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Wednesday 27 May 2026
Samsung wage deal pushed through by chip workers, widening bonus divide
Samsung Electronics' tentative 2026 wage agreement has cleared a union vote with 73.7% approval, moving a months-long labor dispute closer to settlement while exposing a deeper divide between workers in the company's chip and consumer electronics businesses, according to Korean media reports
LATEST STORIES
Thursday 28 May 2026
China tightens travel bans on private-sector AI to stem tech leaks
China has expanded its state travel controls into the private technology sector, deliberately blocking top AI talent from leaving the country without explicit government authorization
Thursday 28 May 2026
Samsung foundry targets robotics, auto AI chips with Cadence platform
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNews reported, citing industry sources
Thursday 28 May 2026
QRT eyes aerospace, defense growth with portable chip radiation tester

South Korean semiconductor testing company QRT is expanding its equipment business with a portable chip radiation reliability testing system, aiming to build a larger presence in aerospace and defense markets

Wednesday 27 May 2026
Unitree sprints toward IPO as profits crumble under rising costs
Chinese humanoid robot maker Unitree Robotics is moving quickly toward an initial public offering, but its latest prospectus points to the commercial challenges still facing the sector
Wednesday 27 May 2026
Facing Chinese rivals, Hyundai accelerates robotaxi plans and cost cuts
As Chinese automakers intensify a global price war, South Korea's Hyundai Motor Group is responding on two fronts at once: accelerating its push into autonomous mobility while pressing suppliers for sweeping cost cuts that could reshape its manufacturing ecosystem
Wednesday 27 May 2026
China clears 9 domestic AI chips for state procurement
China has formally brought AI chips into its national security and reliability evaluation framework for the first time, marking a further expansion of the country's Information Technology Application Innovation procurement policy into AI computing infrastructure
Wednesday 27 May 2026
Former Tencent AI lead says Chinese firms are trailing US on core LLM innovation
A former Tencent large-model technical chief warned that Chinese artificial intelligence companies lack independent paradigm-level breakthroughs and are trailing US rivals, according to an interview with the South China Morning Post. He said the gap in large language model technology was about three months and could widen to six months by year-end as OpenAI prepares to launch GPT 5.6, and that US chip export controls had reduced China's available computing power for training advanced models
Wednesday 27 May 2026
China tightens drone, flying-car rules as low-altitude market takes off

China is building a more formal safety and regulatory framework for its low-altitude economy, as drones, electric vertical takeoff and landing aircraft, and other aerial services move closer to commercial use

Wednesday 27 May 2026
Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design
Tuesday 26 May 2026
Inside China's chip war: How Xiaomi, BYD, and Nio are rewriting the rules
China's semiconductor war has been underway for seven or eight years now
Tuesday 26 May 2026
Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutting power consumption
Tuesday 26 May 2026
Huawei Tau Law series 1: How China's chip industry is pivoting beyond Moore's Law
When Huawei unveiled its "Tau (τ) Scaling Law" at ISCAS 2026 in Shanghai, the announcement signalled more than another chip architecture update. It marked China's most ambitious attempt yet to redefine how semiconductor performance is measured in the post-Moore era
Tuesday 26 May 2026
Samsung's P4 HBM push could worsen DRAM crunch in 2027

Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products

Tuesday 26 May 2026
Huawei eyes AI storage breakthrough with DoB packaging, 245TB SSD roadmap
Huawei has released its Data Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to 10 years, as AI large language models drive data creation into what the company calls the yottabyte era
Tuesday 26 May 2026
Analysis: Huawei's Tau Law signals a new semiconductor framework — with implications beyond China
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory