SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023 as the memory maker increases the volume of flip-chip packaging handled by external partners.
China's auto market is under pressure from high oil prices and shrinking subsidies, weakening domestic sales even as exports keep growing. Taiwanese supply-chain companies are responding by adjusting their product mix.
One of the most pronounced factors behind China's ferocious rise in the global technology landscape has been its unparalleled strength in the EV sector, where fierce competition over power batteries and high-end battery materials has cemented the country's longstanding dominance in battery manufacturing.
Xunfei Healthcare (iFLYTEK Medical), the healthcare AI arm of China's iFlytek, is using its Spark Medical Large Model to support diagnosis and medical record generation while tackling challenges including clinical workflow integration, differences in care settings, and model hallucinations. It also hopes to bring its experience from China to South Korea through local partnerships.
Samsung SDI is accelerating its push into the artificial intelligence (AI) data center battery market, unveiling, for the first time, a cylindrical lithium iron phosphate (LFP) battery featuring its proprietary structural design at Data Centre World Asia (DCWA) 2026 in Singapore on September 29.
National Silicon Industry Group (NSIG) chairman Haitao Jiang has resigned from all positions at the company, prompting the Shanghai-listed semiconductor materials supplier to begin a leadership transition.
Generative AI adoption in China continues to expand. The China Internet Network Information Center (CNNIC) said in its 2026 Generative AI Application Development Report, released on September 29, that the country had more than 700 million generative AI users as of the first half of 2026, with a penetration rate exceeding 50%.
Samsung Electro-Mechanics has signed another long-term supply agreement for server components, bringing the value of its disclosed supply agreements this year to about US$2.6 billion as demand for high-performance passive components continues to rise.
A new partnership between Zhejiang Geely Holding Group and NIO in electric vehicle (EV) battery swapping is signaling potential consolidation in China's fragmented market. With multiple incompatible systems still competing for adoption, the deal could open a new path toward greater standardization and network integration.
China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment, in-house testing and tighter control of its memory supply chain.
The Washington summit between Donald Trump and Xi Jinping did not produce the speculated auto deal that would have allowed Chinese automakers to manufacture vehicles in the US. While that gave incumbent automakers in the US a temporary reprieve, analysts say Chinese cars entering the US is still only a matter of time.
Samsung Electronics expects high-performance computing (HPC) to account for 66% of its foundry business by 2029, up from 28% currently, as the company shifts its contract chipmaking portfolio beyond mobile products toward AI and HPC.
Japanese motor maker Nidec has replaced president and CEO Mitsuya Kishida with chief technology officer Michio Kaida as the company moves to overhaul its business and governance following accounting irregularities and mounting losses.
US rare-earth magnet startup Vulcan Elements has reportedly won a supply contract for the US Army's SkyFoundry drone program, underscoring Washington's push to localize drone production and reduce reliance on China's rare-earth supply chain. Vulcan will produce high-performance neodymium-iron-boron magnets for the brushless DC motors used in small drones.
TDK and Taiyo Yuden have signed a memorandum of understanding to begin discussions on a business alliance to develop electronic components, including MLCCs and inductors jointly, the two Japanese companies announced on September 29, 2026. The talks will also cover cooperation in manufacturing and procurement, and the companies will consider a future capital alliance.
