Global chip buyers, including BYD, Google, AMD, and Tesla, are turning to Samsung Electronics as TSMC's advanced production lines remain fully booked, Nikkei Asia reported. The shift underscores how AI demand and supply-chain risk are reshaping where cutting-edge chips are made.
India-based Kaynes Technology is seeking outsourced automotive semiconductor orders in Japan, a move that could help establish a foothold for Indian backend chip manufacturing in a market long dominated by East Asia. Japanese partners are backing the effort, but the company still faces strict quality hurdles.
Chinese foundry Nexchip is expanding beyond wafer manufacturing with the establishment of a new wholly owned subsidiary, marking its latest move to deepen its presence across the semiconductor value chain.
Poland is seeking major Taiwanese investment to strengthen its manufacturing base, a shift that could reshape Europe's supply chains and technology capacity. The plan spans electric vehicles, semiconductors, and industrial policy, and reflects how governments are adapting to geopolitical pressure and shortages in key global sectors.
Singapore-based Galatek Technologies is expanding into scarce advanced packaging equipment as it builds localized manufacturing capacity in Malaysia, aiming to capture demand from a shifting global semiconductor supply chain.
China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) — an essential material for building silicon-based quantum computers. The breakthrough builds on a government push to sharpen its quantum research edge and reduce its reliance on foreign technology supply chains more broadly.
China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity for the second half of the year. But supply chain players say the long-term priority is still to expand substrate capacity from non-China sources, with supply security for the AI industry outweighing price.
A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has drawn skepticism from Taiwan industry sources, who say the timeline is likely premature and that the company remains focused on evaluating multiple advanced-packaging options.
The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty gas used in chip manufacturing. Planned production adjustments or exits by some Japanese suppliers in the second half of 2026 have intensified concerns over tighter global supply, sending prices sharply higher and raising the risk of disruption into 2027.
Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025 to support Britain's semiconductor ecosystem, marking a step toward cooperation on future semiconductor manufacturing and potential customer development in the UK, according to Rapidus and reports from Nikkei, Bloomberg, and Reuters.
Samsung Electronics' foundry division chief told employees on June 12 that a return to profitability in the contract chipmaking business looks difficult next year, with 2028 emerging as a more likely timeline, Yonhap, ZDNet Korea, and Chosun reported.
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
