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Tuesday 25 August 2026
Tesla senior chip engineer joins DensityAI as in-house plans face more strain
Tesla's senior director of AI hardware design, Shishuang Sun, joined DensityAI in July 2026, taking charge of packaging and system hardware development. The move came as Tesla continued to pursue custom AI and robotics chips amid the loss of another senior hardware leader.
Tuesday 25 August 2026
Taiwan's manufacturers and govt align on economic security push amid heightened trade risk
The Chinese National Federation of Industries (CNFI), an industrial association representing the majority of manufacturing businesses in Taiwan, has released its 2026 white paper, putting forward seven proposals aimed at building a resilient national economic security line amid the current trade and economic climate. In response, the National Development Council (NDC) said the white paper's core demands closely align with the government's current policy direction.
Tuesday 25 August 2026
Anthropic bets on in-house chips, reshaping ASIC orders
Anthropic confirmed on August 5 that it is building an internal silicon team to design custom chips for its Claude models, signaling a sharper push into self-developed AI hardware. The move is set to influence the company's compute procurement plans and could reshape order shares among ASIC vendors.
Tuesday 25 August 2026
From podium to production line: China's robots ace the sprint, but stumble on the real test
The 2nd World Humanoid Robot Games put China's rapid advances in robotics on full display — but beyond the record-breaking sprints and human-robot sports demonstrations, the event raised a tougher question for the industry: can humanoid robots move past the highlight reel and become reliable, economically viable workers?
Tuesday 25 August 2026
Taiwan AI server supply chain expands China footprint
Taiwan's AI server supply chain is stepping up investment in China, but expansion is concentrated in components rather than full-system assembly. By contrast, Taiwan's notebook PC production in China is mostly flat as the industry shifts to Southeast Asia and other non-China locations.
Tuesday 25 August 2026
Intel pitches Diamond Rapids at Hot Chips as server CPU competition heats up
Intel pitched its next-generation Diamond Rapids Xeon at Hot Chips 2026 as the company bets that agentic AI will increase the role of general-purpose processors in AI infrastructure, even as AMD and Arm gain ground in the server CPU market. The company also detailed Crescent Island, a GPU aimed at AI inference, and Wildcat Lake for client and edge systems.
Tuesday 25 August 2026
Energy law amendments lift AI data center storage demand in Taiwan
AI data centers will increasingly rely on energy storage because of its fast response and grid impact mitigation capabilities, according to Recharge Power, a Taiwan-based battery energy storage system integrator (BESSI) which has seen overseas project revenue gradually bearing fruit. In Taiwan, the energy storage market has also received a major boost following amendments to the Energy Administration Act requiring heavy users to strengthen their electricity self-sufficiency.
Tuesday 25 August 2026
China-based Guangyu Xinchen says 3D-stacked edge AI chip has entered mass-production deployment
According to 36Kr, Shanghai Guangyu Xinchen Technology says its TC1000 series of 3D-stacked near-memory-computing AI processors has moved from silicon validation to mass-production deployment, marking a claimed acceleration in the commercialization of memory-centric computing for edge AI.
Tuesday 25 August 2026
Commentary: Nvidia's 15% hike piles pressure on the AI supply chain, lifts ASIC prospects
Nvidia has reportedly notified major customers that server systems using its AI chips will rise by more than 15%, with the new pricing set to apply to models shipping from early 2027, including Grace Blackwell and the next-generation Vera Rubin platform. The move is expected to ripple through the chip and system supply chain, while industry figures say it could also lift the appeal of inference ASICs.
Tuesday 25 August 2026
OpenAI narrows gap as Anthropic's Fable 5 loses enterprise momentum
OpenAI has been gaining ground on Anthropic in enterprise AI spending, while Anthropic's flagship Claude Fable 5 has delivered less market traction than expected. The shift comes as Ramp analyzed usage across more than 70,000 US companies through its bill pay and corporate card products, according to TechCrunch and the Financial Times.
Tuesday 25 August 2026
AI infrastructure boom drives Taiwan export orders, exposing power bottleneck, net-zero tech needs

Global artificial intelligence infrastructure buildouts and rising capex by cloud service providers pushed Taiwan's July export orders for information and communications technology (ICT) products, led by AI servers, up nearly 90% year-over-year, while export orders for foundry and memory also rose by more than 70%. However, companies in advanced economies are encountering power shortages as they invest in AI infrastructure, exposing a bottleneck that highlights the need to develop AI computing and net-zero technologies in tandem.

Tuesday 25 August 2026
Taipower pushes 'information flow' strategy to ease northern Taiwan's AI data center power crunch
As artificial intelligence chip power consumption continues to rise, server racks are moving toward the megawatt (MW) scale. Amid the "electrical power is computing power" trend, the importance of power electronics is increasing, while the overall power system also faces significant upgrade requirements.
Tuesday 25 August 2026
Nvidia Groq 3 LPX enters full production for faster agentic AI inference

Nvidia said its Groq 3 LPX inference accelerator is now in full production, a move that could speed up agentic AI systems used worldwide for coding, reasoning, and other tasks. The company said the platform is designed to improve responsiveness, lower latency, and support growing demand for real-time AI applications.

Tuesday 25 August 2026
SpaceXAI to use Nvidia Vera CPUs for faster agentic AI at scale

SpaceXAI plans to deploy Nvidia's new Vera CPUs to speed up agentic AI workloads, a move that could influence how advanced AI systems are built and run worldwide. The partnership also extends toward orbital computing, signaling a broader shift in where future AI infrastructure may be located.

Tuesday 25 August 2026
Broadcom's debt push signals AI compute is becoming Wall Street asset class
The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly confronting a second bottleneck: how to finance hardware and data-center capacity at the scale frontier-model developers now require.
Tuesday 25 August 2026
Zhongji Innolight's 1.6T surge shows AI networking is becoming next hyperscaler bottleneck
The AI infrastructure boom has long been defined by a race to secure GPUs, memory and power. Yet as cluster sizes continue expanding, another layer of the system is beginning to emerge as an equally decisive constraint: the optical links responsible for moving data fast enough between increasingly dense pools of accelerators.
Tuesday 25 August 2026
SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical and economic limits of scalability.
Tuesday 25 August 2026
Inergy server share hits 47% on cooling, BBU demand

Inergy Technology said strong demand for AI server cooling and power management pushed the share of server-related applications to 47% of revenue in the second quarter of 2026, with shipments of system-on-chip (SoC) cooling fan driver ICs set to ramp up in the second half of 2026 and battery backup unit (BBU) demand expected to keep rising as AI moves toward high-voltage direct current power architectures.

Tuesday 25 August 2026
CNFI White Paper outlines solutions as labor, transformation, and energy headline Taiwan's industry hurdles
Navigating volatile US tariff policies, escalating geopolitical tensions, and a productivity revolution driven by agentic AI, Taiwan's industrial sector has reached a decisive crossroads.
Tuesday 25 August 2026
Applied Materials executive says data centers set new AI competition standard

Commenting on the current surge in artificial intelligence (AI), Erix Yu, group vice president of Applied Materials and president of Applied Materials Taiwan, recently shared his perspective by tracing the evolution of industrial revolutions.

Monday 24 August 2026
Xiaomi taps TSMC to make chips for foldables, AI and autonomous driving
Xiaomi is expanding its in-house semiconductor push from smartphones into AI acceleration and autonomous driving, unveiling three Xring processors that deepen its reliance on TSMC manufacturing while reducing dependence on external chip suppliers.
Monday 24 August 2026
How Nvidia's whitelist was beaten: 74 B300 servers, Taiwan to China
Taiwan's Keelung District Prosecutors Office has indicted nine people over the illegal export of high-end AI servers built on Nvidia's B300 GPUs. The indictment lays out, step by step, how a compliance regime designed to track every unit was defeated from the inside.
Monday 24 August 2026
Etron chair sees memory boom extending to 2028-2030
The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely lasting through 2028 and possibly into 2030. He said supply is tightening further as AI and edge computing create rigid demand, pushing the supply chain to focus on higher-value applications.
Monday 24 August 2026
TPK TGV pilot line to start by September, Thailand plant eyes 2027 ramp
TPK Holding is accelerating its move from consumer touch panels into semiconductors, with its Through Glass Via (TGV) pilot line in Taoyuan, Taiwan set to begin operations in August or September. The company is also working with leading outsourced semiconductor assembly and test (OSAT) providers on the project, while its new Thailand production base aims to complete trial runs by year-end and begin volume production in early 2027.
Monday 24 August 2026
AI energy bottleneck is driving semiconductor materials innovation, says Applied Materials
Rising demand for artificial intelligence (AI) computing is driving a new wave of technological transformation in the semiconductor industry, while energy is emerging as the next bottleneck for the AI sector. Applied Materials group vice president and Taiwan president Eric Yu pointed out that semiconductor technology competition in the AI era can no longer focus solely on performance and transistor counts. How to support more computing with less energy will become the core of the next stage of semiconductor innovation.