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Tuesday 29 April 2025
YMTC lands US$1.3B funding as financials reveal post-Unigroup fallout

YMTC, one of China's leading semiconductor firms, has secured a new funding round with a CNY1.6 billion (approx. US$220 million) capital injection from Quanhong Investment, a subsidiary of Hebei Yangyuan ZhiHui Beverage. Once the deal closes, Quanhong will hold a 0.99% stake in YMTC's parent company. Yicai reports the move aligns with Yangyuan's strategic push into equity investments.

Tuesday 29 April 2025
China launches 'human wave strategy' for R&D, poaching top-level South Korean scholars
Reports indicate that many outstanding South Korean research scholars have been moving to Chinese universities. These experts hold world-class authority in foundational fields of cutting-edge technologies such as semiconductors, batteries, and quantum computing—areas marked by intense global competition. It signals that, amid escalating US-China rivalry for advanced technology supremacy, China is actively recruiting top South Korean talent to accelerate its R&D efforts.
Tuesday 29 April 2025
Samsung shifts focus to 3D DRAM in intensifying competition from SK Hynix and Chinese rivals
Samsung Electronics has reportedly decided to adopt Vertical Channel Transistor (VCT) DRAM as its core next-generation memory product, with plans to begin mass production within the next three years.
Tuesday 29 April 2025
Longsys rolls out bespoke automotive memory solutions to power smarter mobility
At Auto Shanghai 2025, Shenzhen Longsys Electronics Co. unveiled its full range of automotive-grade memory solutions, including two new in-house products: the eMMC Full-chip Custom Edition and a next-gen LPDDR4x, underscoring its growing presence in intelligent vehicles.
Monday 28 April 2025
Weekly news roundup: China's chip merger, Samsung delays, CXMT's rise, and TSMC's global expansion battle
These are the top-read DIGITIMES Asia stories from the week of April 21 – April 27.
Friday 25 April 2025
China's Montage Technology storms into global DDR5 top three as AI chip demand explodes

Montage Technology reported robust first-quarter 2025 results, with revenue climbing 65.78% year-over-year to CNY1.222 billion (approx. US$167 million). Net profit attributable to shareholders jumped 135.14% to CNY525 million, marking record highs across key financial indicators.

Friday 25 April 2025
Exclusive: Google considers HBM3E supplier change
Samsung Electronics has recently intensified its deployment in advanced high bandwidth memory (HBM) processes. However, supply chain sources reveal that Samsung's HBM3E certification progress is once again facing obstacles. Google, which had planned to pair its self-designed AI servers chips with Samsung's HBM3E and submit them to TSMC for CoWoS packaging, suddenly notified Samsung of the removal of HBM from its plans.
Friday 25 April 2025
JEDEC bends rules—Samsung, SK Hynix charge ahead in AI memory war
JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix. The revision allows both companies to continue with volume production using existing DRAM stacking methods, avoiding the early adoption of more expensive packaging technologies like hybrid bonding.
Friday 25 April 2025
Tariffs shadow over NAND: Phison turns cautious, prices rise
In response to potential tariff changes, Taiwanese companies in the industrial computer (IPC) sector are adjusting their strategies. As the US introduced a 90-day tariff exemption period, IPC firms have been closely coordinating with clients and adjusting prices accordingly. With NAND Flash price adjustments now in effect, both industrial control and OEM manufacturers are stocking up to prepare for potential fluctuations in the supply chain.
Thursday 24 April 2025
Sk Hynix completes validation for CXL-based DRAM module, boosting server capacity
SK Hynix has completed customer validation for its 96GB Compute Express Link (CXL) Memory Module, a DRAM solution that has attracted significant industry attention for its potential to enhance data center performance.
Wednesday 23 April 2025
Hanmi reshapes South Korea's HBM arena, eyes Samsung alliance as SK Hynix ties fray
The South Korean semiconductor industry is abuzz with intrigue as Hanmi Semiconductor's once-ironclad relationship with SK Hynix frays over the supply of thermal compression bonders (TC Bonders or TCBs), critical equipment for high-bandwidth memory (HBM) production. The friction became more apparent after Hanmi Semiconductor unexpectedly canceled an investor relations event set for April 22, according to a report by Maeil Business Newspaper. This development came shortly after a visit from SK Hynix executives, with industry sources indicating that disagreements over the terms of TCB supply have escalated to a critical juncture.
Tuesday 22 April 2025
Hanmi Semiconductor's tough stance against SK Hynix supported by large TC bonder order from Micron
South Korean media outlets have reported that Hanmi Semiconductor has received additional orders for thermo-compression bonding (TCB) equipment from Micron Technology. Some industry sources believe that the tough measures recently taken by Hanmi Semiconductor against SK Hynix are backed by strong support from Micron.
Tuesday 22 April 2025
Samsung to end DDR4 module production by 2025
Samsung Electronics is accelerating the industry's transition away from DDR4 memory, having informed PC manufacturers that it will discontinue DDR4 modules by the end of 2025, with final orders due in early June, according to industry sources.
Monday 21 April 2025
Samsung lifts HBM yield as US tariffs loom over China-made chips
South Korean media have reported that Samsung Electronics has made notable progress in developing next-generation high-bandwidth memory (HBM). According to Chosun Biz, the company recently surpassed a test production yield of 40% for the logic die, produced using Samsung's 4nm foundry process, a marked improvement over Baidu's 15-19% yield for chips manufactured using the same technology.
Monday 21 April 2025
Samsung faces delays in 1c DRAM development, raising concerns over HBM4 timeline

Samsung Electronics is encountering delays in the development of its next-generation 1c DRAM chips, according to sources familiar with the matter. Originally slated for sample testing in July 2025, the schedule has reportedly been pushed back to October due to complications in the redesign process. Insiders say the situation remains fluid, with yield rates still uncertain, raising concerns that the timeline for mass-producing HBM4 chips, which rely on 1c DRAM, may also be affected.

Monday 21 April 2025
China's CXMT muscles into DRAM's top tier—Is 'Big Three' era over?
Forecasts suggest ChangXin Memory Technologies (CXMT), China's leading DRAM supplier, will dramatically expand its output in 2025—far surpassing previous expectations. If current momentum holds, CXMT could soon close in on Micron's production and hit 50% of SK Hynix's output levels.
Monday 21 April 2025
IC distributor Supreme reports sharp rise in orders as us tariffs trigger stockpiling
Supreme Electronics, a Taiwan-based IC distributor, is seeing a significant uptick in customer demand and price levels as US tariff policies prompt inventory stockpiling across global markets, the company reported.
Monday 21 April 2025
Samsung makes headway in HBM4 chip yields, signaling a potential comeback in the high-end memory race

As rivals race ahead in HBM3E, Samsung quietly builds momentum in next-gen HBM4 development, banking on its in-house chipmaking and packaging technologies.

Saturday 19 April 2025
Huawei's AI ambitions face energy efficiency test

Huawei's CloudMatrix 384 (CM384) is making waves as the most ambitious AI hardware rollout in China to date—a rack-scale system powered by 384 Ascend 910C chips and positioned as a direct competitor to Nvidia's GB200 NVL72.

Saturday 19 April 2025
JEDEC rolls out HBM4 standard: 2TB/s memory poised to supercharge AI, HPC
The global push to meet surging demand from AI, high-performance computing (HPC), and advanced data centers has reached a new milestone. JEDEC, the international semiconductor standards organization, has unveiled the High Bandwidth Memory 4 (HBM4) specification—a next-gen memory standard featuring major architectural and interface upgrades for dramatically improved bandwidth, capacity, and power efficiency.
Friday 18 April 2025
Micron challenges South Korean dominance in HBM market amid tariff protectionism
Recently, reports from South Korea claim that Micron is set to become a rising star in the HBM market, following Samsung Electronics and SK Hynix. Although Donald Trump's current policies remain unclear, many in the South Korean industry predict that the US will adopt strict protectionist measures for its semiconductor industry. As a result, Micron, being a US company, is likely to benefit.
Friday 18 April 2025
SK Hynix-Hanmi alliance fractures as Korean memory giant seeks new suppliers
SK Hynix's eight-year partnership with Hanmi Semiconductor is showing signs of strain after the memory chipmaker began sourcing thermal compression bonding machines from rival Hanwha Semitech, according to industry sources.
Friday 18 April 2025
Hanmi hikes TCB equipment prices by nearly 30% for SK Hynix, ends free maintenance
Hanmi Semiconductor has reportedly informed SK Hynix of a planned price increase for its thermal compression bonding (TCB) equipment, marking the first price hike since the South Korean equipment maker began supplying the TCB product in 2017.
Tuesday 15 April 2025
Trump tariffs rattle global memory market as Micron shifts costs; Samsung and SK Hynix hold steady

Following President Donald Trump's recent announcement of a sweeping "reciprocal tariffs" policy, a new wave of economic uncertainty is rippling through the global tech supply chain. US chipmaker Micron Technology has already responded, stating it will pass the additional costs onto customers. Meanwhile, South Korean memory giants Samsung Electronics and SK Hynix are taking a more cautious approach—adopting a wait-and-see strategy while maintaining current pricing policies.

Tuesday 15 April 2025
Micron reportedly secures Nvidia certification for fifth-gen 12-layer HBM3E supply
Micron Technology is advancing in the high bandwidth memory (HBM) market, historically led by South Korean giants SK Hynix and Samsung. Reports indicate that Micron has secured Nvidia's quality certification for its fifth-generation HBM3E and will supply this memory for Nvidia's upcoming AI accelerator, Blackwell Ultra (GB300), report Korean outlets SBS Biz and Donga.