Rambus formally rolled out its Redwood logic interface technology Monday (Feb 17)

Assessment of Intel's latest move in the run up to the Intel Developers Forum (IDF).

Solution integrates analog and wireless capabilities -- audio, power management, Bluetooth connectivity, imaging interface, baseband and RF -- into module and chipset platforms for mobile phone makers.

IBM press release and Silicon Strategies article.

Kopin makes GaAs transistors and miniature flat-panel displays for wireless communications and digital imaging with 13% of sales to Japan's Matsushita Electrical, 15% to Japan's Victor, and 25% to Korea's Samsung Electronics.

UMC vice chairman and SiS chairman John Hsuan said Friday SiS plans to continue operating its 8-inch fab, with UMC's help.

Wafer shipments up sharply, while revenue rebound weaker in 2002