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Wednesday 30 September 2026
Apple A20 Pro ditches PoP memory packaging for WMCM
Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side to potentially improve packaging yield and thermal performance, according to a teardown analysis by TechInsights. The findings come as Qualcomm's Snapdragon 8 Elite Gen 6 and Apple's A20 Pro draw comparisons around 2-nanometer chip manufacturing and memory packaging.
Wednesday 30 September 2026
Qualcomm sees smart glasses leading AI wearables boom; AI pins, pendants follow

Among personal AI devices beyond smartphones, smart glasses remain the fastest-growing category, according to Ziad Asghar, senior vice president and general manager of XR, wearables, and personal AI at Qualcomm. Speaking during a media Q&A at Snapdragon Summit 2026, Asghar noted that while smart glasses are drawing intense market focus and a steady stream of new product launches, AI pins and pendants are emerging right behind them to cater to users who prefer not to wear eyewear.

Wednesday 30 September 2026
Acer turns 50, marks it with a musical produced by its founder

Acer marked its 50th anniversary on September 28, 2026, with the premiere of Smile for Half a Century, a commemorative musical that traces the company's journey from a small startup to a global technology brand while looking ahead to its next chapter.

Wednesday 30 September 2026
Commentary: Garmin returns to OLED, putting Micro LED on notice
Garmin's decision to offer OLED options but no Micro LED version in its new flagship smartwatches, the fenix 9 and fenix 9 Pro, has revived debate over whether the emerging display technology is ready for sustained commercial competition. The shift comes about a year after Garmin launched the world's first Micro LED smartwatch, the fenix 8 Pro Micro LED in September 2025.
Wednesday 30 September 2026
Micro LED smartwatches set back as costs remain a fatal hurdle
Micro LED has reached mass production in several end-market applications in recent years, but it is still facing intense competition from OLED. Garmin's new fenix 9 smartwatch has returned to an OLED panel, instead of using Micro LED display technology.
Wednesday 30 September 2026
Meta reaches agreements with Firmus on securing AI compute in Southeast Asia
Meta reached several agreements to source AI compute capacity from Firmus, an Australian neocloud, which will lease GPU compute capacity at its AI factories in Southeast Asia. The deal is said to support Meta's AI expansion across the Asia-Pacific region, while Firmus notches another order from a major customer in the run-up to a potential public listing.
Tuesday 29 September 2026
Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
Micron unveiled the Micron Ventures Paradigm Fund, a US$250 million venture vehicle, in mid-August 2026, as the memory maker pairs more than US$25 billion in fiscal 2026 capex with a pledge to invest more than US$250 billion in the US by 2035. The fund is designed to give Micron an early look at technology shifts, position it for next-generation AI architectures, and strengthen its strategy to reduce memory-cycle volatility.
Tuesday 29 September 2026
Nvidia expands CUDA-Q platform to target fault-tolerant quantum software
Nvidia expanded its open-source CUDA-Q platform with CUDA-Q Logical, an orchestration layer aimed at helping researchers build software for fault-tolerant quantum computers. The company said the platform already integrates with about 75% of publicly available quantum processing units (QPUs), giving developers a common environment across multiple hardware types.
Tuesday 29 September 2026
Samsung invests US$1 billion in ex-AWS chief's AI data center venture, joining Nvidia as a founding investor
Six Samsung companies will invest a combined US$1 billion in Helix Digital Infrastructure, a company set up by investment firm KKR to build data centers and the power supply they need for AI. The investment gives the Korean group a stake in a builder that could become a buyer of its chips, cooling equipment, batteries and construction services.
Friday 25 September 2026
Interview: Intel director talks physical AI, business models, and robotics' future
Physical AI is accelerating like never before. Autonomous intelligent machines can walk, run, fly, swim, and assemble car parts in under a minute. New advances in AI models and technologies like dexterous hands are also pushing the boundaries of how smart and useful humanoids can be.
Thursday 24 September 2026
Qualcomm splits flagship mobile SoCs into more tiers
Qualcomm is launching two flagship platforms in 2026—the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Extreme Gen 6—signaling a new era of finer-grained flagship mobile SoC segmentation. The move has raised questions about whether pricier flagship phones are on the way.
Thursday 24 September 2026
Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC
Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat dissipation. During a media Q&A, Qualcomm Senior Vice President and General Manager of Mobile Handsets Chris Patrick said the new package still falls under existing Package on Package (PoP) technology, but the memory is no longer stacked directly above the die and is shifted to the side to create a thermal path.
Thursday 24 September 2026
AMD pushes ROCm for agentic workloads while Intel holds on to OpenVINO

Starting in the second half of 2025, as AI agent programs such as OpenClaw, Hermes, Claude, and DeepSeek Harness were launched one after another, a wave of "keeping lobsters" began to emerge around on-device AI models paired with AI agents.

Wednesday 23 September 2026
LG Electronics, Microsoft enter partnership on AI data centers, physical AI
LG Electronics entered a partnership with Microsoft to cooperate on a range of AI initiatives. The two firms agreed to work together on AI data centers, LG Electronics' AI data transformation, and physical AI as the company known for appliances taps into growing AI-related industries.
Wednesday 23 September 2026
LG Energy enters Nvidia's ecosystem as it pivots batteries to data centers
LG Energy's battery energy storage system (BESS) has entered Nvidia's AI Factory ecosystem. Its qualification by the chipmaker comes as LG Energy is reorienting its North American battery plants toward data centers and appears poised to capture fresh demand after the US imposed restrictions on Chinese battery imports.
Wednesday 23 September 2026
Hygon takes China's CPU ambitions beyond servers, into physical AI

China's Hygon Information Technology is extending its processor ambitions beyond servers and data centers with the launch of its first embedded industrial CPU family, targeting robotics, machine vision, smart manufacturing, and other edge AI workloads.

Wednesday 23 September 2026
GLT pivots into life sciences with US-patented precast gels

Taiwan-based light guide plate maker Global Lighting Technologies (GLT) is deepening its pivot into life sciences through its investment in Smobio Technology, for which GLT has begun manufacturing precast protein electrophoresis gels under contract. Small-scale production began in August 2026, following the commencement of the partnership between the two companies in 2025. Monthly demand for precast gels currently sits at roughly 20,000–30,000 sheets, and is expected to grow to 200,000–300,000 sheets in the first half of 2027, according to GLT president Johnny Tsai.

Wednesday 23 September 2026
Win Semiconductors expands optical communications capacity with DUV tools
Optical communications capacity is in short supply as surging computing demand from AI data centers turns transmission into a bottleneck for AI infrastructure. The market is shifting toward combined optical-and-copper solutions, while optical communications rapidly advances toward 800G and 1.6T, prompting compound semiconductor foundry Win Semiconductors to expand its photodiode (PD) and laser diode (LD) capacity and co-develop 200G components with customers.
Tuesday 22 September 2026
Acer debuts first Googlebook with 360-degree hinge
Acer has launched its first Googlebook, a new flagship notebook equipped with Gemini Intelligence that combines premium materials, strong performance, smart features, and seamless syncing with Android phones. The Acer Googlebook 14 is also the first convertible Googlebook on the market.
Tuesday 22 September 2026
Meta's rumored Luna smart glasses may go camera-free for lighter design

Meta Connect 2026 is set to begin on September 23, with the next generation of AI smart glasses expected to be a key focus. Among the products drawing particular industry attention is a device internally code-named "Luna," which is reportedly being designed without a camera.

Tuesday 22 September 2026
Taiwan advances major science park expansion to support AI, semiconductor growth

Demand from high-tech companies for new research and manufacturing sites remains strong, prompting Taiwan to advance plans to expand Longtan Science Park by 104 hectares as the government seeks to accommodate continued growth in AI and semiconductor industries.

Tuesday 22 September 2026
Huaqin challenges Quanta for Steam Deck ODM order

Industry sources say Valve is expected to launch a new Steam Deck in 2027, setting up a tougher contest for Taiwanese original design manufacturer (ODM) Quanta as China's Huaqin moves to win the manufacturing order. The winner has not yet been confirmed.

Tuesday 22 September 2026
Tesla speeds up Optimus mass production with China supply chain visits
Tesla is reportedly making new progress toward mass production of its Optimus humanoid robots, with the company's robot team conducting intensive supplier audits across China's Yangtze River Delta last week. The visits covered Ningbo, Hangzhou, and Shanghai and included potential suppliers Tuopu Group, Sanhua Holding Group, and Joyson Electronics, all of which are existing Tesla automotive suppliers.
Tuesday 22 September 2026
EZconn eyes 2027 high-core fiber ramp as shortages persist

EZconn said global fiber and optical cable supplies remain tight as AI data center demand overtakes demand from traditional telecom applications, pushing up raw material prices and boosting costs for optical passive components. The company expects the shortage to ease gradually from the second half of 2026 into 2027 as upstream suppliers add capacity, while it negotiates for larger allocations and longer-term supply contracts.

Tuesday 22 September 2026
AI inference demand surges as training slowdown talk fades
Calls to slow frontier AI model training have sparked debate across the AI semiconductor industry, but executives at the AI Infra Summit in Santa Clara, California, said the real buildout is aimed at AI inference, not training. The event, held from September 15 to 17, became a broad response to Anthropic CEO Dario Amodei's September 12 essay urging frontier AI labs to slow the pace of capability gains.