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Friday 29 May 2026
India's C2i Semiconductors tapes out AI power chip as investors back scaling of data center power technology
C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development and scale production. The developments underscore growing investor interest in addressing power delivery bottlenecks in data centers, driven by accelerating AI workloads
Friday 29 May 2026
Nvidia's Vietnam hiring signals push into high-end AI server manufacturing alongside expanding Taiwan ODMs
Nvidia's expanding recruitment activity in Vietnam signals a potential shift in the country's role within advanced AI infrastructure manufacturing, as Taiwanese server and EMS players continue to scale up production capacity in the region. The developments underscore Vietnam's growing importance in the global reconfiguration of AI hardware supply chains, particularly for high-end data-center systems and GPU-based servers
Friday 29 May 2026
Malaysia's Oppstar revises AI chip deal, formalizes US$2.9 million design contract
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia
Friday 29 May 2026
Anthropic expands India leadership team as enterprise and startup AI adoption accelerates
Anthropic is expanding its leadership and operational presence in India as it scales adoption of its Claude AI models across startups and enterprises, appointing senior executives to lead growth, partnerships, and digital-native customer engagement in one of its fastest-growing markets
Friday 29 May 2026
SmartSens, Unisoc team up on Micro LED optical interconnects for AI computing
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision
Thursday 28 May 2026
Huawei chip chief says post-Moore race is no longer just about nanometers
As Moore's Law nears its limits, Huawei is promoting its "Tau (τ) Law" as a post-Moore chip framework that shifts the focus from nanometer process nodes to shorter signal transmission times across electronic systems
Thursday 28 May 2026
CXMT cleared for IPO listing; could boost China's memory supply chain
ChangXin Memory Technologies (CXMT), China's top DRAM maker, has been cleared by China's securities regulator for its highly anticipated IPO, which could raise funds worth CNY29.5 billion (approx. US$4.4 billion) for the company. The Shanghai Stock Exchange said on May 27 that it had cleared a listing review for its STAR Board
Thursday 28 May 2026
Solidigm appoints co-CEOs to split operations and growth responsibilities
Solidigm, the enterprise storage brand under SK Hynix, announced a leadership reshuffle this spring, naming two executives as co-chief executive officers to divide responsibilities between global operations and commercial growth. One co-CEO was appointed in March 2026, and the other took office on May 1, with leadership stating the change aims to accelerate product execution and business performance amid rising demand for storage driven by artificial intelligence
Thursday 28 May 2026
Peking University's true-3D EDA tool gives Huawei's LogicFolding chip roadmap critical design link

Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap

Thursday 28 May 2026
SK Hynix turns Big Tech's memory scramble into tougher supply terms
SK Hynix is using Big Tech's rush to secure artificial intelligence (AI) memory supply as leverage for tougher long-term contracts, while resisting funding structures that could give major customers influence over its fabs or equipment
Thursday 28 May 2026
Commentary: China's AI chip certification becomes new market gatekeeper
China has brought AI chips into its national security and reliability evaluation framework for the first time, turning what looks like a product certification process into something more consequential: an emerging gatekeeping system for AI computing infrastructure
Thursday 28 May 2026
Huawei Tau Law series 3: Global chip experts split over China's post-Moore push
Huawei's "Tau (τ) Scaling Law," unveiled at ISCAS 2026 on May 25, has become a global semiconductor flashpoint, drawing scrutiny from financial institutions, media outlets, chip analysts, and research firms
Thursday 28 May 2026
Luxshare strengthens antitrust compliance after China imposes fine over Wingtech deal
Chinese electronics manufacturer Luxshare said it is strengthening its antitrust compliance system after China's market regulator imposed a fine related to its acquisition of part of Wingtech's business operations
Thursday 28 May 2026
Wonik IPS secures Visionox XR display etcher order for Kunshan OLED line
Chinese display maker Visionox is moving ahead with a major extended reality display production project in Kunshan, strengthening China's push into high-pixel-density OLED panels for AR and VR devices
Thursday 28 May 2026
China's LLM price war puts DeepSeek, Xiaomi on a collision course with OpenAI
China's large language model (LLM) market is coming under mounting pricing pressure, as domestic AI model developers cut fees closer to cost, while the gap with international model pricing widens to dozens of times