DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.
Please contact us if you're interested in arranging an interview.
Support for startups: Q&A with Arm Taiwan president CK Tseng
Following the release of Flexible Access in 2019, Arm, a subsidiary of SoftBank, is opening up the project to startups with no charge, helping newcomers to reduce...
No peak season for consumer chips in 2H20: Q&A with WT chairman Eric Cheng
Renesas Electronics has announced a decision to delegate IC distribution rights to only a few partners, with Taiwan's WT Microelectronics among them. WT is now...
FCCL enters tech-intensive era: Q&A with Taiflex president Zhi-ming Yen
High-frequency and high-speed flexible PCBs are emerging as indispensable components for antenna transmission modules for hand-held devices, IoT networking equipment...
Beyond ruggedized IPCs: Q&A with Getac chairman James Hwang
Taiwan-based ruggedized industrial PC (IPC) maker Getac has been transforming its business and is adopting a business model of a system integrator (SI) to expand...
Materials challenges for IC substrate production: Q&A with Unimicron vice CEO CP Lee
IC substrates are set to enter a golden growth period driven by ever-increasing applications of 5G and AI chips solutions. To secure a preemptive presence in the...
PC market still full of opportunities: Q&A with Frank Soqui, VP of Client Computing Group and GM of Gaming Division at Intel
Intel currently still holds an 80% share in the global PC market, but the growth of the CPU giant's PC platform business has weakened, thanks to prolonged shortages...
Memory-centric solutions for next 20 years: Q&A with Macronix chairman Miin Wu
Taiwan-based Macronix International has developed into the world's largest supplier of ROM chips and second biggest maker of NOR flash memory chips after experiencing...
LTCC application to 5G mmWave base stations: Q&A with Brian Laughlin and Jeffrey Wang from DuPont
While 5G mmWave-related technologies are developing rampantly, US chemical materials giant DuPont has set eyes on promoting its LTCC (low temperature co-fired...
MediaTek's role in 5G world: Q&A with TL Lee, GM of wireless communication
MediaTek has released Dimensity 1000 featuring four Arm Cortex-A77 cores operating up to 2.6GHz with four power-efficient Arm Cortex-A55 cores operating at up...
Synergy from acquiring Kemet: Q&A with Yageo chairman Pierre Chen
Taiwan-based Yageo announced recently plans to acquire fellow US-based passive component company Kemet in an all-cash transaction valued at US$1.8 billion. The...
Positioned as LaaS provider: Q&A with WPG CEO Frank Yeh
As the largest electronics distributor in Asia, WPG Holdings continues to expand and diversify its offerings particularly those for 5G, AI and automotive electronics...
Advanced packaging, mini LED rising as new growth driver: Q&A with Kulicke & Soffa SVP CP Chong
US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging...
Riding high along with 5G development: Q&A with Unizyx CEO Gordon Yang
Taiwan-based networking devices and solutions provider Unizyx Holding has adjusted its operations over the past two years and also expanded its business scopes...
5G real-time transmission crucial for AR applications: Q&A with Mifly CEO Roger Lu
AR can create brand-new gaming experience, but for industry applications, AR can help firms tackle their long-existing pain points, according to Roger Lu, founder...
AR is friendliest interface to information: Q&A with ARPlanet CEO Jennifer Pai
ARPlanet Digital Technology, founded in 2010 as an AR startup, provides a full range of virtual and physical realities integration solutions. The company is now...
Hybrid cloud in 5G era: Q&A with VMware Taiwan general manager Barry Chen
VMware has teamed up with Taiwan-based partners including Chunghwa Telecom, Chief Telecom, Far EasTone Telecommunications, Systex and Taiwan Mobile to offer its...
Wi-Fi 6 outlook: Q&A with Cees Links from Qorvo
Along with Skyworks and Broadcom as the world's top-3 providers of RF (radio frequency) solutions for advanced wireless devices, US-based Qorvo is keen on promoting...
Quanta making AI push, says chairman
AI will usher in the Fourth Industrial Revolution, and Taiwan must manage to develop a solid presence in the AI era that will persist into the next decades, Quanta...
Memory long-term outlook promising: Q&A with Micron EVP Sumit Sadana
The memory-chip market conditions will start to improve later in 2019, followed by several years of prosperity, according to Sumit Sadana, executive VP and chief...
Why 12-inch fabs are better for power components: Q&A with Bing Xue, AOS SVP of global sales
Alpha & Omega Semiconductor (AOS), which designs and manufactures power semiconductors for a broad range of applications, will start production at its new...
Industry 4.0 brings lucrative opportunities for chipmakers: Q&A with TI manager Matthieu Chervier
Global chipmakers have been racing to develop chip solutions associated with Industry 4.0 applications to tap huge business opportunities arising from smart manufacturing...
Taiwan must run faster in IC development: Q&A with science minister Chen Liang-gee
TSMC is likely to kick off volume production of 3nm manufacturing process in 2022-2023, when AI and 5G applications are seen to explode to drastically drive the...
China IC supply chain gaining momentum: Q&A with Photronics DNP Mask
As a joint venture between US photomask maker Photronics and Japan's Dai Nippon Printing (DNP), Photronics DNP Mask broke ground in mid-2018 for building a photomask...
Focus on stability: Q&A with Globalfoundries executives
Globalfoundries announced in August 2018 its decision to put 7nm FinFET R&D on hold indefinitely in a move to intensify the company's focus on delivering differentiated...
