CONNECT WITH US
Monday 1 June 2026
China to tighten controls on tech, data and talent flows in new overseas investment rules
China's State Council announced new regulations on June 1 that will tighten controls on overseas investment, restricting the export and transfer of prohibited goods, technologies, services and related data. The regulations were approved at the State Council's 83rd executive meeting on April 17 and will take effect on July 1, 2026, the announcement said, requiring firms and investors to comply with approval, filing, information reporting and cross-border capital registration procedures when investing abroad
Monday 1 June 2026
Analysis: Huawei's Tau Law masks a bigger target — TSMC's node gap and Nvidia's compute moat
Huawei's Tau Law is being framed in China as a new semiconductor principle, but its strategic value may lie beyond catching TSMC in process nodes. The real question is whether Huawei can combine LogicFolding, optical interconnects, and system-level scaling to reduce China's reliance on Nvidia
Monday 1 June 2026
SoftBank plans up to EUR75 billion AI data center buildout in France, anchoring Europe's infrastructure
SoftBank Group said it will invest as much as EUR75 billion (US$87.43 billion) to develop 5GW of AI data center capacity in France, a move that would make the country one of its largest AI infrastructure bases in Europe. The first phase targets 3.1GW in the Hauts-de-France region by 2031
Monday 1 June 2026
MiniMax's A-share move could widen funding options for China's AI model companies
MiniMax has started preparations to sell yuan-denominated shares on China's stock market, a step that could give onshore investors exposure to AI model companies beyond chipmakers and extend the company's listing presence beyond Hong Kong
Monday 1 June 2026
Weekly news roundup: Nvidia CEO hosts trillion-dollar dinner; TSMC CEO to address bonus backlash in person
Below are the most-read DIGITIMES Asia stories from the week of May 25-31, 2026
Monday 1 June 2026
LG denies report on sale to Hisense TV as Chinese rivals gain ground
LG Electronics has denied a Korean media report that it discussed a possible sale or restructuring of its TV business with China's Hisense, as intensifying competition from Chinese brands puts new pressure on legacy TV makers in South Korea and Japan
Monday 1 June 2026
India roundup: EMS providers face margin pressure as Anthropic steps up local hiring

India's technology ecosystem is seeing parallel expansion across AI software adoption, electronics manufacturing, and semiconductor investment. Anthropic is scaling its India leadership to capture enterprise demand, while manufacturers move into higher-margin products. At the same time, Wi-Fi 7 production and fresh chip funding highlight deepening industrial capability across the ecosystem

Sunday 31 May 2026
Huawei's Aito M9 turns the luxury SUV into a rolling AI platform
In aerodynamics, the Aito M9 underwent more than 100 engineering refinements, achieving a drag coefficient of just 0.249 Cd — among the lowest ever recorded for a full-size sport utility vehicle
Sunday 31 May 2026
Pentagon funding talks put US drone startups on wartime footing
The Trump administration is in talks to provide funding to several US drone companies, in a move that would mark a stronger federal push to expand domestic drone manufacturing and reduce the cost of battlefield systems that have become central to modern warfare
Sunday 31 May 2026
LinkerBot deal brings AI bionic hands closer to mass market
LinkerBot, a leading Chinese developer of robotic dexterous hands, has acquired Jingling Zhikang in a strategic move that could push AI-powered bionic hands from high-cost rehabilitation devices into a broader assistive technology market
Saturday 30 May 2026
Xpeng plays the long game: South Korea on hold, Europe in sight
Xpeng Motors, often described as "China's Tesla," is advancing on two very different international fronts — cautious and measured in South Korea, but increasingly strategic in Europe — while competing Chinese EV peers such as Zeekr accelerate their own overseas expansion
Saturday 30 May 2026
Intel makes first major move into India's semiconductor ecosystem with advanced glass substrate manufacturing MoU
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations
Saturday 30 May 2026
Samsung tops Micron in automotive memory as AI tightens supply

Samsung Electronics has overtaken Micron Technology to become the world's largest supplier of automotive memory chips for the first time, according to new S&P Global Mobility data, marking a shift in a market long led by the US memory maker

Friday 29 May 2026
Chinese power chipmaker China Resources Microelectronics targets AI servers with PLP packaging
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential
Friday 29 May 2026
India's C2i Semiconductors tapes out AI power chip as investors back scaling of data center power technology
C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development and scale production. The developments underscore growing investor interest in addressing power delivery bottlenecks in data centers, driven by accelerating AI workloads