During its July 16 earnings conference, Taiwan Semiconductor Manufacturing Company (TSMC) offered an upbeat outlook on AI demand. Responding to competition from Intel's EMIB advanced packaging technology, chairman and CEO C.C. Wei said TSMC's CoWoS capacity remains "extremely tight" and welcomed the emergence of additional advanced packaging solutions to help customers alleviate backend manufacturing bottlenecks.
A Taiwan-Japan AI technology forum held at Taiwan Expo Japan brought together government, industry, academia and research representatives to discuss AI applications, semiconductor supply chains, smart manufacturing and innovation. Terry Tsao, SEMI's global marketing chief and head of the organization's operations in Taiwan, told DIGITIMES before the event that IBM has already demonstrated 2nm chip manufacturing capability in the lab, but the biggest challenge for its licensed partner, Japanese chipmaker Rapidus, to achieve mass production in Hokkaido will be yield.
The surge in AI and high-performance computing (HPC) technologies continues to reshape the semiconductor landscape, as demonstrated by the June 2026 financial performances of key supply chain players in Taiwan. Within this thriving ecosystem, IC testing and design services have emerged as pivotal backbones ensuring the physical viability and operational efficiency of next-generation silicon.
Micron has said its Strategic Customer Agreement (SCA) long-term supply deals with 16 key strategic customers include seven automotive customers — among them Qualcomm, Visteon, and Harman, all key suppliers supporting the automotive ecosystem — reinforcing its push into the auto supply chain. The memory maker said the agreements also cover CSPs and AI infrastructure players.
China and the Netherlands agreed that their governments should create a favorable environment for companies to resolve the Nexperia dispute through consultation, China's Ministry of Commerce said July 16.
The global tech landscape is currently dominated by two massive tides: the race for semiconductor supremacy and the long-promised dawn of the quantum era. While quantum technology is often associated with the distant goal of large-scale computing, a German startup is proving that quantum's most immediate impact may actually be in saving inspection time for the global semiconductor industry that powers the modern world.
Power semiconductor makers say prices are still being adjusted as upstream raw material costs rise and AI-driven high-margin products crowd out capacity. With supply tight across the chain, customers are now focusing on securing shipments first, even as new price-hike notices arrive in the third quarter of 2026.
TSMC Chairman C.C. Wei said on July 16 that if more competitors can offer advanced packaging solutions that meet customer needs, the company welcomes the added supply-chain flexibility. His comments, made at TSMC's earnings call, suggested that customer growth has already been somewhat constrained by tight back-end packaging capacity.
TSMC Chairman C.C. Wei formally announced on July 16 that the company will invest an additional US$100 billion in the US, funding several 2nm and more advanced logic wafer fabs as well as advanced packaging plants to support continued strong demand from major US customers.
