LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as demand tied to artificial intelligence chips accelerates, Herald Business reported.
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNews and Yonhap reported.
Samsung Group is expected to announce a domestic investment plan worth more than KRW1,000 trillion (approx. US$648 billion) on June 29, when South Korean President Lee Jae-myung chairs a public briefing at the presidential office in Seoul on what his administration is calling the country's "three mega-projects for a great leap forward," Maeil Business Newspaper reported.
The global memory market is facing a structural supply-demand imbalance that shows little sign of easing. Micron's stronger-than-expected quarterly results have drawn fresh attention from investors and the technology industry, while the broader supply picture remains tight.
