Major Chinese energy storage system suppliers that once dominated the US market have reportedly withdrawn almost entirely from US operations in 2026, amid mounting regulatory restrictions, overlapping tariffs, and stringent ownership scrutiny, according to US supply chain sources.
The rapid advancement of energy-storage technologies in China is enabling the country to capture a formidable share of the global market, with the domestic industry continuing to post record levels of capacity growth.
Toyota Motor will introduce its proprietary gigacasting technology in China to produce premium vehicles, while it has not disclosed whether it will use equipment from local Chinese suppliers. The automaker also plans to produce the next-generation Corolla in China from 2028 using a common platform compatible with multiple powertrain systems.
China's premium electric vehicle (EV) market is facing renewed safety scrutiny following product defect concerns. Maextro, an ultra-luxury automotive brand jointly developed by Huawei and JAC Motors, has sparked widespread public debate over vehicle safety and testing standards after its V800 MPV suffered consecutive brake pedal bracket fractures during dynamic braking tests.
SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges for conventional semiconductor inspection technologies.
China's precision manufacturing giant Lens Technology is expanding into AI server infrastructure through a proposed US$25 million acquisition of a controlling stake in PMG International, gaining access to server rack manufacturing and liquid-cooling technologies. The transaction marks a further diversification beyond the company's established consumer electronics and automotive components businesses.
South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for HBM4 production and the Wide TC Bonder, scheduled for launch in 2027. The company also introduced five 2.5D packaging systems designed to accommodate increasingly large AI chip packages.
South Korean ASIC design solutions provider ASICLAND showcased its proprietary AxHub AI chip design and verification platform at SEDEX 2026 as it seeks to accelerate custom chip development and strengthen its advanced process and packaging capabilities through its Taiwan R&D center. Memory controller projects remain its primary revenue source, supporting its expansion into AI chip mass production and overseas markets.
The European Union is strengthening its response to cybersecurity risks posed by artificial intelligence, planning to use automated measures to accelerate incident response while testing Chinese open-weight AI models to assess the capabilities and limitations of different technologies.
ByteDance's AI research unit Seed has established an Alignment & Preparedness department and is recruiting 10 researchers in Beijing, Shanghai, and San Jose, California, to focus on advanced-model safety, AI alignment, and emerging risks. The move underscores the growing importance of AI safety as competition expands beyond model capabilities, computing power, and product applications to governance and reliable large-scale deployment.
South Korean space AI solutions provider TelePIX is accelerating the development of high-resolution optical payloads and onboard AI technologies, with plans to launch its next-generation system into space for validation in 2027.
On October 16, Japan's Ministry of Economy, Trade and Industry (METI) approved a revised plan from Taiwan Semiconductor Manufacturing Co. (TSMC) to build 3nm logic chips at its second fab in Kumamoto Prefecture, on the southern island of Kyushu. 3nm is one of the most advanced chip processes in commercial production. The plan replaces the 6nm and 12nm production approved in February 2024.
Taiwan Mask Corporation (TMC) is expanding its presence in Japan through the acquisition of semiconductor equipment services provider TCK, extending its business beyond precision photomask manufacturing to equipment assembly and engineering support in Japan's growing Kyushu semiconductor market.
Chinese EV giant and AI mobility manufacturer XPeng has made a major appearance at the Paris Automotive Summit by bringing not just its automotive expertise into the European collaborative space, but a broader technology stack built on the automaker's existing strengths in EV manufacturing and humanoid robotics.
Samsung Electro-Mechanics (Semco) faces potential equipment procurement bottlenecks in its KRW6.78 trillion (approx. US$5.1 billion) expansion of semiconductor substrate production for AI servers, as machinery manufacturers struggle with component shortages and longer delivery times. The South Korean company maintains that its investment is proceeding as planned. No production delay has been confirmed.
FICG is aggressively expanding optical communications production in Malaysia and China to meet surging AI-driven demand, which the company estimates is 3-4x current supply capacity. Chairman Leo Chien described the next three years as a "frenzied expansion period," with the company's Johor, Malaysia, facility set to increase capacity 4x by the end of 2027.
