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Thursday 14 May 2026
Memory supply crunch pushes Phison to historic earnings
Phison Electronics posted record earnings in April as the artificial intelligence boom and tightening NAND flash supply drove memory prices sharply higher, underscoring the growing influence of AI demand across the semiconductor storage industry.
Thursday 14 May 2026
AI chip boom drives record growth for Taiwan testing firm MPI
With surging demand for artificial intelligence, high-performance computing, and custom AI chips, MPI Corporation said strong momentum in semiconductor testing equipment and testing interface products drove another record quarter, underscoring the rapid expansion of AI-related chip validation demand across the industry.
Thursday 14 May 2026
TSMC expands CoWoS and SoIC capacity on AI boom
TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities worldwide. At its 2026 Technology Symposium, TSMC vice president Bor-Zen Tien detailed the company's latest progress in advanced process nodes, 3DFabric advanced packaging, global expansion, and AI-powered smart manufacturing.
Thursday 14 May 2026
QBit Semiconductor targets edge AI growth as copier chips turn oligopolistic
IC design firm QBit Semiconductor will list on the Emerging Stock Board on May 15, 2026, and chairman Simon Shen, a former Kinpo executive, said the debut marks a new milestone for the company and underscores a promising growth outlook.
Thursday 14 May 2026
TSMC symposium spotlights AI expansion, advanced packaging demand
TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute density, high-bandwidth connectivity, power efficiency, and thermal management. Ray Wan, director of Asia-Pacific business, said TSMC will leverage advanced process technology and advanced packaging to help customers accelerate innovation in the AI era.
Thursday 14 May 2026
Japan expands push to secure legacy chip supply chain

Japan is broadening its semiconductor support strategy by expanding subsidies for domestic production of legacy chips, aiming to strengthen economic security and reduce reliance on overseas suppliers.

Thursday 14 May 2026
Tower Semiconductor secures US$1.3 billion in silicon photonics commitments as AI demand accelerates
Tower Semiconductor reported a strong start to 2026, marked by double-digit revenue growth and a significant jump in net profit. Following a "solid" first quarter, the company issued guidance for the second quarter that would represent the highest revenue in its history. Management highlighted surging growth in silicon photonics and a strategic restructuring of manufacturing in Japan as key drivers of long-term expansion.
Thursday 14 May 2026
TSMC SVP: better AI days lie ahead, remember the keyword 'COUPE'
Taiwan Semiconductor Manufacturing Co. (TSMC) used its 2026 Technology Forum on May 14 to outline a sweeping view of the AI-driven transformation in semiconductors. Co-COO and senior vice president Kevin Zhang argued that the AI revolution is advancing far faster than anticipated and is reshaping the industry from generative AI and AI agents to inference computing.
Thursday 14 May 2026
Samsung reportedly speeds up 3D NAND, packaging, and substrate plans
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and high-bandwidth memory (HBM) competitiveness. The move signals a shift from catch-up mode back toward longer-term technology investment.
Thursday 14 May 2026
Analysis: Samsung labor standoff underscores diverging Taiwan-Korea semiconductor workforce models
The ongoing Samsung Electronics labor dispute highlights sharply different labor models in South Korea and Taiwan, where firms such as TSMC operate with minimal union presence and rely instead on compensation-driven workforce stability. Industry observers say the Samsung conflict reflects broader tensions over profit sharing during the AI-driven semiconductor upcycle, while Taiwan's tech sector continues to favor high mobility and individual incentives over collective bargaining.
Thursday 14 May 2026
ASMedia reports record profit as it expands beyond PC chips into AI and automotive
Despite weakness in the personal computer market, surging DDR5 memory prices, and tight CPU supply, ASMedia Technology posted record results in the first quarter of 2026, underscoring early gains from its shift beyond PC connectivity chips into custom silicon, artificial intelligence infrastructure, and automotive electronics.
Thursday 14 May 2026
Samsung and SK Hynix rush to expand capacity as AI memory demand soars
The artificial intelligence(AI) boom is triggering an unprecedented expansion race among the world's largest memory chipmakers.
Thursday 14 May 2026
MediaTek courts Intel as Google pushes for alternatives to CoWoS
MediaTek's decision to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform has become one of the semiconductor industry's most closely watched strategic moves.
Thursday 14 May 2026
Lam Research to hire 1,000-plus engineers in Taiwan on AI chip demand
Lam Research said it will hire more than 1,000 professional engineers in Taiwan in 2026 as customer demand mounts and the company expands technical support services for foundry, memory and assembly and test customers.
Thursday 14 May 2026
China's semiconductor godfather warns against 2nm fixation
While the global semiconductor industry remains fixated on 3nm, 2nm, and the AI GPU arms race, SMIC founder and "China's semiconductor godfather" Zhang Rujing is pushing a sharply different message: the future of China's chip industry may depend less on chasing the world's most advanced nodes and more on dominating the vast market still built on mature processes.
Thursday 14 May 2026
Korea races to narrow chip packaging gap with Taiwan and China

AI server demand is pushing semiconductor packaging into a new growth cycle, but the market remains heavily concentrated among a small group of global outsourced semiconductor assembly and test leaders and Taiwanese and Chinese companies, sharpening the challenge for South Korea's back-end chip industry.

Thursday 14 May 2026
GlobalWafers gains SBTi approval for 1.5°C-aligned emissions cuts and net-zero plan
GlobalWafers announced that its greenhouse gas reduction targets passed review by the Science Based Targets initiative, signaling the wafer maker has aligned its decarbonization pathway with the global 1.5°C climate goal and committed to achieving net-zero emissions across its full value chain by 2050. The approval covers both near-term and long-term targets, and the company said the moves will shape its operational and supplier strategies through the 2030s and beyond.
Wednesday 13 May 2026
Intel's preliminary Apple deal puts Samsung's foundry ambitions under pressure

Intel's reported preliminary agreement to manufacture some chips for Apple is putting new pressure on Samsung Electronics, as the US chipmaker gains momentum with major technology customers and leans on Washington's support to revive its foundry business.

Wednesday 13 May 2026
Imec's IC-Link joins TSMC 3DFabric Alliance, extending 3D integration access worldwide
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI, high-performance computing, automotive, and telecommunications markets worldwide—as well as technology supply chains.
Wednesday 13 May 2026
ChipMOS 1Q26 earnings jump 186% on strong packaging and testing demand
Taiwanese outsourced semiconductor assembly and test (OSAT) services company ChipMOS Technologies reported strong growth in both revenue and profit for the first quarter of 2026. Net profit after tax for the quarter reached NT$505 million (approx. US$16.03 million), up 1% from the previous quarter and 186.37% from a year earlier, while earnings per share (EPS) came to NT$0.72, the highest in the past 10 quarters.
Wednesday 13 May 2026
SEMI says global semiconductor materials market hit record US$73.2 billion in 2025

The global semiconductor materials market reached a record high of US$73.2 billion in 2025, up 6.8% year-over-year, according to the latest Materials Market Data Subscription (MMDS) report released by SEMI on May 13, 2026.

Wednesday 13 May 2026
Samsung labor talks collapse as bonus dispute threatens chip output
Samsung Electronics and its largest labor union failed to reach a pay deal following government-mediated talks, raising the risk of an 18-day strike beginning May 21, 2026, that could disrupt production of memory and other chips.
Wednesday 13 May 2026
Samsung Foundry comeback takes shape—AI chips, HBM4 lift 4nm demand
Samsung Electronics' foundry business is showing signs of recovery after a prolonged downturn, as AI chip projects and HBM4-related demand begin to raise utilization at its advanced-process lines.
Wednesday 13 May 2026
Hanwha Semitech to supply FO-PLP equipment for SpaceX-linked chip production
South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging (FO-PLP) equipment for advanced chip packaging in the second half of 2026, with the systems expected to be used in the mass production of networking chips for SpaceX.
Wednesday 13 May 2026
Malaysia explores semiconductor listings to strengthen domestic capital markets
Malaysia is exploring ways to encourage more semiconductor-related companies to list on Bursa Malaysia as the government seeks to better align the country's capital markets with its growing role in the global chip supply chain.