Numonyx has taped out a 1Gbit phase change memory, according to company CTO Ed Doller. "We've taped out a 1Gb phase change device on 45nm", said Doller. "Our view is that it's scalable for NOR to the 32nm node".

According to new market share figures from Gartner, both Samsung Electronics and Micron Technology have gained the most share in the DRAM market in the fourth quarter of 2008, as rivals struggle to preserve cash by cutting production. Samsung held a 29.5% market share in 3Q08 but saw this increase to 31.1% in the 4Q08. Micron saw its share increase from 8.8% in 3Q08 to 11.0% in 4Q08, thanks to strong bit growth. Micron also moved into fourth place in Gartner's DRAM company rankings.

A combination of 200mm fab closures and slowing capacity expansions at existing 300mm fabs is expected to result in a NAND flash capital expenditure decline of 58.9% in 2009, according to DRAMeXchange. In 2008, NAND flash capex declined 27.7%.

Singapore's chip-packaging and testing firm STATS ChipPAC has said that it will not proceed with an exercise to reduce its capital because it was unable to obtain debt financing amid the financial turmoil.

US semiconductor maker Ramtron International has announced that it has entered into a foundry services agreement with IBM. The companies plan to install Ramtron's F-RAM semiconductor process technology in IBM's Burlington, Vermont, advanced wafer manufacturing facility.

Texas Instruments has sent out a little reminder that it won't be a cakewalk into the smartphone market for newcomers Intel and Nvidia. TI continues to upgrade its arsenal of ARM-design-based processors, which have been shipping for years to cell phone customers.

Samsung Electronics, the world's top maker of memory chips and flat screens, is planning to reduce its capital expenditure by 35% in 2009, the Korea Economic Daily has reported.

Infineon Technologies AG, Europe's second-largest chipmaker, would consider merging with another company although a partner may be hard to find because of the economic crisis, CEO Peter Bauer said.

Global chipmakers, battling slower technology demand, are betting size matters as they pin their hopes for future growth on small and easy to carry mobile devices such as netbooks and smartphones.

Fujitsu and Toshiba has announced that they have signed a memorandum of understanding (MOU) on the transfer of Fujitsu's hard disk drive (HDD) business to Toshiba. The companies plan to conclude a transfer contract at an early date, and aim to complete the transaction in the first quarter of fiscal 2009.

Spansion is in the midst of a crisis. Asked if Spansion would file for Chapter 11 bankruptcy in the US as some have speculated, a spokeswoman for the company said: "Legally, this filing (in Japan) does not automatically require a filing in the US Management is committed to working diligently with outside advisors to help guide the company through the restructuring process. We can't comment on speculation beyond (the Japan) announcement."

ARM, the company that has designed most of the processors in mobile phones, on Monday announced a new, low-cost processor called "Sparrow" at the Mobile World Congress trade show. The company said it is aiming to conquer the netbook market with its multi-core Cortex A9 architecture.

Swiss chipmaker STMicroelectronics says in a warn letter that a three-year plan to phase out positions as the company moves towards the closing of its Carrollton plant is going forward with a staffing reduction that will impact 36 workers in the near future.

Amkor Technology swung to a net loss of US$623 million in 4Q08, compared to a profit of US$32 million in the previous quarter. The US packaging and testing house has said its 1Q09 sales to drop 30-38% sequentially with gross margin between 5% and negative 2%. Meanwhile, Amkor estimated to see its second straight quarterly loss in 1Q09.

Applied Materials announced that its president and CEO Mike Splinter met with President Obama and CEOs of several of America's largest companies at the White House today to discuss the American Recovery and Reinvestment Act. Splinter focused his remarks on key aspects of the clean technology agenda, including incentives for solar energy adoption as a way to create new jobs as the new administration and both houses of Congress look to reinvigorate and stimulate the US economy.

Using natural butterfly wings as a template, researchers have transferred their light-harvesting structures to dye-sensitized solar cells (DSCs). The study shows that some microstructures on the wing surface are effective solar collectors or blocks.

For the troubled memory maker Qimonda things may get even tougher as the company is facing a class-action lawsuit from the former employees of its plant based in Richmond, Virginia.

Commenting on the negotiations with the Taiwanese manufacturers, Elpida's President and CEO Yukio Sakamoto said, "Basically, we would like to form a capital alliance with them. As for DRAM business, it's best if Japan and Taiwan come together."

Elpida Memory will raise about 40 billion yen ($435 million) to 45 billion yen from partners, the Nikkei reported, citing President Yukio Sakamoto.

The largest series of solar installations in history, more than 1,300 megawatts, is planned for the desert outside Los Angeles, according to a new deal between the utility Southern California Edison and solar power plant maker, BrightSource.

Altera Corp will spend US$20-25 million this year on its worldwide operations to grow new technologies and products. The company is also looking to open R&D sites in its Penang plant (Malaysia).

SanDisk and Toshiba has announced the co-development of multi-level cell (MLC) NAND flash memory using 32nm process technology to produce a 32Gb 3-bits-per-cell (X3) memory chip for products ranging from memory cards to solid state drives (SSD).

SanDisk has announced that it will begin mass-production of 4-bits-per-cell (X4) flash memory. Using 43nm process technology, this breakthrough enables 64Gb memory in a single die. The X4 memory chip combines with the X4 controller chip in a multi-chip package (MCP) to provide a complete, integrated and low-cost storage solution.

Infineon Technologies AG CEO Peter Bauer said he will take a 20% pay cut in 2009 as Europe's second-largest maker of semiconductors faces a "difficult year" filled with "many tough challenges."

After months of potential acquisition talks, Microchip Technology Inc Tuesday officially ended its pursuit of FPGA maker Atmel.

Rumors at ISSCC and other events are that Taiwan foundry vendor United Microelectronics Corp. (UMC) is mulling over plans to join IBM's "fab club." The group, which co-develops advanced process technology and shares the associated costs, consists of AMD, Chartered, IBM, Infineon, ST, Toshiba, NEC, Freescale and Sony. AMD's proposed foundry spin-off is also part of the group.

Applied Materials, the world's largest manufacturer of semiconductor production equipment, posted its first quarterly loss since 2003 and said it would cut back production, sending its shares sliding 3.2%.