Micron held a conference for Taiwanese suppliers on September 17 under the theme of building at speed and growing at scale. The event brought together Taiwan-based supply chain partners involved in civil, structural, and architectural (CSA) works; mechanical, electrical, and plumbing (MEP) systems; fab equipment; construction materials; and tool installation.
Winbond Electronics' US$1.12 billion acquisition of Infineon's NOR Flash and ferroelectric RAM (F-RAM) businesses has drawn close attention from China's semiconductor industry.
Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader high-tech industry.
Foreign commitments timed around SEMICON India are moving deeper into the supply chain. In the three days before the 2026 edition opened on September 17, Lam Research, Applied Materials, and Fujifilm announced India plans worth a combined INR144 billion (US$1.50 billion), covering silicon components, chip equipment, and process chemicals rather than chip production itself.
Nvidia CEO Jensen Huang has again been photographed using Samsung Electronics' latest foldable phone, the Galaxy Z Fold8, after being seen with a Galaxy Z Fold7 earlier in 2026. The latest sighting has drawn fresh attention to the close partnership between Samsung Electronics and Nvidia.
Samsung Electronics' total advances received rose 70.4% in the first half of 2026, while memory suppliers and their largest customers increasingly turn to multi-year agreements to secure supply and improve demand visibility.
SK Hynix's production workers' union has approved a revised pay agreement that raises the cash share of employee profit-sharing bonuses, ending weeks of uncertainty after members rejected the previous proposal by just 25 votes.
Micron has demonstrated what it calls the world's first 512GB DDR5 registered dual in-line memory module (RDIMM) across multiple server platforms, doubling the capacity of the 256GB RDIMM it began sampling in May as next-generation systems demand greater memory capacity and bandwidth.
