DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.
Please contact us if you're interested in arranging an interview.
PhD shortage to challenge TSMC: Q&A with company senior VP of R&D Cliff Hou
Shortages of personnel with PhDs will be a challenge facing TSMC as well as Taiwan's chipmaking industry by 2030, according to Cliff Hou, company senior VP of...
FCCL enters tech-intensive era: Q&A with Taiflex president Zhi-ming Yen
High-frequency and high-speed flexible PCBs are emerging as indispensable components for antenna transmission modules for hand-held devices, IoT networking equipment...
Materials challenges for IC substrate production: Q&A with Unimicron vice CEO CP Lee
IC substrates are set to enter a golden growth period driven by ever-increasing applications of 5G and AI chips solutions. To secure a preemptive presence in the...
Commercial inkjet printed OLED displays may come in 2 years: Q&A with Merck CEO of performance materials Kai Beckmann
Merck demonstrated its materials and technologies at the recently concluded CES 2020, focusing on four major aspects - smart city, immersive displays, in-memory...
Memory-centric solutions for next 20 years: Q&A with Macronix chairman Miin Wu
Taiwan-based Macronix International has developed into the world's largest supplier of ROM chips and second biggest maker of NOR flash memory chips after experiencing...
LTCC application to 5G mmWave base stations: Q&A with Brian Laughlin and Jeffrey Wang from DuPont
While 5G mmWave-related technologies are developing rampantly, US chemical materials giant DuPont has set eyes on promoting its LTCC (low temperature co-fired...
Concerns about tender offer by competitor: Q&A with WT Microelectronics chairman Eric Cheng
Taiwan's leading IC distributor WPG has announced an open tender offer to acquire 30% of ordinary shares of its peer WT Microelectronics (WT). WPG has requested...
MediaTek's role in 5G world: Q&A with TL Lee, GM of wireless communication
MediaTek has released Dimensity 1000 featuring four Arm Cortex-A77 cores operating up to 2.6GHz with four power-efficient Arm Cortex-A55 cores operating at up...
A new chapter for UMC: Q&A with company co-presidents Jason Wang and SC Chien
UMC, once a major rival to TSMC in pursuing advanced manufacturing nodes, decided about two years ago to shift its focus away from joining the race to 10nm and...
Synergy from acquiring Kemet: Q&A with Yageo chairman Pierre Chen
Taiwan-based Yageo announced recently plans to acquire fellow US-based passive component company Kemet in an all-cash transaction valued at US$1.8 billion. The...
SiC MOSFET development: Q&A interview with Hestia Power CEO Lee Chwan-ying
SiC MOSFETs sees fast development and growing demand due to needs for high-voltage and high-power operating environment, but it is quite impossible for them to...
Positioned as LaaS provider: Q&A with WPG CEO Frank Yeh
As the largest electronics distributor in Asia, WPG Holdings continues to expand and diversify its offerings particularly those for 5G, AI and automotive electronics...
Intel expanding chip output: Q&A with company CEO Bob Swan
Intel will be gradually expanding its foundry production capacity, particularly for 14nm process this year, according to company CEO Bob Swan. Swan and other Intel...
Ready for SiC wafer production: An interview with GlobalWafers chairman Doris Hsu
GlobalWafers, a semiconductor silicon wafer maker, began trial production of SiC wafers in May-June 2019 and plans to start production in small volume in second-quarter...
Advanced packaging, mini LED rising as new growth driver: Q&A with Kulicke & Soffa SVP CP Chong
US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging...
China foundry HSMC to push chiplet standard formulation, says CEO Shang-yi Chiang
While Moore's Law is approaching its physical limits, only a few could still afford the expensive game of process shrink. And when the post-Moore's Law era comes,...
Arm portrays its strategy for machine learning at the edge
With one of the strongest processor ecosystems in the industry, Arm's role to accelerate the adoption of machine learning (ML) at the edge can't be overemphasized,...
Memory long-term outlook promising: Q&A with Micron EVP Sumit Sadana
The memory-chip market conditions will start to improve later in 2019, followed by several years of prosperity, according to Sumit Sadana, executive VP and chief...
Why 12-inch fabs are better for power components: Q&A with Bing Xue, AOS SVP of global sales
Alpha & Omega Semiconductor (AOS), which designs and manufactures power semiconductors for a broad range of applications, will start production at its new...
Heterogeneous integration bringing more innovation: Q&A with Etron chairman Nicky Lu
The Taiwan semiconductor industry is gearing up to tap huge business opportunities arising from AI and IoT applications, such as machine learning, cloud to edge...
Industry 4.0 brings lucrative opportunities for chipmakers: Q&A with TI manager Matthieu Chervier
Global chipmakers have been racing to develop chip solutions associated with Industry 4.0 applications to tap huge business opportunities arising from smart manufacturing...
Taiwan must run faster in IC development: Q&A with science minister Chen Liang-gee
TSMC is likely to kick off volume production of 3nm manufacturing process in 2022-2023, when AI and 5G applications are seen to explode to drastically drive the...
Transforming into a solution provider: Q&A with Chilisin president Jack Chung
Taiwan-based Chilisin Electronics has developed itself into a leading provider for an array of passive components in recent years through intensified developments...
China IC supply chain gaining momentum: Q&A with Photronics DNP Mask
As a joint venture between US photomask maker Photronics and Japan's Dai Nippon Printing (DNP), Photronics DNP Mask broke ground in mid-2018 for building a photomask...
