SK Hynix reportedly ended talks with LG Electronics over outsourcing part of the backend design for a next-generation enterprise SSD (eSSD) controller, but the memory maker told DIGITIMES that it had not discussed commissioning eSSD controller design work.

Four major US technology companies have committed a combined US$2 billion to investments across South Korea's semiconductor materials, equipment, and clean energy sectors. The move is expected to reinforce critical supply chain resilience between the US and South Korea while providing momentum for the South Korean government's three strategic "Mega Projects."

Memory inventories at Samsung Electronics and SK Hynix have fallen below 10 days of supply as AI infrastructure spending drives simultaneous demand for HBM, server DRAM and enterprise SSDs, according to a Sept. 7 report from KB Securities.

Japan's NEC has halted development of gate-based quantum-computer hardware, marking a strategic retreat from a field the company helped pioneer, while continuing to invest in quantum annealing and quantum-inspired computing services.

DeepSeek is reportedly planning to purchase 160,000 Huawei chips for its large 1 GW data center currently under construction in the Chinese province of Inner Mongolia. This would make it among the largest clusters of Huawei chips deployed to date, as the Chinese authorities attempt to wean the country off Nvidia chips, but still struggle with insufficient domestic manufacturing capacity.

China's intelligent driving market is advancing rapidly, but the true trial has only just begun for domestic smart driving chipmakers.

China's power battery industry has reported robust growth through the first seven months of 2026, driven by rising demand across both electric vehicles and stationary energy storage applications. According to the latest data from the Ministry of Industry and Information Technology of the People's Republic of China (MIIT), cumulative sales of power batteries reached 790.4 gigawatt-hours (GWh) between January and July, representing a 37.1% year-over-year increase.

China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density while access to advanced EUV lithography remains restricted.

India is selling its semiconductor build-out abroad as a hedge against an over-concentrated supply chain. The officials running it are unusually candid that the hedge cannot be built without the country it hedges against. Asked at a media briefing in Taipei on 4 September how New Delhi views the role of Chinese companies in India's chip and electronics supply chain, S. Krishnan, secretary of India's Ministry of Electronics and Information Technology, opened with a line that would be politically awkward in most capitals: "We need to be realistic."

Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more heat.

Revenue rose at every Chinese chip company examined in the first half of 2026 amid the domestic-substitution push, but the interim filings show three quite different businesses hiding under one label. One has reached real scale and is now funding its expansion from the balance sheet rather than from operations. One is repairing its margins on a genuinely homegrown instruction set at a fraction of the scale. And the cohort's most spectacular profit number is not a processor story at all.

The most consequential safety technologies are often judged by what happens after something goes wrong: how fast an alarm sounds, how quickly rescuers arrive, or how effectively protective equipment limits injury.

The BEST OF K-SAFETY EXPO Global Media Awards on September 3 offered a revealing snapshot of where safety technology is heading: away from passive protection and toward systems that can sense danger, interpret it, and increasingly act before humans intervene.

South Korea's Hanmi Semiconductor has reportedly begun supplying 2.5D packaging bonders to an unnamed Taiwanese foundry after the equipment passed mass-production qualification, giving the company an important production foothold as Taiwan's advanced-packaging supply chain expands beyond foundry-owned lines.