SuperAlloy Industrial said after its August 7 board meeting that second-quarter 2026 results showed steady improvement in core profitability, even though foreign exchange losses tied to a weaker yen weighed on net income. The Taiwan-based manufacturer is also moving into the semiconductor front-end equipment supply chain in a bid to build a second growth engine alongside high-end automotive and green materials.
The US signed a presidential proclamation on August 6 (ET) imposing a 15% tariff on polysilicon and related products from all countries, with the new measures set to take effect on December 4, 2026. Taiwan's Executive Yuan said the decision was expected to have limited impact on the island's solar sector and highlighted exemptions available to semiconductor-related firms with US investments.
The Seoul High Court has upheld an 18-month prison sentence for a former SK Hynix employee who leaked trade secrets tied to CMOS image sensor (CIS) technology to Chinese companies while seeking new employment, including with Huawei chip unit HiSilicon.
Samsung Electronics has launched its next-generation 200-megapixel CMOS image sensor, the ISOCELL HPC, and reports said Oppo is set to be the first smartphone brand to use it. The sensor is the industry's first mobile CIS to support 16-bit RAW output, marking a new specification for flagship phone cameras.
Tech talent has moved from being simply a hiring priority to a matter of national security. As major economies increasingly tie talent to competitiveness and national security, control over its cross-border movement is tightening. That shift is visible today: Taiwan's Ministry of Justice Investigation Bureau is probing 17 companies accused of illegally recruiting tech talent in Taiwan, China is preparing to tighten exit controls on key technical workers, and the US continues expanding semiconductor and AI export controls and research security reviews.
Ajinomoto raised its full-year forecast on August 6 as growing demand for AI servers and high-performance computing lifted sales of electronic materials used in semiconductor package substrates, highlighting how advanced packaging is shifting more value upstream into specialized materials.
Powerchip chairman Frank Huang, who spent much of his career mirroring the trajectory of Taiwan's memory and foundry industries and was set to ride the AI boom into profitability in 2026, has passed away. His passing has revived memories of a 1999 attempt to block UMC's aggressive bid for Powerchip, when Huang sought help from TSMC founder Morris Chang and eventually saw Vanguard International Semiconductor (VIS) invest in Powerchip to counter UMC.
Wah Hong Industrial Co. said that in the first half of 2026, it accelerated development of high-value-added products, new technologies and new application markets while continuing to protect its core businesses. The Taiwan-based materials maker also reported that net profit rose nearly 12% year over year, while earnings per share increased 16.83% during the period.
AI chip demand is sustaining a global rise in semiconductor packaging and testing prices, with STATS ChipPAC preparing a broad round of price increases for the second half of 2026. Some customers have recently received notices of varying adjustments from the Singapore-based subsidiary of China's JCET.
Elon Musk's ambitions across AI, robotics and space infrastructure are moving into a new phase following the unveiling of Terafab, an ambitious semiconductor manufacturing complex designed to secure the compute capacity required by Tesla, SpaceX and xAI.
AI-driven demand for advanced packaging is giving old-generation panel fabs and equipment new value. As Taiwan's panel makers accelerate the phaseout of LCD capacity at the 5.5 generation and below, they are splitting into two tracks: selling factories to foundries and outsourced semiconductor assembly and test (OSAT) providers, or keeping lines in-house to develop fan-out panel-level packaging (FOPLP), through-glass via (TGV), redistribution layer (RDL), and glass core technologies.
