BOE, China's leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company recently disclosed that it has formed a dedicated project team for Micro LED optical interconnect systems and glass substrate-based co-packaged optics (CPO), working with ecosystem partners on early-stage technology research to advance optical interconnect and glass substrate CPO development.

China's AI chip sector has a heavyweight new entrant: veteran semiconductor figure Shaojun Wei has formally unveiled Shanghai Orient Computing Core Technology Co., a 3D AI compute chip startup now valued at CNY12.2 billion (approx. US$1.8 billion), just two years after it was founded.

Samsung Group detailed plans on July 2 to invest KRW140 trillion (US$90 billion) in display panels, batteries, chips, and chip materials in South Korea's central Chungcheong region.

Anthropic is exploring a custom AI chip and has held talks with Samsung Electronics as a potential manufacturing partner, joining OpenAI, Google, Amazon, Microsoft and Meta in the race to control AI infrastructure.

Renesas Electronics has completed the sale of its timing device business to US fabless semiconductor specialist SiTime, tightening its portfolio around AI servers, electric vehicles, embedded computing and software-led chip design.

As South Korea moves to accelerate a new semiconductor cluster in the country's southwest, ruling-party officials have returned to one comparison: Kumamoto.