Powertech Technology expects stronger memory packaging and testing demand, higher average selling prices (ASPs), and ramping high-end through-silicon via (TSV) DDR5 production in the fourth quarter of 2026 to drive sequential growth throughout 2026 and lift revenue to a new record. Its Taiwan fan-out panel-level package (FOPLP) line, already booked by Advanced Micro Devices (AMD), is set to add revenue from 2027 and open another growth chapter for both sales and profit.
SK Hynix's high-bandwidth memory (HBM) production site under construction in Indiana has been drawn into local litigation as the race for AI memory capacity intensifies. Local residents in the US are seeking to overturn a land-use change and halt construction, with a trial scheduled for December 2026 and the case drawing market attention.
Starting in the second half of 2025, as AI agent programs such as OpenClaw, Hermes, Claude, and DeepSeek Harness were launched one after another, a wave of "keeping lobsters" began to emerge around on-device AI models paired with AI agents.
Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging and testing project, expanding 2.5D integration and compute-memory co-packaging capacity as AI and high-performance computing lift demand for advanced packaging.
Samsung Electronics is considering expanding its 4nm foundry capacity as rising HBM4 base-die demand pushes existing capacity to full utilization, South Korea's Money Today reported on September 21. The company is also reviewing whether to build a new 2nm production line for base dies in future HBM5 products.
Global memory shortages remain severe, with AI and cloud applications intensifying demand for scarce supply. Prices for both DRAM and NAND flash have risen sharply, while China's two flagship memory makers, CXMT and YMTC, are preparing to break from their long-standing division of the market.
SK Hynix is pushing deeper into logic design as it develops a next-generation 3D DRAM architecture that could separate memory-cell processing from the peripheral circuits that control it, allowing each to be optimized with different manufacturing technologies.
Samsung Electronics is reportedly preparing to at least double production of its HBM4-family memory in 2027, accelerating a shift toward higher-value products as supply constraints persist across the broader memory market.
China's CXMT has begun mass production of its fifth-generation DRAM platform, or G5, claiming process capabilities comparable with the industry's most advanced mass-production nodes and bringing higher-density LPDDR5X into volume production.
Growing memory requirements are increasing interest in Compute Express Link (CXL) as a way to add capacity beyond locally attached memory. But engineers from OpenAI and Intel see limits to using the interconnect as a substitute for high-bandwidth memory (HBM) where bandwidth remains critical.
Solidigm, the US NAND flash subsidiary of SK Hynix, is considering building its first NAND manufacturing plant in the US, with upstate New York emerging as a leading candidate.
ChangXin Memory Technologies (CXMT) is preparing to expand beyond DRAM into NAND flash, a move that would push China's leading DRAM supplier closer to the core market of domestic rival Yangtze Memory Technologies (YMTC) as enterprise storage becomes a bigger part of the memory growth story.
AI is reshaping the global memory industry, tightening supply while creating an opening for China's domestic suppliers. With Samsung Electronics, SK Hynix, and Micron prioritizing high-bandwidth memory (HBM) and high-end server memory, ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC) are gaining ground in conventional DRAM, mobile memory, and NAND Flash.
Micron held a conference for Taiwanese suppliers on September 17 under the theme of building at speed and growing at scale. The event brought together Taiwan-based supply chain partners involved in civil, structural, and architectural (CSA) works; mechanical, electrical, and plumbing (MEP) systems; fab equipment; construction materials; and tool installation.
Winbond Electronics' US$1.12 billion acquisition of Infineon's NOR Flash and ferroelectric RAM (F-RAM) businesses has drawn close attention from China's semiconductor industry.
