Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles for low-risk, high-yield production of ASICs with TSMC 2.5D and 3D Advanced Packaging Technology (APT). The platform supports TSMC's CoWoS-S, CoWoS-R, and InFO technologies. GUC provides a total solution: silicon-proven interface IPs, CoWoS® and InFO silicon-correlated design, signal and power integrity, thermal simulation flows, and high volume product proven DFT and production tests.
The emergence of 5G, Artificial Intelligence (AI) and Internet of Things (IoT) technologies can unlock digital transformation to meet the needs of various industries such as manufacturing, healthcare, urban infrastructure, etc. While Cloud solutions are becoming indispensable technology, challenges around the system performance, privacy, and complexity stimulate connected technology innovation for Edge Computing. AEWIN provides innovative hardware to handle evolving edge computing needs to keep ahead of the competition. The most recent releases of SCB-1932C and SCB-1937C purpose-built servers add speed, flexibility, reliability and maximal computing power to support diverse edge computing for multi-access edge computing (MEC) and AIoT applications.
MSI, the world's leading PC brand, today announced the kick-off of the MSI Creator Awards 2022! The MSI Creator Awards which has been loved by all creators for three consecutive years is held to recognize and encourage the most creative and outstanding creators around the world. In addition to three categories: Graphic Design, 3D Creation and Film, there will be MSI Special Prize and People's Choice, so that more creations have the opportunity to be favored.
ADLINK Technology Inc, a global leader in edge computing, introduces two new modules in the 6-CH EU Series digital I/O – the ECAT-4XMO motion control and trigger module, and the ECAT-TRG4 trigger modules. The new modules are a dynamic extension to ADLINK's EtherCAT System and are designed to perfectly complement the EU Series, enabling higher performance in automatic assembly, test, and inspection equipment across a multitude of applications including cell phone glass inspection, battery cell assembly, camera lens assembly and test and glue dispensing machinery, as well as inspection equipment.
The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the electrical characteristics of each die on the wafer, so that dies with faulty electrical performance can be vetted before packaging, effectively reducing unnecessary manufacturing costs from faulty products.
Consumer demand for higher audiovisual quality is driving the evolution of technologies behind LCD displays. Specifically, mini-LEDs, with their superior contrast and color gradation performance, have emerged in the field of display backlights. With a strong R&D foundation in the field of mini-LED technology, Macroblock recently launched a series of mini-LED backlight driver ICs that correspond to various LCD display sizes. According to Chris Chen, Macroblock backlight product manager, the company can help clients create the most suitable products tailored to the needs of different groups in the market.
Sintrones' in-vehicle computers offer a complete solution for in-vehicle applications, including driver behavior monitoring and self-driving capability. They have high flexibility, support a wide range of peripherals and connectors, and can be adapted to various vehicle management systems. Common use cases include: fleet management with GPS requirements, vehicle maintenance systems, and computing for autonomous vehicles.
