Co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits, Peking University and organized by JWinsights (Shanghai) Technology Co., Ltd., the Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) was successfully concluded on September 25, 2025...
In recent years, the automotive industry has shifted from traditional mechanical manufacturing to a new era of intelligence and connectivity. The introduction of technologies such as autonomous driving, connected vehicles, and OTA (Over-The-Air) software updates has transformed vehicles from simple means of transportation into vital nodes for information exchange...
AT&S, a global leader in high-end IC substrates and printed circuit boards, took part in the 2025 Chongqing Mayor's International Economic Advisory Council (CMIA) conference, held under the theme "Building an AI Application Hub to Enable High-Quality Industrial Development."
Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design
Wise Integration, a pioneer in digital control for gallium nitride]GaN^and GaN IC-based power supplies, today announced the appointment of Ghislain Kaiser as Chief Executive Officer. Kaiser succeeds CEO and co-founder, Thierry Bouchet, who will continue to serve as Chief Technology Officer and General Manager, leading the worldwide R&D and driving the technological vision.
The modern digital supply chain is no longer a traditional linear sequence but a complex, interconnected ecosystem of suppliers, sellers, logistics providers, and customers. While digital transformation greatly improves efficiency, it also exponentially expands the overall attack surface. In this model, risks are no longer isolated but systemic and cascading...
As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled applications-from data center accelerators to compact edge devices-require processing systems with exceptional computational power, high performance, and access to large memory storage.
Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths Group, is pleased to announce that its patented, state-of-the-art DaVinci Gen V test sockets have been selected as the exclusive test socket solution by a major global provider of high-performance artificial intelligence semiconductor chips.
The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum), co-hosted by Shenzhen Memory Industry Association and School of Integrated Circuits at Peking University, is scheduled to be held on September 25, 2025 in Renaissance Shenzhen Bay Hotel...
Hybrid work is reshaping the way organizations train their people. The new reality requires a balance of efficiency and flexibility, as organizations strive to achieve easy access to learning and measurable results across groups dispersed in different locations.
