CONNECT WITH US
Friday 19 September 2025
TSMC to maintain lead for next 5 to 10 years, says new Minister of Taiwan's National Development Council
Chun-Hsien Yeh, the new minister of Taiwan's National Development Council (NDC), pointed out on September 17 that with strong demand for artificial intelligence (AI), TSMC will be running at full capacity through 2026. He believes that TSMC can maintain its technological lead for at least another 5 to 10 years. Taiwan's policies, work culture, talent education, and ecosystem are all key drivers behind TSMC's success.
Friday 19 September 2025
Texas invests another US$250 million in Samsung's Taylor plant
Samsung Electronics has secured another US$250 million subsidy from the Texas state government, bringing its total state aid to US$520 million. The latest funding comes as Samsung's Taylor facility prepares to begin operations in 2026, a project viewed as central to strengthening the company's US foundry capabilities and advancing America's semiconductor supply chain expansion.
Friday 19 September 2025
Samsung, Wolfspeed escalate silicon carbide race as EV and AI demand climbs
Samsung Electronics is accelerating its research into silicon carbide (SiC), a next-generation power semiconductor material, as competition heats up across the industry.
Friday 19 September 2025
Energy warning for Korea's semiconductor cluster: grid, LNG plans clash with net-zero goals
The Yongin Semiconductor Cluster in South Korea, which is anchored by Samsung Electronics and SK Hynix, is currently under development. However, experts caution that there are unresolved power grid issues, mainly due to the massive energy demands of the cluster. Additionally, the current energy supply plan may conflict with the national goals for carbon neutrality.
Friday 19 September 2025
Samsung gains edge as Micron falters on Nvidia's HBM4 demands
As Nvidia raises the performance threshold for fourth-generation high-bandwidth memory (HBM4), reports suggest that Micron Technology may be struggling to meet these standards. Industry analysts in South Korea suggest that Samsung Electronics stands to benefit from this shift.
Friday 19 September 2025
STMicroelectronics to build PLP pilot line in Tours, aiming for 3Q26 production
STMicroelectronics (STM) has announced a US$60 million investment to establish a panel-level packaging (PLP) technology pilot production line at its Tours facility in France, with plans to commence operations in the third quarter of 2026.
Friday 19 September 2025
Imec CEO calls CMOS 2.0 the anchor for AI’s future

Dr. Luc Van den hove, president and CEO of Belgian research institute imec, used his keynote at SEMICON Taiwan 2025 to call for a global push toward "super-fueled innovation" as the semiconductor industry faces mounting demands from artificial intelligence (AI), rising energy consumption, and shifting geopolitical currents.

Friday 19 September 2025
Samsung and SK Hynix set stage for global battle over HBM4 chips

SK Hynix has announced it is the first in the world to establish a mass production system for sixth-generation High Bandwidth Memory (HBM4), signaling the start of a new technological arms race in next-generation memory chips.

Friday 19 September 2025
Analysis: After Nvidia invests in Intel, who's next?

Intel has secured another high-profile backer. Following earlier commitments from SoftBank and the U.S. government, Nvidia has announced a US$5 billion investment in Intel, buying shares at US$23.28 each. The move directly contradicts CEO Jensen Huang's dismissal in March of rumors that his company might take a stake in Intel.

Friday 19 September 2025
Intel–NVIDIA alliance: what it means for TSMC, AMD, Arm and the wider industry

NVIDIA has announced it will invest US$5 billion in Intel, purchasing shares at US$23.28 each. The move surprised no one in the semiconductor and PC industries.

Thursday 18 September 2025
Nvidia invests US$5 b in Intel CPU-GPU pact, viewed as TSMC positive, says DIGITIMES analyst
Nvidia and Intel announced a wide-ranging collaboration to jointly develop data center and personal computing products that integrate both companies' technologies. The agreement centers on combining Nvidia's AI and accelerated computing platforms with Intel's CPU and x86 ecosystem, connected through Nvidia's NVLink technology.
Thursday 18 September 2025
Taiwan bets big on silicon photonics to capture US$100 billion global market
Taiwan is racing to advance its silicon photonics capabilities, aiming to develop high-efficiency 400Gbps optical modules within one to two years, according to the Ministry of Economic Affairs (MOEA).
Thursday 18 September 2025
CoPoS emerges as successor to CoWoS: K&S aligns with AI chip demands
Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS) process. Many suppliers see chip-on-panel-on-substrate (CoPoS) —a panel-level packaging method that converts round wafers into square panels— as the frontrunner for near-term adoption.
Thursday 18 September 2025
FPT eyes leadership in Vietnam's semiconductor packaging and testing sector
Vietnamese technology giant FPT Corporation is intensifying its push into the semiconductor industry with plans to establish a new backend semiconductor manufacturing facility in the central city of Đà Nẵng.
Thursday 18 September 2025
Commentary: China's tech industry eyes global expansion at homegrown expos
A pair of major technology expositions in China has concluded, offering a look into the country's tech supply chain, which is navigating US trade tensions with a firm commitment to self-reliance. The China International Optoelectronic Exposition (CIOE) and the SEMI-e Shenzhen International Semiconductor Exhibition underscored both the ambition and inherent challenges facing the industry.
Thursday 18 September 2025
Baidu's Kunlun chip nab China Mobile contract, but still trails Huawei Ascend ecosystem
Baidu, one of China's leading internet companies, has cultivated its in-house Kunlun chip for years and recently secured a significant contract with China Mobile, marking the first step in its commercialization process of supplying external customers.
Thursday 18 September 2025
White House taps Samsung for health tech initiative, sidelining Chinese rivals
Samsung Electronics is the only South Korean tech company invited to a new US government initiative focused on modernizing the nation's healthcare system. The program, dubbed "Make Health Tech Great Again," is a public-private partnership launched by US President Donald Trump.
Thursday 18 September 2025
EU and Japan plan joint rare earth development in Greenland to reduce reliance on G2 supply
Amid uncertainties posed by major powers such as the US and China, Japan and Europe are strengthening their ties. The scope of Japan-EU cooperation could potentially expand to include the development of rare earth resources in Greenland.
Thursday 18 September 2025
Taiwan's Transcom deepens investment in defense and satellite communications

Transcom, a specialist in high-power amplifiers, is making bold strides into the dual frontiers of national defense and space communications. Leveraging its deep expertise in compound semiconductor technologies such as gallium arsenide (GaAs) and gallium nitride (GaN), the company is expanding the application of its amplifier technology to address both pressing geopolitical demands and the rapidly growing low-Earth orbit (LEO) satellite market.

Thursday 18 September 2025
Nvidia, TSMC face antitrust scrutiny as US-China tensions spotlight market power
Just as Washington and Beijing are preparing to resume trade talks, China's State Administration for Market Regulation (SAMR) has thrown a wrench into the works. The agency accused Nvidia of violating the country's antitrust laws, putting the company back in the spotlight just months after a controversy over its H20 chips had begun to fade.
Thursday 18 September 2025
Hanwha Semitech stakes early lead in hybrid bonding race for SK Hynix's HBM4
Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment suppliers are racing to bring their systems to market ahead of that transition.
Thursday 18 September 2025
Kaynes Semicon, Mirrorcle Technologies sign MoU to produce MEMS mirrors in India
Bengaluru-based Kaynes Semicon has signed a memorandum of understanding with California's Mirrorcle Technologies to manufacture MEMS mirrors and optical systems in India.
Wednesday 17 September 2025
Taiwan's MPI, WinWay, and Chunghwa Precision join advanced chip test race
SEMICON Taiwan 2025 gathered a wide range of packaging and test equipment suppliers, all unveiling their latest technologies and solutions. Central to the event was the emerging "advanced test interface battle," as companies sought to overcome bottlenecks in high-frequency and high-speed testing, thermal control, accuracy, reliability, and cost performance.
Wednesday 17 September 2025
SMIC initiates testing of domestically produced lithography machines to bypass US sanctions
In response to US export controls and to reduce reliance on ASML, China has begun testing its first domestically manufactured deep ultraviolet (DUV) lithography machine. According to media reports, SMIC is currently testing immersion-type DUV equipment developed by a Shanghai-based startup, which can support chip production down to 7nm technology nodes.
Wednesday 17 September 2025
Taiwan semiconductor industry holds home advantage, says economics minister
Taiwan's AI server exports have doubled, with manufacturers' GPU and graphics card production capacity fully booked, driving remarkable export growth for the country. Minister of Economic Affairs Kung Ming-hsin stated on September 16 that the success of Taiwan's technology industry is not accidental.