As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled applications-from data center accelerators to compact edge devices-require processing systems with exceptional computational power, high performance, and access to large memory storage.To meet these demands, the semiconductor industry is making rapid strides in advanced packaging technologies. These innovations are now central to system integration and architectural breakthroughs-yet they also introduce new challenges in reliability, thermal management, and multi-chip assembly.Material companies are transforming their offerings to meet the stringent purity, precision, and performance requirements of the evolving semiconductor industry, while also creating more sustainable and environmentally friendly products. In this exclusive interview with Mr. Kenji Kuriyama, Director of Electronics for Japan & Taiwan at Henkel Adhesive Technologies, we explore how Henkel is helping semiconductor leaders overcome these challenges through materials innovation, strategic collaboration, and a deep commitment to Taiwan's ecosystem.Mr. Kuriyama shares his optimistic outlook on the explosive growth of the advanced packaging market. In particular, Taiwan's semiconductor industry stands out as a global leader in advanced node manufacturing, producing the majority of the world's most sophisticated chips. Henkel looks forward to working closely with customers in Taiwan to accelerate the development of high-performance chips that drive AI innovation.Mr. Kenji Kuriyama Director, Japan & Taiwan, Henkel Adhesive Technologies Electronics.Credit: HenkelHenkel Adhesive Technologies' Electronics division maintains a strong and deliberate focus on both the semiconductor and consumer electronics sectors, supplying advanced materials for electronics assembly, semiconductor packaging, and thermal management. Its product portfolio includes solutions for die attach, underfills, encapsulants, lid attach adhesives, and thermal interface materials—essential components that enable the high performance, miniaturization, and reliability of modern electronic devices.Showcasing Material Solutions for AI-Enabling Advanced Packaging at SEMICON Taiwan 2025Taiwan remains a global hub for advanced packaging innovation, and at SEMICON Taiwan 2025, the spotlight is on technologies that are rapidly evolving to become the backbone of system integration and architectural breakthroughs.Henkel Adhesive Technologies Showcases a portfolio of high-performance materials, and offers tailored solutions aligned with the industry's most critical technologies. The company presents encapsulation, underfill, and adhesive materials that support high-end AI accelerators in data centers, as well as compact Edge AI chips. These devices rely on packaging architectures such as 2.5D and 3D designs, chiplet designs and heterogeneous integration to meet the demands of next-generation computing.Advanced data center AI accelerator chips and smartphone application processors require large dies and large-body packages that consume significant power during operation. As a result, they are susceptible to high stress, warpage, and thermo-mechanical challenges that can impact reliability and performance.Henkel Adhesives has developed semiconductor underfill technologies-including pre-applied pastes and films, capillary materials, and liquid molded solutions-that have set the benchmark for both performance and processability.Henkel's encapsulation technology plays a critical role in protecting large, thin dies from warpage. It also enables high-density 2.5D fan-out wafer-level packaging (WLP) and supports emerging panel-level packaging (PLP) formats-making it one of Henkel's flagship innovations.In the automotive electronics sector, Henkel offers die attach pastes and encapsulants which are widely used across the ecosystem. Its pressure-less and pressure-assisted sintering materials are instrumental in enabling high-performance wide band gap power devices that are critical for modern electric vehicles. Henkel showcases a broad range of sintering technologies, including its latest copper-based pressure-assisted sintering material. This innovation delivers exceptional thermal conductivity, requires lower processing pressure and temperature compared to silver-based alternatives, and offers a lower total cost of ownership.Mr. Kenji Kuriyama presenting at Henkel seminar and panel talk in SEMICON Taiwan 2025.New Release: Loctite Eccobond LCM 1000AG-1 -Liquid Mold Material for Warpage Control in WLP and PLP ProcessesFurthermore, as heterogeneous integration and photonic convergence become increasingly prevalent, advanced packaging technologies such as panel-level packaging (PLP) and co-packaged optics are gaining significant attention. PLP, for example, enables larger AI-enabling IC packages by improving scalability and manufacturing efficiency. However, these advancements introduce new challenges in managing the thermal demands of heterogeneously integrated devices-particularly in data center and smartphone applications-as well as in optimizing materials that interface directly with IC chips. A range of advanced materials-including liquid molded underfills (LMUF), first-level thermal interface materials (TIMs), and capillary underfills-are being developed to effectively distribute and extract heat, thereby enhancing device performance and reliability. Notably, the rise of advanced AI processors with stacked memory architectures has driven strong demand for molded underfill materials that address key challenges in 3D stacking and assembly, such as manufacturing throughput, process complexity, and overall cost.Meanwhile, Henkel is introducing new innovations in fine-filler liquid compression molding (LCM) and molded underfill materials to support both near-term and long-term roadmaps for 2.5D and 3D packaging. These materials are designed to mitigate warpage while demonstrating excellent flowability and void-free filling capabilities at the wafer level, even in fine-pitch (<30 µm) and narrow-gap (<20 µm) configurations.At SEMICON Taiwan 2025, Henkel launches Loctite Eccobond LCM 1000AG-1 , a new anhydride-free, ultra-low warpage liquid molding material designed for wafer-level packaging (WLP) and panel-level packaging (PLP) processes. This new product delivers stable warpage control throughout redistribution layer (RDL) processing, enabling high-yield, reliable advanced packaging solutions.Working with Customers to Enable Materials for Next-Gen Semiconductor DevicesAdvanced packaging is rapidly emerging as a key driver of innovation in semiconductor technology, enabling breakthroughs in system integration, performance, and sustainability. As an innovator in the advanced packaging materials space, Henkel is actively collaborating with Taiwan's leading industrial customers across critical areas-including new material design, customer support, green energy, and sustainable development.This type of collaboration facilitates the sharing of knowledge, resources, and technology, accelerates global competitiveness, and ultimately achieves a win-win for more markets-helping to grow the global semiconductor industry. Henkel is committed to investing resources in solution design tailored to specific functions and maintaining long-term relationships with its customers.Mr. Kuriyama shares two use cases that demonstrate strong momentum in customer collaborations in Taiwan. The first example is thermal cycle reliability for application processor chips. A customer approached Henkel to help pass thermal cycle reliability testing for an end customer's application processor. The challenge extended beyond reliability-it required enhanced processability for high-throughput production. Henkel responded by investing resources and developing new materials to meet the target and support the customer's goals.Among the two cases, the second example focuses on underfill flow speed optimization. In this case, a customer was facing production bottlenecks due to the slow flow speed of their existing underfill material. Henkel stepped in to assess the specific requirements and engineered a faster-flowing underfill solution to replace the legacy product. This not only resolved the throughput issue but also significantly improved overall production efficiency. The case is well-articulated, outcome-driven, and demonstrates Henkel's ability to deliver tailored, high-performance solutions in advanced packaging.The timelines for joint development projects vary significantly depending on the scope of work. Projects involving complex advancements-such as new process development or complete material replacement-can take two to three years. In contrast, initiatives focused on optimizing existing processes within current specifications are much faster, with development cycles of just three to six months.In Taiwan, IC design houses, semiconductor foundries, and Outsourced Semiconductor Assembly and Test (OSAT) providers represent the three major customer types. Design houses focus on delivering new products with innovative IC chips, foundries explore novel materials for advanced packaging solutions, and OSATs emphasize manufacturing capabilities. Once a new material is introduced, Henkel's Taiwan-based application engineering and sales teams work closely with all customer types to ensure the material's functionality meets their specific requirements.Henkel Provides Next-Level Support to Build Strategic Partnerships with Taiwan CustomersAs semiconductor advanced packaging technologies continue to evolve, new opportunities are emerging across Co-Packaged Optics (CPO), panel-level packaging (PLP), and other next-generation formats. These innovations are reshaping how chips are integrated, aligned, and scaled for high-performance applications.Taking CPO as an example, Mr. Kuriyama highlights it as a rising application in advanced semiconductor packaging. Henkel is developing light-pass adhesive materials to address the challenge of precise active alignment for optical components. These light-curing adhesives enable accurate alignment, supporting the assembly of complex optical systems within the CPO process.Henkel Adhesives continues to invest heavily in material innovation and deepen its understanding of the evolving needs of the semiconductor and electronic materials markets. It is aligning its solutions with customers' technology roadmaps and contributing to the development of next-generation products. To fulfill these needs, the Henkel Taiwan Electronics Adhesives Technical Center in Zhubei City provides prompt technical support and fosters collaboration with Taiwan customers to accelerate prototyping and development. This Technical Center is dedicated to supporting innovation and product development through faster application simulation, data generation, and analysis—ultimately speeding up time-to-market for advanced packaging technologies.As the industry shifts from a linear supply chain to a more integrated and collaborative ecosystem, Henkel Adhesives plans to strengthen its local support for Taiwan's semiconductor sector. This includes expanding beyond its application center by establishing local R&D resources and a satellite R&D office in Taiwan to provide direct, localized support. This strategic move will strengthen customer partnerships and accelerate the development of packaging technologies critical for AI chip innovation and the broader semiconductor ecosystem."Taiwan is a leading global center for advanced semiconductor process nodes and packaging innovations," Mr. Kuriyama concludes. "Through Henkel's dedicated support teams and close partnerships with customers, Henkel Adhesives is strongly committed to the Taiwan market and will contribute to technical breakthroughs that open a new frontier in advanced semiconductor packaging."To learn more about Henkel and its advanced packaging solutions, visit the official Henkel website or official LinkedIn for more information.

Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths Group, is pleased to announce that its patented, state-of-the-art DaVinci Gen V test sockets have been selected as the exclusive test socket solution by a major global provider of high-performance artificial intelligence semiconductor chips.Credit: Smiths InterconnectThis strategic contract supports the customer's upcoming global launch of their next-generation AI semiconductor chips, designed for data center GPU applications. These GPUs are engineered to accelerate deep learning, artificial neural networks, and high-performance computing workloads.Smiths Interconnect's DaVinci Gen V sockets will play a critical role in the manufacturing test process, ensuring ultra-reliable and repeatable performance of the chips prior to deployment. This selection underscores the superior performance, innovation, and reliability of Smiths Interconnect's test socket technology.The award builds on a successful collaboration initiated in 2024, when Smiths Interconnect supported the customer's previous AI chip programme. This latest win marks a significant expansion of the partnership and reinforces Smiths Interconnect's position as a trusted technology partner in the semiconductor industry.Brian Mitchell, Vice President of Smiths Interconnect's semiconductor test business unit, said: "Our goal is to provide the fastest, most reliable test with the greatest precision, to meet the demands of semiconductor manufacturers in a fast-moving technological environment. We are proud to grow our relationship with such a world-class company and proud that they trust us to test and validate their products which are integral to so many aspects of modern computing."Smiths Interconnect's test sockets play a critical role in testing semiconductor chips, otherwise known as 'AI chips', which are deployed in a range of areas such as automotive systems, robotics, large language models, computer gaming and 6G communications networks.As AI becomes ever more sophisticated, the need for higher processing power, speed and efficiency in computers has grown-and AI chips are essential for meeting this demand. The testing of these products to ensure reliability, repeatability and longevity, is therefore of crucial importance.

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum), co-hosted by Shenzhen Memory Industry Association and School of Integrated Circuits at Peking University, is scheduled to be held on September 25, 2025 in Renaissance Shenzhen Bay Hotel. GMIF2025, themed "AI Applications, Innovation Empowered", will bring together leading enterprises, technology experts, and industry leaders across the global memory industry chain to explore the evolution of storage technologies and emerging opportunities in the AI era.The Fourth GMIF2025 Innovation Summit is scheduled to be held on September 25, 2025. Credit:GMIFThe summit will feature executives and experts from School of Integrated Circuits at Peking University, Samsung Semiconductor, Sandisk, Solidigm, Silicon Motion, Maxio Technology, Intel, MediaTek, BIWIN Storage, InnoGrit, Arm, China Greatwall, Montage Technology, iFlytek, OKN Technology, GreaTech Substrates, and more than 19 other top global companies and universities. The keynotes will cover topics ranging from storage and memory technology roadmaps and market strategies to AI application practices and ecosystem collaboration, empowering innovation across AI scenarios from cloud to edge.GMIF2025 Innovation Summit Keynote Agenda - Part 1. Credit:GMIFGMIF2025 Innovation Summit Keynote Agenda - Part 2. Credit:GMIFGMIF2025 Innovation Summit Keynote Agenda - Part 3. Credit:GMIFIn the exhibition zone, over 27 exhibitors will present more than 200 innovations, spanning the entire storage ecosystem-including leading IDMs, controller vendors, solution providers, packaging and testing companies, platform providers, and AI terminal enterprises. Attendees will experience immersive interactions, gain first-hand insights into the latest industry trends, and witness the evolving global storage ecosystem landscape.Register now by clicking the link to secure your GMIF2025 pass and join global storage industry leaders in shaping the future of AI-driven innovation!For more information about GMIF, please visit.

Hybrid work is reshaping the way organizations train their people. The new reality requires a balance of efficiency and flexibility, as organizations strive to achieve easy access to learning and measurable results across groups dispersed in different locations.Flexible working models give employees greater control over where and how they learn. However, they also create challenges around consistency, engagement, and measuring results. The solution lies in a blended approach: combining online and in-person training with a corporate LMS.Training Issues in Hybrid WorkplacesConsistency remains a significant issue. Hybrid workforces include both in-office and remote employees, and both sides need the same access to learning for both to be fair and productive. Skewed opportunities can quickly ruin employee trust and retention.Disengagement is another issue. Online sessions that last extended periods tend to cause fatigue, making learning less effective.Measuring effectiveness is also a challenge. Virtually based teams complicate monitoring skill acquisition, and organizations are left solely reliant on analytics and online tests as a fair gauge of results. Without effective systems in place, organizations often offer programs that are difficult to measure, thereby limiting their long-term impact.Corporate LMS as a Central FrameworkTo address these needs, a corporate LMS can serve as the central hub for all training content. It combines live classes, self-paced resources, and microlearning modules into one blended system. This approach gives employees the flexibility to learn in ways that fit their schedules, while still keeping development aligned with company goals.A business LMS also incorporates gamification elements, interactive modules, and certification tools that retain motivation. Integration with workflow systems, such as Slack or Microsoft Teams, allows training within everyday workflows.Just as important, corporate LMS platforms provide visibility. Progress tracking makes it easier to spot skill gaps, measure outcomes, and consistently meet objectives across the workforce. But their true value goes further: connecting business strategy with individual performance. In doing so, they transform learning from a functional process into a growth driver—for employees and the organization.Opportunities in Hybrid Training ModelsDespite the challenges, hybrid work presents new opportunities for business training.One is scalability since corporate LMSs can reach employees in various locations without logistical issues. Another is customized learning paths, which are also on the rise. These paths enable employees to progress at their own pace and focus on specific skills.Dynamic access to course materials provides added flexibility. Users can access or navigate modules at will again, boosting retention. Data-driven insights through analytics add a new level of value, providing organizations with a precise understanding of training results.Beyond talent development, training has since been used to maintain organizational culture, and long-distance teams can maintain a sense of shared mission and identity.Skill-building in the Hybrid WorldHybrid work environments demand more than technical know-how. They call for a renewed focus on soft skills. Today's training programs strike that balance, offering flexibility and efficiency while nurturing the human abilities that keep teams connected.A corporate LMS plays a central role in making this possible. Online learning sessions, quizzes, and exercises bring interactivity into virtual spaces, recreating the energy of face-to-face sessions and helping counter "Zoom fatigue." Scenario-based modules and group projects encourage peer learning, turning abstract concepts into real-world behaviors.What makes this even more effective is the insight behind it. Data gathered through the LMS highlights where learners struggle and where they thrive, allowing trainers to adjust and keep people engaged.Best Practices in Hybrid Workforce TrainingA corporate LMS makes it possible to turn hybrid training into a consistent and engaging experience. The most effective programs share a few standard best practices: flexibility and modularity allow training to adapt to shifting workloads and varied schedules, so learning becomes part of the flow of work rather than a disruption. Peer-to-peer learning fosters collaboration and community, helping employees stay connected even when they're physically apart. Accessibility is prioritized, with mobile-friendly design and multilingual content ensuring every team member can access training without barriers. Certifications and recognition keep motivation high by rewarding progress and giving learners a sense of achievement.The Final OutlookThe hybrid model is here to stay, and training strategies must evolve alongside it. Centralized systems, like a corporate LMS, are now the baseline. What sets organizations apart is how they weave flexibility, personalization, and engagement into every learning experience.Corporate Training for Hybrid Workforces. Pexels

OneXPlayer unveiled its annual flagship 3-in-1 AI PC—the X1 Air, a versatile smart terminal that seamlessly transforms between a tablet, mini notebook, and handheld gaming console. Equipped with BIWIN mini SSD, the X1 Air achieves a “dual-drive” architecture that delivers superior data transfer speeds and flexible capacity expansion, supporting smooth performance across work, creation, and gaming scenarios. Meanwhile, with a modular, slot-in form factor, the mini SSD is user-installable, offering instant storage expansion with true plug-and-play convenience.Mini SSD vs. Traditional Storage SolutionsUFS: As a soldered-to-board solution, UFS is not user-expandable. Over time, limited capacity often leads to performance bottlenecks and slowdowns. For terminal manufacturers, maintaining multiple SKUs for different capacities increases supply chain complexity and after-sales maintenance costs, as faulty units often require full motherboard replacements.microSD Express: In spite of its expandability and flexibility, microSD Express card suffers from compatibility challenges that demand extra certification and validation efforts by device makers. Bandwidth limitations also prevent it from meeting today’s high-performance application needs.Mini SSD vs. Traditional Storage Solutions. Credit: BIWINIn comparison, mini SSD shows all-around excellence in performance, dimension and expansion. And its balance between total cost efficiency and user experience for terminal brands earns it the ultimate storage solution for portable intelligent terminal.Mini SSD shows all-around excellence in performance, dimension and expansion. Credit: BIWINHigh-Speed Read/Write, Ultra-Fast ResponseEngineered with scenario-specific firmware optimizations, BIWIN mini SSD supports PCIe Gen4 ×2, with its 4K random read/write speed up to 850K/750K IOPS by using the dynamic SLC cache technology. The low latency and fast response in data processing empower the X1 Air to handle high workloads and seamless mode switching across handheld, tablet, and notebook use. From multitasking and heavy software loading to instant 3A game rendering, the mini SSD unlocks the full potential of the X1 Air’s AI-ready processors, big-core CPU, and integrated GPU—delivering instant app launches, lightning-fast file transfers, and near-instant boot-ups for a fluid experience across all scenarios.Mini SSD: An Innovative Storage Expansion Solution for the Edge AI Era. Credit: BIWINUltra-Small, Lightweight, and ThinWithin a sleek 252mm x 163.5mm x 13.5mm chassis weighing just about 835g, the X1 Air delivers portability without compromise. Every component equipped has been rigorously tested and precisely integrated to achieve this level of compact efficiency. Built on innovative LGA packaging, BIWIN mini SSD achieves ground-breaking small size, with its volume only 40% of a traditional M.2 2230 SSD and its weight of only 1g (roughly equal to a paperclip). This ultimate miniaturized design frees valuable space for battery and cooling, perfectly satisfying the pursuit of both lightweight body and superior performance of X1 Air.As a 3-in-1 terminal designed for portable uses, X1 Air is built for on-the-go resilience, such as commuting vibrations or travel shocks. Featured with high-quality NAND and advanced controllers, BIWIN mini SSD delivers superior shock & vibration resistance, IP68-rated dust and water protection and 3-meter drop resistance, ensuring data safety during mobile office work, outdoor creative tasks, or handheld gaming.Meanwhile, BIWIN mini SSD comes equipped with intelligent power management technology, demonstrating high-speed responses while significantly lowering power consumption. In this way, not only is the device battery life extended, but heat generation is minimized, enabling the X1 Air to achieve “lightweight and always-on” mobile experience.Plug-and-Play, Ready in a SnapFor X1 Air, portability doesn’t come at the expense of capacity and performance. Benefited from the newly-designed expandable mini SSD slot, users are allowed to additionally add mini SSD to the device based on the standard M.2 PCIe 4.0 SSD. The maximum capacity expansion is up to 1TB (2TB to be launched soon), so the device is able to realize a total capacity of 3TB, more than enough for gaming libraries, creative projects, and productivity workflows.Plug & Play Slot Design. Credit: BIWINThe modular slot-in design supports safe hot-swapping and modular upgrades after power-down, requiring no disassembly or tools. Just like swapping an SD card, users can expand capacity or transfer data on the fly—whether refreshing a game library during travel or quickly loading project files in the studio. Built with premium TLC NAND and fortified by Wear Leveling, ECC, and LDPC error correction, the BIWIN mini SSD ensures data reliability and endurance even under frequent swaps, multi-mode usage, and mobile conditions.Infinite Storage, Unlimited SolutionsAs users demand greater performance, responsiveness, and immersive experiences from portable intelligent devices, storage has become a critical enabler and a key differentiator for competitiveness in edge AI systems. The collaboration between BIWIN and OneXPlayer exemplifies the perfect synergy of technological innovation and exceptional product philosophy.Looking ahead, BIWIN remains committed to its vision of “Infinite Storage, Unlimited Solutions”. By strengthening partnerships across the ecosystem, BIWIN will continue to drive innovation and accelerate the adoption of AI at the edge, unlocking new possibilities for the next generation of intelligent devices.

Taiwan has taken a notable step in corporate digital asset strategy. WiseLink, a Taiwan-listed fintech and SaaS provider, has led a $10 million funding round for Top Win International, which is now rebranding as AsiaStrategy following its merger with Sora Ventures.The deal, finalized on August 15, marks the first instance of a publicly traded company in Taiwan investing directly in a firm whose strategy centers on holding Bitcoin as a treasury reserve.Top Win, previously known for trading luxury watches, is now listed on Nasdaq under the ticker SORA. In May, the company began shifting toward digital assets by adopting a model that blends traditional retail with Bitcoin-focused capital allocation. By holding Bitcoin on its balance sheet and investing in similar firms, AsiaStrategy aims to emulate the trajectory of its Japanese counterpart, Metaplanet. Metaplanet has accumulated over 7,800 Bitcoin and experienced a stock price increase of more than 3,600% over the past year.WiseLink contributed $2 million through a three-year convertible note, with the remaining funds provided by U.S. investor Chad Koehn and four private investors. Company executives described the transaction as a strategic integration of Bitcoin with cross-border financial operations. This hybrid model may offer both asset protection and new avenues for business development.WiseLink CEO Tsai Kun Huang referred to the investment as a timely opportunity to explore long-term innovation in decentralized and inflation-resistant assets.The investment strategy is similar to trends seen in North America and Europe. Here, companies like MicroStrategy have built multibillion-dollar Bitcoin treasuries. For Asia, however, Taiwan's move could be the beginning of a wave of corporate adoption. Market analysts state that the region's growing interest in digital assets reflects global monetary easing and a search for hedges against geopolitical uncertainty. The idea of a 1000x crypto opportunity, which is often discussed in investment circles, shows why firms are increasingly looking for exposure to high-upside, technology-driven financial assets like cryptocurrencies.Taiwan's initiative is not solely financial—it also reflects a technological shift. In July, the government launched a blockchain-based payment system, underscoring its commitment to digital innovation.This direction is evident in WiseLink's operations, which span fintech, SaaS, and a longstanding partnership with smartphone developer OPPO. The company is integrating crypto treasury management with tech platforms, positioning Bitcoin reserves as both passive holdings and potential enablers of new financial models.Top Win's evolution from luxury retail to digital assets represents a significant change in corporate identity. The rebrand to AsiaStrategy and its merger with Sora Ventures establish a broader regional footprint, with expansion plans targeting Thailand and South Korea.Sora Ventures has pledged to deploy a $150 million fund to support at least ten public companies with Bitcoin treasury strategies by the end of 2025. Co-founder Jason Fang stated that the goal is to "anchor Asia in the global Bitcoin treasury movement."Nonetheless, the transition carries risks. Top Win has previously reported issues in financial disclosures and had only $3.8 million in working capital prior to the deal. Its balance sheet remains modest compared to Western peers.Asia's tech sector is increasingly converging with blockchain and decentralized finance. Taiwan's first public Bitcoin treasury may be an early indicator of broader changes ahead. Stakeholders across the region are now exploring not whether Bitcoin belongs on corporate balance sheets, but how significant its role may become in shaping Asia's financial landscape.

Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high performance AI, mass production for the world's first time.SK hynix said that the company has successfully completed development and based on this technological achievement, the company has prepared HBM4 mass production to lead the AI era. Through this momentum, the company has once again proven the AI memory leadership in the global market.“Completion of HBM4 development will be a new milestone for the industry,” Joohwan Cho, Head of HBM Development at SK hynix, who has led the development, said. “By supplying the product that meets customer needs in performance, power efficiency and reliability in timely manner, the company will fulfill time to market and maintain competitive position.”With recent dramatic increase in AI demand and data processing, the needs for high bandwidth memory for faster system speed are surging. In addition, securing memory power efficiency has emerged as a key requirement for customers as power consumption for data center operation has increased. SK hynix expects HBM4, with increased bandwidth and power efficiency, to be the optimal solution to meet customers' needs.HBM4, of which mass production system has been readied, has the industry's best data processing speed and power efficiency with the bandwidth doubled through adoption of 2,048 I/O terminals, double from the previous generation, and power efficiency improved by more than 40%. The company expects to improve AI service performance by up to 69% when the product is applied, which will lead to solve data bottleneck and significantly reduce data center power costs.The company has far exceeded the JEDEC standard operating speed(8Gbps) by implementing over 10Gbps(Gigabit per second) operating speed in HBM4.In addition, the company adopted the Advanced MR-MUF process in HBM4, which has been proven to be reliable in the market, and the 1bnm process, or the fifth-generation of the 10-nanometer technology, to minimize the risk in mass production.“We are unveiling the establishment of the world's first mass production system of HBM4,” Justin Kim, President & Head of AI Infra at SK hynix, said. “HBM4, a symbolic turning point beyond the AI infrastructure limitations, will be a core product for overcoming technological challenges.” “We will grow into a full-stack AI memory provider by supplying memory products with the best quality and diverse performance required for the AI era in a timely manner.”Credit: SK HynixSK hynix develops world's first HBM4, doubling bandwidth and boosting efficiency for AI memory. SK Hynix

SK hynix announced today that it has begun supplying its high-performance mobile NAND solution ZUFS 4.1 to customers, marking the world’s first mass production of this solution.The solution's adoption in the latest smartphones reinforces SK hynix's technological excellence in the global market. ZUFS 4.1 will enhance smartphones’ powerful on-device AI capabilities, offering users an innovative experience.SK hynix successfully completed the qualification process for the solution in June this year through close collaboration with customers. In July, the company began mass production and started supplying the product.ZUFS, or Zoned UFS, is an extended specification of UFS that applies Zoned Storage technology, which stores data in different zones based on its usage and characteristics.When installed in a smartphone, ZUFS 4.1 enhances the operation speed of the operating system (OS) and improves data management efficiency. As a result, it mitigates read performance degradation over extended use by more than four times compared to conventional UFS, enabling a 45% reduction in app launch times. Unlike conventional UFS, which writes new data by overwriting existing data, ZUFS 4.1 writes data sequentially. This data storage method has resulted in a 47% reduction in AI app launch times.These performance characteristics position ZUFS 4.1 as an optimal solution for today's mobile environment, where on-device AI and large-scale data processing are essential.In addition, SK hynix has significantly enhanced the error-handling capabilities of ZUFS 4.1 compared to version 4.0 developed in May 2024. By detecting errors with greater precision and clearly communicating the necessary corrective actions to the central processing unit, the latest solution is expected to significantly improve system reliability and recovery performance.“ZUFS 4.1, which we have successfully begun to supply, is the first solution developed and mass-produced through collaboration aimed at optimizing Android OS and storage devices. Looking ahead, its applications are expected to expand,” said Justin Kim, President & Head of AI Infra at SK hynix.“We will continue to supply NAND solutions that meet customer needs in a timely manner, while strengthening partnerships with global companies to strengthen our competitive edge in the AI memory sector.”Credit: SK Hynix

As digital infrastructure becomes the backbone of today's enterprises and cloud services, servers have transformed far beyond their original role as mere computing units. They now function as central nodes for computation, storage, and connectivity. Within this transformation, Flash Memory has assumed a much more critical role. No longer a passive storage medium for firmware, Flash Memory today underpins server security, trust establishment, and operational resilience.In a modern server, essential functions such as secure boot, firmware updates, identity credentials, encryption keys, and audit logs all rely on Flash Memory. This convergence of code and data means that any compromise of Flash Memory can have catastrophic consequences, potentially granting attackers control over the entire IT infrastructure. For adversaries, targeting the operating system is no longer necessary; infiltrating firmware embedded in Flash Memory can yield far more persistent and devastating results. Once the root of trust is undermined, neither the operating system nor the application layer can be fully trusted, regardless of the protections in place.The Shifting Threat Landscape: From OS to FirmwareIn recent years, multiple real-world incidents have revealed a concerning trend: attacks are no longer confined to software or network vulnerabilities but are reaching deep into firmware and memory. For instance, a compromised Baseboard Management Controller (BMC) firmware can create stealthy, persistent threats invisible to the operating system. Similarly, supply chain attacks have introduced malicious code during the manufacturing or update process, leaving organizations vulnerable even before deployment.Unsecured memory interfaces have also been exploited to execute unauthorized code within servers, effectively bypassing authentication safeguards. The common denominator in these attacks is clear: adversaries are bypassing traditional software defenses and striking directly at the hardware foundation. This makes firmware security—and by extension, Flash Memory security—the new frontline of cyber defense.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.From Passive Storage to Active Security EnablerTraditionally, Flash Memory was seen as a passive storage component—responsible only for reliable read and write operations. That paradigm no longer holds. In the face of increasingly sophisticated attacks, Flash Memory must evolve into an active participant in security enforcement.Modern servers now demand that Flash Memory deliver capabilities well beyond performance and density. At the hardware level, access control must prevent unauthorized read and write attempts. Firmware execution or updates must be validated before they can occur, while rollback prevention ensures that attackers cannot revert the system to older, vulnerable versions.Flash Memory also has to serve as a secure vault for encryption keys, including those designed for post-quantum cryptography (PQC). At the same time, it must provide tamper-evidence, event logging, and auditing support—crucial for forensic analysis. Equally important, Flash Memory must integrate with secure supply chain verification and digital signature validation, ensuring that every firmware image comes from a trusted source.These requirements are not optional. They reflect compliance with internationally recognized security standards. The U.S. NIST SP 800-193 defines resilience requirements for platform firmware. UEFI Secure Boot has become a baseline mechanism to safeguard startup integrity. Meanwhile, frameworks such as NIST 800-161 and the EU Cyber Resilience Act address risks tied to globalized supply chains. Collectively, these standards also lay the foundation for a post-quantum security landscape, where digital signatures must remain resistant to future quantum attacks.Winbond W77Q: Securing the Future of Servers In response to these growing challenges, Winbond has introduced the W77Q secure Flash Memory series, delivering a trusted solution for modern server design. Unlike conventional flash, W77Q integrates security logic directly into the memory device, transforming it from a passive component into an active enabler of system defense.One of the defining features of W77Q is its comprehensive support for secure boot. By embedding digital signature verification, W77Q ensures that servers begin execution in a trusted state from the very first instruction. The device even supports LMS-based algorithms—designed to withstand quantum-era threats—providing forward-looking assurance against tomorrow's risks.Equally important is the secure handling of cryptographic keys. W77Q can isolate keys within a hardware-protected zone, including PQC-compatible keys, shielding them from system-level vulnerabilities or external exploits. Every attempt to modify firmware must pass a hardware validation process, effectively blocking malicious injections before they take hold.W77Q's integrated cryptographic engine supports advanced digital signatures, verifying firmware authenticity directly within the flash device. Whether firmware is preloaded during manufacturing or delivered later through updates, W77Q independently validates its origin and integrity, reducing reliance on host processors and closing off critical attack vectors.By embedding security into the memory layer, W77Q mitigates several high-risk scenarios: firmware hijacking during production, tampering during logistics, insertion of fake updates through compromised channels, and unauthorized modifications that bypass operating system checks. This memory-centric defense ensures protection across the server's entire lifecycle, from factory floor to deployment and beyond.Supply Chain Integrity in the Post-Quantum EraThe rise of outsourced manufacturing and globally distributed supply chains has amplified the complexity of server security. Cybersecurity is no longer the responsibility of individual enterprises alone but a shared obligation across every participant in the supply chain. A vulnerability at any stage—from fabrication to firmware distribution—can be weaponized by attackers to infiltrate the end product.In this environment, memory-level verification becomes not just a best practice but an essential requirement. Secure flash that supports both PQC and supply chain validation ensures that every stage of the process remains verifiable and trustworthy. W77Q embodies this principle, equipping server manufacturers with a solution tailored to the challenges of globalization and quantum-era security.Building the Next Generation of TrustThe evolution of Flash Memory from passive storage to a root of hardware trust reflects a broader industry realization: security must be enforced at every layer, starting from silicon and extending all the way to the cloud. As servers form the backbone of digital society—supporting everything from financial systems and healthcare to AI model training and deployment—the integrity of these platforms is non-negotiable.By launching the W77Q secure flash series, Winbond is not only addressing today's server security requirements but also laying groundwork for the future. With support for PQC, supply chain validation, and zero-trust architectures, W77Q empowers server manufacturers to construct resilient defenses against an increasingly dynamic threat landscape.In a world where trust is both a guarantee of reputation and a prime target for attacks, securing memory at the foundational level means securing far more than a single product. It represents safeguarding entire business models, digital ecosystems, and the trust of millions of users. Flash Memory, once a silent storage element, has now emerged as the first line of defense for the digital future.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

Taiwan-based advanced packaging equipment provider C SUN Manufacturing, Ltd. (TWSE: 2467), now in its 60th year, is undergoing a critical transformation as it expands from its roots in PCB and thermal processing equipment into the forefront of semiconductor advanced packaging. Founded in 1966, C SUN has evolved into a key supplier across the AI semiconductor value chain. Through G2C+ Alliance, the company has established strategic sites across Linkou, Hsinchu, and Taichung: Taiwan's west coast "Golden Corridor" to provide localized support for foundry and OSAT customers.As AI technology progresses through four key stages: perception, generation, reasoning, and physical execution, advanced packaging has become essential for sustaining Moore's Law. Industry analysts point to aggressive capacity expansion from TSMC between 2022 and 2026, with annual growth rates projected at 80% for AI testing and CoWoS, and 100% for SoIC technologies. This surge presents a significant opportunity for equipment suppliers who can keep pace with evolving process requirements.C SUN began co-developing advanced packaging equipment with global semiconductor leaders in 2012. Since then, precision demands have grown exponentially. In the first half of 2025, advanced packaging equipment already contributed 40% of C SUN's revenue, a tenfold increase over the past five years.Building on its legacy as a leader in PCB equipment, the company is also capitalizing on the evolution of HDI for AI technologies. It supplies critical process tools such as desmear, PTH, lamination, and debonding. PCB-related sales accounted for 51% of revenue in the first half of 2025, with advanced PCB revenue alone growing 7x in the past five years. To support these dual growth engines, C SUN has preemptively expanded its engineering workforce by 30% over the past three years, laying the foundation for its next decade.In H1 2025, C SUN reported NT$2.819 billion in revenue, marking a 16.1% year-over-year increase. Notably, equipment sold into the AI industry chain accounted for over 65% of total sales. The two primary growth drivers: advanced packaging and advanced PCB, remain at the center of C SUN's strategic focus. Moving forward, the company will continue to expand its AI-related portfolio, not only CoWoS, but also WMCM, SoIC, HBM, burn-in test, IC substrates, and advanced HDI. The roadmap further extends into emerging sectors such as reclaimed wafers and glass substrates.From a macro perspective, C SUN is uniquely positioned to benefit from the convergence and diversification of AI hardware ecosystems. As the boundaries between foundry and OSAT operations blur under the emerging “Foundry 2.0” model, and as AI-specific demand rises in the PCB sector, equipment suppliers are entering their golden age. Since 2024, OSATs have taken on more outsourced work, opening new collaborative opportunities for toolmakers.C SUN has already seen success with the adoption of its vacuum pressure ovens in OSAT processes and is expanding into CoW-level applications. As demand for high-performance computing (HPC) chips grows, the company is scaling up with top global OSATs, including overseas deployments. Though this expansion entails near-term costs, C SUN expects strong long-term revenue contributions given the high value of its equipment portfolio.Looking ahead, C SUN stands out as one of Taiwan’s few players with deep involvement in both advanced PCB and semiconductor packaging. It plays a pivotal role in the upstream AI server supply chain. With major US-based CSPs continuing to increase capex, C SUN is positioning itself as a core enabler of the global AI packaging wave, ready to ride the next high-growth cycle.Credit: Company