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Thursday 23 April 2026
Samsung and SK Hynix race to upgrade China chip plants as NAND demand surges
As the artificial intelligence boom reshapes global computing demand, the memory chip industry is entering a new phase of strain and restructuring — one in which both DRAM and NAND flash are seeing rapidly tightening supply.
Thursday 23 April 2026
SK Hynix builds HBM packaging hub in Cheongju to expand AI memory capacity
SK Hynix has broken ground on a large-scale advanced packaging facility in Cheongju Technopolis, underscoring how the battleground for AI semiconductors is shifting beyond wafer fabrication to the back-end processes that increasingly define performance.
Thursday 23 April 2026
SK Hynix hits 72% operating margin in Q1, doubling profit quarter-on-quarter
SK Hynix reported its strongest quarterly results on record in the first quarter of 2026, with revenue of 52.58 trillion won (approximately US$37.9 billion), operating profit of 37.61 trillion won (approximately US$27.1 billion), and net profit of 40.35 trillion won (approximately US$29.1 billion).
Wednesday 22 April 2026
Focus: South Korea builds a semiconductor talent pipeline

South Korea's long-running experiment with job-guaranteed semiconductor education is entering a more consequential phase, with the first large wave of students from expanded industry-linked programmes set to enter the workforce from 2027. The shift is drawing fresh scrutiny over whether a model built around direct hiring pipelines, practical training, and university-industry coordination can do more than produce graduates at scale and whether it can ease the country's persistent shortage of semiconductor design talent.

Wednesday 22 April 2026
Powerchip DRAM foundry price hike to boost June revenue; IPD to drive Intel demand in 2H27
Powerchip Semiconductor Manufacturing (PSMC) held an earnings call on April 21 to address developments in memory and logic foundry services, as well as its future business outlook. PSMC president Martin Chu stated that DRAM foundry prices had significantly increased in March. However, due to the impact of the tape-out cycle on pricing, the price hike is expected to contribute to revenue starting in June.
Wednesday 22 April 2026
Samsung reportedly ramps up GDDR6 supply for Tesla but halts 1d DRAM mass production plan
Samsung Electronics is reportedly increasing production of GDDR6 specifically for Tesla starting in April 2026, even as it simultaneously scales back parts of its broader memory product line and halts plans for mass production of its next-generation 1d DRAM due to insufficient yields.
Wednesday 22 April 2026
ASM International reports 16% growth in 1Q26 revenue driven by booming AI market
ASM International reported a high revenue in the first quarter of 2026, driven by surging AI demand and its need for advanced chips. The Dutch maker of deposition equipment in the chip-making process said that this, in turn, has led semiconductor manufacturers to continue investing in equipment amid a period of tight chip-making capacity.
Wednesday 22 April 2026
Japan earthquake intensifies Kioxia supply concerns as SanDisk, Phison halt NAND pricing
A strong earthquake struck Japan's Tohoku region on the evening of April 20, 2026, near a critical semiconductor hub, raising global memory supply chain alarms. The quake's epicenter was close to Kioxia's NAND flash factories in Kitakami, Iwate Prefecture, prompting major NAND suppliers SanDisk and Phison to suspend market pricing amid fears of tightening NAND flash supply.
Wednesday 22 April 2026
Powerchip returns to profitability in 1Q26 following fab sale to Micron
Powerchip Semiconductor Manufacturing (PSMC) reported revenue of NT$13.57 billion (approx. US$432 million) in the first quarter of 2026, up 6% from the previous quarter and 22% year over year, benefiting from the disposal gains related to the sale of its Tongluo fab in Taiwan to Micron Technology. Net profit after tax reached NT$14.23 billion, with earnings per share (EPS) of NT$3.36, ending 10 consecutive quarters of losses.
Wednesday 22 April 2026
CXMT fills LPDDR4X gap as non-China CSPs seek capacity
Memory giant ChangXin Memory Technologies (CXMT) is stepping in to fill the consumer market shortfall left by Samsung Electronics' planned phase-out of LPDDR4X production. With memory costs soaring and supply tightening, roughly 40% of CXMT's capacity will reportedly be reserved for LPDDR4X, while the remaining 60% is dedicated to advanced DDR5 and LPDDR5 products.
Wednesday 22 April 2026
CXMT HBM3 timeline slips, mass production unlikely in 2026
China's leading memory chipmaker ChangXin Memory Technologies (CXMT) is facing fresh uncertainty over the commercialization timeline of its fourth-generation high bandwidth memory (HBM3), according to Korean media reports.
Tuesday 21 April 2026
AP Memory posts 112% profit surge in March, expects stronger growth momentum in 2026
Niche memory design firm AP Memory announced a 112% year-over-year increase in its self-reported March 2026 revenue to NT$814 million (approx. US$25.9 million). Pre-tax net income rose 53% to NT$457 million, while net profit attributable to the parent company grew 62% to NT$372 million. Earnings per share (EPS) reached NT$2.29. The company is optimistic about sustained growth momentum throughout 2026, with overall operational visibility better than in previous years.
Tuesday 21 April 2026
Samsung plans NAND expansion at P5 on AI-driven price gains
Surging demand for NAND flash, fuelled by artificial intelligence workloads and data centre expansion, is pushing memory makers into a new investment cycle, with Samsung Electronics and SK Hynix accelerating capacity plans after years of restraint.
Tuesday 21 April 2026
ASML's memory revenue tops logic in 1Q26, AI-fueled HBM demand surges
ASML revealed during its first quarter 2026 earnings call that revenue from memory systems has, for the first time, exceeded that of logic chips. Against a backdrop of sustained AI infrastructure investment, DRAM manufacturers are aggressively competing for extreme ultraviolet (EUV) equipment capacity, signaling a shift in global semiconductor demand patterns.
Tuesday 21 April 2026
Beijing acts on memory price surge, AI demand reshapes device costs

China's Ministry of Industry and Information Technology (MIIT) is stepping in to steady the memory supply chain after a sharp rise in DRAM and mobile memory prices began feeding into smartphones and other consumer electronics.

Tuesday 21 April 2026
Qualcomm Chief reportedly seeks memory and manufacturing deals in South Korea

Qualcomm Chief Executive Cristiano Amon is expected to meet senior executives from Samsung Electronics and SK Hynix during a recent visit to South Korea, according to industry sources. The discussions are expected to focus on securing memory supplies as well as potential cooperation with Samsung in advanced semiconductor manufacturing, including its 2nm foundry process.

Tuesday 21 April 2026
Samsung scales MRAM to 8nm, setting 5nm showdown with TSMC in 2027
Samsung is accelerating its push into magnetoresistive random-access memory (MRAM), positioning the technology as a strategic pillar alongside DRAM and high-bandwidth memory (HBM) in the intensifying global AI semiconductor race.
Tuesday 21 April 2026
China amping up DRAM integration: GigaDevice expands into DRAM through CXMT tie-up
GigaDevice is moving into DRAM through a KRW1 trillion (US$680 million) related-party deal, combining CXMT's manufacturing capacity with its own sales network in a move that could reshape the global supply landscape.
Tuesday 21 April 2026
AI reshapes memory supply; Global Electronics Association warns that traditional procurement strategies will fail
The Global Electronics Association has released a report highlighting how AI demand is redistributing memory supply, causing extended lead times, rising prices, and increased market uncertainty for electronics manufacturers worldwide.
Tuesday 21 April 2026
Samsung's HBM4 yield improves, 4nm PMBIST upgrade receives praise from Nvidia
Samsung Electronics is accelerating its catch-up in the high-bandwidth memory (HBM) market against leader SK Hynix by advancing its sixth-generation HBM4. A key factor is Samsung's upgrade from traditional MBIST to programmable PMBIST testing architecture built on cutting-edge 4nm process technology, significantly enhancing production yield and efficiency.
Monday 20 April 2026
Analysis: How TSMC avoids memory's boom-and-bust cycle
Ahead of TSMC's earnings call, DIGITIMES senior analyst Luke Lin explained that TSMC typically does not revise its full-year revenue forecast or capital expenditure during its first-quarter earnings announcement. If adjustments are needed, TSMC usually waits until July. That is when second-quarter results and third-quarter guidance are released, giving the company a firmer basis for any revisions.
Monday 20 April 2026
Chinese conglomerate makes entry into memory sector as AI drive structural shift
On April 17, Security Times reported that Beijing New Space-time Technology (Time Space Technology) plans to acquire Shenzhen-based memory module maker Powev Electronic Technology for CNY1.078 billion (US$158 million), marking its official entry into the semiconductor storage sector. The report noted that the deal represents a strategic transformation for the company as it seeks to move away from its traditional night-time economy and smart city businesses, which have been under sustained pressure from macroeconomic headwinds and tightening local government budgets.
Monday 20 April 2026
SOCAMM2 race intensifies as SK Hynix starts mass production, while Micron and Samsung push competing designs
SK Hynix has begun mass production of its 192GB SOCAMM2 memory module, marking a major step in the commercialization of next-generation low-power server DRAM designed for AI workloads, according to a company press release on April 20, 2026. Built on SK Hynix's 1-c nm (10nm-class sixth-generation) process and LPDDR5X technology, the module is positioned as a core memory solution for AI servers, particularly for training and inference of large language models.
Monday 20 April 2026
Samsung reportedly signals exit from LPDDR4 market as memory industry shifts toward LPDDR5
Memory makers are accelerating the phase-out of older mobile DRAM generations, with policies on LPDDR4 and DDR4 increasingly converging toward end-of-life (EOL) management as the industry shifts capacity toward higher-value LPDDR5, LPDDR5X, and server-class memory products.
Monday 20 April 2026
Weekly news roundup: Samsung launches voluntary retirement; Qualcomm moves into custom DRAM with CXMT
Below are the most-read DIGITIMES Asia stories from the week of April 13-19, 2026: