Diamond Foundry has produced what it calls the first-ever single-crystal diamond measuring 200mm in diameter, according to a company blog post published on November 5, 2026. The post describes the crystal, which the company calls D8-inch, as a single continuous crystal and a step toward treating diamond as a semiconductor-scale material.

Samsung Electronics acquired four US silicon photonics patents from UK-based Rockley Photonics in September 2026, South Korea's Shinailbo reported on November 11, citing US Patent and Trademark Office (USPTO) records. The reported acquisition could strengthen Samsung's intellectual property portfolio in optical interconnect technology as it expands its silicon photonics foundry business to compete with TSMC.

Canon Inc. said on November 10, 2026, that it will launch the FPA-6400ES6a, a krypton fluoride (KrF) scanner for manufacturing memory and logic semiconductors, in early December 2026. The company's release gave no exact launch date, price, or shipment volume.

Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer evaluations to follow, ZDNet Korea reported on November 10, citing an industry source familiar with the plans.

Nexperia could eventually reunite its Chinese and international operations despite an unresolved control dispute with Chinese parent Wingtech Technology, acting CEO Stefan Tilger said recently. If the separation becomes permanent, Wingtech's ownership should entitle it to fair compensation.

Infineon Technologies told analysts that demand is no longer what limits its growth. On a November 10 call to discuss its fiscal 2026 results, the German chipmaker said orders for its data center power products already exceed the close to EUR4 billion (approx. US$4.46 billion) of revenue it forecasts for fiscal 2027, and that how much of that it can book will depend on how fast its factories and outsourcing partners can ramp.

Ingentec’s consolidated revenue reached NT$1.329 billion (US$40.4 million) from January to October 2026, up 79.32% from the same period in 2025. However, October revenue fell 8.59% month-over-month and 18.37% year-over-year to approximately NT$130 million as shipments of specialty gases to Japan, South Korea, and domestic customers declined slightly.

Intel is expanding its CPU and GPU portfolio with the Intel GPU D-series, code-named Crescent Island, and next-generation Xeon processors, code-named Diamond Rapids, targeting large-model inference and enterprise high-performance orchestration workloads. The company outlined new GPU D-series technology at the 2026 Open Compute Project (OCP) Global Summit as it pursues server CPU upgrade opportunities driven by agentic AI.

Charles Kau, chairman of IEMC, said TSMC "cannot make 3D DRAM," dismissing reports that the foundry is evaluating entry into the next-generation memory market at Nvidia's request. TSMC declined to comment on market speculation and stressed that it remains focused on its core foundry business.

Infineon Technologies ended fiscal 2026 with its strongest quarter ever, and the shape of the result says more than its size: profitability rose much faster than sales, and the German chipmaker now plans for a year in which power supplies for data centers become one of its largest single businesses.

Asia Electronic Materials is developing high-frequency, high-speed substrate materials based on polytetrafluoroethylene (PTFE) through a Hybrid Coreless solution and continues to submit samples for AI customer validation, targeting advanced semiconductor and AI applications.

Acer subsidiary Acer Synergy Tech benefited from sustained semiconductor industry growth, which drove demand for information technology (IT), operational technology (OT), and workforce service solutions. Its consolidated revenue reached NT$307 million (US$9.34 million) in October 2026, up 187.93% year-on-year and marking a record high for the second consecutive month.

DIGITIMES observed that Nvidia is advancing an optics-on-interposer (OOI) architecture that moves the optical engine from an organic substrate to a silicon interposer to increase interconnect density and reduce transmission energy consumption.

Intel is expanding its computing platform strategy for agentic AI and enterprise workloads with the Intel Core Series 3 processor, codenamed Wildcat Lake, targeting mainstream consumer and commercial notebooks. The processor combines Intel 18A and Taiwan Semiconductor Manufacturing Co. (TSMC) 6nm processes in a two-chiplet design, using the Universal Chiplet Interconnect Express (UCIe) standard chiplet interconnects and organic-substrate multi-chip packaging (MCP) to lower the cost barrier for bringing advanced process technology to mainstream PCs.

China's leading smart-device original design manufacturer (ODM), Huaqin Technology, plans to invest CNY1 billion (approx. US$149.86 million) in a wafer foundry venture, strengthening upstream semiconductor ties while expanding its AI server and data center businesses.

Infineon Technologies AG said on November 9, 2026, that it has processed 300mm silicon carbide (SiC) wafers into functional power devices at its fab in Villach, Austria, which it described as an industry first in a full-scale semiconductor fab environment. The company plans to show the first processed 300mm SiC wafer publicly at the electronica trade show in Munich, which opens on November 10.

Jiangsu HISI Semiconductor (HISIGK) has prepared 14 automated lithography systems for delivery across 300mm, 200mm and 150mm wafer platforms, expanding its specialty semiconductor equipment business in markets ranging from MEMS to AR optics and LED chips.

UK photonic integrated circuit (PIC) startup Wave Photonics is expanding in Asia and, despite partnerships with the Hon Hai Research Institute (HHRI) and Taiwan-based EDA companies, is considering Singapore as a potential regional base. The company said Singapore offers a concentration of integrated photonics foundries, government support for quantum technology, and proximity to Malaysia's photonics cluster, helping it connect with Asia's supply chain.

Driven by rising demand for AI, semiconductors, and automation equipment, Hiwin Technologies delivered strong results in the third quarter of 2026, with all three key profit margins improving. Gross margin reached 36.3%, boosted by four factors including a US subsidiary tariff refund, while net profit surged 1.76 times year-over-year to NT$1.23 billion (US$37.4 million).

SK Hynix is using Nvidia's AI technology and GPU acceleration to speed up memory chip simulations, with improvements in etching-process development and tests of thermal and elastic deformation analysis. As memory structures and manufacturing processes become increasingly complex, the companies are working to reduce simulation time and computational demands to support process optimization during R&D.

ASMedia Technology reported consolidated revenue of NT$2.66 billion (approx. US$80.9 million) in the third quarter of 2026, with a gross margin of 51.6%, as rising substrate, outsourced semiconductor assembly and test (OSAT), and foundry costs prompted the company to adjust prices for its own-brand products and negotiate cost sharing with customers.

Former colleagues and business associates describe Alice Huang as an executive skilled at turning relationships into commercial opportunities. Their accounts are now central to understanding how the former Megaspeed executive established credibility in AI infrastructure—and whether her access to Nvidia CEO Jensen Huang influenced hardware supply.

Japan's state-backed chipmaker Rapidus is facing mounting technological challenges that could delay its plan to begin mass-producing 2nm semiconductors by March 2028, potentially undermining Tokyo's efforts to rebuild its domestic advanced semiconductor manufacturing capabilities.

Ion Electronic Materials is capitalizing on rising demand for localized supplies of electronic specialty gases driven by advanced semiconductor processes, AI, and high-performance computing. Led by Taiwan's "DRAM godfather" Charles Kau, the company reported consolidated gas revenue of NT$534 million (US$16.2 million) in the first three quarters of 2026, up more than 30% year-over-year, while its third-quarter loss narrowed to about NT$800,000, bringing it close to break-even.

Driven by the European Chips Act (ECA) and the trend toward localizing semiconductor manufacturing, demand for materials, equipment, and technical services in the European market has attracted growing attention. Topco Scientific Germany, a subsidiary of Topco Scientific (TSC), made its debut at SEMICON Europa 2026, being held at Messe Munchen in Germany from November 10 to 13. Together with supplier partners from Taiwan and Japan, the company showcased its ability to integrate cross-border resources and provide localized services.