Dreame Technology, a Chinese consumer electronics maker, has formed nearly 1,000 affiliated companies in its ecosystem since the end of 2024. This breakneck pace of expansion signals the ambitions of its leadership to unearth growth opportunities across the broader Chinese tech sector, although some media outlets question the sustainability of the business model.

TSMC chairman and CEO C.C. Wei personally addressed employees at a company-wide meeting on the morning of May 27, making a direct commitment on bonuses after days of backlash over reports of a 15% cut.

Wah Lee Industrial said it has formally moved into investments in standard gases and other supplies needed by wafer fabs, with its Tainan logistics center set to open in the second half of 2026 to support future growth. Chairman Gary Chang also confirmed that the company will pass on higher costs for semiconductor and PCB products quarterly as raw material prices climb.

Computex 2026 is set to officially open in Taipei, and Taiwan External Trade Development Council (TAITRA) Chairman James C.F. Huang has stated that the combined market capitalization of foreign companies participating in forums and keynote sessions at this year's event exceeds US$10 trillion. He also said that TAITRA has allocated the entire Taipei International Convention Center (TICC) exclusively to Nvidia for GTC Taipei 2026.

Taiwan-based Daxin Materials posted stronger revenue and profitability in 2025 as rapid growth in semiconductor materials offset a still-cautious display market recovery, with AI- and HPC-driven demand emerging as the company's primary growth engine.

WinWay Technology's orders are already booked out five to six months in advance, says company Chairman Mark Wang. He expects new production capacity coming online at the company's Kaohsiung facilities to gradually ease supply shortages and help drive record monthly and quarterly revenue growth throughout the second half of 2026.

Samsung Electronics' tentative 2026 wage agreement has cleared a union vote with 73.7% approval, moving a months-long labor dispute closer to settlement while exposing a deeper divide between workers in the company's chip and consumer electronics businesses, according to Korean media reports.

Nvidia CEO Jensen Huang, who is visiting Taiwan for two weeks, stated that the island's manufacturing sector is developing rapidly and needs more electricity.

The world's largest chip designers are steadily growing more bullish on the future of cloud artificial intelligence (AI) chips known as ASICs (application-specific integrated circuits) — a market increasingly seen as the next major battleground in the global AI boom.

Kinpo Electronics outlined its 2026 core strategy at a shareholders' meeting on May 25, centering on "bearing fruit" as it builds on years of product-mix adjustments, expands into AI-related products, and accelerates its shift toward an ODM model.

Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's semiconductor industry is increasingly worried that the newly expanded performance bonus structure, which guarantees employees a fixed percentage of business performance, could negatively impact the country's long-term semiconductor competitiveness.

Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to hold a company-wide communication meeting on the morning of May 27, during which chairman C.C. Wei is expected to address employees in person over the growing backlash surrounding reports that the company will cut employee bonuses by 15%.

For the past three years, graphics processing units, or GPUs, have dominated the artificial intelligence boom. But Johnny Shen, chairman of Alchip Technologies, believes the next phase of the market may belong to something more specialized.

When Nvidia quietly wrote a US$2 billion check to Marvell Technology earlier this year, it was less a financial bet than a strategic maneuver — one that converted a potential rival into a committed partner. Now, for the first time since that deal was struck, the two companies' CEOs will share a stage.

China's semiconductor war has been underway for seven or eight years now.

The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has reportedly developed a 900-layer-class V-NAND prototype, a significant leap that brings the memory industry closer to the 1,000-layer threshold as chipmakers intensify efforts to pack more storage into smaller chips while cutting power consumption.

Facing expanding opportunities in both optical communications and satellite connectivity, Dennis Chen, chairman of Win Semiconductors, said the company is actively advancing a range of products, including driver ICs, continuous-wave (CW) lasers, and photodiodes, while also ramping up capacity in anticipation of growing demand from next-generation networks.

Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions Rio Rancho — its New Mexico site — as a global hub for next-generation packaging production.

Following GlobalWafers' shareholders' meeting on May 25, Chairperson Doris Hsu stated that the company's core compound semiconductor business, gallium nitride (GaN), is addressing strong demand for high-efficiency power solutions in AI servers. The company is also beginning to see emerging demand from diversified applications such as AI robotics. As a result, production capacity in 2026 has already entered a state of supply shortage. To meet strong demand from Japanese IDM customers, GlobalWafers is launching a continuous "30% plus 20%" expansion plan.

Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV technologies to reduce energy consumption per wafer at the process level, while continuing to deepen its presence in Taiwan. The company also plans to hire around 1,000 new employees in Taiwan in 2026 to support customer expansion and rising global capacity demand.

GlobalWafers held its shareholders' meeting on May 25, where CEO Doris Hsu stated that the semiconductor market in 2026 has gradually moved beyond 2025's two extremes, when only AI and advanced process technologies dominated growth. In 2026, non-AI and traditional application markets began to recover, making market conditions thrive.

Intel CEO Lip-Bu Tan is set to arrive in Taiwan this weekend, joining AMD CEO Lisa Su and Nvidia CEO Jensen Huang in a high-stakes push by the world's top chip leaders to deepen ties with Taiwanese partners ahead of Computex 2026.

Wingtech Technology, the Chinese tech company that owns Dutch semiconductor manufacturer Nexperia, has filed a civil lawsuit against Nexperia and five defendants for alleged damages worth CNY8 billion (approx. US$1.2 billion). The case is the latest development of the legal troubles between the Chinese company and its subsidiary following the Dutch government's seizure of the company in late 2025 for national security reasons.