Around the web news tagged Semiconductors

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Displaying links tagged Semiconductors [back to index]

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30 Jun 2005

SKorea's Samsung Elec develops advanced display drive IC chip for 3G handsets (Jun 29)

STMicro licenses H.264 mobile decoder software from McubeWorks

Analyst raises annual chip market growth forecast to 7% (Jun 29)

NAND market hit by MP3 slowdown (Jun 29)

AMD leaves Lenovo out of antitrust complaint (Jun 29)

AMD's Athlon FX-57 chip enhances graphics and performance (Jun 28)

Micron introduces low-profile memory modules for blade server (Jun 29)

29 Jun 2005

Speakers spar over foundry vs. IDM models (Jun 28)

Renesas tapes out 90nm production using Synopsys Galaxy (Jun 29)

Analyst warns of bleak future for photomask manufacturers (Jun 28)

Programmable ASIC market gains steam (Jun 28)

Jury finds Ultratech step-and-scan patent invalid in case against ASML (Jun 28)

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VLSI Research customer satisfaction survey results: ten best equipment suppliers in seven categories (Jun 28)

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Korea calls WTO decision a 'miscarriage of justice;' Hynix downplays impact (Jun 28)

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Applied Materials buys single-wafer cleaning technology from SCP; SCP to focus on service (Jun 28)

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August Technology jilts Nanometrics, agrees to be acquired by Rudolph (Aug 28)

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SigmaTel slashes June quarter guidance on weaker than expected audio player sales (Jun 28)

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Japan could penalize Hynix after WTO decision (Jun 28)

LSI pushes RapidChip ASICs to 90 nm (Jun 28)

Japan could impose tariffs on Hynix, says report (Jun 28)

Apple adds Radeon X850 XT as Power Mac G5 option (Jun 28)

AMD charges Intel with coercion in antitrust suit (Jun 28)

Altera, InterNiche and MorethanIP announce networking reference design for Nios II processor (Jun 28)

28 Jun 2005

New powerhouse is emerging in India (June 27)

CEVA unveils CEVA-Audio DSP-based audio platform (Jun 27)

China-made chips to be embedded in TVs (Jun 27)

Toppan Photomasks to expand Ichon, Korea, facility and add leading-edge production line (Jun 27)

Nano-Tech Silicon India breaks ground for 200-mm fab (Jun 27)

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Freescale joins EU 45nm research (Jun 27)

AMD sticks with single core for gamers (Jun 27)

4G mobile phone tests hit 1Gbit/sec. (Jun 27)

WTO backs U.S. appeal on Hynix computer-chip tariffs (Jun 27)

SMIC releases 180 nm design kit for use with Agilent tools (Jun 27)

0.4-V DRAM array technology using twin cells for next generation mobile devices (Jun 27)

Metalink unveils complete chipset for 802.11n standard

Broadcom unveils world's first Bluetooth EDR chip for wireless stereo headsets

27 Jun 2005

Samsung develops extra-small image sensor chip (Jun 27)

Intel, STMicro release fuel cell specs for notebooks (Jun 27)

Samsung, analysts clash over memory market (Jun 24)

Hynix issues smaller than expected US$500 million bond in New York (Jun 25)

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