At the Hygon-initiated HAIC 2025 Artificial Intelligence Innovation Conference in Kunshan from December 17 to 19, Hygon Information Technology unveiled a "dual-chip strategy," positioning its DCU accelerator and CPU as a tightly integrated foundation for China's next phase of AI infrastructure.
As demand for AI computing power continues to surge, traditional Apple supply-chain manufacturing heavyweights are accelerating their transformation, extending into higher-margin segments such as AI servers and advanced cooling.
Tokyo-based startup EdgeCortix plans to deliver samples of its next-generation Sakura-X artificial intelligence (AI) processor by the end of 2026, accelerating its production timeline to address the growing energy demands of AI infrastructure. The company is positioning the new silicon as a low-power alternative to Nvidia's dominant graphics processing units as data center operators and industrial users face increasing pressure to curb electricity consumption.

