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Thursday 4 June 2026
TSMC chair says CoPoS could scale within years while downplaying risk from Terafab
Taiwan Semiconductor Manufacturing Co. (TSMC) told shareholders on June 4 that the AI surge is creating major opportunities, but also leaving TSMC with the bulk of the investment and operating burden. Chairman C.C. Wei said the company's long-term edge still rests on technology, manufacturing efficiency, and customer trust.
Thursday 4 June 2026
Southern Taiwan Science Park January-April 2026 revenue tops NT$1 trillion on AI boom
Driven by the booming semiconductor industry, the Southern Taiwan Science Park (STSP) posted revenue of nearly NT$1.1 trillion (approx. US$35.04 billion) for January to April 2026, up 21.3% compared with the same period in 2025, surpassing the NT$1 trillion mark. This performance not only underscores the park's strong expansion momentum but has also reinforced its position at the core of the global high-tech supply chain.
Thursday 4 June 2026
TSMC sees no sign of capex slowdown as demand stays strong
TSMC chairman C.C. Wei told shareholders on June 4 that the company sees no reason to cut capital spending, citing strong demand for advanced chips, continuing expansion in the US, and growing interest in robots and autonomous vehicles.
Thursday 4 June 2026
Applied Materials to add 1,000 Southeast Asia jobs as Singapore role grows

Applied Materials plans to expand its Southeast Asia workforce by about 25% this year, adding at least 1,000 workers mainly in Singapore as the city-state becomes a more important manufacturing, logistics, and advanced-packaging hub for the US chip-equipment maker, Nikkei Asia reported.

Thursday 4 June 2026
EU launches Technology Sovereignty Package to strengthen chips, AI, and cloud infrastructure
The European Commission has unveiled a comprehensive Technology Sovereignty Package aimed at strengthening Europe's capabilities in semiconductors, AI, cloud infrastructure, open-source software, and digital energy systems.
Thursday 4 June 2026
Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing power and energy efficiency. The concept is increasingly seen as a key route for China to extend AI chip performance in the post-Moore's Law era.
Thursday 4 June 2026
Exclusive: How China's subsidized SiC boom is driving global prices to the floor
China's silicon carbide (SiC) substrate manufacturers continue to slash prices despite already operating on razor-thin margins, underscoring the intensity of a price war reshaping the global compound semiconductor industry.
Thursday 4 June 2026
Exclusive: China tightens its grip on Silicon Carbide as the industry shifts to 8-inch wafers
At Computex 2026, much of the spotlight fell on the rapid evolution of AI data center infrastructure. Among the technologies drawing renewed attention was silicon carbide (SiC), a compound semiconductor material whose ability to handle high voltages and large currents has made it a critical enabler of the industry's shift toward 800-volt high-voltage direct current (HVDC) power systems.
Thursday 4 June 2026
SK and TSMC deepen HBM, advanced packaging tie-up
SK Group Chairman Chey Tae-won met TSMC Chairman C.C. Wei in Taiwan on June 3, as the two sides exchanged views on the latest trends in next-generation AI technologies and discussed how to shape the future of the AI ecosystem. The meeting underscored closer ties between the two companies, which plan further to strengthen cooperation in next-generation HBM and advanced packaging.
Thursday 4 June 2026
BE Epitaxy Semiconductor targets 1.6T CPO with AMD, MediaTek
Silicon photonics (SiPh) chip designer BE Epitaxy Semiconductor turned profitable in 2025 as demand for 800G and 1.6T co-packaged optics (CPOs) heads toward explosive growth. Backed by orders and funding from AMD and MediaTek, the company is using a lean-asset model and ecosystem integration strategy to push into full-optical CPO design. General manager Jada Wang said 2026–2027 will mark the industry-wide breakout point for SiPh chips and CPO commercialization. BE Epitaxy Semiconductor's 800G products have already reached shipment standards, and the company is now moving toward 1.6T optical engine (OE) chipsets.
Thursday 4 June 2026
Chip test equipment makers hit by FPGA, CPU supply crunch

Semiconductor test equipment makers are facing severe shortages of key components, with lead times for FPGAs, CPUs, GPUs, and driver ICs stretching sharply as AI and data center demand strain the broader chip supply chain, according to The Elec.

Thursday 4 June 2026
Taiwan courts the world's AI startups in a bid to secure chip future
Taiwan is stepping up its efforts to position itself as a global hub for artificial intelligence and semiconductor innovation, deepening ties between international startups and its world-leading chip ecosystem.
Thursday 4 June 2026
Interview: Andhra Pradesh moves to become India's semiconductor packaging hub
Andhra Pradesh is making its most concrete move yet in semiconductors, zeroing in on packaging as the immediate entry point into the chip supply chain. Speaking on the sidelines of the Computex technology expo in Taipei, Bhaskar Katamneni, Secretary to the Government for ITE&C, acknowledged that wafer fabrication remains a long-term "seven or eight-year journey," but said packaging work is already well underway — with four PCB manufacturers having already begun operations, according to him.
Thursday 4 June 2026
Taiwan's Walsin Technology gains pricing power from AI demand

Walsin Technology, one of Taiwan's leading manufacturers of multilayer ceramic capacitors (MLCCs), has notified distributors that it will raise prices on resistors and selected capacitor products beginning June 1, citing mounting cost pressures and robust demand from AI-related applications. The move makes Walsin one of the first Taiwanese MLCC suppliers to formally implement a new round of price increases, and a sign that the inflationary effects of the artificial intelligence (AI) boom are spreading deeper into the electronics supply chain.

Wednesday 3 June 2026
MIPS CEO makes the case for RISC-V in physical AI at Computex forum
Sameer Wasson, CEO of MIPS by GlobalFoundries, spoke at the MIPS Forum at Computex 2026 on June 3 in Taipei, held at the Taipei Courtyard by Marriott Nangang — one day after his company announced the completion of its acquisition of Synopsys' ARC Processor IP Solutions business.
Wednesday 3 June 2026
Physical AI must act before it thinks, NXP CEO argues at Computex
As robots and autonomous systems move from factory floors into hospitals, warehouses, and public spaces, NXP Semiconductors CEO Rafael Sotomayor used his Computex 2026 keynote to argue that the defining challenge of physical AI is not raw intelligence, but the ability to act in milliseconds without waiting for instructions from the cloud.
Wednesday 3 June 2026
Tight laptop chip supply tests Intel's 18A comeback
Intel's effort to rebuild confidence in its manufacturing technology is facing an early test, as PC makers struggle to secure laptop processors built on the company's 18A process.
Wednesday 3 June 2026
GlobalFoundries completes acquisition of Synopsys' ARC processor IP business to build physical AI platform
GlobalFoundries (GF) has completed its acquisition of Synopsys' ARC Processor IP Solutions business, the company announced on June 2. The acquisition adds to GF's existing MIPS subsidiary, combining two processor IP portfolios into a single offering that spans RISC-V processor IP, software tools, custom silicon design, and semiconductor manufacturing.
Wednesday 3 June 2026
Nvidia to accelerate Vera Rubin production; Quanta Computer to add three US plants by end of 2026
Quanta Computer executive vice president and Quanta Cloud Technology (QCT) president Mike Yang said GPU applications are expanding across training, edge computing, and storage, as well as in the development of application-specific integrated circuits (ASICs). In response to future demand, the company is preparing for power needs and production capacity, planning to add three more plants in the US by the end of 2026.
Wednesday 3 June 2026
Nvidia and Infineon press supply chain co-design as AI power limits tighten
At the opening day of Computex 2026, Lite-On Technology hosted an AI industry summit under the theme "Powering the AI-driven Future," where DIGITIMES chairman Colley Hwang moderated a cross-industry panel with Nvidia, Infineon Technologies, and Gigabyte subsidiary Giga Computing at the exhibition venue.
Wednesday 3 June 2026
MediaTek denies rumored EMIB adoption timeline
MediaTek denied a foreign report about a timeline for adopting Intel Corp.'s embedded multi-die interconnect bridge packaging at a recent investor event and said its supply-chain strategy remains focused on TSMC. The clarification came after a Goldman Sachs research note, and media coverage suggested MediaTek had set tape-out and mass-production dates for a project using Intel EMIB-T packaging.
Wednesday 3 June 2026
SK Group weighs pausing SK Siltron sale as AI chip demand lifts wafer strategy
SK Group is reportedly placing AI and semiconductors at the center of its next round of business restructuring, prompting a fresh internal review of the strategic value of SK Siltron, a major global silicon wafer maker. The planned sale of SK Siltron, once seen as a move to improve SK Group's financial structure, now faces uncertainty as the group reconsiders whether to push ahead with the deal.
Wednesday 3 June 2026
Commentary: Why the world's memory giants are betting on Anthropic
The latest funding round for Anthropic produced a headline-grabbing figure: a US$65 billion capital raise that pushed the artificial intelligence (AI) startup's valuation to $965 billion, surpassing OpenAI and making Anthropic the world's most valuable AI startup.
Wednesday 3 June 2026
Analysis: New AI race is redefining semiconductor industry at Computex
Computex 2026 showcased the industry's latest innovations with its usual fanfare. Yet beneath the spectacle, the event revealed something far more consequential: artificial intelligence is rewriting not only the rules of competition but also the relationships that have long defined the global semiconductor industry.
Wednesday 3 June 2026
Naura pushes into AI chip packaging with first 600mm PLP descum tool
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level packaging into panel-level packaging, according to ICviews and ICsmart.