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Friday 24 July 2026
Intel reportedly considers SK Hynix for Ohio fab partnership

Intel is considering SK Hynix as a potential partner to help operate its delayed Ohio semiconductor project, Semafor reported, after the South Korean memory maker formally denied pursuing an acquisition of the site.

Friday 24 July 2026
Commentary: Wistron's Texas AI factory shows why US manufacturing still needs Taiwan
Wistron's opening of its D1 AI smart factory in Fort Worth, Texas, marks a new milestone for Taiwan's downstream electronics manufacturers. The plant will support the first US mass production of Nvidia GB300 compute boards, a development with far-reaching implications for Taiwan, the US and the global AI industry.
Friday 24 July 2026
Intel says supply, not demand, is its ceiling as it lifts 2026 capex above US$20 billion
Intel used its second-quarter 2026 earnings call on July 23 to argue that its biggest problem is no longer winning demand but building enough capacity to fill it, telling analysts it will raise capital spending, push its 18A and 14A process nodes forward, and expand a fast-growing custom-silicon business — even as it warned it will still be short of chips through the fourth quarter.
Friday 24 July 2026
Intel's blowout quarter wins over the bulls, but analysts stay split on the foundry turnaround
Intel's second-quarter results have shifted the Wall Street debate from whether chief executive Lip-Bu Tan's turnaround is working to how durable the AI-driven compute demand behind it will prove, with the sharpest disagreement now centering on the still-unprofitable foundry business and a valuation that has already more than tripled this year.
Friday 24 July 2026
AI server demand powers Intel's fastest growth since 2011, but foundry proof still pending
Intel's second-quarter 2026 results suggest the AI data-center buildout is beginning to pull the chipmaker's long-delayed turnaround forward, even as the payoff from its costliest bet — the contract manufacturing business — remains unproven.
Friday 24 July 2026
Amkor, Nvidia widen AI packaging partnership as US capacity expands
Amkor Technology has deepened its partnership with Nvidia to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms. The agreement includes a prepayment from Nvidia to support expanded US capacity, highlighting how global demand for AI infrastructure is reshaping supply chains and manufacturing priorities worldwide.
Friday 24 July 2026
Arizona lures chip boom with three key advantages
As TSMC expands its investment in Arizona to US$265 billion, the global semiconductor supply chain is accelerating its move into the state, transforming the long-known "Sunshine State" into a new US hub for semiconductors and AI. Arizona has also become a focal point for companies looking to tap into the next wave of growth around advanced manufacturing, data centers, and related services.
Friday 24 July 2026
Mitsubishi Electric seeks September deal on power-chip merger with Toshiba, ROHM

Mitsubishi Electric is seeking an agreement with Toshiba and ROHM by September on combining semiconductor operations centered on power devices, as the three Japanese suppliers negotiate product scope and corporate control while seeking government support.

Friday 24 July 2026
AMD goes all-in on ecosystem strategy to challenge Nvidia
AMD used its Advancing AI 2026 conference in San Francisco this week to do more than launch new hardware — it put its entire AI ecosystem strategy on display in a direct challenge to NVIDIA's grip on the AI infrastructure market.
Thursday 23 July 2026
Moonshot AI model challenges EDA moat with 2-day chip design
China AI startup Moonshot AI has drawn intense attention from the semiconductor industry after unveiling its new large language model Kimi K3, which delivered strong results across multiple model benchmarks and demonstrated an AI agent completing a full chip design flow in 48 hours using open-source electronic design automation (EDA) tools.
Thursday 23 July 2026
STMicroelectronics raises AI data center ambition as second-quarter revenue rebounds 26%
STMicroelectronics (ST) has raised its revenue ambition for AI data centers to above US$1 billion in 2026 and well above US$2 billion in 2027, staking a larger claim on the AI infrastructure buildout as the European chipmaker swung back to profit in the second quarter of 2026.
Thursday 23 July 2026
Samsung weighs Besi's Korean rivals for 50-bonder hybrid bonding line as pricing talks drag on

Samsung Electronics is preparing a die-to-wafer hybrid bonding production line with about 50 bonders at its Pyeongtaek campus for next-generation high-bandwidth memory and logic chips, according to The Elec.

Thursday 23 July 2026
Intel 18A adopts High-NA EUV in dual-certification push
Intel Foundry has moved high numerical aperture (High-NA) EUV lithography into production on its Intel 18A process, with ASML confirming in a recent press release that Intel is using the expensive next-generation tool on selected layers of its latest notebook processors, including Panther Lake and the Core Ultra Series 3 built on Intel's 18A technology. The move comes years earlier than Intel's original roadmap, but it currently remains in use for some layers of the 18A process is not replacing standard Low-NA EUV equipment.
Thursday 23 July 2026
Texas Instruments sees China EV surge and rising analog prices as upcycle broadens

Texas Instruments' second quarter of 2026 results landed Wednesday with two signals worth parsing beyond the headline numbers: an automotive demand acceleration that TI's own management didn't see coming three months ago, and the first analog price increases the company has executed in years. Together, they suggest the current upcycle is broadening in ways the supply chain has not fully absorbed.

Thursday 23 July 2026
SEMICON Taiwan 2026 sees record global participation as AI investment accelerates

Participation in the Global Pavilion at the upcoming SEMICON Taiwan 2026 has reached a new high, with the number of participating countries climbing to 18 and the booth count surging from 62 in 2023 to 220 in 2026, an increase of more than 250%. Both metrics set new records, reflecting that amid rising artificial intelligence (AI) investment and the regionalization of supply chains, countries are moving faster to deepen cooperation with Taiwan's semiconductor industry.

Thursday 23 July 2026
China's research ties weaken as UK, Germany and the US expand cross-border papers

China's research and academic community appears to be drifting away from international collaboration, even as the UK, Germany, and the US have steadily expanded cross-border partnerships in recent years. The contrast has drawn fresh attention after Moonshot AI's flagship 2026 model Kimi K3 and other Chinese technology products, including Unitree Robotics's H1 robot, prompted questions over how much of China's advanced innovation is truly homegrown.

Thursday 23 July 2026
Kyushu chip output jumps 60% amid TSMC expansion, but local suppliers see limited gains

Kyushu's semiconductor production, investment and hiring have risen sharply since TSMC announced its Kumamoto expansion, but local companies have captured only a limited share of the region's growing chip-related spending.

Thursday 23 July 2026
Merck makes 'AI for AI' its new semiconductor materials strategy

As the global AI race intensifies, Germany's Merck is extending its reach into semiconductor materials research with an "AI for AI" strategy. Using its in-house Elvis AI platform, BaBE Bayesian optimization tool, digital twin, and enterprise knowledge platform Melinda, the company is building a closed-loop innovation model in which AI drives materials development and new materials, in turn, support next-generation AI chips.

Thursday 23 July 2026
GlobalWafers Italy 8-inch plant fire disrupts output, 12-inch line stays online
GlobalWafers said its Novara plant in Italy caught fire on July 21, forcing a shutdown of the site's 8-inch production line. The silicon wafer maker said all personnel evacuated safely and no injuries were reported.
Thursday 23 July 2026
SK Hynix speeds P&T7 cleanroom rollout, keeps overall budget at KRW19 trillion
SK Hynix's board approved approximately KRW 7.09 trillion (approx. US$4.83 billion) in facility investment on July 22 to accelerate construction of its P&T7 advanced packaging plant in Cheongju, South Korea.
Thursday 23 July 2026
Ainos passes 613 million odor data points as it expands Physical AI
Ainos said its AI Nose platform has collected more than 613 million industrial odor data points, with most of the readings coming from semiconductor manufacturing sites. The AI odor-sensing startup, backed by Advanced Semiconductor Engineering (ASE), said the expanding rollout is accelerating real-world data collection and strengthening its Smell Language Model as it builds a long-term Smell Intelligence Network.
Thursday 23 July 2026
Commentary: Intel must show real AI orders to prove its turnaround
Agentic AI is rapidly gaining traction worldwide, while cloud giants and Anthropic are accelerating spending on AI infrastructure. That surge is pulling CPU demand back to the center of the industry and drawing Intel back into the AI compute supply chain.
Thursday 23 July 2026
Jensen Huang says no need to 'point a gun' at Taiwan as chipmakers expand in US
Taiwan's links with US technology firms are reshaping chip supply chains, with implications for investors and policymakers worldwide. Nvidia CEO Jensen Huang said those ties have strengthened America's semiconductor and PC industries, while Taiwan's companies are expanding in the US by choice, not coercion, amid growing tariff and security concerns.
Thursday 23 July 2026
Texas Instruments 2Q26: Revenue beats at $5.46B as industrial and auto recovery silences fab-spend doubters
Texas Instruments delivered a second-quarter 2026 result that topped Wall Street expectations and, more importantly for the industry, signaled that the analog chip cycle is turning up across several end markets at once. The Dallas-based company reported revenue of US$5.46 billion, up 13% sequentially and 23% year over year, with net income of US$1.98 billion and earnings per share of US$2.14, according to its earnings release.
Thursday 23 July 2026
Laser source outsourcing pushes back CPO rollout
While the commercialization timeline for co-packaged optics (CPO) has not accelerated as expected from the AI data center-driven demand for high-speed transmission, industry players say CPO remains a key long-term technology trend as electrical signaling is still approaching its physical limits. One increasingly favored approach is to place the laser source outside the package, which makes replacement easier and allows the same source to serve multiple transmission channels.