AI chip demand is sustaining a global rise in semiconductor packaging and testing prices, with STATS ChipPAC preparing a broad round of price increases for the second half of 2026. Some customers have recently received notices of varying adjustments from the Singapore-based subsidiary of China's JCET.
Elon Musk's ambitions across AI, robotics and space infrastructure are moving into a new phase following the unveiling of Terafab, an ambitious semiconductor manufacturing complex designed to secure the compute capacity required by Tesla, SpaceX and xAI.
AI-driven demand for advanced packaging is giving old-generation panel fabs and equipment new value. As Taiwan's panel makers accelerate the phaseout of LCD capacity at the 5.5 generation and below, they are splitting into two tracks: selling factories to foundries and outsourced semiconductor assembly and test (OSAT) providers, or keeping lines in-house to develop fan-out panel-level packaging (FOPLP), through-glass via (TGV), redistribution layer (RDL), and glass core technologies.
The government-organized 2026 Taiwan Innotech Expo (TIE) will open in Taipei on September 17, with the National Science and Technology Council's (NSTC) Future Tech Pavilion set to showcase the latest research achievements that are ready for proof-of-concept validation and technology licensing. This year's exhibition will spotlight six priority areas: AI applications, semiconductors, precision health, space technology, disaster prevention technology, and net-zero technology.
US President Donald Trump said imports of polysilicon and related products threaten national security and ordered new trade measures aimed at lifting domestic production. The proclamation reflects a broader effort to reduce the US's reliance on foreign supply for solar manufacturing, semiconductors, and other advanced technologies.
Largan announced on August 5 that July revenue reached NT$4.877 billion (US$150.8 million), up 31% month-over-month and 11% year-over-year. For the first seven months, consolidated revenue totaled NT$34.086 billion, up 7% year-over-year, as the company entered the traditional peak season.
On August 5, Taiwan's National Science and Technology Council said it had completed the central government's 2027 budget plan, with NT$182.3 billion (US$5.7 billion) earmarked for technology spending, up about 9.5% from 2026. The biggest increase goes to sovereign AI computing power and infrastructure as Taipei pushes ahead with its Smart Nation 2.0 initiative.
Rashi Peripherals, a national distribution partner for global technology brands in India, has entered a joint venture with Japanese electronics and technology company Restar Corporation. The move pushes the distributor beyond product distribution into engineering, design, and field application support for India's manufacturing sector, according to ScanX, IT Voice India, and CRN Asia.
Infineon said demand for its AI data center power semiconductors continues to exceed available supply, prompting leading customers to sign multi-year capacity reservation agreements that give the chipmaker greater visibility while securing future supply for hyperscale AI deployments.
Daeduck Electronics plans to invest KRW497 billion(US$349.50 million) in semiconductor production facilities through 2027, its second major expansion announcement this year, Seoul Economic Daily reported, citing a regulatory filing with South Korea's Financial Supervisory Service.
