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Hardware Security
Hardware security is crucial for providing robust protection for sensitive data in our increasingly interconnected environment. Relying solely on software protection is insufficient to prevent the rising threats of remote cyberattacks.
For more details on how Winbond can help secure your supply chain and simplify compliance, visit Winbond's website, contact Winbond directly, or download the latest Hardware Security White Paper.

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IN THE NEWS
Tuesday 28 October 2025
Winbond boosts memory production capex over fivefold amid tight supply
Taiwan-based memory manufacturer Winbond Electronics Corp. has approved a capex budget of NT$35.509 billion (US$1.16 billion) to restructure its memory production capacity in response...
Wednesday 22 October 2025
Secure Flash Memory : The Cornerstone of Next-Generation Cybersecurity Standards

As digitalization penetrates every industry-whether in cloud computing, telecommunications infrastructure, automotive electronics, or IoT devices-the security of hardware...

Monday 20 October 2025
Winbond chairman says memory supply-demand will rebalance in 2-3 years
Winbond chairman Arthur Chiao expressed a cautious outlook on the memory industry's current boom, stating that he does not believe this cycle represents a "super cycle." Speaking...
Monday 20 October 2025
Winbond eyes record revenue of NT$100B in 2026 amid memory market rebound
Memory giant Winbond aims to surpass the NT$100 billion (US$3.3 billion) mark in 2026 for consolidated revenue. President Pei-Ming Chen said the memory market has emerged from a downturn,...
Friday 3 October 2025
Winbond eyes 3Q25 profit to offset 1H losses amid DDR4 supply tightness
Taiwanese memory makers have emerged as major beneficiaries of the recent DDR4 supply shortage, which has driven rapid price increases. Companies like Nanya and Winbond saw significant...
Wednesday 1 October 2025
Embracing WP.29 R155 and R156-Winbond Secure Flash Memory Accelerates Automotive Compliance and Differentiation
In recent years, the automotive industry has shifted from traditional mechanical manufacturing to a new era of intelligence and connectivity. The introduction of technologies such...
Saturday 27 September 2025
Memory makers flash early profit signs; ESMT and Macronix edge closer to break-even
The memory market is warming up, with DRAM and NAND flash prices rising consecutively. Several Taiwanese memory-related companies have successively announced their preliminary profits...
Tuesday 23 September 2025
Quantum resilience: Quantum cryptography will protect the future of the global network equipment supply chain
The modern digital supply chain is no longer a traditional linear sequence but a complex, interconnected ecosystem of suppliers, sellers, logistics providers, and customers. While...
Thursday 11 September 2025
Winbond sees nearly 90% DRAM price increase, aims for 4Q25 peak
Winbond Electronics has implemented significant price increases for its DDR4 DRAM products beginning in the third quarter of 2025, with contract prices for the fourth quarter finalized...
Wednesday 10 September 2025
How Flash Memory Shapes Server Security: From Firmware Integrity to Root of Trust
As digital infrastructure becomes the backbone of today's enterprises and cloud services, servers have transformed far beyond their original role as mere computing units. They now...
Tuesday 2 September 2025
Building the Foundation of Trust: Achieving ISO/SAE 21434 Compliance in Automotive Systems Using Sec
As vehicles become increasingly intelligent and connected, the complexity of electronic/electrical (E/E) systems is growing exponentially. The automotive industry faces unprecedented...
Tuesday 26 August 2025
Firmware attacks escalate - platform firmware resiliency becomes the critical line of defense
As cybersecurity threats continue to evolve, attackers are no longer just targeting applications or operating systems, but are now penetrating deeper into the boot firmware layer...
Tuesday 26 August 2025
NOR flash prices set to surge in 4Q25 on cost pressures, supply constraints

After months of sluggish demand and weakened pricing, the NOR Flash memory market appears poised for a significant turnaround, particularly...

Friday 22 August 2025
eMMC shortage fuels rivalry between Macronix and Winbond in auto flash market
As NAND leaders recalibrate production allocation, Taiwan's Winbond Electronics and Macronix International are doubling down on specialized segments. Both are expanding their presence...
Tuesday 19 August 2025
Hardware Security Risks in the AIoT Era: Ubiquitous Flash Memory, Ubiquitous Threats
With the widespread adoption of AIoT (Artificial Intelligence and Internet of Things) applications—from smart home devices to smart manufacturing, connected vehicles, smart...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.