Like advanced AI processors, high-bandwidth memory (HBM) has been a target of US export curbs under former President Joe Biden. HBM capacity and bandwidth shape the speed and efficiency of AI training and inference. From Nvidia's H100 to the GB200, HBM capacity has grown 2.4 times and bandwidth 2.6 times. Despite that, China still lacks self-developed HBM and cutting-edge AI chips, which have been left exposed to Washington's pressure points
China's National Silicon Industry Group (NSIG), the country's biggest silicon wafer producer, said longtime executive Wang Qingyu, also known as Jeffrey Wang, has stepped down in a board rotation and will no longer hold any role at the company or its subsidiaries
Industry analysts say Samsung could start supplying 12-layer HBM3E to Nvidia in the fourth quarter of 2025. But shipments for Nvidia's flagship Blackwell processors are projected to make up less than 10% of the total. SK Hynix and Micron have already won certification for 12-layer HBM3E and remain well ahead. Samsung cleared certification for its 8-layer version in the second quarter of 2025, roughly a year after SK Hynix, and is now trying to close the gap
The US International Trade Commission (ITC) has issued a preliminary ruling siding with Samsung Display (SDC) in its trade secrets case against Beijing-based BOE Technology. The decision could bar the Chinese company from the US OLED market for nearly 15 years
