Friday 5 September 2025
China's NEV market sees rising adoption of hybrid SiC tech amid price warChina's new energy vehicle (NEV) sector continues to face intense price competition, with domestic manufacturers pushing vehicle prices to unprecedented lows. This aggressive pricing strategy has severely squeezed profit margins, prompting the industry to seek innovative solutions that can balance cost and performance. One such emerging technology gaining traction is hybrid SiC, which promises to enhance NEV efficiency while controlling manufacturing expenses.
Friday 5 September 2025
Tech Forum 2025: AI chip testing seen as necessary evil amid heterogeneous integration challenges, says National InstrumentsAs AI chip manufacturing technology rapidly evolves, US test equipment manufacturer National Instruments (NI) points out that many view the testing phase as a "necessary evil." Customers must repeatedly verify their products to ensure proper operation and meet claimed performance standards. However, this process is lengthy and complex, driving up overall testing costs.
Friday 5 September 2025
Samsung enters HBM4 race with aggressive pricing to win Nvidia supply dealTo reshape the high-bandwidth memory (HBM) market landscape, Samsung Electronics is reportedly set to engage in a "game of chicken" once again. According to the latest reports from South Korean media, Samsung is producing sixth-generation HBM (HBM4) samples on an unprecedented scale and plans to adopt a low pricing strategy to secure a place in Nvidia's supply chain.
Friday 5 September 2025
Aoi Electronics acquires Sharp's Mie factory to produce data center and packaging productsAoi Electronics, a Japanese outsourced semiconductor assembly and test (OSAT) provider, has purchased Sharp's factory in Taki, Mie Prefecture, and will convert the site into a new production base for data center and advanced packaging applications.
Friday 5 September 2025
Commentary: Advanced AI packaging driving semiconductor industry toward 'virtual integration'Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs and ASICs) have seen advanced back-end packaging costs reach US$4.1 billion, accounting for 46% of the total process cost structure—nearly matching wafer foundry costs at US$4.8 billion. This has caused the front-end process share to drop significantly to 54%, leaving only an 8% gap between the two.
Thursday 4 September 2025
Tech Forum 2025: AI-semiconductor convergence will double global market to US$2 trillion by 2040, says Etron chairNicky Lu, chairman of Etron Technology, emphasized at the DIGITIMES Tech Forum 2025 in Taipei that artificial intelligence (AI) and semiconductors form a "perfect match," a symbiotic relationship that solidifies Taiwan's critical role in the global technology supply chain.
Thursday 4 September 2025
Tech Forum 2025: Taiwan must embrace TSMC as the world's, says DIGITIMES chairmanDIGITIMES chairman Colley Hwang pointed out that from 2025 to 2026, the technology industry will revolve around three key terms: artificial intelligence (AI), semiconductors, and Donald Trump.
Thursday 4 September 2025
Japan demands state control over Rapidus for US$672 million fundingJapan's Ministry of Economy, Trade and Industry (METI) has launched a public call for proposals to fund domestic chipmakers as part of a revised Information Processing Promotion Act. The initiative, which began on September 3, 2024, seeks to support Rapidus in its effort to bring cutting-edge semiconductors into mass production.
Thursday 4 September 2025
Samsung is reportedly betting on 2nm Exynos to win back QualcommSamsung Electronics' foundry business is showing early signs of a turnaround as it attempts to reclaim market share from its dominant rival, TSMC. Industry insiders indicate that Qualcomm may reconsider Samsung as a key chip supplier if the South Korean company successfully enters mass production on its advanced 2 nm process node.
Thursday 4 September 2025
Fujifilm Electronic Materials eyes India for major semiconductor investmentFujifilm Electronic Materials is considering a significant investment in India as part of its strategy to expand in the fast-growing semiconductor sector, according to a report by the Times of India.
Thursday 4 September 2025
Semicon India 2025: Kaynes Semicon forges key partnerships to strengthen local chip ecosystemKaynes Semicon, a subsidiary of Kaynes Technology and India's first advanced OSAT and module manufacturer, has announced a series of strategic partnerships during Semicon India 2025, held from September 2-4, 2025. The collaborations underscore India's push to expand its semiconductor manufacturing and testing capabilities, while positioning Kaynes as a key industry player, according to multiple reports, including The Economic Times, Electronics Media, DQ India, and Devdiscourse.
Thursday 4 September 2025
China's SiCarrier returns to equipment expo with bold claims, but industry has doubtsAt the 13th China Semiconductor Equipment, Core Components and Materials Expo (CSEAC 2025) in Wuxi, Chinese equipment maker SiCarrier returned with another high-profile showcase. The firm exhibited images and scale models of semiconductor process tools, continuing the publicity blitz it began at SEMICON China earlier this year. But industry skepticism persists over whether its touted technological advances are genuine.
Thursday 4 September 2025
Resonac launches JOINT3 alliance to develop next-gen semiconductor techJapanese chemical and materials company Resonac announced on September 3, 2025, the formation of a new industry alliance named JOINT3, comprising 28 domestic and international semiconductor-related firms. The alliance aims to expedite the development and commercialization of advanced semiconductor technologies within five years through a collaborative investment of JPY26 billion (US$175.22 million), representing Resonac's largest semiconductor technology partnership to date.
Thursday 4 September 2025
Intel's Dalian plant officially renamed SK Hynix amid US export controls tighteningThe US Department of Commerce announced on August 29, 2025, that it will revoke the "Validated End-User" (VEU) status previously granted to Samsung Electronics and SK Hynix for their semiconductor factories in China. Starting January 2026, South Korean companies will need to apply for case-by-case approval to introduce American equipment into their Chinese production lines.
Thursday 4 September 2025
Global chipmakers embrace 'China for China' model as Chinese partners take on prominent rolesForeign chipmakers are partnering with Chinese firms as geopolitical tensions and supply chain risks reshape the global semiconductor industry. The push, known as a "China for China" strategy, aims to secure stable supply chains in China.
Thursday 4 September 2025
Why the US revoking TSMC’s Nanjing license may matter less than it seemsThe US Commerce Department has told TSMC it will revoke the company's Verified End-User (VEU) status for its Nanjing factory by December 31, 2025. TSMC said on September 2 that the decision will not disrupt operations. The announcement follows Washington's decision to end similar exemptions for Samsung and SK Hynix in China.
Thursday 4 September 2025
Chunghwa Precision Test reports 37% revenue increase in August fueled by AI and mobile chip demandTaiwan-based chip probing and testing solution provider Chunghwa Precision Test announced a 37% year-over-year revenue increase in August 2024, driven by rising demand for next-generation mobile application processors and AI-related chips. The company's consolidated revenue from January to August 2024 rose 59.7% compared to the same period in 2023.
Thursday 4 September 2025
Taiwan govt stresses cooperation as US strips TSMC Nanjing's VEUThe US has revoked TSMC Nanjing's Verified End-User status, effective as of the end of 2024, requiring case-by-case approval for US equipment imports. Taiwan's Economic Minister Kung Ming-hsin emphasized the importance of cooperation and ongoing dialogue with Washington, while evaluating that the move will have minimal impact, given TSMC's relatively small production share in China.
Thursday 4 September 2025
Odisha secures semiconductor deals at Semicon India 2025Odisha emerged as a key player in India's semiconductor landscape at Semicon India 2025, securing multiple high-value investment commitments and unveiling ambitious manufacturing projects that position the state as a major hub for chip production.
Thursday 4 September 2025
GlobalFoundries finds new road in China: Zensemi partnership anchors auto chip strategyGlobalFoundries (GF), the US-based contract chipmaker, is accelerating its "China for China" strategy through a partnership with Guangzhou Zen Semiconductor (Zensemi). The collaboration aims to deepen local production and supply-chain integration, targeting surging demand in South China's fast-growing new energy vehicle (NEV) market.
Thursday 4 September 2025
China's SiC substrate industry faces setback, seeks strategic pivotIn early 2025, a leading Chinese third-category silicon carbide (SiC) substrate manufacturer faced international IDM customer complaints over product quality, triggering market concerns and cautious responses. Despite challenges abroad, the company refocused on China's domestic market, maintaining stable growth amid intense local price competition.
Thursday 4 September 2025
Hermes Testing expands probe solution business amid AI-driven semiconductor demandHermes Testing, a testing solutions provider under Hermes Epitek, is leveraging its machine engineering services and customized equipment manufacturing to address growing demand in advanced semiconductor testing driven by AI industry growth. The company has partnered with Japan's MJC, a leading probe solution provider, to develop new products and expand its market presence globally.
Thursday 4 September 2025
Commentary: TSMC's Songjiang escape highlights Korean chipmakers' China trapThe US Department of Commerce's Bureau of Industry and Security (BIS) has revoked the "Validated End-User" (VEU) status for Samsung Electronics and SK Hynix, ending a key exemption that allowed the companies to ship equipment to their fabs in China without prior approval. The move tightens Washington's grip on the two South Korean chipmakers' operations in China, forcing future expansions and equipment upgrades through a burdensome case-by-case review.
Thursday 4 September 2025
Tech Forum 2025: TSMC faces the next decade of chip war from Arizona to BeijingTaiwan Semiconductor Manufacturing Co. (TSMC) has begun mass production and turned a profit at its Arizona plant in 2025, a milestone that marks not only a breakthrough in its global expansion but also a reversal of long-standing skepticism about America's ability to sustain advanced chip manufacturing.
Thursday 4 September 2025
Dai Nippon Printing to open first overseas R&D center in the Netherlands, focused on co-packaged opticsStarting from September 2025, Japanese company Dai Nippon Printing (DNP) will launch its first research and development facility outside Japan, located in the High Tech Campus Eindhoven in the Netherlands. The new center will focus on advancing co-packaged optics (CPO) technology, aiming to accelerate innovation in photonic-electronic integration.
- TSMC fine-tunes advanced packaging, delays projects, and trims low-return ops
- Samsung-Nvidia CEO embrace hints at HBM4 deal amid Seoul's U$150B US pledge
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- Inside TSMC's 2nm leak involving TEL: How a job application became an international incident
- Intel CEO rebuffs Trump resignation call in staff letter
- Exclusive: NAND flash rally gains steam with SanDisk's 10% price hike
- Huawei remains China’s sole heavyweight in AI chips
- China's AI agenda finds a backer: Ant Group expands into chips
- Google reportedly explores combining TPU chips with Nvidia GPUs to cut costs and boost data center scaling
- iPhone 17 sales forecast at 80 million units in 2H25, four major variables loom
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