Under the deal, LDK Solar will deliver roughly 540 megawatts of solar wafers to Qimonda or its new joint venture with Centrosolar from 2009 through 2013.

Are chip makers building electronic trapdoors in key military hardware? The Pentagon is making its biggest effort yet to find out.

"...The group said its 59 affiliates would invest a total of 27.8 trillion won (27.9 billion dollars) for this year to enhance growth potential and develop new businesses..."

A recent study by the global market intelligence firm IDC (International Data Corporation) indicates the Indian semicon and embedded design service industry would face challenges due to looming recession in the US and a depreciating dollar putting pressure on margins.

The departure of Samsung Group chairman Lee Kun-hee out and disbanding of the group’s strategic planning office has set subsidiaries on a more solitary course under their respective management. They will have to strengthen their autonomy and will be evaluated on their achievements without having to seek cooperation with other affiliates.

Oerlikon Solar and Baoding Tianwei announced the contract signing for a turnkey thin film solar module production line. The initial production capacity will be 46.5 MWp (Megawatt peak) per year. The deal includes all major thin-film solar module production equipment including metrology and testing facilities. In the coming months the machinery will be shipped, installed and commissioned by a team of Oerlikon Solar experts. The project site is located in Bao Ding.

"...Amid the gloomy situation in the global chip market, Samsung plans to maintain the dominance by killing its rivals with cash...Samsung will invest some 10 trillion won solely for the semiconductor business in 2008..."

According to the U.S. Patent & Trademark Office, the invention relates to a method for assembly and packaging of one or more flip chip-configured semiconductor dice with an interposer substrate to form a flip chip-type semiconductor device assembly. The flip chip-type semiconductor device assembly includes a conductively bumped semiconductor die and an interposer substrate having a plurality of recesses formed therein.

Writing on Nanosolar’s blog, CEO Martin Roscheisen has unveiled the next prong in his firm’s business plan — a focus on municipal solar power plants of 2 - 10 megawatts in size. The idea is to build 10 acre lots on the outskirts of small cities that could feed into the municipal power grid directly.

Samsung Electronics beat expectations with a 37% rise in quarterly net profits, fuelled by sparkling performances in display panels and mobile phone handsets.

Rambus has scored another legal victory in its battle to collect millions of dollars in royalties on its memory chip patents, as a federal appeals court ruled that the FTC didn't offer enough evidence that the company engaged in monopolistic behavior. The court raised questions about whether there's enough evidence to support the FTC's claim that Rambus engaged in deceptive behavior in the standards-setting process. And even if Rambus did deceive the engineering council, it did not harm competition in a monopolistic way.