SK Hynix is stepping up its use of extreme ultraviolet (EUV) lithography in next-generation DRAM, increasing the number of EUV layers in its upcoming sixth-generation 10nm-class (1c) products to more than five. The plan was revealed at the Next Generation Lithography + Patterning Academic Conference in Suwon, South Korea.

China's domestic high-bandwidth memory (HBM) technology has reportedly reached a major milestone, with one of the nation's top DRAM manufacturers beginning mass production of HBM3 chips using a homegrown 16nm G4 process. Industry sources say sample shipments to Huawei are already in progress, and the product is undergoing final verification.

Huawei has launched its Unified Cache Manager (UCM), a software framework designed to speed up inference in large AI models. The company says the tool could lower costs and reduce China's dependence on costly high-bandwidth memory (HBM) chips.