LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks, one of the technology's toughest yield challenges. The move comes as industry forecasts and supplier roadmaps increasingly point to around 2028 as an early window for initial glass-core substrate production.
Apple's first foldable iPhone is putting Chinese precision-component makers under closer scrutiny as its complex hinge creates new opportunities in structural parts, metal injection molding and other high-value components.
The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production in 2028, and TSMC plans to introduce the technology into advanced-node high-volume manufacturing in 2030.
Sumitomo and its IT subsidiary SCSK are partnering with Japanese AI startup Sakana AI to expand the use of domestically developed AI among Japanese companies, leveraging Sumitomo's broad customer base to reach businesses of various sizes.
Arm unveiled its second-generation mobile Compute Subsystem (CSS), Arm CSS for Mobile 2, at its annual Arm Everywhere China event in Shanghai on September 8, further integrating AI computing capabilities across the CPU, GPU, and system interconnect while strengthening its presence in the Chinese market.
Hiwin Technologies has signed a supply contract with Semes, Samsung Electronics' semiconductor equipment arm, for a single-axis positioning stage being tested in hybrid bonding equipment, signaling a potential opening in South Korea's advanced packaging supply chain. The deal complements Hiwin's push to broaden its co-packaged optics (CPO) business and move into higher-value semiconductor equipment components.
As AI applications move from the lab to large-scale deployment, China's open source ecosystem is increasingly focused on how to connect once-siloed technology layers to improve computing costs and operating efficiency. The KubeCon + CloudNativeCon + OpenInfra Summit + PyTorch Conference China 2026 opened in Shanghai on September 6, marking the first joint appearance of CNCF, OpenInfra, and PyTorch have converged at a single event, with discussions centered on AI infrastructure, AI agent trends, and the Model Context Protocol (MCP).
Huaqin Technology has signed two new projects in Nanchang High-tech Zone, expanding the smart-hardware ODM group's local manufacturing base into embodied-AI robotics and data collection, according to Hongguan News reporting on Sina Finance.
Chinese AI chip developer Cambricon said on September 8 that it has formally joined the PyTorch Foundation as a platinum member, the organisation's highest membership tier, securing a seat on its governing board.
South Korea's long-standing dominance in the global display market is facing an aggressive challenge as major Chinese panel makers—including BOE, China Star Optoelectronics Technology (CSOT), and Visionox—rapidly expand their organic light-emitting diode (OLED) production capacity. While South Korea maintains a firm lead in mobile and TV displays, industry analysts warn that a massive volume offensive from China threatens to erode South Korea's footing in fast-growing sectors, particularly IT devices like laptops and tablets alongside automotive displays.
China is tightening scrutiny of initial public offerings by humanoid robotics companies as regulators seek to curb excessive valuations and distinguish commercially viable businesses from a crowded field of startups, according to The Information.
China has imposed provisional anti-dumping measures on Japanese dichlorosilane (DCS), a semiconductor material used in thin-film deposition, potentially accelerating Chinese wafer fabs' shift toward domestic suppliers.
China's rapid advance in DRAM is intensifying debate in South Korea over whether rigid working-hour rules could make it harder to preserve one of the country's remaining technology advantages over China.
JD.com is accelerating its expansion in physical AI, announcing a new "Physical AI Acceleration Plan" at the 2026 JD Global Technology Explorers Conference on September 9. Over the next five years, the company plans to establish 80 RoboBase robotics industry hubs across China, while JD Logistics intends to procure 3 million robots, 1 million autonomous vehicles, and 100,000 drones to advance automation across its logistics supply chain.
Axcelis Technologies plans to invest US$35 million in a new semiconductor equipment manufacturing facility in Pyeongtaek, South Korea, a move that could help strengthen global chip supply chains. The project underscores how leading suppliers are expanding production capacity to meet rising demand from manufacturers worldwide.
The 27th China International Optoelectronic Exposition (CIOE) opened at the Shenzhen World Exhibition & Convention Center, taking place alongside the International Integrated Circuit Innovation Expo (IICIE) and the 23rd Shenzhen International Electronics and Embedded Exhibition (elexcon). Together, the co-located events highlight the accelerating convergence of AI, photonics, and semiconductor technology.
