Around the web news tagged Semiconductors

Top 10 equipment suppliers, VLSI Research

ISuppli lowers PC forecast, but ups flash memories (Feb 24)

SST's SuperFlash yields 32-Mbit memory with speedy erase (Feb 24)

KLA-Tencor rolls out advanced CD SEM for sub-100nm chip production (Feb 24)

Canon insists 157nm tool program on track (Feb 24)

Semiconductor Industry Association sees light at the tunnel (Feb 24)

Atmel introduces new high-performance easy-to-use SiGe IF demodulator IC with integrated switching buffer capability

Altera qualifies ASE's lead-free packages (Feb 24)

Agilent opens two new facilities in Malaysia for R&D and manufacturing of new technologies (Feb 24)

KLA-Tencor establishes new performance standards in sub-100nm lithography control with latest-generation CD SEM platform (Feb 24)

Analog Devices announces the first 3V, 14-bit, 80-MSPS A/D converter with sub-500mW power consumption in a chip-scale package, for wireless infrastructure applications (Feb 24)

Atmel joins ZigBee alliance (Feb 24)

Invensys, Mitsubishi Electric, Motorola, and Philips formed the ZigBee Alliance to drive the creation and further the development of the ZigBee wireless connectivity standard

Teradyne Connection Systems to offer deep micro-via solutions (Feb 24)

Tower Semiconductor announces 4Q and year 2002 results (Feb 24)

2002 Revenues flat on year. Fab 2 brought on line and 0.18-micron process technology transfer from Toshiba completed. 0.13-micron process technology from Motorola lined up. Macronix counts among Tower's major shareholders.

Samsung to up investment in Indonesia this year (Feb 24)

Intel kicks off nex-gen audio effort – Azalia specification (Feb 21)

Hitachi licenses on-chip interconnect technology from Sonics (Feb 21)

iSuppli analyst: DRAM consolidation will not raise prices (Feb 21)

Intel shifting emphasis in stacked CSP from custom to standard products (Feb 21)

Sunplus licenses MIPS technology (Feb 21)

Power budget reduced for Intel-based notebooks (Feb 21)

Fab utilization declined in 4Q, says SICAS (Feb 21)

Chip of a new block: India may get Intel outside

Reports about Intel siting a fab plant in India emerged after CEO Craig Barrett said in Australia this week that "it should come as no surprise that we export our manufacturing operations to areas where there is a skills surplus, such as India."

Databeans: ST retains lead in analog (Feb 21)

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