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10 Nov 20048 Nov 20045 Nov 20044 Nov 20043 Nov 2004
Silicon Strategies
Compound Semiconductor
9 Nov 2004
Silicon Strategies
STATS ChipPAC has further expanded its die stacking technology to include two leadframe based performance packages, exposed pad Thin QFP (TQFP-ep) and the Quad Flat No Lead (QFN) package family.
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Semiconductor International
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Silicon Strategies
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