CONNECT WITH US
Friday 23 October 2026
Oppo targets premium smartphone growth with global Find X10 launch
Oppo unveiled the international version of its Find X10 smartphone series in Spain on October 22 (Taiwan Standard Time), following the line's China launch in late September. The move marked the company's latest effort to strengthen premium smartphone shipments as competition intensifies and overall demand remains under pressure.
Friday 23 October 2026
Taiwan, UK expand offshore wind, CCUS energy cooperation
Taiwan and the UK deepened cooperation on offshore wind, carbon capture, and energy security at two bilateral meetings held recently in Taipei. The 21st Taiwan-UK Renewable Energy Exchange Conference brought together about 80 government, industry, and research representatives to discuss energy policy, technical practices, and collaboration on low-carbon technologies. The eighth Taiwan-UK Energy Dialogue Conference followed that afternoon.
Friday 23 October 2026
SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production

SK Hynix is reportedly working with materials and equipment suppliers to commercialise its next-generation iHBM cooling technology, targeting a reduction of more than 30% in thermal resistance. The initiative aims to address mounting heat dissipation challenges in HBM and strengthen the company's competitiveness in AI memory.

Friday 23 October 2026
AMEC ships first Primo Domingo selective etching system, targeting critical gaps in China's advanced 3D chipmaking
China's Advanced Micro-Fabrication Equipment (AMEC) has shipped the first unit of its Primo Domingo high-selectivity vapor-phase etching system to a major domestic semiconductor research and manufacturing customer, marking a step forward in China's efforts to develop indigenous equipment for next-generation 3D chips.
Thursday 22 October 2026
Taiwan-France semiconductor alliance strengthens with CPU pact between SiPearl and Egis Group
Highlighting the deepening industrial synergies between Europe and Asia, the Egis Group TechDay Taiwan-France Strategic CPU Partnership Signing Ceremony hosted the official signing between Egis Group and SiPearl. The landmark ceremony unveiled a joint initiative to build a Mobius 100 CPU and UCIe chiplet-based marketplace, establishing a cooperative framework for sovereign AI and high-performance computing (HPC) data center infrastructure.
Thursday 22 October 2026
Samsung reportedly overhauls DRAM, NAND R&D incentives to retain talent and accelerate next-gen memory chips
Samsung Electronics is reportedly restructuring its semiconductor research operations and performance-based compensation system to accelerate next-generation DRAM and NAND flash development, bringing researchers and production teams closer together while addressing concerns over incentives and talent retention.
Thursday 22 October 2026
China's L3 autonomous driving adoption tipped to top 35% by 2030, raising stakes for automakers
Level 3 (L3) autonomous driving penetration in China is forecast to exceed 35% by 2030, supported by falling sensor costs, advances in AI models, and tighter safety regulations. The forecast comes as the country expands autonomous driving trials and prepares for wider commercial deployment.
Thursday 22 October 2026
Why Terafab approached South Korean suppliers first
Elon Musk is moving ahead with Terafab, as Tesla and SpaceX reportedly negotiate with about 10 South Korean semiconductor materials, components, and equipment suppliers. The discussions cover process materials, piping and valves, wastewater recycling equipment, and semiconductor testing components, raising questions about whether Taiwan's semiconductor supply chain will benefit from the massive expansion.
Thursday 22 October 2026
Unitree showcases H2-X as China's humanoid robot output tops 100,000
Unitree Robotics unveiled its new H2-X humanoid robot on October 21, showcasing martial arts combat, landings from height, and vehicle rescue as China's humanoid robot production accelerates. China's Ministry of Industry and Information Technology (MIIT) said humanoid robot output exceeded 40,000 units in 1H26 and is expected to surpass 100,000 units for the full year, signaling the industry's shift toward large-scale production and broader applications.
Thursday 22 October 2026
Japan sets execution plan for 17 growth strategies
Japanese Prime Minister Sanae Takaichi will finalize a five-year plan by the end of 2026 outlining an investment blueprint for 17 strategic sectors. The plan will prioritize semiconductors and gaming for near-term investment, while physical AI and hydrogen are positioned as the next growth drivers.
Thursday 22 October 2026
LG robot unit Bear Robotics expands China outsourcing
Bear Robotics, the robotics subsidiary of LG Electronics, is adopting a dual-track production strategy by expanding outsourcing from South Korean partners to manufacturers in China. The move is aimed at supporting rising shipments and lowering manufacturing costs, with some robots made in China already shipped to the US.
Thursday 22 October 2026
Lam Research builds India supplier base to capitalize on Semicon 2.0 localization push
Lam Research is grooming Indian companies to become its suppliers rather than relying only on its global vendor base, a senior executive said, as the US chip equipment maker deepens its presence in a market where the government now ties incentives to local sourcing.
Thursday 22 October 2026
Charts: China's smartphone market bounces back from summer lows on new launches
China's smartphone market rebounded in September 2026 after weak July and August shipments, as brands rolled out more new models. Shipments reached 21.86 million units, down nearly 22% from a year earlier but up from a monthly average of about 17 million units over the previous two months, according to China Academy of Information and Communications Technology (CAICT) data cited by industry channel sources.
Thursday 22 October 2026
Charts: Nvidia's China AI chip lead shrinks 80% as Huawei closes in
Nvidia's lead over Huawei in China's AI accelerator market has narrowed by 80% in a year, bringing CEO Jensen Huang's warnings about losing the country's US$50 billion AI chip market closer to reality. According to IDC, Huawei shipped 572,000 Ascend chips in the first half of 2026, securing a 28% market share, just 6pp behind Nvidia, compared with a 31pp gap a year earlier.
Thursday 22 October 2026
Micron skips 4F² for 3D DRAM as CXMT pushes ahead
Micron does not plan to commercialize 4F² DRAM even as Chinese rival ChangXin Memory Technologies (CXMT) advances the technology, saying the architecture offers limited benefits while adding cost and complexity.