IBM and Lam Research have announced a five-year collaboration to develop materials, manufacturing processes, and High-NA EUV lithography technologies for sub-1nm logic scaling. The agreement expands a long-standing partnership aimed at establishing viable manufacturing paths for future logic chips.
As automation expands from controlled indoor environments into more complex and unpredictable outdoor settings, the ability of vision perception systems to operate reliably under harsh conditions has become a critical factor in the development of Physical AI.
Chinese authorities have moved to curb the use of OpenClaw AI software across government agencies and state-owned enterprises (SOEs), including major banks, amid rising concerns over potential security risks linked to the rapidly spreading AI agent platform.
Tencent is reportedly developing an AI agent for its flagship messaging platform WeChat, a move that could reshape how users interact with services across China's largest digital ecosystem.
JCET, China's leading semiconductor packaging and testing provider, has launched a facility focused on automotive electronics and robotics chips, strengthening the country's vehicle-grade semiconductor manufacturing ecosystem.
