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Monday 9 June 2025
Kioxia to double NAND memory production by 2029, next-gen SCM launch set for 2026
Kioxia, Japan's leading NAND flash memory manufacturer, is preparing for an aggressive expansion. The company has announced a bold plan to double its memory production capacity by fiscal year 2029, with a focus on increasing output to meet growing demand from sectors like artificial intelligence.
Monday 9 June 2025
Samsung reportedly races to LPDDR6 with 1c DRAM by late 2025 to fend off Chinese rival
Samsung Electronics is accelerating its development of next-generation low-power memory technology, aiming to begin production of LPDDR6 using its advanced 1c DRAM process in the second half of 2025, according to a report by South Korean media outlet Businesspost. The company reportedly plans to supply major global tech firms such as Qualcomm, a strategic move to reinforce its leadership and counter rising competition from China's ChangXin Memory Technologies (CXMT).
Monday 9 June 2025
Samsung union loses nearly 7,000 members amid leadership crisis
Samsung Electronics's largest labor union lost almost 7,000 members in two months following the mass resignation of its executive leadership, potentially disrupting negotiations with management as the South Korean chipmaker grapples with production challenges and intensifying competition from TSMC.
Monday 9 June 2025
Phison reports May consolidated revenue of US$175 million
Taiwan-based NAND controller manufacturer Phison Electronics posted a May 2025 consolidated revenue of NT$5.69 billion (approx. US$175 million), down 5.2% from the previous month but up 6% year-over-year. Cumulative revenue for January through May reached NT$25.531 billion, declining 5.7% annually but marking the third-highest on record.
Monday 9 June 2025
Weekly news roundup: Arm's rebrand, Huawei's R&D blitz, and Asia's rising AI chip challengers
These are the most-read DIGITIMES Asia stories from June 2 to June 8, 2025. Top highlights include Arm's strategic rebrand and entry into proprietary chip design, Huawei's aggressive R&D-driven resurgence, and growing momentum across Asia in AI semiconductors and advanced packaging. As global tech giants recalibrate in response to shifting supply chain dynamics, export controls, and rising open-source threats, the week's top stories reflect deepening fault lines—and fresh opportunities—across the semiconductor and system architecture landscape.
Monday 9 June 2025
Korean equipment firms see Chinese memory makers flooding premium orders amid US curbs
South Korean semiconductor equipment manufacturers are seeing a surge in demand from Chinese memory chipmakers, according to a report from Hankyung. ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC) are placing urgent bulk orders - some reportedly at premiums of 1.7-2 times the original price - to secure tools essential for producing advanced LPDDR5 DRAM and high-bandwidth memory (HBM) products.
Friday 6 June 2025
Memory module maker Goldkey approved for IPO, eyes strong growth in 2H25
Memory module maker Goldkey Technology officially received approval from the Taiwan Stock Exchange on June 5, 2025, for its initial public offering (IPO), with a listing capital of NT$680 million (US$22.71 million). The company is well-positioned to capitalize on the recovery of the global memory industry in 2025 and anticipates significant growth momentum in the second half of the year.
Friday 6 June 2025
DRAM prices unlikely to drop in 2025; Team Group embraces edge AI opportunities
Driven by the established trend of memory manufacturers reducing production, Team Group general manager Gerry Chen stated that memory prices are not expected to decline in 2025. The price gap between DDR4 DRAM and DDR5 will continue to narrow, while NAND flash prices are projected to maintain an overall upward trajectory. As a result, the company holds an optimistic outlook for operations from the second quarter to the third quarter.
Thursday 5 June 2025
Samsung loses key US memory architect to SanDisk as chip race escalates
Jim Elliott, a veteran executive who spent over 20 years leading Samsung Electronics' memory operations in the US, has reportedly exited the company to join rival NAND flash provider SanDisk as Chief Revenue Officer (CRO), according to sources cited by South Korea's Financial News (Fnnews) and Asian Economic News Agency.
Thursday 5 June 2025
Hanmi Taiwan posts record growth as demand for maintenance services and component sales surge
Hanmi Taiwan, the local subsidiary of South Korea's Hanmi Semiconductor, reported explosive growth in the first quarter of 2025, generating 76% of its entire 2024 revenue in just three months. Industry analysts point to robust demand from key clients such as Micron Technology for maintenance services and component sales as the main driver behind the surge.
Thursday 5 June 2025
CXMT's surprise HBM3 sprint puts Samsung, SK Hynix on alert
China's CXMT is accelerating its development of high-bandwidth memory (HBM) and DDR5 chips, mounting a direct challenge to the global DRAM dominance of Samsung Electronics and SK Hynix. The company plans to deliver HBM3 samples by late 2025 and begin mass production in 2026, with HBM3E (fifth-generation) development set for 2027. As reported by The Financial News (Fnnews), CXMT has advanced its HBM2 production timeline from 2026 to mid-2025, signaling a faster-than-expected ramp-up.
Thursday 5 June 2025
Micron takes lead in LPDDR5X race with early 1γ-based mobile memory shipment
Micron Technology has begun mass production of its 1γ-based LPDDR5X memory, outpacing rivals Samsung Electronics and SK Hynix in the race to supply faster, low-power DRAM for AI smartphones. The chip achieves 10.7 Gbps speeds and is Micron's first mobile product built with EUV lithography.
Wednesday 4 June 2025
Samsung's DRAM yield jumps following bold redesign under new chief Jun Young-Hyun
Samsung Electronics is accelerating its push to reclaim semiconductor leadership, spotlighting its latest breakthrough in sixth-generation DRAM (1c node) yields. The development is fueling optimism about a potential rebound in the HBM market. Spearheading this turnaround is Jun Young-hyun, CEO and head of the Device Solutions (DS) division, who returned in May 2024 and initiated a high-stakes redesign of Samsung's DRAM architecture to reverse recent setbacks.
Wednesday 4 June 2025
Samsung and SK Hynix lead AI-driven EDA revolution to power next-gen semiconductor design
South Korea's semiconductor giants, Samsung Electronics and SK Hynix, are ramping up the adoption of artificial intelligence (AI)-driven electronic design automation (EDA) to bolster their competitive edge in next-gen chip production. The companies have started implementing AI-based design solutions across advanced process nodes and memory products, reporting notable progress in efficiency and innovation.
Wednesday 4 June 2025
DDR4 Memory prices surge as chipmakers announce phase-out
Amid intensifying US-China tensions and persistent uncertainty in global demand, major memory chipmakers are moving to phase out DDR4 DRAM, triggering a rapid spike in prices as supply constraints ripple through the market.
Wednesday 4 June 2025
South Korea maintains HBM chip lead while China faces tech and trade hurdles
The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics and SK Hynix—are leading this charge, combining deep R&D with strategic alliances to extend their technological edge. In contrast, China's DRAM challengers continue to be hampered by sanctions and capacity constraints. This article breaks down the market forces, innovation race, and geopolitical headwinds shaping the HBM landscape.
Wednesday 4 June 2025
Samsung executives visit Nvidia headquarters to secure HBM supply deal
Samsung Electronics memory division executives traveled to Nvidia's US headquarters in late May to advance large-scale high-bandwidth memory (HBM) supply arrangements, according to South Korean media reports.
Tuesday 3 June 2025
Samsung rides GDDR7 wave as Nvidia, AMD shift to comply with US export curbs
In response to intensified US export controls on advanced semiconductor shipments to China, major chipmakers Nvidia and AMD are reportedly adopting Samsung Electronics' GDDR7 graphics DRAM as a lower-bandwidth alternative to high-bandwidth memory (HBM), which falls under stricter US trade restrictions.
Tuesday 3 June 2025
SoftBank and Intel forge AI memory venture to challenge HBM dominance
Japan's SoftBank has partnered with Intel to co-develop cutting-edge DRAM tailored for AI applications, aiming to challenge the incumbent High Bandwidth Memory (HBM) technology. The new chip initiative could receive backing from the Japanese government and is part of a broader national effort to revitalize Japan's semiconductor ecosystem.
Tuesday 3 June 2025
Samsung upgrades capacity layout, reportedly transforming old memory lines into packaging mainstay
Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly growing AI and high-performance computing markets. Equipment transfers are expected to begin as early as the second half of 2025.
Tuesday 3 June 2025
South Korean exports to the US and China fall sharply, but semiconductor sales hit record high

South Korea's exports to the US and China tumbled by more than 8% in May, reflecting growing pressures from global trade tensions and supply chain realignments. Despite the broader slump, the country posted record-breaking semiconductor exports for the month, offering a rare bright spot amid mounting economic uncertainties.

Tuesday 3 June 2025
South Korea's chip crown becomes a strategic burden

South Korea's leadership in DRAM, NAND, and high-bandwidth memory (HBM) is becoming a strategic liability amid rising US-China friction. With SK Hynix and Samsung holding a combined 70% of DRAM and more than half the NAND market, the country anchors a supply chain vital for AI training and HPC workloads. A single disruption could trigger global price shocks and shortages, particularly in AI computing and mobile devices.

Monday 2 June 2025
Nanya targets 4Q25 profitability as DDR4 rivals exit
Both AI and non-AI demands in the DRAM market are showing gradual recovery signs. Nanya estimates that it will clear all inventory before the third quarter of 2025. With yield improvements in its 1B process technology, the company expects operational growth in volume and pricing in the second half of the year, aiming to return to profitability in the fourth quarter.
Monday 2 June 2025
Weekly news roundup: Huawei's 5nm PC, Wolfspeed's SiC crisis, and China's export chokehold
These are the most-read DIGITIMES Asia stories from May 26 to June 1. Top highlights include Huawei's 5nm HarmonyOS PC as a milestone in China's chip self-sufficiency, Wolfspeed's looming bankruptcy threatening Renesas' US$2 billion SiC deal, China's EUV-free 5nm efforts, mounting export control risks, Samsung Electronics' delayed entry into Nvidia's HBM3E supply chain, and Malaysia's US$270 billion pivot to IC design and advanced packaging.
Monday 2 June 2025
US plans wider China tech sanctions with subsidiary crackdown
The Trump administration plans to broaden restrictions on China's tech sector with new regulations to capture subsidiaries of companies under US curbs.
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