National Silicon Industry Group (NSIG) expects to complete its expansion to 1.2 million 300mm silicon wafers per month by the end of 2026, positioning the Chinese semiconductor materials supplier to benefit from recovering wafer prices and growing demand for silicon-on-insulator (SOI) substrates used in silicon photonics (SiPh).

Chinese semiconductor equipment makers report record orders extending into 2027, with AI-driven investment in advanced memory, logic chips and packaging strengthening demand for domestic manufacturing tools. The expansion is benefiting suppliers across etching, thin-film deposition, cleaning and electroplating, although component delivery constraints could delay the conversion of orders into revenue.

Samsung Electronics plans to begin structural work at its P5 Fab 2 facility in Pyeongtaek, South Korea, in January 2027, accelerating its memory capacity expansion as chip shortages are expected to persist through 2028, DealSite reported.

Taiwan and the UK are deepening technology ties as supply-chain restructuring and industrial security reshape semiconductor strategy. A new bilateral arrangement covers semiconductors, space, communications, net zero, and AI standards, while cooperation could link British research strengths with Taiwan's manufacturing and testing capabilities across more of the chip lifecycle.

V5 Technologies, a major provider of advanced semiconductor optical inspection and image-processing software, reported consolidated revenue of NT$316 million (US$9.61 million) in October 2026, up 1.67% from September and 32.5% year-on-year. Revenue for the first 10 months surpassed NT$2.6 billion, rising 69.7% from the same period in 2025.

Niching Industrial reported a 369% year-on-year increase in 3Q26 operating profit to NT$45.05 million (US$1.37 million), as the consolidation of Ming Chun Yuan boosted manufacturing contributions and improved its product mix. Gross margin climbed to 28%, up 8 percentage points from the previous quarter.

Texas governor-elect Gina Hinojosa has announced plans to suspend new data center approvals until the state establishes legal safeguards for residents, power supplies, and the environment, while also urging the state government to pause land deals that could involve SpaceX. The policy could reshape investment plans by major technology companies in one of the US's fastest-growing AI data center regions and a key base for Tesla and SpaceX.

Transcend Information posted record net profit and earnings per share (EPS) for the first nine months of 2026, but its third-quarter revenue, gross margin, and profit all declined from the previous quarter as shipments fell and procurement costs rose.

China's second-largest contract chipmaker, Hua Hong Grace Semiconductor, is expanding into silicon photonics and power management chips to capitalise on AI infrastructure demand, following record third-quarter 2026 revenue and a 147.1% surge in profit.

Sumitomo Bakelite reported a 47.2% year-over-year increase in attributable net profit to JPY19.561 billion (US$123 million) for the first half of fiscal 2026, as AI server demand drove growth in semiconductor packaging materials. Revenue and operating profit rose 22.7% and 57.9%, respectively, prompting the company to raise its full-year net profit forecast to JPY35 billion in late October.

A patent lawsuit between Japanese electronic components maker Murata and Chinese radio-frequency (RF) front-end chip vendor Maxscend has ensnared some Samsung Electronics Galaxy smartphones and tablets equipped with the disputed filters. The products fall under the scope of a first-instance injunction issued by a German court, although Samsung said the affected models have already been discontinued, while Maxscend plans to appeal.

Humanoid robots require at least US$2,000 worth of semiconductors per unit—twice the content of an EV—and could drive the next semiconductor supercycle, Texas Instruments (TI) said. The company is expanding capacity for the next wave of demand rather than the current boom, according to William Feng, TI's Taiwan and South Asia sales and applications general manager.

Chipmakers are moving to secure production equipment for delivery as far ahead as 2029, as AI-driven fab expansion pushes some equipment lead times beyond two years and forces manufacturers to negotiate supply contracts years earlier than usual, South Korea's ETNews reported, citing industry sources.

China's National Integrated Circuit Industry Investment Fund Phase III (Big Fund III) is shifting its focus from targeted semiconductor investments to large-scale manufacturing and industry consolidation, with a CNY900 million (approx. US$134 million) capital injection into Silan Microelectronics' 12-inch analog chip project highlighting its latest priorities.

Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth memory (HBM). The fab is estimated to cost KRW25 trillion (approx. US$18.6 billion), with the broader project potentially reaching KRW30 trillion if an existing production line is converted into an advanced packaging facility, Seoul Economic Daily reported on November 4.

German quantum-sensing startup QuantumDiamonds has tested its technology on high-bandwidth memory (HBM) devices, including cases involving individual through-silicon via (TSV) failures, as it works to bring its chip defect detection technology into semiconductor production lines. The company, however, does not yet have a high-throughput wafer inspection system.

Mitsui Chemicals is planning to acquire semiconductor materials maker JSR from state-backed Japan Investment (JIC) in a deal potentially worth more than JPY1.3 trillion (US$8.2 billion), which would rank as the largest acquisition in Japan's chemicals sector, according to reports by Nikkei Asia and Reuters on November 4, 2026.

FPT has begun trial operations at a semiconductor testing and packaging plant in Vietnam's Bac Ninh province, initially focusing on chip testing as it prepares to expand into packaging technologies. The facility has six production lines and a maximum designed capacity of 300 million chips annually, the company said in a November 3 release.

GlobalFoundries' third quarter showed the contract chipmaker's revenue base shifting from smartphones to AI-related networking, and that shift is now boosting profitability. Revenue rose 13% from a year earlier to US$1.9 billion for the three months ended September 30, according to the company's November 4 earnings release, while IFRS gross margin widened to 30.1%.

Taiwan and the Netherlands announced four joint research and development collaborations on November 4 under their bilateral Technology Bridge Program, targeting photonic packaging, 5G and 6G communications, AI data center connectivity, and quantum computing. The agreements were unveiled during PIC Summit Europe as both sides sought to deepen semiconductor cooperation and strengthen supply chain resilience despite having no formal diplomatic relations.

HCLTech said AI chips will need about 1.5 years to move into mass adoption beyond cloud infrastructure, as the industry develops integrated semiconductor platforms to support large-scale AI deployment. The company made the remarks in a white paper released with Omdia on November 3, which highlights Taiwan's key role in powering the next phase of AI infrastructure growth.

ASML and TSMC announced plans in September 2026, ahead of the SPIE BACUS symposium, to advance high-numerical-aperture extreme ultraviolet (High NA EUV) lithography by replacing the decades-old 6-inch photomask format with larger 12-inch masks. TSMC plans to introduce High NA EUV into advanced-node volume production from 2030, establish a 12-inch mask pilot line and begin production-line and ecosystem qualification by 2031, and achieve full readiness for 12-inch-mask High NA EUV systems supporting advanced-node manufacturing by 2033.

AI expansion and rising household electricity demand are pushing Taiwan's power consumption higher, with Taipower forecasting that the Southern Taiwan Science Park's electricity load will reach about 4GW in 2031, accounting for 9% of Taiwan's total power use. Taiwan's electricity consumption per unit of land is already about 2.7 times Japan's and 1.3 times South Korea's, Taipower said.

Onsemi has agreed to acquire Ferric, Inc., a developer of integrated voltage regulator (IVR) technology, for US$600 million in cash plus up to US$175 million in contingent consideration tied to revenue milestones, the company announced on November 2, 2026. Alongside the deal, Onsemi raised its 2030 AI data center revenue target by US$500 million to more than US$3 billion.