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Wednesday 29 April 2026
NXP beats expectations and lifts outlook on improving chip demand
NXP Semiconductors reported first-quarter fiscal 2026 revenue of US$3.18 billion, rising 12.2% year on year but down 4.6% sequentially, according to company data. Gross profit increased 14.6% year on year to US$1.79 billion, while operating income more than doubled to US$1.51 billion. Net profit rose 129% year on year to US$1.12 billion, reflecting margin expansion and operating leverage.
Wednesday 29 April 2026
CPUs reclaim the core of AI architecture as multicore trend tightens substrate supply
Workloads are shifting from training to inference. In this transition, CPUs are regaining a central role in coordinating diverse computing tasks, significantly boosting their importance. Industry estimates suggest that CPU demand could eventually rival that of GPUs, with the ratio between the two trending toward 1:1.
Wednesday 29 April 2026
Samsung doubles down on 2nm as TSMC pushes toward 1nm
Samsung Electronics and TSMC have taken increasingly different approaches to advanced semiconductor manufacturing as the industry moves beyond the 3nm generation. Although being the first to introduce mass production of a 3nm-class process in 2022, Samsung Electronics now plans to take a cautious path, focusing on improving 2nm node yields and meeting customer demands.
Wednesday 29 April 2026
Texas Instruments VP makes the case for 800V power and GaN in AI data centers
Texas Instruments (TI) plans to showcase its 800V power architecture-based AI data center solutions at Computex 2026, featuring applications in humanoid robots, automotive, and edge AI. Ahead of the event, TI executives have been engaging with local Taiwanese supply chains to explore collaborations.
Wednesday 29 April 2026
Memory test capacity stays high as substrate prices may rise in 2Q26
The memory industry cycle is on the upswing, driven by strong customer orders, rising OSAT prices, and high capacity utilization rates. Memory OSAT companies reported a surprisingly robust first quarter of 2026 despite the usual seasonal slowdown. With DRAM demand remaining strong and upstream substrate material costs increasing, market watchers expect key raw material price hikes to become a trend. Continued healthy customer demand should further boost OSAT capacity utilization, supporting revenue growth into the second quarter of 2026.
Wednesday 29 April 2026
PCB industry urges four policy moves in Thailand expansion
Amid global supply chain restructuring, Asia's PCB industry is moving toward closer regional collaboration. Industry experts say that as southbound expansion in the PCB sector takes shape, the next phase for Thailand's PCB industry will shift from capacity expansion to accelerating the development of an advanced manufacturing ecosystem. Future competitiveness will hinge on localizing supply chains, developing talent, and continuously improving related supporting infrastructure and systems.
Tuesday 28 April 2026
Taiwan's 2026 exports set to top US$800 billion as AI fuels electronics surge
Taiwan's exports were forecast to surpass US$800 billion in 2026, driven by strong demand for electronic components and information and audiovisual products tied to artificial intelligence, according to China Credit Information Service. The projection followed a record first quarter when exports reached US$195.74 billion, marking the highest quarterly total on record and a 51.1% year-over-year increase.
Tuesday 28 April 2026
ASE signs cybersecurity MOU with national institute to shore up semiconductor defenses
Advanced Semiconductor Engineering (ASE) and the National Institute of Cyber Security signed a memorandum of understanding on April 28 to establish a joint cyber defense, intelligence sharing, and cooperation framework aimed at countering complex global cyber threats. The agreement will integrate technical resources and real-time threat intelligence to strengthen industry-wide defenses for the semiconductor sector, with an emphasis on protecting smart manufacturing and core corporate assets in Kaohsiung.
Tuesday 28 April 2026
Amkor records strong 1Q26, advanced packaging expected to triple YoY
Amkor Technology is off to a record start in 2026. First-quarter revenue hit US$1.68 billion, up 27% from the prior year, driven by record performance in AI data center applications and a fourth consecutive quarter of growth in automotive and industrial segments. Earnings per diluted share came in at US$0.33, beating analyst expectations on the back of a favorable product mix and disciplined cost management. The company's strategy is firmly anchored in high-value advanced packaging for AI and High-Performance Computing (HPC). CEO Kevin Engel noted that several High-Density Fan-Out (HDFO) programs are underway, with a new data center CPU device beginning its ramp this quarter.
Tuesday 28 April 2026
Agentic AI sparks CPU demand surge, boosting ASIC and niche chip makers
The rise of agentic AI has transformed computing chip requirements, igniting a fierce CPU supply scramble. Traditional x86 giants like Intel and AMD are seeing growing CPU demand in cloud AI, while application-specific integrated circuit (ASIC) vendors stand to benefit significantly.
Tuesday 28 April 2026
Analysis: Why Tokyo Electron's China problem goes deeper than a data breach
Amid growing geopolitical tensions over the global semiconductor supply chain, what initially appeared to be an internal personnel matter is evolving into a broader case study of the operational risks that foreign equipment vendors face in China.
Tuesday 28 April 2026
Samsung fast-tracks Pyeongtaek fabs to turn HBM4 edge into AI memory scale

Samsung is accelerating one of its most aggressive memory capacity buildouts in years, aiming to bring its Pyeongtaek Line 4 fab, or P4, into full operation by the end of 2026 as the AI server boom reshapes demand for high-bandwidth memory (HBM) and advanced DRAM.

Tuesday 28 April 2026
Nvidia says GPU allocation follows first-come, first-served principle, not highest bidder
Nvidia CEO Jensen Huang clarified in an April 2026 interview with Silicon Valley podcast host Dwarkesh Patel that the company allocates GPUs based on a first-come, first-served principle rather than a highest bidder wins approach.
Tuesday 28 April 2026
US chip packaging capacity to hit 10% by 2032
The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing capacities stateside, strengthening local OSAT capabilities is seen as the "last mile" in building a domestic supply chain.
Tuesday 28 April 2026
Strong demand and advanced packaging execution drive Amkor's upbeat quarter
Amkor Technology reported a strong start to 2026, with management attributing the performance to robust demand across multiple end markets and continued execution in advanced packaging.
Tuesday 28 April 2026
TSMC 2nm leak case results in NT$150M fine for TEL; company says no confidential data was leaked and discussions are underway
In the trade secret leak case involving TSMC's 2nm process, the Intellectual Property and Commercial Court ruled on April 27, 2026, that Tokyo Electron (TEL), the equipment supplier involved, must pay a fine of NT$150 million (US$4.8 million), marking the first penalty imposed on a legal entity under the National Security Act.
Tuesday 28 April 2026
Why the AI boom still runs through Taiwan — and why that won't change
As trade tensions simmer and geopolitical flashpoints multiply, Taiwan's technology sector is holding firm. Anchored by surging AI infrastructure demand and a pivotal shift in how its chips reach the world, the island's economy is on track for its strongest growth in years — and industry experts say the fundamentals have rarely looked more solid.
Tuesday 28 April 2026
Commentary: Tim Cook's sole omission during 15-year tenor
On December 6, 2022, Tim Cook stood on a construction site in Phoenix, Arizona, alongside President Biden, TSMC founder Morris Chang, and Nvidia CEO Jensen Huang. It was the tool-in ceremony for TSMC's first Arizona fab, a moment that crystallized how central Taiwan's semiconductor industry had become to American technology ambitions. For Cook, it was also the closest he ever got to TSMC's leadership in 15 years as Apple's CEO.
Monday 27 April 2026
DIGITIMES: Enterprise AI shifts toward inference as computing architectures undergo structural realignment

As enterprise adoption of generative AI accelerates, a new phase of infrastructure demand is beginning to take shape. According to DIGITIMES' special report, Accelerating enterprise AI: Hardware advancements and compute architecture transformation, the industry is moving beyond the initial buildout of training capacity and into a stage defined by large-scale deployment—where inference workloads are emerging as the primary driver of compute growth.

Monday 27 April 2026
Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions to rapidly improve yield.
Monday 27 April 2026
TSMC trade secret theft ends in 10-year sentence, $4.6M fine against Tokyo Electron
A Taiwanese court handed down its harshest ruling yet in a semiconductor trade secret case on Monday, sentencing a former TSMC engineer to 10 years in prison and fining Japanese equipment giant Tokyo Electron (TEL) NT$150 million (approximately US$4.6 million) for stealing advanced chipmaking secrets — marking the first time a corporation has been penalized under Taiwan's National Security Act.
Monday 27 April 2026
HCL-Foxconn JV taps Taiwan's CTCI to build India OSAT facility
The HCL-Foxconn joint venture has selected Taiwan-based engineering firm CTCI as the engineering, procurement, and construction (EPC) partner for its upcoming outsourced semiconductor assembly and testing (OSAT) facility in Uttar Pradesh, according to people familiar with the matter cited by The Economic Times. The project marks a further step in India's push to localize semiconductor packaging capacity amid a global supply chain diversification.
Monday 27 April 2026
Quanta bets on speed and scale to power next growth wave
Quanta Computer is doubling down on speed, scale, and execution as it heads into 2026, with leadership expressing strong confidence that surging AI server demand will drive another year of record growth, even amid global uncertainty. At Quanta's 38th anniversary celebration, Vice Chairman C.C. Leung emphasized the company's ability to meet increasingly demanding customer expectations. Orders are not only growing in volume, he noted, but also require faster delivery and lower costs. Despite operating at full capacity, he stressed that the company continues to seek even more orders and growth opportunities.
Monday 27 April 2026
Denso weighs Rohm bid withdrawal as support stalls

Japanese auto parts supplier Denso said on April 27 that it is considering all options, including withdrawing its acquisition proposal for chipmaker Rohm, after failing to secure the company's support.

Monday 27 April 2026
ASE Technology spotlights 18 suppliers at the forefront of a trillion-dollar AI wave
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging and testing equipment, raw materials, components, and processing, along with its subsidiaries Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), and Universal Scientific Industrial (USI).