Hardware security is crucial for providing robust protection for sensitive data in our increasingly interconnected environment. Relying solely on software protection is insufficient to prevent the rising threats of remote cyberattacks.
For more details on how Winbond can help secure your supply chain and simplify compliance, visit Winbond's website, contact Winbond directly, or download the latest Hardware Security White Paper.
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Winbond Electronics, a specialty DRAM and flash memory chipmaker, has begun ramping up its DDR4 chip output in the second half of 2024, with the memory output increase expected to...
Taiwan-based niche semiconductor firms have mostly focused on opportunities in edge AI during the current AI boom. In particular, Winbond Electronics specializes in customized memory...
Winbond Electronics Chairman Arthur Yu-Cheng Chiao expressed optimism about the memory market, indicating that the second half of 2024 will enter an upward cycle extending into 202...
Winbond Electronics, a manufacturer of specialty DRAM and flash memory, sustained operating losses throughout the first quarter of 2024, including a NT$464 million (US$14.4 million)...
Generative AI has stimulated demand for High Bandwidth Memory (HBM), driving Taiwanese memory chipmakers to seize a share of the AI business opportunity.
Winbond Electronics has kicked off mass production of specialty DRAM memory using 20nm process technology, with plans to transition to a newer 16nm process, according to the Taiwan-based...
With the generative AI boom in full swing, the supply chain is shifting its focus to developing edge AI device applications. In 2024, AI PCs and smartphones will undergo market sales...
Winbond Electronics, a Taiwanese maker of specialty DRAM and NOR flash memory, has authorized NT$1.286 billion (US$41.4 million) in capital expenditures. The money will be used to...
The Taiwan Carbon Solution Exchange (TCX) has officially started trading, marking a significant moment in carbon exchange activities. Winbond Electronics Corporation (WEC), a total...
Winbond Electronics, a Taiwan-based memory chipmaker, has signed a letter of intent to collaborate with OSAT Powertech Technology (PTI) to jointly develop 2.5D and 3D advanced packaging,...
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