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Wednesday 7 October 2026
AMD expands Korea push after Taiwan supply talks
AMD CEO Lisa Su moved from supply-chain talks in Taiwan to South Korea this week, broadening the chipmaker's Asia push from efforts to secure more CPU, GPU and advanced-wafer capacity to building an open computing ecosystem around its processors, Korean AI accelerators and software.
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Wednesday 7 October 2026
Z.ai takes GLM-5.3 global through Amazon Bedrock's enterprise channel
Chinese AI company Z.ai is expanding its overseas commercialisation through Amazon Bedrock, with AWS adding GLM-5.3 on October 6 and sharing revenue with Z.ai based on model usage.
Wednesday 7 October 2026
Starship reaches orbit on 14th test as Chinese rocket makers race toward low-cost reusability
SpaceX's Starship reached Earth orbit for the first time on its 14th test flight and deployed 26 next-generation Starlink V3 satellites. Whereas the previous 13 flights primarily focused on orbital testing, Flight 14 marked a further step into operational orbital missions.
Wednesday 7 October 2026
DeepSeek reportedly set to raise more than US$12B ahead of potential IPO
Chinese AI startup DeepSeek is poised to raise more than CNY80 billion (approx. US$11.9 billion) in its latest funding round, as it builds capital ahead of a potential domestic initial public offering (IPO).
Wednesday 7 October 2026
Huawei's NPO bet challenges CPO's path to AI scale
Huawei is backing near-packaged optics (NPO) rather than co-packaged optics (CPO) for its next-generation AI infrastructure, arguing that NPO offers a better balance of cost, manufacturability, reliability and serviceability as optical interconnects move deeper into large-scale AI clusters.
Wednesday 7 October 2026
Analysis: Kioxia's NAND pedigree meets an AI-era SSD gap

Kioxia helped create the NAND flash industry, but AI is changing what leadership in memory looks like. The Japanese supplier is benefiting from record NAND demand and higher prices, yet rivals are capturing more value from enterprise solid-state drives (SSDs) for AI servers. Kioxia's challenge is therefore less about making advanced NAND than turning it into qualified products, hyperscaler relationships, and committed volumes before today's AI infrastructure boom hardens the supplier hierarchy.

Wednesday 7 October 2026
Smaller batteries, smarter roads: Honda tests different EV cost model
The complexity of vehicle economics surrounding surging battery costs has long put the EV industry in a difficult position, caught between power-delivery constraints and energy-efficiency demands.
Tuesday 6 October 2026
Chinese LCD panel makers tighten supply to lift prices — Taiwan suppliers eye order shifts
Chinese panel makers moved to cut production during the National Day holiday after issuing their first price increase notices in September, combining pricing signals with supply controls to stabilize LCD TV panel prices and profitability.
Tuesday 6 October 2026
South Korea keeps sovereign AI contest on track, adds KRW4.7T frontier program after hours of confusion
South Korea's Ministry of Science and ICT said its Sovereign AI Foundation Model Project will run to completion as originally planned. The statement reversed, within hours, a vice minister's suggestion that the national-team AI competition would wind down as the government launches a new KRW4.7 trillion frontier AI program.
Tuesday 6 October 2026
China's 15th five-year plan elevates PCB role in AI supply chains
China's Ministry of Industry and Information Technology and the National Development and Reform Commission have released the 15th Five-Year Plan for the development of the electronic information manufacturing industry, aiming to push revenue at large-scale enterprises above CNY30 trillion (US$4.5 trillion) by 2030 and foster world-class companies in semiconductors, advanced computing, consumer electronics, basic electronics, and energy electronics.
Tuesday 6 October 2026
Samsung secures customer backing for US$5B substrate expansion
Samsung Electro-Mechanics is investing KRW6.78 trillion (approx. US$5 billion) to expand FCBGA capacity in South Korea and Vietnam. The projects are backed by customer funding and medium- to long-term volume commitments, as demand for high-performance package substrates pushes Korean production lines toward high utilization.
Tuesday 6 October 2026
Huawei's Kirin 9050 Pro reveals new logic folding chip design
Huawei's Kirin 9050 Pro has been fully broken down by Chinese and overseas researchers, giving the market a closer look at the company's "LogicFolding" approach. Analysis from Geekerwan and die-shot images posted by Kurnal Insights show that the flagship SoC in the Huawei Mate 90 Pro Max uses two vertically stacked dies rather than a traditional single-plane chip design.
Tuesday 6 October 2026
Samsung steps up HBM cooling as TSMC expands CoWoS
Samsung Electronics is expanding its thermal-management efforts for high-bandwidth memory (HBM) beyond the memory stack as increasingly large chip packages raise heat-management challenges.
Tuesday 6 October 2026
MIPS deepens RISC-V ties with China despite US-China tech tensions
Despite intense technology competition between the US and China, cooperation between the two sides on the open-standard RISC-V architecture continues to deepen, with US intellectual property provider MIPS expanding its work with Chinese industry.
Tuesday 6 October 2026
LB Semicon expands power chip capacity as Qualcomm production ramps up
South Korean outsourced semiconductor assembly and test (OSAT) provider LB Semicon is expanding power semiconductor backend capacity at its Gumi plant as it steps up efforts to reduce its reliance on display driver integrated circuits (DDIs) and a highly concentrated customer base, backed by new business from Qualcomm and Renesas and KRW30 billion (approx. US$22.3 million) in planned equipment investment.
Tuesday 6 October 2026
DeepSeek closes in on US rivals despite chip curbs
China's leading AI models have narrowed their performance gap with US rivals to a record low, while DeepSeek's latest advances in memory efficiency and its deepening work with Huawei suggest Chinese developers are finding ways to improve model performance despite tighter access to advanced US chips.