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Thursday 4 June 2026
Goldkey targets NT$10B funding to lock in memory supply as prices surge
Memory module maker Goldkey said it plans to raise NT$6 billion (US$191.4 million) to NT$10 billion in working capital in 2026 through multiple channels as tight supply and rising contract prices fuel a memory supercycle. The company also plans to accelerate a shift into higher-value segments such as industrial control, AI, and edge computing after posting a 30% gross margin and 27.4% operating margin in the first quarter of 2026.
Thursday 4 June 2026
Kioxia weighs new NAND fab as AI demand drives long-term expansion plans
Kioxia is evaluating the construction of a new NAND flash manufacturing facility at its Kitakami site in Iwate Prefecture, aiming for production to begin after 2029-2030 as the company prepares for sustained growth in AI-driven storage demand.
Wednesday 3 June 2026
Micron's HBM4 push signals bigger Nvidia supply role
Micron Technology may supply more HBM4 memory for Nvidia's next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment for the new technology, according to sources in South Korea's memory equipment industry.
Wednesday 3 June 2026
SK Group weighs pausing SK Siltron sale as AI chip demand lifts wafer strategy
SK Group is reportedly placing AI and semiconductors at the center of its next round of business restructuring, prompting a fresh internal review of the strategic value of SK Siltron, a major global silicon wafer maker. The planned sale of SK Siltron, once seen as a move to improve SK Group's financial structure, now faces uncertainty as the group reconsiders whether to push ahead with the deal.
Wednesday 3 June 2026
Commentary: Why the world's memory giants are betting on Anthropic
The latest funding round for Anthropic produced a headline-grabbing figure: a US$65 billion capital raise that pushed the artificial intelligence (AI) startup's valuation to $965 billion, surpassing OpenAI and making Anthropic the world's most valuable AI startup.
Wednesday 3 June 2026
Exclusive: SK Group and Foxconn talks could signal deeper Taiwan-Korea AI supply chain ties
COMPUTEX drew major AI supply chain players to Taiwan, and industry sources said SK Group chairman Chey Tae-won was set for a private meeting with Foxconn chairman Young Liu, alongside his meetings with TSMC chairman C.C. Wei and Nvidia CEO Jensen Huang. The reported talks could signal broader cooperation on AI infrastructure.
Wednesday 3 June 2026
NAND market hits record as YMTC closes in on global rivals
The global NAND flash memory market reached a record US$46 billion in revenue in the first quarter of 2026, driven by AI infrastructure demand, higher enterprise SSD shipments, and rising NAND prices, according to Counterpoint Research.
Wednesday 3 June 2026
SK Hynix to double capacity over next 5 years, as Nvidia CEO leaves 'Please make more' note on Computex booth
SK Group chairman Tae-won Chey said SK Hynix plans to double its overall production capacity over the next five years, as strong demand for artificial intelligence (AI) drives a global memory shortage. He added that the expansion is tied to deeper cooperation with Taiwan's semiconductor and IT supply chains, particularly through a strategic alliance with foundry leader Taiwan Semiconductor Manufacturing Company (TSMC).
Tuesday 2 June 2026
Samsung signals broader AI memory deployment with HBM5 roadmap and thermal tech
Samsung Electronics has used Computex 2026 to outline a broader AI memory strategy, highlighting HBM5, thermal management, and advanced packaging as it prepares for next-generation AI systems. The company also pointed to deeper alignment across memory, foundry, logic, and packaging.
Tuesday 2 June 2026
South Korea cuts EUV equipment approvals to speed Samsung and SK Hynix expansion
South Korea's Ministry of Trade, Industry, and Energy announced on June 2, 2026, that it would sharply streamline domestic approval procedures for extreme ultraviolet equipment used in semiconductor fabrication, reducing installation lead times from 34 days to 9 days to accelerate advanced production lines. The ministry said the change reclassifies EUV tools from high-pressure gas manufacturing facilities to a new "specific equipment" category after a partial revision to the Enforcement Decree of the High-Pressure Gas Safety Control Act.
Tuesday 2 June 2026
SK Hynix reportedly preparing Dalian fab for 200-layer FG NAND to capture AI storage demand
SK Hynix is reportedly preparing to mass-produce a new generation of 200-layer-class NAND flash memory based on floating-gate (FG) architecture at its Dalian Phase 2 facility in China, as the company seeks to strengthen its position in the fast-growing enterprise SSD (eSSD) market for AI data centers.
Tuesday 2 June 2026
Micron unveils AI memory and storage roadmap at COMPUTEX 2026
Micron outlined a broad AI memory and storage strategy ahead of Computex 2026, saying surging demand across data centers and intelligent edge devices is reshaping the semiconductor landscape. The company announced solutions spanning high-bandwidth memory, low-power DRAM and PCIe Gen5 SSDs, and said these products address growing requirements for capacity, bandwidth and efficiency as AI workloads expand from training to large-scale inference and agentic systems.
Tuesday 2 June 2026
Agentic AI triggers widespread computing crunch across global supply chain
In 2026, a global compute shortage spanning chips, cloud services, servers, and data-center components is sweeping across the industry. The scarcity of compute and broad price hikes are running through the entire AI sector, pushing Nvidia's market value higher, lifting cloud revenue and profits at Amazon, Microsoft, and Google to record levels, and driving the valuations of AI startups OpenAI and Anthropic to nearly US$1 trillion.
Tuesday 2 June 2026
Phison and Intel roll out aiDAPTIV to boost local AI on Intel AI PC platforms
Phison Electronics announced a collaboration with Intel to bring aiDAPTIV memory extension technology to Intel AI PC platforms running Intel Core Ultra processors, aiming to enable larger on-device AI workloads and reduce reliance on cloud processing. The partners said the effort, which includes support for the OpenVINO toolkit, will cover ISV software validation, technology demonstrations, and development of optimized workloads for local execution.
Tuesday 2 June 2026
China's underwhelming holiday season shows memory hikes still weigh on consumer demand
After sharp swings in the memory spot market in April and May 2026, the industry's tight supply-demand balance has not changed. Spot prices through the end of May have recovered modestly from April, while the third-quarter memory contract price increase is expected to slow from a high base but remain firmly on an upward trend, with quarterly gains likely to stay in the double-digit 10-20% range.
Tuesday 2 June 2026
YMTC SSDs target Asia-Pacific consumer market from Taiwan
Yangtze Memory Technology is moving its retail SSD brand into the Asia-Pacific consumer market, beginning with Taiwan and later expanding to Singapore and South Korea. The shift comes as memory supply remains tight, prices stay high, and global markets face a storage landscape shaped by rising AI, gaming, and PC demand.
Tuesday 2 June 2026
DeepSeek's pricing move could redistribute value across AI hardware market
Chinese AI startup DeepSeek said it will permanently cut the API price of its flagship model by 75% from June 1, prompting debate across the global AI industry. Amazon AWS said the move may matter less as a price war than as a bid to change how AI infrastructure is built and sold.
Monday 1 June 2026
ByteDance reportedly developing Groq-style chip with InnoStar
ByteDance is creating a new chip similar to those made by Nvidia partner Groq to help the Chinese creator of TikTok handle its AI inference loads, according to The Information. Its expansion into language processing units (LPUs) marks another step in the development of its domestic AI infrastructure.
Monday 1 June 2026
Top memory maker executives gather in Taiwan in preparation for Computex 2026
After Nvidia CEO Jensen Huang wrapped up his "trillion-dollar banquet" for Taiwan AI supply-chain giants, GTC Taipei is set to become a highlight of Computex 2026. Nvidia will also host its first "South Korean partners night" in Taiwan.
Monday 1 June 2026
Nvidia expects AI boom to keep supply tight beyond 2027
Nvidia chief executive Jensen Huang said the artificial intelligence industry is entering a rapid growth phase that could keep revenue rising sharply into 2027, while supply-chain bottlenecks are likely to persist as demand continues to outstrip capacity.
Monday 1 June 2026
Nvidia courts Korea's industrial giants ahead of Computex
Nvidia chief executive Jensen Huang's pre-Computex meetings in Taipei are drawing close attention from South Korean companies seeking a bigger role in the global AI supply chain. With demand for AI infrastructure rising, their interest reflects how the next phase of AI development could shape worldwide competition, partnerships, and technology access.
Sunday 31 May 2026
Winbond accelerates custom memory transition
Winbond Chairman Arthur Chiao said market sentiment in the second half of 2026 would carry the strong momentum seen in the first half, with the overall market remaining in a supply shortage. He expects the current shortage will be difficult to ease in the near term, and said capacity constraints might not be resolved until the second half of 2027.
Saturday 30 May 2026
Terafab explained: SpaceX outlines space-optimized chips and AI megafab plan in IPO filing
SpaceX's IPO prospectus details an early-stage "Terafab" initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty, unfinalized partnerships, and capital intensity risks. The plan, still in preliminary form, depends on future agreements and could face delays, cost overruns, and supply-chain constraints.
Saturday 30 May 2026
Samsung tops Micron in automotive memory as AI tightens supply

Samsung Electronics has overtaken Micron Technology to become the world's largest supplier of automotive memory chips for the first time, according to new S&P Global Mobility data, marking a shift in a market long led by the US memory maker.

Friday 29 May 2026
Samsung begins shipment of HBM4E samples as AI memory competition intensifies
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.