Despite flat demand for most consumer electronics chips and a muted outlook for traditional wire bonding and packaging equipment, Singapore's semiconductor packaging equipment giant Kulicke & Soffa (K&S) has confirmed its close collaboration with Taiwan's semiconductor foundry leaders in the advanced packaging field for high-end chips.
Server suppliers confirm GB300 will retain the GB200's Bianca architecture, abandoning a planned redesign that promised expanded business for component makers.
STMicroelectronics offered a better-than-expected revenue forecast for the second quarter, suggesting a potential recovery in demand for automotive and industrial semiconductors. However, weaker-than-expected gross margin guidance and the absence of a full-year outlook tempered optimism, leaving analysts divided over whether the uptick reflects genuine demand or a short-term boost from tariff-related inventory moves.
