Realtime news
Mobile components
  • TSMC on track to start 3nm production in 2022
    TSMC has been fast advancing its manufacturing processes. It is on track to move 5nm node to commercial production in the second half of 2020, and will soon break ground for a 3nm facility where volume production will start in 2022. Next...
  • Demand from the Wi-Fi 6 sector is picking up
    MediaTek and Realtek Semiconductors are both gearing up to ramp up their output of Wi-Fi 6 (802.11ax) chips in 2020, according to sources at IC testing solutions providers.
  • Motorola has switched orders for flexible AMOLED panels for its new foldable smartphones to Chinese
    Motorola has switched orders for flexible AMOLED panels for its new foldable smartphones to Chinese suppliers BOE Technology and China Star Optoelectronics Technology (CSOT) from Taiwan-based AU Optronics (AUO) who cannot provide sufficient production capacity, according to industry sources.
  • Qualcomm
    TSMC uses its N7, the foundry's 7nm process without EUV, to fabricate Qualcomm's latest flagship processor, Snapdragon 865 series. Nevertheless, its Snapdragon 765 chips are being manufactured using Samsung's EUV-based 7nm process technology.
  • 5G to see intense competition in midrange phone segment
    Qualcomm has introduced its new 5G SoC lineup - the Snapdragon 865 series for smartphone vendors' flagship models and the 765 series for midrange to high-end ones. But it is the midrange smartphone market segment that is expected to see...
  • Qualcomm has introduced Snapdragon 7 series for midrange 5G phones
    The main battlefield in the 5G mobile chip market is expected to shift from flagship models to mostly midrange ones in the first half of 2020, as around 70% of over 200 million 5G smartphones to be shipped next year will be midrange to high-end ones, according to industry sources.
  • Qualcomm Snapdragon 865 and 765 series
    Qualcomm has introduced its new Snapdragon 865 and 765 seies SoC chips designed for 5G-capable Android smartphones slated for launch in 2020. TSMC and Samsung Foundry reportedly are both being contracted to manufacture the chips.
  • Smartphone antennas
    Modified polyimide (MPI) and liquid crystal polymer (LCP) materials for smartphone antennas are expected to coexist, with the former being adopted mainly for Android models, and the latter likely to be increasingly used by Apple for its iPhones from 2020 onwards, according to industry sources.
  • China telecom carriers and smartphone vendors gearing up for 5G business
    With the arrival of 5G commercialization, China-based telecom carriers and smartphone vendors are expanding their services and releasing new products in pursuit of new business opportunities.
  • TL Lee, GM of MediaTek wireless communication BU
    MediaTek has released Dimensity 1000 featuring four Arm Cortex-A77 cores operating up to 2.6GHz with four power-efficient Arm Cortex-A55 cores operating at up to 2.0GHz, accelerating its deployments in the 5G market.
  • 5G mobile SoC unit price to stay high
    Demand for 5G smartphones is expected to pick up fast next year, with mobile SoC prices for these handsets to stay at high levels at least in the first half of 2020. Tight capacity at TSMC's 7nm node will prevent production cost for 5G mobile chip from falling and Andriod phone vendors will not have...
  • Market of RF components for telecom infrastructure to be shaken by active antenna systems
    The radio frequency (RF) front-end (FE) market for telecom infrastructure, estimated at US$1.47 billion in 2018, is forecast to reach US$2.52 billion in 2025, according to Yole Developpement.
  • Handset vendors are keen to upgrade camera functions
    Handset vendors are demanding significant upgrades to camera lenses, screens, image resolutions and APs seeking to stand out in an increasingly competitive market.
  • Covestro CEO Markus Steilemann
    Germany-based Covestro, spun off from the Bayer Group in September 2015, is now among the world's leading makers of premium polymers with 30 production bases and around 16,000 employees worldwide, mainly engaged in supplying high-tech polymer materials and solutions for diverse applications to automotive,...
  • 5G mobile SoC price will stay at high levels
    5G mobile SoC unit price will stay above US$100 in the first half of 2020, several times that for 4G solutions, as tight capacity at TSMC's 7nm node is likely to keep production cost at high levels, according to industry sources.
  • Chipmakers keen to increase inventory for 5G
    The prospect of 5G definitely looks promising, but players in the supply chain have to make sure they have sufficient support from one another in order to fully enjoy the opportunities promised by the arrival of 5G. Chipmakers and their partners are gearing up to build key...
  • Mobile chipmakers are gearing up to secure stronger support from supply chain partners
    Mobile chipmakers are gearing up to secure stronger support from supply chain partners aiming to gain a greater presence in the market for 5G smartphones whose shipments are estimated to reach at least 200 million units in 2020, according to industry sources.
  • 5G applications are bringing new demand
    With the arrival of 5G's commercialization, Taiwan- and China-based makers of components including PCB and cooling modules, are expected to see rising orders from the segment, which will also improve their operations in 2020. Meanwhile, as true wireless stereo (TWS) earbuds have grown popular among...
  • Cooling module makers expects increasing orders from 5G applications
    The commercialization of 5G communication networks will spur the growth of both base station and smartphone markets, which in turn will significantly drive demand for high-performance cooling modules in 2020, according to industry sources.
  • PCL chairman Gene Chen
    Optical transceiver module maker PCL Technologies has begun small volume shipments of its 400G transceiver modules to clients for trial operations with prospects to ramp up shipments significantly in 2020, according to company chairman Gene Chen.
  • UMC has kicked off risk production for 5G RF switches using its 12-inch wafer fabrication lines
    UMC may have quit the expensive race to advance manufactuing nodes, but it has been keen to develop specialty process. The latest development reportedly sees th pure-play foundry enter risk production for 5G FR switches at its 12-inch...
  • MediaTek launches Dimensity 5G SoC
    MediaTek has launched its next-generation 5G SoC family, Dimensity. The launch made a splash with high-ranking executives from many fellow semiconductor firms, including TSMC and ASE, attending. MediaTek, as one of the biggest IC designers...
  • NOR flash demand is being driven by rising popularity of TWS earbuds
    The supply of NOR flash memory is likely to fall short of demand in 2020, with the gap estimated at up to 10%, according to industry sources.
  • High-level executives at TSMC and other major Taiwan-based chipmakers participate in MediaTek's 5G
    MediaTek held a press conference on November 26 to introduce the new generation of its 5G SoC chips, with guests including TSMC VP Lora Ho, a number of high-ranking executives from major backend houses including ASE, SPIL and KYEC, and IC probing specialist CHPT.
  • Intel and MediaTek team up for 5G
    MediaTek has announced it is partnering with Intel to bring MediaTek's new 5G modem to PCs. Through this partnership, Intel has been working with MediaTek on the 5G solution for deployment in key consumer and commercial laptop segments. MediaTek is developing the 5G modem and working with partners...

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