Asus reported consolidated revenue of NT$94.96 billion (US$3.02 billion) in August 2026, up 12.87% from July and 51.17% from a year earlier — the second-highest monthly figure in company history. Revenue for the first eight months reached NT$645.19 billion (US$20.5 billion), up 42.3% year over year. The company attributed the gain to AI server and PC demand, with motherboard orders also recovering.

At its booth at the China International Optoelectronic Expo (CIOE), Luxshare and its camera-module affiliate Luxvisions showcased the components they believe will define the next generation of smart eyewear, pointing to weight and price as among the industry's biggest remaining obstacles.

Ample Electronic Technology said strong demand for passive components and artificial intelligence (AI) server-related products is boosting business momentum, as multi-layer ceramic capacitor (MLCC) customers ramp up copper paste purchases.

Verizon and Corning have agreed to a multi-billion-dollar supply deal that could shape broadband access and artificial intelligence infrastructure well beyond the US. The pact underscores how telecom networks are becoming a shared foundation for consumer internet, enterprise connectivity, and the data-heavy systems driving the next wave of AI services.

This week, DIGITIMES heads to Shenzhen to cover an expo showcasing the world of optoelectronics, a class of technologies that serves as the link between electricity and light. In today's era of pervasive digital connectivity, from smart glasses to cars to phones, this event is expected to give us a glimpse into the hardware supply chain behind these devices, and increasingly behind the global AI infrastructure build-out.

The 27th China International Optoelectronic Exposition (CIOE 2026) will run September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions as AI infrastructure, high-speed optical communications and AR/VR applications reshape the optoelectronics industry.

As AI server computing power and per-rack power density continue to rise, traditional 54VDC power architectures are hitting bottlenecks such as excessive current, higher copper usage, and greater transmission losses. This is pushing next-generation AI data center power designs toward 800V high-voltage direct current (HVDC).

STMicroelectronics said humanoid robots are still most likely to enter manufacturing first, as the industry works through key hurdles in hand dexterity, edge AI decision-making, and total system cost. The chipmaker made the remarks at a recent press event in Taiwan focused on sustainability, AI data centers, and robotics.

As AI computing power surges, the energy consumption of AI servers has become a major bottleneck that must be solved. The issue is spreading from chips into power delivery systems as Nvidia's AI racks ramp up, rapidly pushing up the power draw of a single AI rack.

AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data transfer requirements rise rapidly, competition is no longer limited to front-end process scaling; 3D stacking, advanced packaging, high-density interconnects, thermal management, and memory technologies are also becoming more important.

System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical communications between racks and chips will enter practical use. Industry players say the maturity of system integration is still the main consideration for commercialization.

Acer used its next@acer global press conference at IFA 2026 in Berlin, Germany, to unveil non-PC products as part of its strategy to enhance resilience. At the event, the company introduced an e-paper display, a foldable screen, an e-scooter, and its latest gaming handheld, with chairman and CEO Jason Chen noting that Acer will continue making new products to wow consumers.

As Acer marks its 50th anniversary in 2026, Chairman and CEO Jason Chen said at the company's next@acer global press event during IFA in Berlin, Germany, that the PC maker's four future growth drivers are PCs, smart healthcare, smart living, and sustainability. He said the roadmap underscores Acer's stature as an international brand and its continued ambition.

Niching Industrial is expanding its heat-spreader capacity as AI and high-performance computing demand pushes up orders across the global semiconductor supply chain. The company said larger stamping equipment, tighter plating control, and future liquid-cooling technologies are being developed to support chips that generate more heat in data centers worldwide.

Ligitek is accelerating its move from LED packaging into silicon photonics (SiPh) and high-speed optical communications, with 1.6T product samples already tested and volume-production equipment due from late 2026 through the first quarter of 2027. Chairman I-hsin Tung said recent optical throughput tests exceeded industry benchmarks, with revenue contribution expected in the second half of 2027.

Samsung Electronics launched its new Galaxy Z series foldable smartphones, including its first wide-folding model, kicking off this year's foldable smartphone battle. With attention on the upcoming release of Apple's debut foldable smartphone, the market reported on September 2 that Xiaomi and Huawei will unveil new foldables on September 7, ahead of Apple.

Solomon Technology, a Taiwanese artificial intelligence (AI) 3D vision company, is showcasing two key inspection applications that integrate its core AI vision and optical technologies at Semicon Taiwan 2026. The applications include full-wafer warpage detection inside front-opening unified pods (FOUP)/cassettes and through-glass via (TGV) aperture defect inspection technology, aimed at preventing equipment downtime during manufacturing processes and ensuring the yield and quality of next-generation advanced packaging.

AI infrastructure expansion is accelerating demand for 800G and 1.6T optical modules, lifting first-half 2026 results across major Chinese suppliers and extending order visibility into 2027.

Cooling specialist Auras Technology is expanding from GPU platforms to ASIC-related products as its next growth driver, amid the ongoing shift toward liquid cooling in AI servers, with chairman Steve Lin highlighting sustained progress in projects for major international cloud service providers (CSP) such as AWS and Meta.

Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory closer to processors as inference workloads strain conventional memory systems.

Cable manufacturer Wonderful Hi-Tech announced its financial results for the second quarter and first half of 2026 during an earnings call held on September 1. A ramp-up in high-speed transmission cable shipments for artificial intelligence (AI) applications, coupled with strong pull-in momentum from a major US low-Earth-orbit (LEO) satellite customer, drove second-quarter results. The company also said it is expanding capacity in Thailand and Vietnam to capture new opportunities in space data centers and physical AI.

Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer process is used only in the entry-level Mac mini, while the 3-nanometer M5 Ultra is officially billed as the "most powerful M-series chip yet."

Humanoid robot scaling is still constrained by price, and Chinese humanoid robots — which command the largest global market share — show a sharp gap between consumer and industrial models. Industrial versions demand high load, high precision, and strong stability, making several precision transmission parts a key battleground for Chinese players and Taiwan suppliers.

Taiwan’s manufacturing business-climate indicator moved into the index’s red “prosperity” category in July, with the Taiwan Institute of Economic Research (TIER) saying on August 31 that a sharper rise in optimism among local manufacturers lifted its operating environment index. At the same time, year-over-year export growth to the US fell to 28.0% from 267.6% in January, the lowest level since February 2025.

AI-driven demand for optical transceiver modules is rising rapidly, and LuxNet said its business in the second half of 2026 will grow sharply from the first half. With capacity coming online in 2027, revenue from data center interconnect (DCI) products is expected to multiply, driving a leap in overall operations, while 1.6T optical modules are slated to enter mass production in the second half of 2027.