Micron is joining the LPCAMM2 race dominated by Samsung and SK Hynix in the next-generation AI notebook memory market. Following the high-bandwidth memory (HBM) surge, the AI notebook semiconductor sector is evolving into a three-way competition.

The 2025 Future Innovation Technology Expo (FIX 2025) opened in Daegu in January 2025, bringing together 585 companies across 2,000 booths to showcase breakthroughs in mobility, robotics, artificial intelligence, and ICT.

Yageo chairman Pierre Chen announced the successful acquisition of Japan's Shibaura Electronics and immediately traveled to Tokyo for a joint press conference with Shibaura president Akira Kasai, marking a new milestone in their partnership aimed at expanding presence in the Americas and Europe.

Samsung Electronics has officially released its first extended reality (XR) headset, the Galaxy XR, priced at KRW2.69 million (approx. US$1,882). It targets the mid-to-high-end market segment, falling between Meta's Quest 3 and Apple's Vision Pro.

The AI wave shows no sign of slowing, and AI glasses have become the next frontier where technology meets wearables, following smartphones and wireless earbuds. As of late 2025, China's AI glasses market is heating up fast, with Alibaba and Baidu ready to debut their own models within six months, marking the start of true industrialisation and a coming shake-up from brands to the supply chain.

US President Donald Trump is set to personally attend oral arguments on November 5, 2025, at the US Supreme Court regarding the legality of his administration's reciprocal tariffs—a rare move underscoring the critical importance of the case for his signature trade policies.

Chinese drone maker DJI had once dominated over 70% of the global consumer drone market and as much as 90% in the US. However, Taiwan's domestic drone makers in recent years have begun to shine in the dual-use (civilian and military) market. The industry's production value surpassed NT$5 billion (approx. US$163 million) in 2024 and is expected to exceed NT$10 billion in 2025.

As Nvidia boldly announces the arrival of 800V high-voltage power supplies for AI servers, nearly all leading power semiconductor players have joined its supply chain. The industry is closely watching whether their technologies and solutions can meet the practical demands of future AI servers.

Pegatron Group's server subsidiary ASRock Rack is preparing to go public, marking a key milestone in the group's broader transformation. Pegatron Chairman T.H. Tung personally attended ASRock Rack's pre-IPO investor meeting on October 20 to show his support, joking that he came to embrace his "golden grandson." Tung also revealed that more subsidiaries are preparing for spin-offs following ASRock Rack's listing, signaling an active restructuring drive within the group.

Taiwan's industry players are seizing every opportunity in the rapidly advancing field of quantum technology. According to the National Science and Technology Council's (NSTC) quantum technology exhibit at the 2025 Future Tech Pavilion, a preliminary division of labor in the quantum computing industry has emerged, covering quantum chip design and fabrication to control modules and applications, with an increasing number of professors and students across Taiwan now taking part in related research projects.

Nvidia is planning to promote new cooling technologies in response to increasing demand for AI server cooling. In addition to the Microchannel Lid (MCL), the company is also said to be introducing a Microchannel Cold Plate (MCCP), both designed to meet the cooling requirements of the Vera Rubin server rack. Since both technologies rely on liquid cooling, liquid cooling is becoming a crucfial standard for AI servers. Subsequently, it has also sparked competition between Taiwan's two major thermal solution companies.

Targeting the global continuous glucose monitoring (CGM) market, microcontroller IC design house Holtek has unveiled its latest CGM application integrated with edge AI computing to capture healthcare opportunities.

Dixon Technologies reported strong growth across its mobile, telecom, and IT hardware divisions in the second quarter of fiscal 2026, driven by new joint ventures, expanding production capacities, and rising export opportunities.

Garmin's second quarter 2025 financial report hit a new record, with total revenue reaching US$1.815 billion, up 20% from the same period in 2024. Operating profit grew 38% year-over-year to US$472 million, with an operating margin of 26%, while the overall gross margin remained high at 58.8%. The strong performance highlights the company's solid profitability and technological competitiveness. Among its product lines, fitness and recreation products led with a 41% year-over-year increase, reflecting growing consumer interest in personalized health monitoring and smart sports technology, as well as global demand for wearable devices.

The Sun Yad Group, known for its subsidiary Myson Century, which aims to become Taiwan's answer to DJI, also includes U-Best Innovative Technology, an upstream PU resin supplier that has developed bulletproof coatings. U-Best is actively expanding into defense and security materials and has recently completed customer validation for its bulletproof coating, which is primarily used in soft body armor. In addition, U-Best has begun mass production of a new generation of eco-friendly water-based treatment agents, which have already been adopted by major Taiwanese manufacturers.

The rapidly growing demand for AI and augmented reality (AR) smart glasses in China has sparked a tenfold increase in sales during the first half of 2025, significantly accelerating the adoption of microLED technology for miniature displays. Industry analysts anticipate 2025 will become a critical year for full-color microLED development, though mature single-chip full-color microLED displays are projected to appear only by 2027.

Jabil announced a significant leadership transition on October 16, stating that Executive Chairman Mark T. Mondello and two other directors will not seek re-election to the board. The departures are scheduled for the company's annual stockholder meeting in January 2026.

As the AI industry continues to thrive, Double Bond Chemical (DBC) has entered the electronic materials market. Revenue from its 5G/6G materials has already exceeded 10% of total sales, and the company is planning to expand production capacity from the current 300 tons to 2,000 tons.

Electronic components distributor Audix has demonstrated operational resilience with steady revenue growth in the third quarter of 2025, when gross margin surged past 30% to reach the company's second-highest ever level. Audix's strategic transformation across three core business units has expanded its reach from traditional products into emerging technology sectors, including AI, electric vehicles (EV), and medical devices.

US-based PMIC manufacturer Power Integrations (PI) announced that it has officially entered Nvidia's 800V data center power supply architecture supply chain, becoming a certified supplier for the entire platform.

At the opening of the 2025 Taipei Innovative Textile Application Show (TITAS) on October 14, Tong-sheng Wu, chairman of Shinkong Synthetic Fibers Corporation (SSFC)—a subsidiary of Shinkong Group—addressed the industry's ongoing challenges, from global tariffs to China's low-price dumping. Despite this, he maintained an optimistic outlook, remarking, "Business is always tough, but there are always opportunities."

Intel has unveiled its most ambitious artificial intelligence (AI) roadmap to date, featuring the next-generation Panther Lake AI PC processor, Clearwater Forest server processor, and a comprehensive AI execution plan. At the recent Intel Tech Tour (ITT) keynote, the company's new Chief AI and Technology Officer, Sachin Katti, announced that Intel will adopt an "annual update" cadence for its AI product lineup, marking a strategic shift toward faster iteration and innovation.

Hewlett Packard Enterprise (HPE) posted record revenue but weaker margins in its fiscal third quarter of 2025, reflecting both the strength of AI infrastructure demand and the costs of strategic restructuring.

Foxconn Interconnect Technology (FIT) unveiled its latest high-speed interconnect and thermal management solutions aimed at enhancing 224G generation transmission and energy efficiency at the 2025 Open Compute Project (OCP) Global Summit in San Jose, the US. The exhibition highlighted FIT's efforts to address rising power consumption challenges in high-performance computing (HPC) and data centers.