Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4 output for Nvidia's Vera Rubin AI platform.

China may remain 10–15 years away from developing domestic extreme ultraviolet (EUV) lithography, according to assessments from UBS and Zeiss, highlighting the technological gap Beijing still faces in replicating the chipmaking equipment required for leading-edge AI processors.

For years the quantum industry has worked on a discouraging assumption: that a machine capable of doing anything commercially useful would need a million qubits or more. Fujitsu told a Taipei audience that the number is coming down sharply, and that its own work is part of the reason.

Xiaomi Auto has formally begun laying the groundwork for its overseas expansion. Xiaomi Group partner and CEO William Lu said on September 4 that the automaker had signed agreements with eight major German dealership groups during IFA 2026 in Berlin, establishing an initial sales and service network ahead of its planned entry into Europe.

Chinese AI startup Moonshot AI has reportedly filed confidentially for an initial public offering in Hong Kong, potentially setting up one of the city's most closely watched technology listings and one of the largest Chinese AI IPOs in recent years.

Sumitomo Chemical has started mass production and sales of indium phosphide (InP) epitaxial wafers, a core material for optical semiconductors used in next-generation data centers and high-speed networks. The move could help ease power and data bottlenecks facing AI infrastructure worldwide, as demand rises for faster, more efficient computing and communications.

South Korean OSAT player LB Semicon has begun shipments to Qualcomm Inc., marking a key step in its effort to move beyond a business structure long centered on display driver ICs (DDI) and expand into system and power semiconductors.

At first glance, many of the technologies spread across the K-Safety Expo 2026 show floor in Busan looked familiar: CCTV cameras, industrial sensors, warning lights and control panels. But after moving from booth to booth on September 2, a more consequential shift became clear. South Korea's emerging safety systems are increasingly being built not simply to record what went wrong, but to recognize risk early enough to intervene.

K-Safety Expo 2026 opened at BEXCO Exhibition Center 1 in Busan on September 2. An hour-long opening ceremony beginning at 11 a.m. brought together South Korean government officials, international organization representatives and industry participants to mark the start of the three-day safety-industry exhibition. The 12th edition is jointly hosted by the Ministry of the Interior and Safety and Busan Metropolitan City.

China's domestic GPU industry crossed a commercial threshold in the first half of 2026, but the interim filings of its six listed players show that revenue growth and earnings power have not yet converged. Three of the six reported positive attributable net profit. Only one of those earned it primarily by selling chips. For an industry whose customers are now committing capital on multi-year horizons, that distinction matters more than the headline growth rates.

The global auto industry is being jolted by "China speed," as Chinese regulators move to slow an extreme race to launch vehicles that has crossed quality and safety red lines. The Ministry of Industry and Information Technology (MIIT) and other watchdogs have launched special enforcement actions and tightened rules to prevent carmakers from sacrificing safety in the rush for speed.

Japanese industrial giants Mitsubishi Heavy Industries (MHI) and NEC Corporation have signed a memorandum of understanding (MOU) to establish a strategic partnership in the defense sector. The alliance aims to fortify Japan's defense industrial base while bolstering national data and AI sovereignty amid shifting global security dynamics.

Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser integration of multiple dies and high-bandwidth memory for AI chips and high-performance computing (HPC).

Shanghai UniVista Industrial Software Group has launched an Agentic EDA framework, a native 3DIC physical-design tool and an advanced-process closure platform, expanding China's domestic toolchain for chip verification, 3D integration and digital back-end design.