CONNECT WITH US
Tuesday 15 September 2026
Astera Labs targets the KV cache bottleneck as agentic AI outgrows GPU memory
Astera Labs has added three products to its Leo memory controller line, aimed at a problem that arises as AI inference shifts from single queries to agents that run continuous loops: the key-value cache outgrows the HBM on the accelerator, and the usual fallback makes things worse.
Tuesday 15 September 2026
High-capacity memory shortages worsen: Team Group reveals edge AI strategy amid rising price pressures

As memory shortages worsen, Team Group is aggressively deepening its footprint in the industrial control market. Vice general manager Shao-An Hsia noted that with AI applications accelerating their expansion from the cloud to the edge, industrial and edge system manufacturers must pivot away from competing head-on with cloud giants for component supply. Instead, they need to rely on flexible specification adjustments and specialized hardware protection technologies. In driving edge AI adoption, memory suppliers will serve as "icebreakers" during the commercialization process.

Tuesday 15 September 2026
Micron's record Taiwan payout fails to end union demand for 15% of profits
Micron Technology's Taiwan union is pressing for a permanent profit-sharing formula despite the US memory chipmaker announcing its largest employee rewards package to date, leaving a labour dispute unresolved ahead of further negotiations.
Tuesday 15 September 2026
DIGITIMES Insight: AI sends the semiconductor market toward US$1.6T, with memory doing the heavy lifting
DIGITIMES Intelligence forecasts the global semiconductor market will expand from US$791.7 billion in 2025 to US$1.6 trillion in 2026, representing year-on-year growth of 109.1%.
Tuesday 15 September 2026
China elevates HBM and HBF in five-year plan, opening a new front in AI memory
China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have jointly released the 15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry. For the first time, the plan identifies high-bandwidth flash memory and high-bandwidth memory as priority areas for next-generation memory research.
Tuesday 15 September 2026
Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM
Samsung Electronics is accelerating the restructuring of its semiconductor packaging footprint. Its Cheonan facility is gradually phasing out packaging operations for the Exynos mobile application processor (AP), and repurposing the equipment for high-bandwidth memory (HBM) production.
Tuesday 15 September 2026
Global semiconductor revenue hits record US$425B in 2Q26
Global semiconductor revenue reached a record US$425 billion in the second quarter of 2026, surging 31.4% quarter-over-quarter, as AI demand and strong memory pricing continued to drive the market, according to research firm Omdia.
Tuesday 15 September 2026
Samsung, SK Hynix diverge on cell design for sub-10nm DRAM in 2028

Samsung Electronics and SK Hynix are preparing to move DRAM below the 10nm threshold in 2028, with the two memory makers pursuing different cell structures as conventional scaling becomes increasingly difficult.

Tuesday 15 September 2026
Memory makers tighten supply as DRAM price rally extends into 2027

As memory vendors continue signing long-term agreements (LTAs), the supply-demand imbalance is set to worsen in 2027. Gerry Chen, general manager of Team Group, revealed that module makers have recently received "friendly notices" from upstream memory manufacturers. These notices explicitly state that shipment allocations will be drastically cut in 2027, creating a massive supply gap for DRAM. Upstream manufacturers have reportedly sold out nearly all of their capacity for 2027 through 2028.

Tuesday 15 September 2026
Sigmaintell: Memory shortage to ease in 2027 before chip growth hits 2029 wall

After months of tight supply and sharp price increases in 2026, the global memory market is expected to see its supply-demand gap narrow significantly in 2027 as DRAM capacity expands and demand patterns shift, according to Beijing-based Sigmaintell Consulting. The consultancy expects the memory and broader semiconductor markets to continue growing through 2028, but forecasts a potential pullback in 2029 as evolving AI applications reshape demand.

Tuesday 15 September 2026
CXMT rides AI boom to 80% operating margin

China's leading DRAM maker, CXMT Corporation (CXMT), formerly known as ChangXin Memory Technologies, is reaping a windfall from price gains in general-purpose memory as the AI boom reshapes the market. In the second quarter of 2026, CXMT posted an operating margin of about 82% on an EBIT basis, ranking near the top among major memory vendors and underscoring how Samsung Electronics, SK Hynix, and Micron's shift of more resources into HBM has made CXMT one of the biggest beneficiaries of the current price surge.

Monday 14 September 2026
Kokusai Electric gains from Hitachi split as AI memory demand surges
Kokusai Electric, the semiconductor equipment maker spun off from Hitachi and later acquired by KKR, has emerged as one of the clearest winners from Hitachi's restructuring. According to Nikkei, the company benefited from faster decision-making, continued research and development spending, and rising demand for advanced memory equipment as AI infrastructure spending accelerated in the second half of 2024.
Monday 14 September 2026
Samsung, SK Hynix reject US$19 billion power prepayment as Korea speeds chip expansion

Samsung Electronics and SK Hynix have rejected a proposal to prepay KRW25 trillion (approx. US$18.7 billion) in electricity bills, highlighting the financing challenge facing South Korea as it accelerates semiconductor expansion and the power infrastructure needed to support it.

Monday 14 September 2026
Sandisk recruits engineers in Korea as memory talent race heats up

Sandisk is making an unusual push into engineering recruitment in South Korea, seeking talent across NAND system architecture, NAND core design, VLSI design, and mask design while listing experience in HBM, LPDDR, and GDDR among key qualifications.

Monday 14 September 2026
South Korea broadens espionage law to counter rising tech leaks
South Korea's revised Criminal Act took effect September 13, extending the scope of espionage offenses from acts benefiting North Korea to those benefiting any foreign country or equivalent organization, as South Korea strengthens protection of semiconductors and other strategic technologies.
Monday 14 September 2026
India semiconductor deals hit a multi-year high ahead of SEMICON India 2026
India's semiconductor companies have raised nearly half of their all-time equity funding since the start of 2025, and deal activity this year is already at a multi-year high. The figures arrive days before SEMICON India 2026, the country's flagship semiconductor conference, opens in New Delhi on September 17.
Monday 14 September 2026
Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout
AI demand remained the dominant force across semiconductors, memory, foundry and data-center infrastructure this week. Intel raised CPU prices while Qualcomm and MediaTek targeted openings in IPC and IoT; memory inventories tightened as HBM4 and server demand strained DRAM and NAND supply; and Micron, Taiwan Mobile, Samsung Electronics, ASML, Synopsys and Eaton advanced plans tied to AI, advanced-node manufacturing and higher-density data centers. Below are the most-read DIGITIMES stories from September 7–13, 2026.
Friday 11 September 2026
Kioxia eyes US listing amid NAND profit rebound
Kioxia's planned US listing could broaden the Japanese memory maker's access to global institutional investors as a sharp recovery in NAND profitability coincides with stronger data-center demand and a new round of capacity investment.
Friday 11 September 2026
Memory makers gain the upper hand as Apple's iPhones pay the price
Apple has raised prices on both its new iPhone 18 Pro series and older models, including the iPhone 17, as rising memory costs push up component expenses.
Friday 11 September 2026
Micron pays Taiwan fab workers up to 68 months' salary in memory upturn
Micron has announced its FY26 pay package for more than 60,000 employees worldwide, the largest in the company's history. For the first time, every employee will receive merit-based stock awards, making the entire workforce shareholders.
Friday 11 September 2026
Apple's new chip packaging boosts A20 Pro AI power, pushing MediaTek, Qualcomm to follow suit
Apple has unveiled its latest iPhone 18 Pro and the A20 Pro, its first 2nm chip. According to Apple's official specifications, the A20 Pro features a six-core CPU, seven-core GPU, and two 16-core Neural Engines totaling 32 cores.
Friday 11 September 2026
SK Hynix raises cash portion of bonuses after 25-vote union rejection

SK Hynix has increased the cash portion of its profit-sharing bonus in a revised tentative wage agreement, after production workers rejected an earlier stock-heavy proposal by just 25 votes.

Friday 11 September 2026
AI server tracker: Taiwan's August filings say demand is still accelerating
The clearest read yet on whether the AI build-out is still accelerating arrived this week in a batch of unaudited Taipei filings, and it accelerated. The 49 Taiwan-listed companies spanning AI server assembly, cooling, power, substrates, materials, networking, test, and optics reported combined August revenue of NT$2.84 trillion (US$89.74 billion), up 76.5% from a year earlier and 9.9% from July, according to their filings to the Market Observation Post System. Both the total and the growth rate are the highest of the cycle, and the year-on-year rate is a step up from July's 61.3%.
Friday 11 September 2026
Rayzher rides semiconductor fab buildout to record revenue
Rayzher Industrial, a high-tech factory gas supply system solutions provider, reported consolidated revenue of NT$369 million (approx. US$11.7 million) in August 2026, up 83.26% year-over-year and a record monthly high. Cumulative consolidated revenue for the first eight months of 2026 reached NT$1.993 billion, up 27.91% from the same period in 2025 and also a record for the period.
Friday 11 September 2026
China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing
Chinese electronics manufacturer Shenzhen Kaifa Technology, also known as Shenzhen Kaifa or Kaifa, plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip packaging and testing capacity through its wholly owned subsidiary Payton Technology (Shenzhen), according to a company announcement.