Samsung Electronics Chairman Jae-yong Lee departed for the Sun Valley Conference in the US on July 7, marking his second straight year at the event as he looks to deepen AI cooperation with global tech giants. Industry watchers expect the trip to help Samsung expand its ties with major customers and partners.
France's push into Taiwan's tech ecosystem has entered a new phase. After three years of cultural outreach and research exchanges, cooperation is now showing up in steel, silicon, and server racks. Foxconn, SiPearl, and a growing list of AI data center projects are turning bilateral goodwill into industrial output.
TSMC's July 16 earnings call is likely to test how far the chipmaker can extend its already upbeat guidance, as investors look for signs that AI demand, flagship smartphone launches, and broader wafer orders can offset inflation, materials shortages, and mounting manufacturing complexity. The market is watching for another upgrade to revenue, spending, and margin targets.
Msscorps reported record consolidated revenue in June, and for the first half of 2026, as demand from AI and semiconductor customers continued to expand. The Taiwan-based semiconductor inspection and analysis company also said on July 6 that its board had approved a cash capital increase to support expansion of its AI chip analysis platform, silicon photonics interconnect testing equipment, and mass production of its self-developed tools.
ThinTech Materials Technology (TTMC) is currently the only supplier with technology transfer recognition approved for FOPLP metal substrates. While first-half shipments came in below plan, chairman Chien-Hui Lee said the business has room to grow more strongly in the fourth quarter.
Onsemi is selling two manufacturing facilities in the Philippines and the US to cut fixed costs, streamline its global production network and improve gross margins under its Fab Right strategy.
Global PMX said on July 6 that demand tied to semiconductor advanced-process equipment and AI server liquid-cooling systems remained strong, helping lift June 2026 consolidated revenue to NT$750 million (US$23.47 million), up 30.66% from a year earlier. The automotive powertrain and safety component maker also reported higher revenue for the second quarter of 2026 and the first half of the year.
Speaking at the Taiwan Venture Capital and Private Equity Annual Conference on July 7, Foxconn Chairman Young Liu said demand for AI computing power has entered a phase of structural growth.
The US International Trade Commission's final determination against Innoscience has been upheld following the conclusion of the Presidential Review Period, confirming that the Chinese GaN chipmaker infringed a patent held by Germany's Infineon Technologies.
Tokyo Artisan Intelligence said it has finished validating its Sting Ray test chip, a step that could broaden access to lower-power edge AI hardware for industries worldwide. The milestone highlights how startups and foundries are pushing specialized chips that may ease energy pressure from AI, even as they support real-time applications in factories, transport, and infrastructure.
The planned acquisition of Element Solutions by Solstice Advanced Materials would create a larger supplier serving electronics, data center cooling, and other industrial markets closely watched by customers and investors worldwide. The deal may reshape competition in advanced materials, where demand is rising alongside artificial intelligence infrastructure, semiconductor manufacturing, and energy-efficient technologies.
Analog Devices (ADI) has reportedly notified customers of extended delivery lead times for certain products, with lead times now reaching six months. The company has advised customers to place orders at least six months in advance to help secure an adequate chip supply.
