Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential
MiniMax has started preparations to sell yuan-denominated shares on China's stock market, a step that could give onshore investors exposure to AI model companies beyond chipmakers and extend the company's listing presence beyond Hong Kong
LG Electronics has denied a Korean media report that it discussed a possible sale or restructuring of its TV business with China's Hisense, as intensifying competition from Chinese brands puts new pressure on legacy TV makers in South Korea and Japan
In aerodynamics, the Aito M9 underwent more than 100 engineering refinements, achieving a drag coefficient of just 0.249 Cd — among the lowest ever recorded for a full-size sport utility vehicle
LinkerBot, a leading Chinese developer of robotic dexterous hands, has acquired Jingling Zhikang in a strategic move that could push AI-powered bionic hands from high-cost rehabilitation devices into a broader assistive technology market
Xpeng Motors, often described as "China's Tesla," is advancing on two very different international fronts — cautious and measured in South Korea, but increasingly strategic in Europe — while competing Chinese EV peers such as Zeekr accelerate their own overseas expansion
Samsung Electronics and SK Hynix dominate the global memory chip market, but their weaker position in automotive memory is drawing new scrutiny as AI data centers absorb more DRAM and NAND supply
Solidigm, the enterprise storage brand under SK Hynix, announced a leadership reshuffle this spring, naming two executives as co-chief executive officers to divide responsibilities between global operations and commercial growth. One co-CEO was appointed in March 2026, and the other took office on May 1, with leadership stating the change aims to accelerate product execution and business performance amid rising demand for storage driven by artificial intelligence
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap
SK Hynix is using Big Tech's rush to secure artificial intelligence (AI) memory supply as leverage for tougher long-term contracts, while resisting funding structures that could give major customers influence over its fabs or equipment
Huawei's "Tau (τ) Scaling Law," unveiled at ISCAS 2026 on May 25, has become a global semiconductor flashpoint, drawing scrutiny from financial institutions, media outlets, chip analysts, and research firms
Chinese electronics manufacturer Luxshare said it is strengthening its antitrust compliance system after China's market regulator imposed a fine related to its acquisition of part of Wingtech's business operations
Chinese display maker Visionox is moving ahead with a major extended reality display production project in Kunshan, strengthening China's push into high-pixel-density OLED panels for AR and VR devices
China's large language model (LLM) market is coming under mounting pricing pressure, as domestic AI model developers cut fees closer to cost, while the gap with international model pricing widens to dozens of times
China's smartphone market showed signs of stabilization in April 2026, with both overall handset shipments and smartphone shipments returning to year-over-year growth, according to new figures released by the China Academy of Information and Communications Technology (CAICT)
China has expanded its state travel controls into the private technology sector, deliberately blocking top AI talent from leaving the country without explicit government authorization