Samsung Electronics' DRAM wafer capacity will grow only marginally through 2027, with investment directed at node migration and line conversions rather than aggressive wafer-capacity expansion, according to Omdia data obtained by Chosun Biz.
Samsung Electronics is gaining pricing power in its foundry business as AI and high-bandwidth memory (HBM) demand tightens advanced-node capacity, with its 4nm lines reportedly fully booked through 2027 and some customers being steered toward 5nm production.
South Korean export data showed a sharp shift in high-bandwidth memory, or HBM, shipments toward Malaysia and away from Taiwan, according to SemiAnalysis ChipBook. The shift suggested that some HBM shipments previously sent to Taiwan for TSMC's CoWoS packaging might be redirected to packaging plants in Malaysia.
The Gujarat government's approval of 12-hour work shifts at Micron Technology's Sanand assembly and test plant is more than just a single-factory ruling. It is the clearest sign yet that Indian states are willing to reshape decades-old labor rules to fit the round-the-clock demands of semiconductor manufacturing, as they compete for a slice of a global chip supply chain shifting away from China.
Samsung Electronics fully repaid a KRW20 trillion unsecured loan from Samsung Display ahead of schedule in the second quarter of 2026, according to South Korean publication ZDNet Korea and filings in the Financial Supervisory Service's DART system. The early repayment came as AI-related demand lifted memory prices and strengthened the company's cash position.
