Frankly speaking

DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.

Please contact us if you're interested in arranging an interview.

Displaying interviews tagged Passive, PCB, other IC components [back to index]

Virtual Antenna: Q&A with Ignion VP of innovation Carles Puente

Wednesday 7 April 2021

Notebook chip overbooking concerns: Q&A with Edom chairman Wayne Tseng

Tuesday 16 March 2021

Epi-wafer key to compound semiconductor: Q&A with VPEC chairman Jian-Lian Chen

Wednesday 10 March 2021

Contract PCB drilling service: Q&A with Key Ware CEO Chen Po-ying

Wednesday 24 February 2021

'IT' partnerships: Q&A with Manik Mumar from ELCINA

Monday 30 November 2020

Geared towards 5G mmWave: Q&A with Flexium chairman MC Cheng

Wednesday 26 August 2020

No peak season for consumer chips in 2H20: Q&A with WT chairman Eric Cheng

Tuesday 16 June 2020

FCCL enters tech-intensive era: Q&A with Taiflex president Zhi-ming Yen

Monday 27 April 2020

Materials challenges for IC substrate production: Q&A with Unimicron vice CEO CP Lee

Monday 10 February 2020

Commercial inkjet printed OLED displays may come in 2 years: Q&A with Merck CEO of performance materials Kai Beckmann

Wednesday 15 January 2020

LTCC application to 5G mmWave base stations: Q&A with Brian Laughlin and Jeffrey Wang from DuPont

Thursday 2 January 2020

Synergy from acquiring Kemet: Q&A with Yageo chairman Pierre Chen

Tuesday 19 November 2019

Why 12-inch fabs are better for power components: Q&A with Bing Xue, AOS SVP of global sales

Friday 29 March 2019

Transforming into a solution provider: Q&A with Chilisin president Jack Chung

Friday 4 January 2019

Atotech talks about core products and opportunities for 5G, AI and PCBs at TPCA Show 2018

Thursday 1 November 2018

Farewell to low-price business model: Q&A with Lelon president Wu Chih-min

Monday 9 July 2018

Cobalt solutions best helper for 7nm node: Q&A with Applied Materials expert Jonathan Bakke

Tuesday 19 June 2018

Global diode supply shortfall to last into 2Q18, says Diodes CEO

Thursday 1 March 2018

IGBT outlook in China: Q&A with HHGrace executive Jiye Yang

Thursday 9 November 2017

Heraeus Photovoltaics continues to expand and penetrate deep into the China market

Tuesday 9 May 2017

What works in telecom can work in high-speed manufacturing: Leveraging IoT with Vitesse

Wednesday 4 June 2014

Solid state storage for the enterprise and consumers: Q&A with Alex Mei, CMO at OCZ Storage Solutions

Wednesday 4 June 2014

The challenges: Digitimes Research director Joanne Chien on the changing Taiwan role in the global supply chain

Tuesday 3 June 2014

Tapping the power of mobile devices through connectivity: Silicon Image on HDMI, MHL and Wireless HD

Tuesday 3 June 2014
1/3 pages
Realtime news

Taiwan notebooks – 1Q 2021

Global server market – 1Q 2021

Taiwan LCD monitors – 4Q 2020

Global server shipment forecast and industry analysis, 2021

China semiconductor industry: From 13th 5-year Plan to 14th 5-year Plan, 2015-2025

Global LCD panel shipment forecast, 2021 and beyond

This website adheres to all nine of NewsGuard's standards of credibility and transparency.
© 2021 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.