Nan Pao Resins Chemical is accelerating its push into the high-end semiconductor materials market through a joint venture with Advanced Echem Materials Company and Trusval Technology, forming Advanced Pao Trusval Technology to target advanced packaging adhesive materials.

India is advancing its technology and semiconductor ambitions through new fab projects, packaging facilities, data center investments, and industry partnerships. However, analysts say the next phase of the India Semiconductor Mission will depend on addressing weaknesses in equipment, materials, supply chains, talent, and R&D, as the country seeks to convert investment momentum into a sustainable semiconductor ecosystem and broader digital manufacturing growth.

Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through continued investment in its Arizona manufacturing operations.

Samsung Electronics is reportedly preparing to shift more of its gallium nitride (GaN) power semiconductor strategy toward foundry services after struggling to secure customers for its own GaN devices and modules, according to The Elec.

AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while also revealing a new strategic direction centered on an elevated fanout bridge (EFB) packaging ecosystem.