DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.
Please contact us if you're interested in arranging an interview.

Semiconductor knows no borders: Q&A with Silicon Catalyst partners
While many might be deterred by the hefty costs of starting a semiconductor company, there are still many other entrepreneurs with a silicon dream knocking on...

Partnerships towards global leaderships: Q&A with Ashwin Pershad, Tech Mahindra country head in Taiwan
Taiwanese companies planning to invest in India might have second thoughts in the wake of a riot at Wistron's plant in Narasapura stemming from salary disputes...

Transformation in next 30 years: Q&A with WPG Holdings CEO Frank Yeh
Frank Yeh, CEO of WPG Holdings, is optimistic about the overall IC industry, which he expects will be driven by demand for Chromebooks, 5G handsets and others...

All-round OSAT: Q&A with PTI CEO Boris Hsieh
Taiwan-based Powertech Technology (PTI) is one of the world's top OSATs with major backend orders from non-Korean memory vendors. PTI has just completed a top...

'IT' partnerships: Q&A with Manik Mumar from ELCINA
India is a huge country, in terms of both its size and its potential as a production base rivaling that of China's. The South Asian country, in its bid to build...

Pandemic-triggered structural changes: Q&A with ASE Technology COO Tien Wu
ASE Technology has turned optimistic about the IC backend industry prospects for the first half of 2021 with high capacity utilization to linger in diverse processes...

Driver ICs tight supply: Q&A with Chipbond chairman FJ Wu
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to...

5G, mini LED opportunities in 2021: Q&A with K&S executive VP CP Chong
For the world, 2020 has been a roller-coaster year, but that has not dampend the prospects of some new tech applications such as mini LED backlighting which are...

Opportunities amid macro uncertainty: Q&A with Avnet Asia-Pacific president Prince Yun
The coronavirus pandemic, coupled with the escalating US-China trade war, have prompted businesses to revise their roadmaps and goals for 2020. Disruptions brought...

Chips R&D matters: Q&A with iST chairman Danny Yu
Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support...

More choices for gamers: Q&A with Frank Soqui, GM of Intel Gaming Division
With the gaming market expanding quickly in the wake of the coronavirus pandemic, Intel, AMD and Nvidia are all set to release their latest CPUs and GPUs in the...

Geared towards 5G mmWave: Q&A with Flexium chairman MC Cheng
Taiwan's flexible PCB specialist Flexium Interconnect has seen its business operations improve significantly, reportedly as a result of entering the supply chain...

Support for startups: Q&A with Arm Taiwan president CK Tseng
Following the release of Flexible Access in 2019, Arm, a subsidiary of SoftBank, is opening up the project to startups with no charge, helping newcomers to reduce...

Jumping on the EUV bandwagon: Q&A with Gudeng chairman Bill Chiu
Gudeng Precision Industrial, a member of TSMC Grand Alliance and Taiwan's first semiconductor equipment maker allowed to join SEMI in setting next-generation equipment...

No peak season for consumer chips in 2H20: Q&A with WT chairman Eric Cheng
Renesas Electronics has announced a decision to delegate IC distribution rights to only a few partners, with Taiwan's WT Microelectronics among them. WT is now...

Government subsidies crucial for new TSMC fab establishment in US
TSMC is in talks with the US government about relevant subsidies for its new wafer fab in Arizona so that the foundry is able to implement the investment plan,...

PhD shortage to challenge TSMC: Q&A with company senior VP of R&D Cliff Hou
Shortages of personnel with PhDs will be a challenge facing TSMC as well as Taiwan's chipmaking industry by 2030, according to Cliff Hou, company senior VP of...

FCCL enters tech-intensive era: Q&A with Taiflex president Zhi-ming Yen
High-frequency and high-speed flexible PCBs are emerging as indispensable components for antenna transmission modules for hand-held devices, IoT networking equipment...

Materials challenges for IC substrate production: Q&A with Unimicron vice CEO CP Lee
IC substrates are set to enter a golden growth period driven by ever-increasing applications of 5G and AI chips solutions. To secure a preemptive presence in the...

Commercial inkjet printed OLED displays may come in 2 years: Q&A with Merck CEO of performance materials Kai Beckmann
Merck demonstrated its materials and technologies at the recently concluded CES 2020, focusing on four major aspects - smart city, immersive displays, in-memory...

Memory-centric solutions for next 20 years: Q&A with Macronix chairman Miin Wu
Taiwan-based Macronix International has developed into the world's largest supplier of ROM chips and second biggest maker of NOR flash memory chips after experiencing...

LTCC application to 5G mmWave base stations: Q&A with Brian Laughlin and Jeffrey Wang from DuPont
While 5G mmWave-related technologies are developing rampantly, US chemical materials giant DuPont has set eyes on promoting its LTCC (low temperature co-fired...

Concerns about tender offer by competitor: Q&A with WT Microelectronics chairman Eric Cheng
Taiwan's leading IC distributor WPG has announced an open tender offer to acquire 30% of ordinary shares of its peer WT Microelectronics (WT). WPG has requested...

MediaTek's role in 5G world: Q&A with TL Lee, GM of wireless communication
MediaTek has released Dimensity 1000 featuring four Arm Cortex-A77 cores operating up to 2.6GHz with four power-efficient Arm Cortex-A55 cores operating at up...