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Sunday 19 July 2026
Interview: The pragmatic playbook behind Agility Robotics' rise
Humanoid robots are very hyped these days. They are performing ever more impressive feats, from pulling off coordinated dance performances to running half-marathons. Yet one investor believes that the robots ultimately winning the commercial race will be the "boring" ones with solid, real-world market potential.
Sunday 19 July 2026
Interview: Merck's origins trace back to 358-year-old Engel Pharmacy
Merck did not begin in a laboratory, but in a neighborhood pharmacy that still opens every day to fill prescriptions for local residents. The Engel Pharmacy in central Darmstadt, Germany, founded in 1668, has operated for 358 years and is the company's starting point.
Friday 17 July 2026
Exclusive: SiPearl turns to Taiwan ODMs to bring Rhea-based servers to market
SiPearl has powered on and begun validating Rhea1, its first-generation server CPU designed in Europe. Its next challenge is convincing Taiwan's server manufacturers to turn the chip into systems that data centers can order and deploy.
Friday 17 July 2026
Interview: QuantumDiamond's EU-backed quantum leap in chip inspection lands in Taiwan
The global tech landscape is currently dominated by two massive tides: the race for semiconductor supremacy and the long-promised dawn of the quantum era. While quantum technology is often associated with the distant goal of large-scale computing, a German startup is proving that quantum's most immediate impact may actually be in saving inspection time for the global semiconductor industry that powers the modern world.
Thursday 16 July 2026
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO
Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon photonics (SiPh) and Co-Packaged Optics (CPO). Benjamin Hein, CEO Electronics and Executive Board member at Merck, said advanced packaging materials are poised to outgrow front-end process materials and the broader materials market, while Near-Packaged Optics (NPO) will bridge the industry's transition to commercial CPO.
Tuesday 14 July 2026
Interview: UK's AI sovereignty pitch — research at home, scale with Taiwan
As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the most advanced models. It is increasingly shaped by who can secure compute, deploy infrastructure at scale, reduce energy constraints, and turn research into commercial capability.
Saturday 11 July 2026
Interview: Why Geckos bets materials, not chips, will decide the next AI performance leap
As generative AI fuels rapid growth in demand for high-performance computing (HPC), the semiconductor industry is shifting from a process race to a materials race. Geckos chairman Shen Tsung-huan says that as chip manufacturing moves to 2nm and even more advanced nodes, gains in AI computing power are no longer just a chip design issue, but are increasingly constrained by the thermal conductivity and high-frequency signal transmission capabilities of materials.
Thursday 9 July 2026
Interview: UK courts Taiwan suppliers for AI hardware buildout
The UK is pitching itself as a new base and technology partner for Taiwanese electronics suppliers, seeking to turn its AI infrastructure push into a market and investment opportunity for companies in chips, packaging, servers, cooling, power, and data centers.
Tuesday 7 July 2026
Exclusive: Geckos bets on AI materials beyond nano copper powders and CPO waveguides
As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos chairman Raymond Shen said that once chip manufacturing advances to 2nm and beyond, improvements in AI computing power are no longer just a chip-design issue, but are increasingly constrained by materials' heat dissipation and high-frequency signal transmission capabilities.
Tuesday 7 July 2026
Interview: Corning's GlassBridge points to longer-term packaging shifts, not an immediate FAU replacement
Corning has unveiled an early-stage fiber-to-chip connector concept that could reshape optical packaging if it matures, though the company says the technology is still far from commercial use. GlassBridge is aimed at passive alignment in advanced systems, underscoring the convergence of AI infrastructure, photonics, and packaging.
Monday 6 July 2026
Exclusive Interview: Dutch startup Nearfield bets on process control to rival EUV in AI chip manufacturing
As Moore's Law approaches its physical limits, simply shrinking semiconductor process nodes is no longer the sole path to improving chip performance.
Monday 6 July 2026
Exclusive Interview: Dutch startup Nearfield targets AI chip process control expansion after US$380 million funding round
Dutch semiconductor equipment startup Nearfield Instruments has completed a US$380 million Series D funding round, the largest-ever fundraising for a Dutch deep-tech company. The company is now targeting an initial public offering (IPO) in 2028.
Wednesday 1 July 2026
AI chip complexity stretches electronic materials order windows to six months, DuPont spinoff warns
As the AI wave drives rapid growth across the global semiconductor industry, the upstream electronic materials supply chain has become a key bottleneck for AI-related shipments. To keep pace with AI investment, Qnity was spun off from US chemical giant DuPont and listed independently in November 2025.
Tuesday 30 June 2026
Interview: Why DuPont spinoff Qnity is betting its Taiwan growth on packaging, not process nodes
As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals giant DuPont and separately listed — is likewise expanding its production capacity investment in Taiwan. Asia-Pacific president Dennis Chen said in an interview with DIGITIMES that future investment will center closely on three main battlegrounds: advanced processes, advanced packaging, and thermal management.
Monday 29 June 2026
Exclusive: Winbond sees AI making memory a strategic resource, maps next growth in DRAM and Flash
AI is turning memory from an inventory risk into a strategic resource. As memory becomes integral to platform and system design, customers are securing supply earlier, making availability increasingly critical to product launches, says Winbond Electronics president James Chen.