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Thursday 20 August 2026
AMEC profit jumps 300%: China chip equipment maker expands beyond etch with US$520M plan
Advanced Micro-Fabrication Equipment Inc. China (AMEC) posted a 300% surge in first-half 2026 profit and announced a CNY3.5 billion (US$520 million) capacity expansion, accelerating its shift from an etch specialist into a broader semiconductor equipment supplier.
Thursday 20 August 2026
Analysis: Google keeps Sunfish at Broadcom, Zebrafish at MediaTek — Marvell's US$12.2bn warrant buys a category nobody was defending

One word in Marvell Technology's August 19 filing decides how the Google agreement should be read. The custom silicon programs, it says, attach to the tensor processing unit (TPU) ecosystem. Attach, not replace.

Thursday 20 August 2026
Jusung, PSK China sales plunge over 40% amid China's chip self-sufficiency drive

Jusung Engineering and PSK each lost more than 40% of their China revenue in 2025. The similarity ends there.

Thursday 20 August 2026
Nvidia, TSMC, chip gear makers ride AI boom into high-margin club
Strong AI demand is driving a wave of high profitability across the semiconductor supply chain, with equipment and materials suppliers increasingly joining a "high-margin club." Trailing only Nvidia's 75% gross margin in the fiscal first quarter of 2027 (which ended in April 2026), TSMC posted a record quarterly gross margin of 67.72% in the second quarter, with its first-half margin also reaching 67%. Related suppliers have joined the club as well.
Thursday 20 August 2026
Kenmec subsidiaries target SiC, AIDC growth

Kenmec Group founder and president Frank Hsieh said on August 19 that two of the company's new businesses have taken shape, with Taisic Materials focusing on silicon carbide (SiC), a third-generation semiconductor material, and Kentec targeting the AI data center (AIDC) market. Both companies are expected to list on Taiwan's Emerging Stock Board in October 2026.

Thursday 20 August 2026
Marvell issues Google warrant worth $12.2bn at exercise — custom chip work spans five TPU-related categories

Marvell Technology has issued Google a warrant to purchase up to 58,970,907 shares of its common stock at US$206.58 per share, according to a Form 8-K signed on August 19, 2026, by Mark Casper, the company's executive vice president, chief legal officer, and secretary. The filing does more than register a financing detail. It puts a company signature under a set of supply-chain reports that have circulated since the spring, and it attaches a dollar meter to how far the relationship is expected to run.

Thursday 20 August 2026
Gujarat's 12-hour shift approval for Micron shows how India is rewriting labour rules to court chipmakers

The Gujarat government's approval of 12-hour work shifts at Micron Technology's Sanand assembly and test plant is more than just a single-factory ruling. It is the clearest sign yet that Indian states are willing to reshape decades-old labor rules to fit the round-the-clock demands of semiconductor manufacturing, as they compete for a slice of a global chip supply chain shifting away from China.

Thursday 20 August 2026
Samsung repays 20 trillion won SDC loan early as memory demand surges

Samsung Electronics fully repaid a KRW20 trillion unsecured loan from Samsung Display ahead of schedule in the second quarter of 2026, according to South Korean publication ZDNet Korea and filings in the Financial Supervisory Service's DART system. The early repayment came as AI-related demand lifted memory prices and strengthened the company's cash position.

Thursday 20 August 2026
Innolux turns panel fabs into FOPLP capacity, banking on sticky advanced packaging ties

Innolux is accelerating its dual-track transformation and asset-light strategy, with second-quarter 2026 earnings per share rising 185% sequentially to NT$0.57. After disposing of Fab 2, Fab 5, and a small module plant, chairman Jim Hung said the company had reached an optimal stage in external asset sales and would now focus on repurposing existing production space for semiconductor processes, particularly fan-out panel-level packaging (FOPLP).

Thursday 20 August 2026
Rising demand for CPO, SiPh reshapes semiconductor testing
As chip power consumption, transmission speed and architectural complexity increase, testing has shifted from being a final pre-shipment quality gate to an earlier stage in product development and ramp-to-volume, according to KPMG managing director Jesse Chen, who previously worked at IBM and in venture capital. That shift is making testing a critical factor in product verification, yield ramp and supply chain stability.
Thursday 20 August 2026
India's chipmaking push faces its real test after initial wafers: yield
India's semiconductor manufacturing drive will face one of its toughest tests after equipment is installed and production begins: whether new fabs can consistently produce enough working chips to compete with established plants.
Wednesday 19 August 2026
Cerebras' CS-4 rack combines three wafer-scale processors, claims 2x gain over CS-3
Cerebras Systems on Tuesday announced the CS-4, a rack-scale AI accelerator the company says is up to twice as fast as its current CS-3 system and up to 30 times faster than GPU-based alternatives on a tokens-per-second-per-user basis.
Wednesday 19 August 2026
Socionext taps Intel 18A-P process for high-performance compute chiplet development
Custom System-on-Chip (SoC) designer Socionext has selected Intel Foundry's 18A-P process node to build its next-generation custom silicon, aiming to accelerate workloads across data centers, edge computing, and artificial intelligence (AI).
Wednesday 19 August 2026
PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and CoPoS have emerged as the two hottest keywords, while glass-based technologies remain further ahead on the roadmap.
Wednesday 19 August 2026
NSTC's unmanned vehicle revenue tops 40% as semiconductor AOI and CPO fuel growth
Optical imaging technologies company New Smart Technology (NSTC) is moving beyond traditional optical and image inspection into semiconductor high-end automated optical inspection (AOI), co-packaged optics (CPO) optoelectronic modules, and unmanned vehicle vision systems, with a clear change in its revenue structure, according to chairman Stone Shih and president Phil Chen.
Wednesday 19 August 2026
Commentary: Tsinghua Unigroup distances itself from failed US$15 billion Dongguan chip-cloud project

Tsinghua Unigroup's former "chip-to-cloud" expansion strategy unraveled after a debt crisis in 2020 and subsequent bankruptcy restructuring. Several projects originating in the group's earlier era have since entered disposal proceedings, and one of the former group's largest planned investments has now reached a formal end.

Wednesday 19 August 2026
Modi to inaugurate Semicon India 2026 as government courts global chipmakers
Indian Prime Minister Narendra Modi will inaugurate the fifth edition of Semicon India on September 17 at Yashobhoomi (India International Convention and Expo Centre) in New Delhi, with the three-day event running through September 19 under the theme "Silicon to Systems: Building the Ecosystem," according to ETV Bharat and the Statesman.
Wednesday 19 August 2026
Rattled supply chains: Over half of Taiwan firms feel the squeeze of US-Iran conflict

More than half of Taiwanese companies surveyed by TAITRA reported being negatively affected by the US-Iran conflict, with rising costs emerging as the biggest concern as geopolitical tensions disrupt energy, raw material, and supply chain conditions.

Wednesday 19 August 2026
Samsung, SK hynix build KRW278 trillion cash pile on AI memory surge

Samsung Electronics and SK hynix have amassed a combined KRW278 trillion (approx. US$196.9 billion) in cash equivalents and short-term financial instruments by the end of the second quarter of 2026 as AI-driven memory demand lifted prices, revenue, and profit. The surge has shifted attention from earnings growth to how South Korea's two largest memory chipmakers will deploy their expanding financial firepower.

Wednesday 19 August 2026
Hanmi Semiconductor scales up bonding capacity with US$91.4 million plant buy amid AI packaging boom

Amid a global shortage of AI semiconductor equipment, Hanmi Semiconductor announced on August 18 that it will acquire a factory owned by Mercury in the Juan National Industrial Complex in Incheon, South Korea. The site, covering 221,683 square feet, will become Hanmi Semiconductor's eighth and largest production base.

Wednesday 19 August 2026
Shikhar Malhotra named chairman of HCL-Foxconn chip venture as Jewar plant advances

India Chip Private Limited, the semiconductor joint venture between HCL Group and Hon Hai Technology Group (Foxconn), has appointed Shikhar Malhotra as its chairman, according to tele.net.in. Malhotra, who also chairs HCL Capital and serves on the board of HCL Corporation, will lead the venture as it works toward commissioning its outsourced semiconductor assembly and test (OSAT) facility in Jewar, Uttar Pradesh.

Wednesday 19 August 2026
Charts: Memory, not logic, is doing the work in Taiwan's July chip revenue

Scale and growth have decoupled. TSMC still supplies more than half the sector's monthly sales, but the growth table now belongs to DRAM, NOR flash and controller names.

Wednesday 19 August 2026
Charts: New capacity is starting to show up in Taiwan's packaging and test revenue
Ardentec credits a new fab entering volume production for the sharpest monthly jump in the sub-sector; ELASER's revenue nearly doubled year on year on customer demand.
Tuesday 18 August 2026
LG Electronics lands first OSAT order for chip packaging LDI

LG Electronics has secured its first order for laser direct imaging (LDI) equipment used in semiconductor packaging, marking an early commercial milestone as it expands into chip packaging.

Tuesday 18 August 2026
Xintec readies 12-inch IVR backside copper for TSMC's next-gen AI chips

TSMC is expanding cooperation with packaging and testing affiliate Xintec as it develops next-generation power delivery and advanced packaging for AI chips, while market speculation points to a broader outsourcing role for the company in CoWoS back-end assembly.