Mobile components
  • Fingerprint sensors
    Smartphone vendors in the Android camp are rushing to incorporate in-display fingerprint recognition technology into their 18:9 all-screen models as they have turned conservative about adopting 3D sensor-based face recognition modules that are too costly to afford, according to industry sources.
  • The new Samsung Galaxy S9+ equipped with 64GB of NAND flash memory (model number SM-G965U1) carries a bill of materials (BOM) cost of US$375.80, much higher than for previous versions of the company's smartphones. The preliminary estimated total is US$43.00 higher than costs for the Galaxy S8+, according...
  • iPhone X
    With Apple reportedly to make 3D sensing a standard for its 2018 series iPhone devices, trial production of the new series is expected to kick off in the second quarter of 2018 at the earliest, as Apple will try to avoid a repeat of the mishap caused by the initial low yield rates on production of...
  • Genius Electronic Optical has reportedly obtained orders for receiver lens modules used in 3D sensing lenses of smartphones from China-based vendor Huawei Technologies, with shipments likely to begin in second-half 2018, according to industry sources.
  • Taiwan-based IC designer MediaTek is expected to report strong sales in the second quarter of 2018 and see its revenues, gross margins and net earnings for the year to rebound, thanks to China smartphone vendors Oppo, Vivo and Xiaomi moving to mass adopt the firm's latest Helio P60 chipsets for their...
  • apple
    Apple plans to launch a new 5.85-inch OLED iPhone this year as an upgrade to the existing iPhone X, but the vendor has managed to reduce the new device's initial manufacturing bill of materials (MBOM) to a level much lower than that of its present flagship model, according Digitimes Research senior...
  • Passive components in increasingly tight supply
    Taiwan suppliers of passive components and their downstream clients have shown divided views over when the lingering supply shortfalls and price hikes would ease. Though downstream customers expect a significant improvement to come in the next two quarters, suppliers opine that the situations may last...
  • Apple is expected to procure a total of 250-270 million flat panels for the production of iPhone devices in 2018, accord to sources from Taiwan's panel industry.
  • Metal-alloy chassis maker Catcher Technology has announced plans to subscribe to new shares of PCB firm Career Technology for NT$38 (US$1.30) each or a total of about NT$1.13 billion.
  • ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, returned to profitability in the fourth quarter of 2017. EPS for the year came to NT$1.05 (US$0.04), hitting a record low, however.
  • Smartphone-use lens module maker Largan Precision has plans to recruit about 4,500 new employees, with about 1,000 of them to be hired in 2018, according to industry sources.
  • MediaTek's recently-introduced Helio P60 mobile SoC that comes with AI capabilities has been adopted by Oppo and Meizu for their upcoming smartphone models, according to a report from Taiwan's TechNews.
  • With Apple set to launch its in-house designed wireless charging pad AirPower by the end of March, Taiwan suppliers of glass passivated package (GPP) bridge rectifiers needed to support the device expect their shipments to double in the first quarter of 2018 from a quarter earlier and rise further...
  • Mobile SoC specialist MediaTek has reported consolidated revenues of NT$12.71 billion (US$434.2 million) for February 2018, down 24.5% sequentially and about 25% on year.
  • iphone x
    Most Android smartphone vendors, particularly those in China, are still reluctant to adopt 3D sensing technology for their new models to be launched in 2018 due to the persistent high prices of 3D sensing modules, according to sources from Taiwan-based IC-design houses.
  • IEAS
    India Electronics & Semiconductor Association (IESA) held its annual event IESA Vision Summit at the Leela Palace in India's high-tech center Bengaluru at the end of February. Taking place at the Leela Palace - one of India's best hotels featuring Indo-Islamic architectural grandeur, the event...
  • TL Lee, head of MediaTek's wireless communication product business unit
    MediaTek has introduced its new solution to bring artificial intelligence (AI) capabilities to smartphones, and is gearing up for competition in the AI smartphone field.
  • MediaTek president Joe Chen
    There were major management changes at MediaTek last year, showing the IC deisgner's intention to regain its growth momentum. The changes included the appointment of Joe Chen as MediaTek president late in the year.
  • Smartphone-use lens module maker Largan Precision has reported consolidated revenues of NT$2.217 billion (US$75.5 million) for February, the lowest monthly level since February 2016. The sum represents decreases of 36.82% sequentially and 35.37% on year.
  • Taiwan suppliers of compound semiconductor devices are poised to gain significant growth momentum from the increasing market demand for radio frequency (RF) and power amplifier (PA) components along with the efforts of chipmakers to roll out related solutions to support 5G devices such as smartphones,...
  • The low-end market segment offers huge business opporunties
    The Indian handset market has experienced drastic changes in the past two years. Xiaomi has dethroned Samsung, whose six-year development in India ha allowed it to remain the only non-China brand among the top five vendors there. The third, fourth and fifth largest vendors are respectively Lenovo,...
  • The adoption of all-screen displays for smartphones will extend from flagship models to mid-tier and even entry-level models in 2018, pushing the ratio of all-screen models to over 40% of global handset panels shipments in the year, according China-based market research firm All View Cloud (AVC).
  • India's Ministry of Electronic and Information Technology
    With steady market growth and increasing economies of scale, India is an important alternative to China for countries that seek balanced industrial developments and try to avoid overdependence on the China market. Businesses from Taiwan and other countries have been keen to expand into India. Many...
  • The worldwide PCB industry output value grew 11.7% to US$65 billion in 2017, according to data compiled by Taiwan Printed Circuit Association (TPCA). The on-year growth was the highest in nearly 10 years.
  • Micron Technology has announced three new 64-layer, second-generation 3D NAND storage products, which support the high-speed Universal Flash Storage (UFS) 2.1 standard. Micron's new mobile 3D NAND products are available in 256GB, 128GB and 64GB capacities.

Global server market – 4Q 2017

Taiwan LCD monitors – 4Q 2017

Taiwan handsets – 4Q 2017

Global AP market, 2017-2021

Taiwan server shipment forecast and industry analysis, 2018

China AMOLED panel capacity expansion forecast, 2016-2020

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