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NEWS TAGGED IT COMPONENTS, PERIPHERALS
Wednesday 9 September 2026
AI servers push Asus' August revenue up 51%
Asus reported consolidated revenue of NT$94.96 billion (US$3.02 billion) in August 2026, up 12.87% from July and 51.17% from a year earlier — the second-highest monthly figure...
Wednesday 9 September 2026
CIOE: Luxshare bets on flat optics to solve AR glasses' weight problem
At its booth at the China International Optoelectronic Expo (CIOE), Luxshare and its camera-module affiliate Luxvisions showcased the components they believe will define the next generation...
Wednesday 9 September 2026
Ample Electronic hits 120% utilization as MLCC customers step up copper paste orders
Ample Electronic Technology said strong demand for passive components and artificial intelligence (AI) server-related products is boosting business momentum, as multi-layer ceramic...
Wednesday 9 September 2026
Verizon, Corning strike multi-billion-dollar fiber deal for broadband and AI buildout
Verizon and Corning have agreed to a multi-billion-dollar supply deal that could shape broadband access and artificial intelligence infrastructure well beyond the US. The pact underscores...
Tuesday 8 September 2026
What to expect at CIOE, Shenzhen's optoelectronics mega-expo
This week, DIGITIMES heads to Shenzhen to cover an expo showcasing the world of optoelectronics, a class of technologies that serves as the link between electricity and light. In today's...
Tuesday 8 September 2026
CIOE 2026 opens in Shenzhen: 5,000 exhibitors chase the AI-driven optics boom
The 27th China International Optoelectronic Exposition (CIOE 2026) will run September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions...
Tuesday 8 September 2026
SST market grows 32% as global players race to secure position
As AI server computing power and per-rack power density continue to rise, traditional 54VDC power architectures are hitting bottlenecks such as excessive current, higher copper usage,...
Monday 7 September 2026
STMicroelectronics says humanoid robots must clear a trio of hurdles
STMicroelectronics said humanoid robots are still most likely to enter manufacturing first, as the industry works through key hurdles in hand dexterity, edge AI decision-making, and...
Monday 7 September 2026
AI racks move toward MW scale as power, cooling converge
As AI computing power surges, the energy consumption of AI servers has become a major bottleneck that must be solved. The issue is spreading from chips into power delivery systems...
Sunday 6 September 2026
Trumpf CTO says advanced packaging reshapes semiconductor equipment race
AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data...
Saturday 5 September 2026
Topco targets optical comms, cooling as copper gives way
System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical...
Friday 4 September 2026
Acer broadens lineup with e-paper displays and scooters, ahead of PC industry headwinds
Acer used its next@acer global press conference at IFA 2026 in Berlin, Germany, to unveil non-PC products as part of its strategy to enhance resilience. At the event, the company introduced...
Friday 4 September 2026
Acer wowed IFA with AI, gaming hardware
As Acer marks its 50th anniversary in 2026, Chairman and CEO Jason Chen said at the company's next@acer global press event during IFA in Berlin, Germany, that the PC maker's four future...
Thursday 3 September 2026
Niching validates 500-ton press for large heat spreaders
Niching Industrial is expanding its heat-spreader capacity as AI and high-performance computing demand pushes up orders across the global semiconductor supply chain. The company said...
Thursday 3 September 2026
Taiwan LED packaging provider Ligitek pivots to silicon photonics; 1.6T modules eye 2H27 revenue
Ligitek is accelerating its move from LED packaging into silicon photonics (SiPh) and high-speed optical communications, with 1.6T product samples already tested and volume-production...