Around the web news tagged Semiconductors

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27 Jun 2003

SanDisk denies violating Infineon's flash-memory patents (Jun 27)

AMD completes Indian outsourcing move

Fujitsu ASIC claimed to significantly cut design time and cost

Update - Cirrus transfers chip-test assets to Chippac

26 Jun 2003

Is hyperthreading hyperthreatening homestyle PC preconceptions?

ATI 3Q revenues soar

Applied announces low down-force, low-k CMP machine

DRAM opponents come out swinging at ITC dumping trial

Qualcomm licenses CDMA chip technology to Via

SEMI says Semicon Taiwan still on track

Interview: John Bourgoin, chairman and CEO of MIPS Technologies

IBM claims world's first 3D magnetic crystal

TSMC to globally offer 79 million ADRs

Sandisk seeks ruling it did not infringe on patent

25 Jun 2003

Skies clearing for Taiwan tech stocks (Jun 25)

What is ahead for Taiwan's two favorite foundries: TSMC and UMC?

DRAM chip prices steady but may drop near end of June (Jun 25)

See DRAMeXchange's weekly update for a different forecast.

Fuji Film buys Motorola unit's CCD fab (Jun 25)

Capital costs to soar for 65nm masks, warns Photronics' CEO

Motorola preps SOI for 90nm node, for Crolles alliance (Jun 25)

Atmel preps 'Janus' gigaflop DSP for HotChips

Intel , HP help academia (Jun 25)

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Fuji Film buys Motorola unit's CCD fab

AMD sees quarterly sales shortfall

Epson, Fuetrek co-develop display control IC for mobile phones with megapixel cameras (Jun 25)

24 Jun 2003

Atmel plugs SoC hole in DSP push

Jury still out for EDA industry on structured ASICs

Epson develops new display control LSI for cellular phones with megapixel cameras

Lattice spins 10-Gbit transceiver chip

Next phase for PRAM

Wafer prices flat in second quarter, says FSA

Motorola preps SOI for 90nm node, for Crolles alliance

ATI sets sights on Intel (Jun 23)

Catalyst Semiconductor looks to China sales expansion

23 Jun 2003

Time, tide and the electronics migration wait for no politician

TI delivers industry's most highly integrated DAB baseband

ST receives 2003 Industrial Award from CERN in Geneva

TSMC sues to protect customers and invalidate Syndia patents

VIA and Transmeta are made for each other (Jun 23)

600MHz TigerSharc packs IBM DRAM

Is Winbond blowing smoke on 300mm fab plans?

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