DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.
Please contact us if you're interested in arranging an interview.

Contract PCB drilling service: Q&A with Key Ware CEO Chen Po-ying
Taiwan suppliers of high-end IC substrates, HDI boards, rigid PCBs with high layer counts and flexible PCBs are expected to have another busy year in 2021 after...

5G opportunities: Q&A with LitePoint president Brad Robbins
LitePoint, a US-based wireless test solution provider, offers turnkey over-the-air test solutions from development to production, combined with software automation...

Customized 5G private networks: Q&A with Quanta Cloud Technology president Mike Yang
Following years of deployments in 5G-based ORAN (open radio access network), Quanta Cloud Technology (QCT), a subsidiary of Quanta Computer, has set sail on a...

Taiwan to head for smart digital economy, says science minister
Taiwan will focus its next wave of technology development on materializing smart healthcare, precision medicine, smart city and digital data governance by leveraging...

Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to...

5G, mini LED opportunities in 2021: Q&A with K&S executive VP CP Chong
For the world, 2020 has been a roller-coaster year, but that has not dampend the prospects of some new tech applications such as mini LED backlighting which are...

IT ecosystem transformation: Q&A with Inventec chairman Tom Cho
The global IT ecosystem is undergoing fundamental changes in the wake of the coronavirus pandemic and US-China trade tensions. Inventec, as one of the major ODMs...

Chips R&D matters: Q&A with iST chairman Danny Yu
Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support...

Geared towards 5G mmWave: Q&A with Flexium chairman MC Cheng
Taiwan's flexible PCB specialist Flexium Interconnect has seen its business operations improve significantly, reportedly as a result of entering the supply chain...

Support for startups: Q&A with Arm Taiwan president CK Tseng
Following the release of Flexible Access in 2019, Arm, a subsidiary of SoftBank, is opening up the project to startups with no charge, helping newcomers to reduce...

No peak season for consumer chips in 2H20: Q&A with WT chairman Eric Cheng
Renesas Electronics has announced a decision to delegate IC distribution rights to only a few partners, with Taiwan's WT Microelectronics among them. WT is now...

FCCL enters tech-intensive era: Q&A with Taiflex president Zhi-ming Yen
High-frequency and high-speed flexible PCBs are emerging as indispensable components for antenna transmission modules for hand-held devices, IoT networking equipment...

Beyond ruggedized IPCs: Q&A with Getac chairman James Hwang
Taiwan-based ruggedized industrial PC (IPC) maker Getac has been transforming its business and is adopting a business model of a system integrator (SI) to expand...

Materials challenges for IC substrate production: Q&A with Unimicron vice CEO CP Lee
IC substrates are set to enter a golden growth period driven by ever-increasing applications of 5G and AI chips solutions. To secure a preemptive presence in the...

PC market still full of opportunities: Q&A with Frank Soqui, VP of Client Computing Group and GM of Gaming Division at Intel
Intel currently still holds an 80% share in the global PC market, but the growth of the CPU giant's PC platform business has weakened, thanks to prolonged shortages...

Memory-centric solutions for next 20 years: Q&A with Macronix chairman Miin Wu
Taiwan-based Macronix International has developed into the world's largest supplier of ROM chips and second biggest maker of NOR flash memory chips after experiencing...

LTCC application to 5G mmWave base stations: Q&A with Brian Laughlin and Jeffrey Wang from DuPont
While 5G mmWave-related technologies are developing rampantly, US chemical materials giant DuPont has set eyes on promoting its LTCC (low temperature co-fired...

MediaTek's role in 5G world: Q&A with TL Lee, GM of wireless communication
MediaTek has released Dimensity 1000 featuring four Arm Cortex-A77 cores operating up to 2.6GHz with four power-efficient Arm Cortex-A55 cores operating at up...

Synergy from acquiring Kemet: Q&A with Yageo chairman Pierre Chen
Taiwan-based Yageo announced recently plans to acquire fellow US-based passive component company Kemet in an all-cash transaction valued at US$1.8 billion. The...

Positioned as LaaS provider: Q&A with WPG CEO Frank Yeh
As the largest electronics distributor in Asia, WPG Holdings continues to expand and diversify its offerings particularly those for 5G, AI and automotive electronics...

Advanced packaging, mini LED rising as new growth driver: Q&A with Kulicke & Soffa SVP CP Chong
US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging...

Riding high along with 5G development: Q&A with Unizyx CEO Gordon Yang
Taiwan-based networking devices and solutions provider Unizyx Holding has adjusted its operations over the past two years and also expanded its business scopes...

5G real-time transmission crucial for AR applications: Q&A with Mifly CEO Roger Lu
AR can create brand-new gaming experience, but for industry applications, AR can help firms tackle their long-existing pain points, according to Roger Lu, founder...

AR is friendliest interface to information: Q&A with ARPlanet CEO Jennifer Pai
ARPlanet Digital Technology, founded in 2010 as an AR startup, provides a full range of virtual and physical realities integration solutions. The company is now...