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Tuesday 4 August 2026
HP, Asus and Acer reportedly turn to CXMT for laptop memory
HP, Asus and Acer have begun using limited quantities of DRAM from China's ChangXin Memory Technologies (CXMT) in selected budget notebooks sold outside the US, Nikkei Asia reported, as a global memory shortage pushes PC makers to widen their supplier base.
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Tuesday 4 August 2026
SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and bandwidth of up to 3TB/s.
Tuesday 4 August 2026
Samsung Foundry nears full utilization, but 2nm yields remain a hurdle
Samsung Electronics' contract chipmaking business could approach full utilization in the second half of 2026, marking a potential turning point after prolonged underuse weighed on earnings.
Tuesday 4 August 2026
China claims 8 in 10 robots worldwide are made at home

China's National Development and Reform Commission (NDRC) said humanoid robots have become a key symbol of the country's emerging manufacturing sector, claiming that 8 of every 10 humanoid and quadruped robots sold globally are produced by Chinese companies. The remarks came at a July 31 press briefing and also highlighted progress in IC design, semiconductor equipment, wafer fabrication, and packaging and testing.

Tuesday 4 August 2026
Intel China adds day 0 support for MiniMax H3 after DeepSeek

Intel China has completed day-0 adaptation for MiniMax H3, the latest multimodal generative model from Chinese AI startup MiniMax, following its earlier support for the DeepSeek model family. The move underscores Intel's push to capture local AI deployment opportunities in China's growing open-source model ecosystem.

Tuesday 4 August 2026
China tightens chip layout design protection to strengthen domestic semiconductor innovation

China has revised its regulations on the protection of integrated circuit (IC) layout designs, introducing stricter registration requirements, stronger enforcement measures and clearer commercialization rules as Beijing steps up efforts to strengthen its domestic semiconductor industry amid ongoing US technology restrictions.

Tuesday 4 August 2026
Kumamoto semiconductor production recovers, TSMC's Japan subsidiary returns to normal operations

TSMC has announced that Japan Advanced Semiconductor Manufacturing (JASM), its subsidiary in Kikuyo, Kumamoto Prefecture, has resumed normal operations following production disruptions caused by the recent Kumamoto earthquake.

Tuesday 4 August 2026
ispace turns to H3 for 2028 mission as Japan builds domestic lunar transport stack

Japan's effort to localize lunar transportation is gaining momentum as the government and private sector seek to reduce reliance on overseas launch services and establish a domestically supported lunar logistics system.

Tuesday 4 August 2026
Unitree sees 1H26 revenue rise over 35% on humanoid robot demand

China's leading humanoid robot maker Unitree Technology expects first-half 2026 revenue to reach roughly CNY1.1 billion (US$155.8 million), an increase of 35.6% to 45.4% year on year, as demand for embodied AI continues to grow and the company expands its business scale.

Tuesday 4 August 2026
Roborock beats Samsung, LG to win over 70% of South Korea's robot vacuum market
Roborock Technology has grown from its roots in China to become the world's leading robot vacuum brand, securing the top spot in the global market for three years in a row and beating the runner-up in 2025 by more than 10pp with a commanding 27% share of the market worldwide. As competition in its home market of China grows increasingly fierce, Roborock has instead seen overseas revenue surpass domestic revenue for the first time in 2025.
Tuesday 4 August 2026
China revamps EV battery reuse rules, cuts whitelist firms by 70%
China's Ministry of Industry and Information Technology (MIIT) has abolished all clauses related to cascade utilization in its rules governing used power batteries dismantled from new-energy vehicles in a major regulatory shift aimed at curbing unsafe repurposing practices. The move ends the policy label for battery second-life use and ushers in a full overhaul of used power battery management.
Monday 3 August 2026
Memory makers lift capex as Kioxia holds spending to defend NAND lead
Major memory suppliers are increasing capital spending as AI-related demand from U.S. technology companies accelerates, but Kioxia is keeping investment comparatively tight. According to Nikkei Asia, the Japanese NAND maker is prioritizing technology leadership over a rapid expansion of equipment spending, reflecting caution shaped by earlier downturns in the memory market.
Monday 3 August 2026
Chinese display makers reportedly double down on large LCDs and OLED expansion

China's leading display manufacturers are stepping up investments across both LCD and OLED technologies, targeting larger TV panels and expanding into the fast-growing notebook OLED market as they seek new growth opportunities.

Monday 3 August 2026
CXMT closes in on LPDDR6 mass production, challenging Samsung, SK Hynix
CXMT is nearing the end of research and development validation for LPDDR6, bringing it closer to mass production of next-generation mobile DRAM and intensifying competition with Samsung Electronics, SK Hynix and Micron.
Monday 3 August 2026
TCL Technology to take full ownership of TCL CSOT
TCL Technology Group plans to pay CNY9.32 billion (approx. US$1.38 billion) for the 45% of China Star Optoelectronics Semiconductor Display Technology it does not already own, according to the registration-stage draft of the company's share-issue-and-cash asset purchase report, dated July 2026. The sellers are three Guangdong state-linked shareholders: Hengjian Investment (25.00%), Chengfa Investment (7.50%) and Science City Investment (12.50%).
Monday 3 August 2026
MA-tek sells Shanghai unit, expands AI market push in Japan and the US

MA-tek announced on July 31, 2026, that it will sell 80% of its Shanghai subsidiary for about CNY1.9 billion (US$281.4 million), as global semiconductor supply chains are reshuffled and demand surges for AI, high-performance computing (HPC), advanced process nodes, advanced packaging, and silicon photonics (SiPh). The deal is expected to close and be recognized in revenue by the end of 2026.