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Key components news coverage
IN THE NEWS
Thursday 26 May 2016
Communications and computer systems drive IC sales across all regions, says IC Insights
Communication and computer systems are forecast to be two of the three largest system applications for IC sales in every global region, Americas, Europe, Japan, and Asia-Pacific,...
Thursday 26 May 2016
TSMC to spend US$2.2 billion on R&D in 2016, says co-CEO
Taiwan Semiconductor Manufacturing Company (TSMC) expects to boost its R&D spending to a record US$2.2 billion in 2016, increasing about 10% on year, according to company co-CEO...
Thursday 26 May 2016
Lattice pASSPs to enter production in August
Lattice Semiconductor's recently-announced programmable bridge device that supports leading protocols for mobile image sensors and displays will be ready for volume production in...
Wednesday 25 May 2016
Server management SoC provider Aspeed to see revenues grow 25-30% in 2016
Taiwan-based remote server management SoC provider Aspeed Technology is expected to see its revenues grow 25-30% on year in 2016 after it completes the acquisition of Broadcom's Emulex...
Wednesday 25 May 2016
ASE, SPIL halt trading pending release of material information
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both announced they will enter a trading halt on May 26, pending the release of material...
Wednesday 25 May 2016
US fab-tool book-to-bill stays above parity, says SEMI
The book-to-bill ratio for the North America semiconductor equipment industry stayed above parity for the fifth consecutive month in April 2016, according to industry association...
Wednesday 25 May 2016
Taiwan backend firms seeing robust orders from HiSilicon
Demand for HiSilicon's chips has been robust, according to sources at Taiwan-based IC backend firms, which have identified the China-based fabless IC vendor as one of their important...
Wednesday 25 May 2016
ASE, SPIL in talks to form holding company
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are in talks about the feasibility of forming an industrial holding company, according to separate...
Tuesday 24 May 2016
28nm HPM production lines at TSMC, UMC to run at full capacity until 3Q16, says paper
Both the 28nm HPM (high performance mobile computing) production lines at Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) will run...
Tuesday 24 May 2016
Digitimes Research: Korea LCD driver IC vendor Silicon Works sees revenues hit record high in 2015
Combined revenues of Korea's major LCD driver IC vendors reached a record high of KRW419.4 billion (US$353.97 million) in 2015, with Silicon Works, a subsidiary of LG Electronics,...
Tuesday 24 May 2016
Silicon Motion expects NAND flash shortage in 2H16
NAND flash device controller supplier Silicon Motion Technology is expecting a shortage for the NAND flash industry in the second half of 2016.
Tuesday 24 May 2016
Digitimes Research: China smartphone AP shipments to grow 11.3% sequentially in 2Q16
Having digested their excessive inventory, smartphone vendors have stepped up the pace of placing chip orders in the second quarter of 2016, according to Digitimes Research. Smartphone...
Monday 23 May 2016
Chip suppliers cautious about unit production for upcoming iPhone
Chip suppliers are looking to enter production starting mid-June for the upcoming new iPhone series slated for launch in September 2016, but are generally less optimistic on their...
Monday 23 May 2016
GlobalWafers to acquire wafer business unit from Topsil
Semiconductor-grade silicon wafer maker GlobalWafers has disclosed it will acquire a 100% stake in the wafer business unit of Denmark-based Topsil Semiconductor Materials A/S at Danish...
Friday 20 May 2016
Chip demand from Apple disappointing, say sources
Chip orders from Apple have been relatively slow in the second quarter of 2016 compared to the same quarter in previous years, due to poor sales of the vendor's existing iPhone and...