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Tuesday 29 September 2026
US, China eye US$60 billion in tariff relief, but chips stay off the table
The US and China are moving toward tariff reductions on about US$60 billion of bilateral trade following last week's Trump-Xi summit, but semiconductors and other strategically sensitive sectors remain outside the arrangement.
Tuesday 29 September 2026
Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics (IME), KLA, ASM International, the National University of Singapore (NUS), the SHINE Centre, and ASMPT discussed how advanced packaging is evolving beyond conventional chip integration, with optical interconnects, panel-level packaging, and talent development emerging as key challenges.

Tuesday 29 September 2026
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding beyond the performance of individual tools to hybrid bonding, interface materials, defect metrology, process control, optical interconnects, and panel-level packaging.
Tuesday 29 September 2026
Samsung bonus plan to lift South Korea talent race

Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance bonus in late September, after a holiday break. The move comes as SK Hynix continues recruiting experienced talent, underscoring how pay systems and workplace conditions have become key to attracting and retaining workers at South Korea's semiconductor giants.

Tuesday 29 September 2026
GlobalFoundries eyes GaN expansion to challenge TSMC in AI

GlobalFoundries (GF) is preparing a major global capacity expansion as TSMC is set to gradually exit gallium nitride (GaN) foundry services in 2027. GF said it was the first foundry to proactively approach TSMC and secure a GaN technology license, positioning itself to give existing customers a "seamless migration" path to its own platform.

Tuesday 29 September 2026
GF's MIPS bets on RISC-V physical AI, expands into autos and data centers
MIPS, a GlobalFoundries (GF) unit, said it has completed its integration with the ARC unit acquired from Synopsys earlier this year and is using the move to position RISC-V for physical AI, while expanding from AIoT into automotive and data center applications. MIPS said the strategy lowers the barrier for global customers to adopt GF platforms across process technologies and has pushed GF and MIPS to become the world's second-largest processor IP provider.
Tuesday 29 September 2026
Chips make up nearly half of South Korea's September exports; China, Hong Kong account for 52% of them
Semiconductors made up nearly half of South Korea's exports in the first 20 days of September, while China and Hong Kong combined accounted for more than half of the country's chip shipments in August, underscoring the growing concentration of the latest export surge by both product and destination.
Tuesday 29 September 2026
VSMC Singapore fab fully booked as VIS weighs Fab 2
Capacity at VisionPower Semiconductor Manufacturing Company's (VSMC) first 12-inch wafer fab in Singapore is fully booked as the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors begins a preliminary evaluation of a second fab.
Tuesday 29 September 2026
TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
VSMC, the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, officially opened its first 12-inch wafer fab in Singapore on September 28, completing construction in just 22 months.
Tuesday 29 September 2026
Vanguard chairman says AI slowdown won't free up chip capacity

Vanguard International Semiconductor (VIS) and NXP Semiconductors' joint venture, VisionPower Semiconductor Manufacturing Company (VSMC), officially opened its 12-inch (300mm) wafer fab on September 28 in Tampines, Singapore. Vanguard and VSMC chairman Leuh Fang said the AI-driven crowding out of capacity has spread across the global semiconductor supply chain, leaving almost no company able to say it has sufficient capacity.

Tuesday 29 September 2026
Trump-Xi state dinner puts tech titans at the head table, spotlighting Taiwan's quiet supply chain clout

Chinese President Xi Jinping and his wife, Peng Liyuan, arrived at the White House on the evening of September 24 US time to attend a state dinner hosted by US President Donald Trump and First Lady Melania Trump.

Tuesday 29 September 2026
AI server MLCC prices rise as Chinese suppliers gain ground in generic parts

Multilayer ceramic capacitor (MLCC) prices for AI servers have continued to climb, while prices for general-purpose components used in consumer appliances have dropped sharply. The split in the market has opened more room for Chinese suppliers in midrange and general-purpose categories as major manufacturers shift capacity toward higher-value products.

Tuesday 29 September 2026
AMD pays US$8.2 billion for Fei-Fei Li's 3D world-modeling startup to shape future AI chips
AMD has agreed to acquire World Labs, the San Francisco AI research startup led by Fei-Fei Li, in an all-stock deal valued at about US$8.2 billion. The chipmaker says it wants the startup's model expertise to shape its future hardware, software and systems.
Tuesday 29 September 2026
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging. In the second part of his interview with DIGITIMES, Dr. Shin-Puu Jeng, chairman of IMAPS and a former TSMC executive, shared how TSMC transformed CoWoS from a niche lab concept into an industry standard.
Tuesday 29 September 2026
Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC advanced packaging executive, reflected on the early development of CoWoS. In the first of this two-part series, Jeng details how a critical thin-interposer crisis forced TSMC and Xilinx to innovate, laying the foundation for modern advanced packaging.
Monday 28 September 2026
NXP says Singapore fab with Vanguard is its biggest investment since Freescale
NXP Semiconductors CEO Rafael Sotomayor said the Singapore fab NXP built with Vanguard International Semiconductor (VIS) is NXP's largest investment since it acquired Freescale in 2015. The 12-inch fab, run by the joint venture VisionPower Semiconductor Manufacturing Company (VSMC), opened in Tampines, Singapore on September 28. It is now in trial production, and volume production is scheduled for the first quarter of 2027.
Monday 28 September 2026
Beyond ASML: China rethinks EUV race with light-source strategy
China is trying to broaden the definition of the extreme ultraviolet (EUV) race. Rather than focusing only on building a domestic equivalent to ASML's lithography platform, Chinese researchers are exploring alternative EUV light sources that could improve energy efficiency, support semiconductor metrology and eventually provide new options for advanced lithography.
Monday 28 September 2026
India roundup: India's tech ambitions widen from electronics manufacturing to chips, cloud and talent
India's technology push is widening across electronics manufacturing, semiconductors, cloud infrastructure and talent, as domestic expansion draws deeper investment, tighter scrutiny and stronger links with global technology supply chains worldwide.
Sunday 27 September 2026
Beijing escalates domestic chip drive with Broadcom audits

China is intensifying its push to replace foreign technology across critical computing infrastructure, targeting high-speed networking hardware alongside foreign AI accelerators.

Sunday 27 September 2026
South Korea's 300mm research gap: Daejeon pitches an open fab as a US$1.46 billion fix
Daejeon is seeking to build a roughly KRW2 trillion (approx. US$1.46 billion) national semiconductor research hub centered on an open 300mm manufacturing and demonstration fab, aiming to fill a gap between South Korea's research infrastructure and its large commercial chipmaking base.
Saturday 26 September 2026
US and Chinese accounts of Xi's Washington visit agree on the framework, not the fine print
Chinese President Xi Jinping's September 23-25 state visit to Washington ended without a joint statement, leaving the White House fact sheet and Beijing's official readouts as the only formal record of what was agreed. Read side by side, the two accounts converge on the architecture of the relationship and on the channels for further talks, but diverge on almost everything that could be measured: every quantified pledge appears only in the US text, while Taiwan appears only in China's.
Saturday 26 September 2026
Samsung foundry recovery gains pace, but 2nm, Taylor fab remain hurdles

Samsung Electronics' foundry recovery is gaining pace as higher utilization, firmer pricing, and stronger advanced-node demand improve earnings, but a sustained return to profit will depend on 2nm yields and how quickly its Taylor fab in Texas ramps production.

Friday 25 September 2026
Singapore brands its chip sector as it tries to move up from manufacturing
Singapore is deepening semiconductor R&D ties with Applied Materials, KLA, GlobalFoundries (GF) and other industry players across advanced packaging and silicon photonics, as the city-state builds on its manufacturing base to strengthen technology development, validation and commercialization.
Friday 25 September 2026
Dutch PM presses US to avoid tighter ASML China curbs
Dutch Prime Minister Rob Jetten is pressing Washington to avoid another round of export restrictions on ASML's China business as US lawmakers pursue legislation that could tighten controls on the chip-equipment maker's immersion lithography systems and servicing activities.
Friday 25 September 2026
Trump-Xi summit leaves rare-earth issue unresolved amid yttrium supply squeeze
The Trump-Xi summit left rare-earth supplies among the unresolved issues in US-China economic relations, as the US and Japan confront uneven access to yttrium, a little-known rare-earth metal used in heat-resistant coatings for semiconductor manufacturing tools.