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Friday 14 August 2026
South Korea's memory-chip exports surge 277% as system chips slip

South Korea's semiconductor export boom was heavily concentrated in memory in July. Memory-chip export value surged 276.9% year over year, while system semiconductor exports slipped 0.7%, as server demand and higher memory prices created a sharp split between the two segments.

Friday 14 August 2026
SanDisk lays out multiyear NAND roadmap and AI storage targets at investor day

SanDisk Corp used its August 13, 2026 investor day to detail a technology roadmap and a set of financial targets it says will carry the flash-memory maker through the end of the decade. The plans center on new multiyear supply contracts with data center customers and an accelerating NAND product cadence built around artificial intelligence inference workloads.

Friday 14 August 2026
Samsung weighs moving legacy memory backend work to Vietnam to free up capacity for HBM
Samsung Electronics may move part of the general-purpose DRAM and NAND packaging and testing now handled at its Cheonan and Onyang sites in South Korea to Vietnam, potentially freeing domestic backend capacity for high-bandwidth memory (HBM), according to DealSite.
Friday 14 August 2026
Silicon Motion completes US$1.15 billion zero-coupon bond offering
Silicon Motion Technology has completed a US$1.15 billion convertible bond sale, giving it fresh capital to support growth and debt repayment. For global investors and chip buyers, the financing signals confidence in storage, automotive, and physical AI demand, while also showing how semiconductor firms are using low-cost structures to fund expansion.
Friday 14 August 2026
SK Hynix looks beyond memory with new global growth team
SK Hynix has set up a dedicated team to search for growth opportunities beyond its core memory business and has put a senior group executive in charge, a move aimed at turning the company's lead in high-bandwidth memory (HBM) into a wider role in AI infrastructure.
Friday 14 August 2026
Phison reports record second quarter profit as AI storage demand surges
Phison Electronics reported record second-quarter results for 2026, with profit and revenue both reaching new highs as AI-driven storage demand accelerated. The Taiwan-based NAND controller supplier said quarterly net profit rose to NT$26.219 billion and earnings per share reached NT$118.57.
Friday 14 August 2026
Asus sees stronger second-half PC demand despite memory pressure, stronger server outlook
Asus said record second-quarter results have set a higher base for 2026. Still, investors are now watching whether the company can sustain momentum through the second half as memory prices climb and global PC demand remains uneven. The company expects third-quarter PC revenue to rise 15% to 20% quarter-on-quarter, helped by both pricing and shipments.
Friday 14 August 2026
Kioxia eyes customer trials for PCIe Gen6 optical SSD

Kioxia is developing a PCIe Gen6 optical SSD and hopes to work with customers on its next prototype, as the Japanese memory maker tackles cost and reliability hurdles that still stand between the technology and mass production.

Friday 14 August 2026
Intel tests system memory to ease AI KV-cache pressure
Intel tests presented at the OCP APAC Summit 2026 that moving the key-value cache used in large language model (LLM) inference from GPU memory to system DRAM can raise serving throughput and support more concurrent requests when VRAM is the bottleneck, although the gains fade once compute becomes saturated.
Friday 14 August 2026
Samsung and SK hynix push AI deeper into fabs as semiconductor manufacturing enters autonomous era
As the world enters an AI-powered era where the persistent need for more complex architectures is driven by rising demands for higher computing performance, one bottleneck confronting the semiconductor industry lies not only in technological advancement itself, but also in the capacity to deploy standardized manufacturing processes at greater scale and speed.
Friday 14 August 2026
Beyond silicon and copper: OCP APAC looks under the hood of future AI infrastructure
AI's appetite for compute is growing at such speeds that simply building bigger versions of today's data centers may no longer cut it.
Thursday 13 August 2026
SK Hynix expands EUV roadmap with High-NA tools and PSM adoption
SK hynix said it is advancing its use of extreme ultraviolet (EUV) lithography for the mass production of next-generation DRAM, with high-numerical-aperture (High-NA) EUV equipment introduced in the second half of 2025 and related research and development beginning in 2026. The memory maker is also adopting phase-shift mask (PSM) technology and other process materials to improve EUV performance as demand rises for higher-capacity, higher-performance chips.
Thursday 13 August 2026
AI inference surge lifts NAND market to record revenue: Counterpoint
The global NAND market tightened sharply in the second quarter of 2026 as AI workloads shifted from training to inference, driving demand for enterprise SSDs and squeezing consumer supply. The trend matters because it is reshaping storage prices, supplier rankings, and the availability of devices and servers worldwide.
Thursday 13 August 2026
Intel signals memory push after hiring former SK Hynix CEO

Intel is signaling a broader push into next-generation memory technologies, with CEO Lip-Bu Tan revealing that the company is exploring new memory architectures after hiring former SK Hynix CEO Lee Seok-Hee.

Thursday 13 August 2026
OCP APAC 2026: Intel sees agentic AI shifting bottlenecks toward CPUs, memory
Intel sees agentic AI changing the balance of AI servers, as CPU orchestration, memory capacity and data movement emerge as performance constraints even when more GPU capacity is available.
Thursday 13 August 2026
Yangtze Memory-backed capital expands into FD-SOI specialty process investment

Changcun Capital, the investment arm backed by Yangtze Memory Technologies Co., has completed a strategic investment in RuiLiPingxin Microelectronics (Guangzhou) Co., Ltd., according to the source material.

Thursday 13 August 2026
South Korea widens chip strategy beyond Samsung and SK Hynix with KRW5 trillion ecosystem fund
As market momentum spirals into an intensifying race over AI infrastructure buildouts, the global landscape has entered a more aggressive round of AI-centered investment, with national-scale projects taking shape across many of the world's major technology economies.
Thursday 13 August 2026
Longsys profit soars 715-fold on AI memory boom, enterprise storage, 5nm chips
Chinese memory supplier Longsys reported a dramatic earnings rebound for the first half of 2026, benefiting from rising memory prices, stronger AI data center demand, and a shift toward higher-value storage products.
Wednesday 12 August 2026
CXMT DDR5 yield tops 90%, narrowing gap with Samsung

China's leading DRAM maker CXMT has reportedly raised its DDR5 production yield above 90%, narrowing the gap with Samsung Electronics and strengthening its position in the global PC memory supply chain.

Wednesday 12 August 2026
FocalTech expects demand to improve in the second half of 2026
Touch controller and display driver IC maker FocalTech Systems said it saw revenue regain quarter-on-quarter momentum in the second quarter of 2026 as the 618 shopping festival, new device launches, and stronger notebook and tablet demand lifted sales. The company, which held an investor briefing, said persistent memory price pressure and weak peak-season demand for high-end Android phones still kept revenue below 2025 levels.
Wednesday 12 August 2026
SK Hynix reportedly revives China NAND expansion as YMTC and global rivals race to meet AI storage demand

SK Hynix is restarting a long-frozen expansion of its Dalian, China, NAND flash plant, adding capacity that will lift output at the site by roughly 50%. The move comes as the AI boom turns memory chips into one of the tightest-supplied components in the industry, according to the Seoul Economic Daily.

Wednesday 12 August 2026
Cash deposits reshape memory supply deals
The global memory industry has embraced a new business model over the past two quarters. Memory manufacturers are not only signing multi-year supply agreements with customers, but also requiring substantial cash deposits or other financial commitments as guarantees against future demand.
Wednesday 12 August 2026
Haechitech enters eSSD sensors as it prepares Kosdaq listing

South Korean sensor IC designer Haechitech is moving beyond smartphone compass chips into enterprise solid-state drive temperature sensors, with supply to a major South Korean memory maker set to begin in 2026. The shift would end a single-supplier setup previously dominated by Texas Instruments and give Haechitech a foothold in the data center and memory markets.

Wednesday 12 August 2026
Fudan's single-electron memory breakthrough opens new path for 2D chip scaling
China's effort to advance memory technology has gained a new research avenue, with a Fudan University team developing a room-temperature single-electron non-volatile memory device based on two-dimensional materials.
Wednesday 12 August 2026
Samsung HBM4 yield nears 80% in push to rival SK Hynix

Samsung Electronics' production yield for its sixth-generation high-bandwidth memory, HBM4, has reportedly approached 80%, marking a sharp improvement since mass production began and strengthening its ability to compete with SK Hynix on volume and cost.