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Friday 18 September 2026
Micron's Taiwan investment passes US$47 billion as it rallies fab construction suppliers

Micron held a conference for Taiwanese suppliers on September 17 under the theme of building at speed and growing at scale. The event brought together Taiwan-based supply chain partners involved in civil, structural, and architectural (CSA) works; mechanical, electrical, and plumbing (MEP) systems; fab equipment; construction materials; and tool installation.

Friday 18 September 2026
Taoyuan to sign high-end IC substrate MOU with Unimicron, Kinsus as Aerotropolis zone takes shape

In response to rapid AI market growth, the Taoyuan City Government announced plans to establish a 40-hectare high-end integrated circuit (IC) substrate zone within Phase 1 of the Taoyuan Aerotropolis Industrial Area. Utilizing a phased construction and staggered site handover model to accelerate tenant entry, the city aims to begin joint land preparation with manufacturers in 2028, with options to scale the zone up to nearly 100 hectares based on industry demand.

Friday 18 September 2026
Taiwan prepares 150-qubit quantum computer RFP, seeks 'win-win' partnerships with global suppliers

Taiwan is moving closer to issuing a request for proposal (RFP) for its quantum computing system project.

Friday 18 September 2026
Taiwan's small businesses race into AI, raising the stakes for execution

Taiwan's small and medium-sized enterprises (SMEs) are making plans to adopt AI, according to a new survey that suggests the debate has shifted from whether to adopt AI to how quickly it can be turned into measurable business gains. The findings point to a new competitive divide shaped by decision speed, data readiness, and management execution.

Thursday 17 September 2026
AMD pivots to China developer ecosystems as Nvidia retreats

As Nvidia gradually retreats from China's high-end AI accelerator market amid strict US export controls, Advanced Micro Devices (AMD) is deepening its regional AI strategy. Rather than relying solely on traditional CPU and GPU sales, AMD is shifting its focus toward edge AI platforms, AI PCs, agent computers, local developer communities, and university partnerships.

Thursday 17 September 2026
Samsung bets on zHBM as 2.5D memory nears its limits
Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising AI response throughput from about 100 to 1,000 tokens per second per user as workloads become more demanding.
Thursday 17 September 2026
Tier IV open-sources self-driving AI chip design to challenge Nvidia

Japanese autonomous driving developer Tier IV is developing an AI chip and will release its chip design and related toolchain as open source, allowing semiconductor manufacturers to use them to develop autonomous driving chips. The company aims to break Nvidia's dominant position in the autonomous driving chip market.

Thursday 17 September 2026
Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer

Huawei has unveiled the OceanStor M900 at Huawei Connect 2026, extending its AI infrastructure strategy into memory and storage with a petabyte-scale key-value (KV) cache system designed for AI agents and long-context inference.

Thursday 17 September 2026
Samsung Galaxy S27 series rumored to feature 4 models, reshaping flagship lineup with display and camera upgrades
Samsung Electronics is expected to launch its Galaxy S27 series in early 2027, marking what could be its most significant product lineup restructuring in years. Market reports indicate that the newly added Galaxy S27 Pro will substantially narrow the specification gap with the Ultra model. Both high-end smartphones are expected to share top-tier features, including 60W wired fast charging, a 200-megapixel main camera, and the latest M16 OLED display. Samsung will continue to use telephoto cameras, screen sizes, battery capacities, and S Pen support to differentiate the models, establishing a new "dual high-end flagship" hierarchy.
Thursday 17 September 2026
Taiwan to pilot ETS by end-2026, experts urge three safeguards

Taiwan will launch a pilot emissions trading scheme (ETS) by the end of 2026 to help semiconductor and technology manufacturers align with international systems. Ministry of Environment adviser and former deputy environment minister Wen-Chen Shih said the ETS design must address three key areas.

Thursday 17 September 2026
Huawei Connect 2026: Ascend 960 puts industry-first NPO supernode at heart of Huawei's AI scale-up bet
Huawei has unveiled its next-generation Ascend 960 supernode, positioning near-packaged optics (NPO) at the centre of its effort to scale AI computing beyond the limits of individual accelerators. Huawei said the system is the industry's first supernode to adopt NPO and is designed to support large-scale training and inference for models with up to 10 trillion parameters.
Thursday 17 September 2026
20 of China's OSATs push into advanced packaging amid EUV curbs
China is broadening its advanced packaging base as restrictions on leading-edge semiconductor equipment complicate further process-node scaling. The effort now extends beyond the country's largest outsourced semiconductor assembly and test (OSAT) suppliers to specialist packaging houses and chiplet startups, increasingly targeting AI and high-performance computing (HPC).
Thursday 17 September 2026
China's LCD trio flexes newfound pricing power as Taiwan panel makers retreat
China's top three liquid-crystal display (LCD) panel makers have sent written price-increase notices to customers for the first time, as Taiwan's leading panel makers sell factories and China tightens its grip on the global market. With South Korea and Japan already out of the thin-film-transistor LCD (TFT-LCD) market, China now controls more than 70% of LCD TV and monitor panel share, creating an effective oligopoly.
Thursday 17 September 2026
TOK completes KRW101 billion facility in South Korea to bolster semiconductor supply chain

Japanese semiconductor materials leader Tokyo Ohka Kogyo (TOK) held a completion ceremony on September 15, 2026, for a new KRW101 billion (US$73.1 million) production plant in the Poseung District of Pyeongtaek, Gyeonggi Province.

Thursday 17 September 2026
AI risk split among tech leaders set to play out at Trump-Xi White House dinner
Former Apple CEO Tim Cook and OpenAI CEO Sam Altman are set to attend a White House state dinner on Sept. 24, 2026, with Nvidia CEO Jensen Huang and other business leaders also expected to attend, according to people familiar with the matter. Trump, who is hosting the dinner for Chinese President Xi Jinping's visit to Washington, has invited Cook, Altman, Huang and other business leaders — even as a fight over the pace of AI development roils Silicon Valley and Washington alike. OpenAI's chief global affairs officer, Chris Lehane, has confirmed Altman's attendance.