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Wednesday 26 August 2026
Apple gives 2nm debut to Mac, not iPhone: M6 leads TSMC node transition
Apple on Aug. 25 introduced M6 in a new Mac mini and M5 Ultra in a new Mac Studio, framing both chips around AI compute and memory bandwidth rather than conventional CPU headline numbers. The more consequential detail is that M6 is Apple's first 2-nanometer part — putting a Mac, not an iPhone, at the front of the node transition.
Wednesday 26 August 2026
India chip manufacturing push exposes production-test skills gap, NI says
India's semiconductor expansion is beginning to expose a shortage of engineers with experience in production testing, a capability that will become increasingly important as new OSAT plants and fabs move toward manufacturing, executives at Emerson's NI test and measurement business said.
Wednesday 26 August 2026
Eternal Materials reports July revenue gain as advanced packaging demand strengthens
Eternal Materials said July marked the start of its traditional peak season, with stronger shipments across its three main business units lifting monthly revenue to NT$4.093 billion (US$128.5 million). That was up 23.86% from a year earlier and 6.82% from June, as demand from the electronics supply chain continued to support sales.
Wednesday 26 August 2026
Samsung, Intel widen AI chip battle into memory, packaging
Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports cited by Counterpoint Research said Samsung is using high-bandwidth memory (HBM) to strengthen its foundry business, while Intel is expanding from logic chips and foundry services into memory through advanced packaging and system-level technologies.
Wednesday 26 August 2026
China has plenty of indium but not enough InP wafers for AI data centers
China accounts for more than 70% of the world's primary indium output but only about 10% of finished indium phosphide substrates, leaving a gap between its strength in raw materials and the qualified wafer capacity increasingly needed for AI data-center optics.
Wednesday 26 August 2026
China's advanced-chip gap could close well before its lithography gap does
As China enters a near-frenzied state of continuous production-capacity expansion, it is easy to see that the main driver behind these aggressive, purpose-built movements in the domestic chip-manufacturing space is rooted in a national need to maintain sovereign control over critical process nodes, where access to the surrounding supply chain has proved increasingly constrained.
Wednesday 26 August 2026
TSMC's 310mm push threatens Samsung's PLP lead
Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and high-performance computing. But the next phase of PLP competition may depend less on who moved first than on which rectangular panel format equipment makers, materials suppliers and OSATs ultimately build around, and activity around 310×310mm is growing in Taiwan.
Wednesday 26 August 2026
Samsung steps up Taylor Fab 2 preparations as foundry capacity tightens
Samsung Electronics has begun asking semiconductor equipment suppliers to complete safety-compliance groundwork for a second foundry fab in Taylor, Texas, months before construction is scheduled to begin, according to ZDNet Korea.
Tuesday 25 August 2026
Intel x86 share drops below 70% as AMD reaches a record high
Intel's long-running lead in x86 processors slipped below a major threshold in the second quarter of 2026, even as AI infrastructure spending helped support demand. New market data showed Intel's combined share of PC and server x86 CPU shipments fell to 69.3%, its lowest level since 1995, while Advanced Micro Devices (AMD) climbed to a record 30.7%.
Tuesday 25 August 2026
Insight: One Nexperia, two supply chains? China-Europe split tests automotive chip model
Nexperia China is accelerating its separation from the Dutch chipmaker's traditional European manufacturing network, raising the prospect that one of the world's largest suppliers of automotive and industrial semiconductors could operate through increasingly distinct China- and Europe-based supply chains.
Tuesday 25 August 2026
Nexperia China rebuilds 12-inch local supply chain after 330 days
Nexperia China said it has rebuilt a domestic 12-inch wafer supply chain after 330 days of overseas wafer supply disruptions, unveiling the new platform at a press conference outlining its new direction. The company said complete China-based manufacturing supply chains have now been established for metal-oxide-semiconductor field-effect transistor (MOSFET) and logic IC products.
Tuesday 25 August 2026
China foundry Nexchip breaks beyond display chips: CIS reaches 25% of revenue
Nexchip Semiconductor reported higher first-half 2026 revenue as broadening demand for CMOS image sensors, power management chips and display drivers diversified its product mix, even though profit declined.
Tuesday 25 August 2026
Samsung Foundry sees higher 4nm volumes as Nvidia ramps Groq 3
Nvidia's Groq 3 ramp is adding meaningful 4nm volume to Samsung Electronics' foundry business, with monthly wafer input estimated at about 10,000 and expected to rise above 15,000 in 2027. The increase comes as reported yields improve, Samsung's 4nm capacity remains tight, and pricing on the node moves higher.
Tuesday 25 August 2026
China power chip makers CRM, Silan post sharp 1H profit gains
China Resources Microelectronics (CRM) and Hangzhou Silan Microelectronics (Silan), two of China's leading integrated device manufacturers, reported strong first-half 2026 results as firmer semiconductor demand, higher utilisation and improved product mix lifted earnings.
Tuesday 25 August 2026
TSMC suppliers reportedly plan Taiwan plant for critical chipmaking tubing
Taiwan's semiconductor supply chain is moving to close a gap that turned costly during the industry's last major crunch: the plastic tubing that carries chemicals through chip fabs. TSMC suppliers Nichias and Gold Stone Development are building a factory in Hsinchu to produce fluoropolymer (PFA) tubes domestically, Nikkei Asia reported, citing sources with direct knowledge of the plan.
Tuesday 25 August 2026
Kulicke and Soffa names Raj Talluri as CEO
Kulicke and Soffa Industries has appointed Raj Talluri as president and chief executive officer, a leadership change that may influence the company's strategy in semiconductor equipment markets used across Asia, the US, and Europe. The move signals continuity for investors, while highlighting the global competition shaping chip manufacturing supply chains.
Tuesday 25 August 2026
TSMC, Intel, and Samsung battle over backside power delivery below 2nm
As competition in advanced semiconductor manufacturing moves below the 2nm node, the battleground is no longer just shrinking transistors; it has expanded to how power is delivered to the chip. With Intel, TSMC, and Samsung Electronics each betting heavily on backside power delivery, the race is entering a new phase.
Tuesday 25 August 2026
AI infrastructure boom drives Taiwan export orders, exposing power bottleneck, net-zero tech needs

Global artificial intelligence infrastructure buildouts and rising capex by cloud service providers pushed Taiwan's July export orders for information and communications technology (ICT) products, led by AI servers, up nearly 90% year-over-year, while export orders for foundry and memory also rose by more than 70%. However, companies in advanced economies are encountering power shortages as they invest in AI infrastructure, exposing a bottleneck that highlights the need to develop AI computing and net-zero technologies in tandem.

Tuesday 25 August 2026
Broadcom's debt push signals AI compute is becoming Wall Street asset class
The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly confronting a second bottleneck: how to finance hardware and data-center capacity at the scale frontier-model developers now require.
Tuesday 25 August 2026
SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical and economic limits of scalability.
Tuesday 25 August 2026
Inergy server share hits 47% on cooling, BBU demand

Inergy Technology said strong demand for AI server cooling and power management pushed the share of server-related applications to 47% of revenue in the second quarter of 2026, with shipments of system-on-chip (SoC) cooling fan driver ICs set to ramp up in the second half of 2026 and battery backup unit (BBU) demand expected to keep rising as AI moves toward high-voltage direct current power architectures.

Tuesday 25 August 2026
Applied Materials executive says data centers set new AI competition standard

Commenting on the current surge in artificial intelligence (AI), Erix Yu, group vice president of Applied Materials and president of Applied Materials Taiwan, recently shared his perspective by tracing the evolution of industrial revolutions.

Tuesday 25 August 2026
Nvidia memory demand widens the gap between SK Hynix and Samsung

Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to Chosun Biz, Nvidia became SK Hynix's biggest customer in the first half of 2026, while it did not rank among Samsung's top five revenue sources.

Monday 24 August 2026
TPK TGV pilot line to start by September, Thailand plant eyes 2027 ramp
TPK Holding is accelerating its move from consumer touch panels into semiconductors, with its Through Glass Via (TGV) pilot line in Taoyuan, Taiwan set to begin operations in August or September. The company is also working with leading outsourced semiconductor assembly and test (OSAT) providers on the project, while its new Thailand production base aims to complete trial runs by year-end and begin volume production in early 2027.
Monday 24 August 2026
AI energy bottleneck is driving semiconductor materials innovation, says Applied Materials
Rising demand for artificial intelligence (AI) computing is driving a new wave of technological transformation in the semiconductor industry, while energy is emerging as the next bottleneck for the AI sector. Applied Materials group vice president and Taiwan president Eric Yu pointed out that semiconductor technology competition in the AI era can no longer focus solely on performance and transistor counts. How to support more computing with less energy will become the core of the next stage of semiconductor innovation.