Micron Technology said Monday that its board had authorized as much as $1 billion in share buybacks, its first such repurchases in three years.

Samsung successfully expands the use of the 20 nanometer process from PC and mobile memory to the enterprise server market.

Microchip Technology missed revenue targets for its second fiscal quarter ending September 30 and said the next quarter will see single-digit declines.

SiTime, a MEMS and analog semiconductor company, has signed a definitive agreement under which MegaChips, a top 25 fabless semiconductor company based in Japan, will acquire SiTime for US$200 million in cash.

Three of Japan's biggest electronics companies reported modest earnings gains Thursday for the first half of the financial year ending March, helped by the yen's weakness and restructuring, but held back by a soft domestic economy.

The 2014 Nobel Prize for physics has been awarded to a trio of scientists in Japan and the US for the invention of blue light emitting diodes (LEDs).

By integrating International Rectifier, Infineon complements its offerings and will be able to provide customers with a broader range of products and services. Infineon will also benefit significantly from greater economies of scale as well as a larger regional footprint.

ON Semiconductor has announced the completion of its acquisition of Aptina Imaging. The total consideration of approximately US$400 million in cash for the acquisition of Aptina was funded by cash on the balance sheet and ON Semiconductor's existing revolving line of credit.

Applied Materials has reported a 79% jump in its third-quarter profit, aided by solid demand for computer chips and the machines used to make them.

Qualcomm has completed its acquisition of Wilocity and has released a wireless chipset family based on the IEEE 802.11ad standard, also known as WiGig.

Qualcomm has announced that it has taken two major steps to enable the industry to deliver multi-gigabit wireless with 60 GHz technology for mobile, computing and networking devices.

In a ruling issued Thursday, the European Union's General Court rejected Intel's appeal of a EUR1.06 billion (US$1.44 billion) penalty for antitrust violations. Instead, the EU General Court upheld the record-breaking penalty against the US computer chip giant, which had been issued in 2009 by the EU Commission.

Broadcom has announced it is exploring strategic alternatives for its cellular baseband business, including a potential sale or wind-down.

More than a year after announcing plans to combine their struggling system chip operations, Fujitsu and Panasonic are finally launching their new merged company with the help of Japanese government money.

NXP Semiconductors has announced its investment in Senseg, a leader in next-generation spatial haptic feedback technology.

Taiwan Semiconductor Manufacturing Co (TSMC), the world's biggest contract chipmaker, is expected to expand its global market share to more than 50 percent this year and to 60 percent in the next few years, benefiting primarily from its leadership position in advanced technologies, Credit Suisse AG said yesterday.

Taiwan's semiconductor pioneer Morris Chang on Thursday said the protracted protest against the trade pact with Beijing is casting a gloom over the nation's future, calling for a rational and peaceful solution.

STMicroelectronics and rivals such as NXP Semiconductor and Qualcomm are battling to be picked to provide the brains for the various products in the hot segment.

Qualcomm has announced the management transition of Steve Mollenkopf to CEO and Paul E. Jacobs to executive chairman of the board of directors.

Hillcrest Labs and Bosch Sensortec have announced a partnership to launch a new sensor solution for head-mounted displays (HMDs).

More than 450 employees at NXP Semiconductors wafer fab in Nijmegen, The Netherlands, have held a two-hour strike in protest at stalled wage negotiations, according to local reports.

Intel is in the process of buying smartwatch startup Basis, as part of the tech giant's new focus on wearables and the Internet of Things.

Broadcom has announced that Datang Mobile, a core subsidiary of the Datang Telecom Technology and Industry Group, has selected Broadcom's dual-mode TD-SCDMA/TD-LTE system-on-chip (SoC) to develop a new family of enterprise and residential small cell solutions.

Amtech Systems, a supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and sapphire and silicon wafers, has received approximately US$10 million in new solar orders.

Intel is expecting its next Atom tablet chip, code-named Cherry Trail, to be in devices by the end of 2014, the company said this week.

Chipmaker Avago Technologies said it expects current-quarter sales to decline 3-6% from the first quarter as it lost revenue from a smartphone maker, which analysts said could be Apple.

Fujitsu, NTT Docomo and NEC will dissolve by March a joint venture for developing core chips for smartphones. The venture, Access Network Technology, was formed in August 2012 to develop baseband chips.

GCT Semiconductor has licensed the Cadence Tensilica ConnX BBE16 digital signal processing (DSP) core for a next-generation chipset targeting mobile applications.

JEDEC Solid State Technology Association has announced the publication of Release 6 of the DDR3 Serial Presence Detect (SPD) document. The updated standard describes new memory timing parameters and enables higher capacity memory modules.

The Gobi 9x30 is the world's first commercially announced cellular modem for automotive based on the 20nm technology node with support for global carrier aggregation deployments up to 40MHz in both LTE FDD and TDD modes.

Toshiba has developed what it claims is the world's fastest device controller for embedded NAND flash memory modules compliant with the Universal Flash Storage (UFS) Ver.2.0 and UFS Unified Memory Extension (UME) Ver.1.0 standards defined by JEDEC Solid State Technology Association (JEDEC).

International Rectifier (IR) has commenced initial production at its new ultra-thin wafer processing facility in Singapore. Wafer thinning, metallization, testing and additional proprietary wafer level processing are undertaken at the new 60,000 square foot manufacturing site which receives processed wafers from IR's internal fabs and foundry partners.