India is moving deeper into semiconductor manufacturing with construction beginning on an INR23.87 billion (US$250 million) OSAT facility in Visakhapatnam, supporting New Delhi's broader effort to build a domestic semiconductor ecosystem beyond chip design.
MediaTek said at its latest earnings call that its second-generation data-center ASIC product remains on schedule for mass production in 2028, and that the Intel embedded multi-die interconnect bridge (EMIB) advanced packaging process it uses has already reached a very good yield level. MediaTek also said its first-generation product remains on track for volume ramp-up in the fourth quarter of 2026 and is expected to generate US$2 billion in revenue.
India is expanding its semiconductor ambitions through new R&D centers, indigenous design tools, packaging facilities and AI infrastructure investments, aiming to strengthen domestic capabilities and reshape global technology supply chains.
Powerchip Semiconductor Manufacturing Corp. (PSMC) chairman Frank Huang died on July 31, 2026, at age 76, closing a career that spanned medicine, electronics, DRAM and foundry manufacturing. His life traced nearly 30 years of booms and busts in Taiwan's memory and semiconductor industries.
When the agenda for this year's OCP APAC Summit landed, seasoned observers noticed something unusual. TSMC, Applied Materials, Advantest, and ASE are sharing the stage with Microsoft, Nvidia, and Google.
Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure budget for a second time this year to a record US$10.5 billion, up from its original plan of US$8.5 billion.
Automotive chip sales are improving across Europe and the US, but major suppliers say global carmakers and their suppliers are still buying largely for immediate needs. A fuller inventory rebuild — one that could affect prices and supply globally — has yet to begin, leaving the recovery more cautious than expected.
China's lithography equipment sector has returned to the global semiconductor spotlight following reports that a domestically developed immersion deep ultraviolet (DUV) system has entered mass production.
TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB), signaling that competition in AI semiconductor packaging is becoming as critical as chip manufacturing itself. The project, internally described as "EMIB-like," is being developed with Taiwanese substrate supplier Kinsus Interconnect Technology as TSMC seeks to broaden its packaging portfolio and address growing customer demand.
The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single number. It was the shape of the customer list: cloud service providers, AI/HPC designers, an LPU maker ramping at 4nm, and talks with Broadcom. This is not the mobile-centric foundry business Samsung has run for a decade. It is the profile of a fab catching overflow from a leading-edge market that has run out of capacity.
