Chinese semiconductor material manufacturers are accelerating investments in advanced products as Beijing pushes for greater self-sufficiency, challenging the long-standing dominance of Japanese suppliers in a global market valued at US$73.2 billion.
Taiwan's carbon fee system has begun collecting payments, with the first batch covering 240 high-emitting companies across 461 factories and generating NT$4.97 billion (US$156.07 million) in initial revenue. Taiwan also plans to roll out an emissions trading system (ETS) in 2028, initially targeting 20 major emitters in the steel, cement, and semiconductor sectors.
India's proposed second phase of the India Semiconductor Mission (ISM 2.0) has reportedly taken a key step forward, clearing the Finance Ministry's Expenditure Finance Committee (EFC), according to Indian media reports. The development could pave the way for a broader expansion of the country's semiconductor manufacturing ambitions.
As the AI wave drives rapid growth across the global semiconductor industry, the upstream electronic materials supply chain has become a key bottleneck for AI-related shipments. To keep pace with AI investment, Qnity was spun off from US chemical giant DuPont and listed independently in November 2025.
SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than routine R&D reinforcement and as a sign that competition in the high-bandwidth memory (HBM) market has entered a new stage. As AI chips demand more from memory, logic design, advanced process nodes, and packaging integration, talent with system semiconductor and foundry experience has become a strategic asset.
South Korea is moving to build a complete semiconductor supply chain modeled on Taiwan's technology corridor, but Gudeng chairman Bill Chiu said the hardest part to replicate is not science parks or fabrication plants, but Taiwan's deeply rooted supply chain culture.
Asia Neo Tech has announced a 15-year technology licensing agreement with US-based Brooks Automation to cooperate on FOUP (front-opening unified pod) cleaning equipment and expand its reach into global markets. The two companies held a signing ceremony on June 30, 2026.
Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged optics (CPO) are likely to become its second-largest product line after notebook camera modules, as the company pushes to expand into new growth drivers. Chairman Weiya Gao said the expected 10% to 20% cut in 2026 shipments by notebook brands would have a relatively limited impact, since the company mainly supplies high-end business notebook cameras.
TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to use a new "round-to-square" architecture to break through cost and capacity bottlenecks in large AI chip packaging and build its next competitive moat.
As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven investment wave is now spreading beyond foundries into the equipment, materials, factory engineering, and inspection supply chains.
As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals giant DuPont and separately listed — is likewise expanding its production capacity investment in Taiwan. Asia-Pacific president Dennis Chen said in an interview with DIGITIMES that future investment will center closely on three main battlegrounds: advanced processes, advanced packaging, and thermal management.
AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs, tightening capacity across both 8-inch mature processes and 12-inch advanced nodes. CoWoS's advanced packaging and HBM capacity are also set for a prolonged supply shortage, effectively rewriting the foundry industry's business cycle.
Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The Bell reported, citing industry sources.
Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position. The prospectus highlights its scale in display driver chips and image sensors, while also warning investors about customer concentration, heavy capital needs, and exposure to shifting trade policy.
Taiwanese prosecutors have reportedly expanded their investigation into the alleged illegal export of high-end AI servers to China, Hong Kong, and Macau, launching a second round of raids targeting Supermicro's Taiwan branch and two listed Taiwanese technology companies.
Microcontroller customers are accelerating shipments into the first half of 2026 as higher production costs ripple through the supply chain, with global implications for electronics pricing and availability. Industry sources said buyers are seeking to secure supply before further increases, while weak demand and AI-related capacity pressure continue to shape the market.
