and Field Applications from Montage Technology, considered CXL as an ideal solution for optimizing memory architecture, lowering data center costs, and improving AI computing efficiency. By enabling efficient sharing and pooling of memory resources, it breaks through the bottlenecks of the traditional memory wall and provides a more flexible and scalable solution for high-performance computing and large-scale AI applications.Shang Shang, General Manager of the Information Security from iFLYTEK, introduced iFLYTEK Spark AI PC, positioned as an AI office assistant for government and enterprises. Through integration of generation, summarization and insight capabilities, it fosters a new paradigm of human-machine collaboration, empowering users to focus on decision-making and innovation.Ming Zhao, General Manager from OKN Technology, pointed out that against the backdrop of surging storage demand driven by AI, requirements for capacity, speed, and power consumption are becoming increasingly stringent, and specialized testing technologies are essential to ensure high-quality industry development.Lucas Lu, Director of R&D Department from GreaTech Substrates, concluded that AI applications are driving semiconductor market growth, with a projected CAGR of 6.7% from 2025 to 2028. AI servers, smartphones, and PCs are the key drivers. Packaging technologies are rapidly evolving toward 2.5D and 3D, and heterogeneous integration solutions such as CoWoS are being widely adopted. This trend places higher demands on packaging substrates, including larger sizes, higher layers, thinner profiles, and finer wiring.GMIF2025 offered a full-spectrum view of the latest advances in technology. Credit: GMIFThe GMIF2025 of the year presented a full-spectrum view of the latest progresses in technological breakthroughs, product innovations and ecosystem co-building of the storage and memory industry within the AI era. With a particular focus on advanced industry trends such as AI applications, storage-compute convergence, advanced packaging, and edge intelligence, the summit served as a high-level platform for industry stakeholders to gain insights, exchange technology, and explore partnerships.By bringing together executives from leading global enterprises, academic experts from top universities, and professional attendees, GMIF2025 not only demonstrated the strong momentum of collaborative innovation in the industry, but also provided crucial support for the deep integration of storage technologies with AI, cloud computing, and smart devices. It further contributed to the creation of an open, collaborative, and sustainable global storage ecosystem, helping accelerate progress in the data-driven era.

In recent years, the automotive industry has shifted from traditional mechanical manufacturing to a new era of intelligence and connectivity. The introduction of technologies such as autonomous driving, connected vehicles, and OTA (Over-The-Air) software updates has transformed vehicles from simple means of transportation into vital nodes for information exchange. However, these advancements have also rapidly increased cybersecurity challenges and risks. From past incidents of remote vehicle hacking to increasingly stringent privacy and data security requirements, the entire industry is facing unprecedented tests.All vehicles aiming to enter the EU market must comply with R155 and R156. Credit: WinbondAgainst this backdrop, the European Union has established a series of regulations targeting automotive cybersecurity and software updates, most notably WP.29 under the World Forum for Harmonization of Vehicle Regulations-specifically, R155 (Cybersecurity Management System, CSMS) and R156 (Software Update Management System ; SUMS). These regulations require comprehensive information security and update management throughout the entire vehicle lifecycle, from design, manufacturing, testing, operation, to maintenance. In other words, any vehicle aiming to enter the EU market must comply with these regulations, or it will be denied entry.For automotive engineers and decision-makers, this is not just a matter of regulatory compliance, but a key issue concerning brand reputation and market survival. How to achieve compliance quickly and effectively with limited development resources has become the most urgent challenge across the industry.The Necessity of Compliance and Industry ConsensusThe establishment of R155 and R156 is not merely a unilateral requirement from the EU, but a global need shared by the automotive industry. The reason is simple: vehicles are no longer isolated products, but continuously connected, frequently updated, and potential targets for cyberattacks.Security Requirements: Once a vehicle system is breached, hackers can not only steal user privacy data but may also directly manipulate vehicle functions, causing traffic safety incidents. The core of R155 is to require manufacturers to establish a complete cybersecurity management mechanism from the early development stage, including threat modeling and risk analysis, with systematic countermeasures.Continuity Requirements: Modern vehicles are increasingly software-driven, with many functions relying on OTA updates. Without secure update mechanisms, malicious software could be injected during the upgrade process, potentially paralyzing entire fleets. R156 aims to ensure that the software update process is verifiable, complete, and traceable.Market Requirements: Consumer trust in vehicle safety directly affects brand image and sales. Failure to meet regulations not only results in losing access to the European market but may also erode consumer trust, impacting other regional markets.Therefore, compliance is no longer a question of "if," but "how to do it effectively." This is the common pain point across the automotive industry: how to meet complex compliance requirements within compressed development cycles and limited human resources.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Credit: WinbondWinbond W77Q/W77T Secure Flash Memory-Technical Highlights and ValueIn this challenging environment, Winbond's W77Q/ W77T Secure Flash Memory emerges as a crucial tool to help customers overcome compliance challenges. This solution enables OEMs and Tier 1 suppliers to quickly meet R155 and R156 requirements while significantly reducing verification and development costs.1. Reduced Verification Time and Cost: Traditionally, to meet cybersecurity requirements, customers must design and verify a complete set of security mechanisms themselves, which is time-consuming and requires highly specialized talent. Winbond's W77Q/ W77T has already passed rigorous international security certifications, allowing customers to integrate proven solutions directly and greatly shorten verification time.2. Accelerated New Product Design: For new product development, time-to-market pressure is intense. Secure Flash Memory features built-in security mechanisms, enabling design teams to adopt pre-verified security modules instead of building from scratch, further shortening development time and speeding products to market.3. Support for Legacy Product Upgrades: Winbond's Secure Flash Memory is suitable not only for new designs but can also replace existing flash memory modules in legacy products, helping older vehicle models upgrade to meet WP.29 cybersecurity requirements. This ensures flexibility and competitiveness as regulations evolve.4. Technical Highlights: Hardware-Level Data Partitioning and Backup: Through built-in hardware logic circuits, Secure Flash Memory achieves data partitioning and backup, ensuring isolation between different security levels and preventing data leakage or tampering.Secure OTA Upgrade Mechanism: During OTA upgrades, Winbond's Secure Flash Memory provides encryption and authentication functions, ensuring confidentiality and integrity during data transmission and installation.System Resilience Protection: If anomalies occur during upgrades (such as interruptions), the system can automatically revert to a safe state, preventing vehicles from becoming inoperable.Post-Quantum Cryptography (PQC) Support: Winbond offers solutions equipped with the LMS (Leighton-Micali Signature) algorithm, providing stronger protection for OTA upgrades and forward-looking defense against future quantum computing security threats.With these technical features, Winbond's W77Q/ W77T Secure Flash Memory not only meets current regulations but also offers future scalability, supporting information security throughout the vehicle lifecycle.Credit: WinbondCertified Solutions Deliver Industry Value and DifferentiationIn summary, adopting Winbond's W77Q/ W77T Secure Flash Memory offers several clear advantages for automotive industry participants:1. Compliance Assurance: Winbond's Secure Flash Memory has passed relevant security certifications, directly helping customers meet R155 and R156 requirements and reducing regulatory risks.2. Cost Optimization: With built-in security verification mechanisms, customers can avoid significant additional verification costs, effectively reducing R&D expenditure.3. Design Flexibility: Whether for new vehicle development or legacy product upgrades, Winbond’s Secure Flash Memory can be quickly integrated, providing high flexibility for customers.4. Market Differentiation: Compared to products offering only single functions, Winbond's Secure Flash Memory integrates hardware security, OTA protection, and PQC support, giving customers a distinct competitive edge.5. Verification Convenience: Since Winbond's Secure Flash Memory is internationally certified, customers can reference existing certifications during product verification, greatly simplifying the process.In the future, competition in the automotive industry will be not only about speed and price but also about safety and trust. With Winbond's Secure Flash Memory, customers can achieve regulatory compliance quickly and establish unique market advantages. This is not just a response to regulations but a proactive strategy for the industry's future.In other words, Winbond's W77Q/ W77T Secure Flash Memory is not just a peripheral component, but a key partner for the automotive industry's sustainable cybersecurity development.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

AT&S, a global leader in high-end IC substrates and printed circuit boards, took part in the 2025 Chongqing Mayor's International Economic Advisory Council (CMIA) conference, held under the theme "Building an AI Application Hub to Enable High-Quality Industrial Development."Credit: AT&SAT&S CEO Michael Mertin delivered a keynote speech titled "AT&S and Chongqing's Joint Path Toward AI-Driven, Sustainable Manufacturing." He reaffirmed the company's commitment to advancing intelligent, sustainable manufacturing in close partnership with Chongqing.In his address, Mertin highlighted AT&S's long-term commitment to strengthening Chongqing's position in the global industrial value chain. He stressed the importance of partnerships, talent development, and cutting-edge technology, noting that combining these strengths with Chongqing's unique advantages will accelerate the city's transformation into an AI-driven, sustainable manufacturing hub.Artificial intelligence is a driving force of digital transformation, and AT&S is positioning itself as a key enabler of this trend by delivering innovative technologies essential for AI applications. These include substrates for AI processors, energy management solutions for data centers, and embedding technologies for high-performance components. In particular, AT&S plays a vital role in enabling on-device AI, serving as an innovative partner for leading manufacturers of smartphones, notebooks, and other end devices.AT&S Highlights how AI accelerating industrial transformation of Chongqing. AT&SIn line with the conference theme, AT&S also released a white paper outlining how AI, combined with Chongqing's strategic policies, can accelerate industrial transformation and reinforce the city's global competitiveness.Chongqing is one of AT&S's most important global production bases. Since establishing operations there in 2011, the company has made continuous investments in advanced technologies and innovation. Today, AT&S Chongqing manufactures high-tech IC substrates and modules for high-performance processors, data centers, gaming, 5G, automotive, and AI applications. The rapid growth of the AI market creates significant opportunities for the site, with rising demand for high-performance infrastructure, energy-efficient components, and integrated AI solutions expected to drive continued growth. AT&S's strategic focus on"local-for-local" solutions further supports Chongqing's and China's digital transformation.Initiated in 2005 by the Chongqing municipal government, CMIA provides a platform for global business leaders to advise the Mayor and his leadership team on the city's development. The 2025 conference marks AT&S's tenth consecutive year of high-level participation in the council.Credit: AT&S